CN110562603A - high-strength carrier tape and manufacturing method thereof - Google Patents

high-strength carrier tape and manufacturing method thereof Download PDF

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Publication number
CN110562603A
CN110562603A CN201910869694.5A CN201910869694A CN110562603A CN 110562603 A CN110562603 A CN 110562603A CN 201910869694 A CN201910869694 A CN 201910869694A CN 110562603 A CN110562603 A CN 110562603A
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China
Prior art keywords
layer
carrier tape
antistatic
copper foil
adhesive
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CN201910869694.5A
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Chinese (zh)
Inventor
唐拥军
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Kunshan New Best Electronic Packaging Materials Co Ltd
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Kunshan New Best Electronic Packaging Materials Co Ltd
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Priority to CN201910869694.5A priority Critical patent/CN110562603A/en
Publication of CN110562603A publication Critical patent/CN110562603A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D29/00—Producing belts or bands
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/06—Polystyrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21—Anti-static
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/017—Additives being an antistatic agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a high-strength carrier tape and a manufacturing method thereof, wherein the high-strength carrier tape comprises a base layer, an upper surface layer and a lower surface layer, wherein the upper end surface and the lower end surface of the base layer are respectively coated with an adhesive layer, the upper surface layer and the lower surface layer are respectively and fixedly connected to the top end and the bottom end of the base layer through the adhesive layers, the upper surface layer is a high-strength polystyrene layer, the lower surface layer is a copper foil layer, one end surface of the copper foil layer, facing the base layer, is coated with a thermosetting resin layer, the base layer is an antistatic PC layer, and the weight ratio of the upper surface layer to the base layer to the lower surface layer is: 5: 3, by adopting the antistatic PC as the base layer, the antistatic performance is enhanced, the antistatic dispersing agent is added into the upper surface layer, the integral antistatic capacity of the carrier tape is further improved, and the thermosetting resin layer is arranged between the copper foil and the viscose layer, so that the bonding performance of the copper foil and the base layer is improved.

Description

high-strength carrier tape and manufacturing method thereof
Technical Field
The invention relates to the technical field of carrier tapes, in particular to a high-strength carrier tape and a manufacturing method thereof.
background
SMD: it is an abbreviation for Surface Mounted Devices, meaning: a Surface Mount device, which is one of SMT (Surface Mount Technology) components. The Carrier Tape (Carrier Tape) is a Tape-shaped product applied to the field of electronic packaging, and has a specific thickness, and holes (also called pockets) for holding electronic components and positioning holes for indexing are equidistantly distributed in the length direction of the Tape-shaped product. At present, the carrier tape in the prior art is often poor in antistatic effect and often has the problems of insufficient strength and easy breakage and tearing.
Disclosure of Invention
The present invention is directed to a high-strength carrier tape and a method for manufacturing the same, which solves the above-mentioned problems of the prior art.
In order to achieve the purpose, the invention provides the following technical scheme:
The utility model provides a high strength carrier band, includes basic unit, upper epidermis and lower top layer, the upper and lower both ends face of basic unit has all coated the viscose layer, upper epidermis and lower top layer are respectively through viscose layer fixed connection in the top and the bottom of basic unit, the upper epidermis is high strength polystyrene layer, the top layer is the copper foil layer down, the one end surface coating of copper foil layer towards the basic unit has the thermosetting resin layer.
As a further scheme of the invention: the basic unit is antistatic PC layer.
as a further scheme of the invention: the weight ratio of the upper surface layer, the base layer and the lower surface layer is 2: 5: 3.
as a further scheme of the invention: the adhesive layer is any one of thermoplastic polyester adhesive, rubber modified epoxy adhesive and polyurethane adhesive.
as a further scheme of the invention: the thermosetting resin layer comprises the following components in percentage by weight: 40-50% of epoxy resin, 10-20% of organic silicon resin, 5-10% of phenolic resin and 30-35% of polyimide.
As a further scheme of the invention: the high-strength polystyrene layer comprises the following components in percentage by weight: 50-60% of polystyrene, 10-20% of polyethylene, 10-20% of polyolefin, 9-18% of antioxidant and 1-2% of antistatic dispersing agent.
As a further scheme of the invention: the antistatic dispersing agent comprises the following components in percentage by weight: 40-50% of carbon nano tube, 5-10% of polyacrylamide, 5-10% of sodium dodecyl sulfate and the balance of water.
a method for manufacturing a high-strength carrier tape includes the following steps:
S1, adding the carbon nano tube and a proper amount of organic solvent into a ball mill, fully grinding to obtain carbon nano tube slurry, adding the carbon nano tube slurry, polyacrylamide and sodium dodecyl sulfate into an ultrasonic dispersion machine, and ultrasonically dispersing for 15-20min to obtain the antistatic dispersing agent;
s2, adding the antistatic dispersing agent, the script laundry detergent, the polyethylene, the polyolefin and the antioxidant into a stirrer, stirring for 30-60min at the rotating speed of 300-500r/min, uniformly mixing, adding into a double-screw extruder, and extruding into a forming die to obtain the upper-layer carrier material;
S3, adding epoxy resin, organic silicon resin, phenolic resin and polyimide into a stirrer, stirring for 20-40min at the rotating speed of 120-150r/min to obtain thermosetting resin, and coating the thermosetting resin on the surface of a copper foil to obtain a lower-layer carrier material;
s4, respectively coating adhesive layers on the upper end surface and the lower end surface of the anti-static PC layer, placing the anti-static PC layer, the upper surface layer and the lower surface layer in a laminating machine from top to bottom in sequence for hot pressing, and baking for 30-120min at 160-200 ℃ for curing to obtain the finished carrier tape.
Compared with the prior art, the invention has the beneficial effects that:
the antistatic PC is used as the base layer, so that the antistatic performance is enhanced, the antistatic dispersing agent is added into the upper surface layer, the integral antistatic capacity of the carrier tape is further improved, the thermosetting resin layer is arranged between the copper foil and the viscose layer, and the bonding performance of the copper foil and the base layer is improved.
Detailed Description
the technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
The utility model provides a high strength carrier band, includes basic unit, upper epidermis and lower top layer, the upper and lower both ends face of basic unit has all coated the viscose layer, upper epidermis and lower top layer are respectively through viscose layer fixed connection at the top and the bottom of basic unit, the upper epidermis is high strength polystyrene layer, the top layer is the copper foil layer down, the copper foil layer has thermosetting resin layer towards the one end surface coating of basic unit, and this department adopts the carrier band of copper foil layer to be applicable to the circumstances that require high, the carrier band degree of depth is less than 0.5mm simultaneously to electrically conductive and hardness, is greater than 0.5 mm's demand to the degree of depth, and the lower top layer of carrier band also can adopt high strength polystyrene layer.
The basic unit is antistatic PC layer.
The weight ratio of the upper surface layer, the base layer and the lower surface layer is 2: 5: 3.
the adhesive layer is any one of thermoplastic polyester adhesive, rubber modified epoxy adhesive and polyurethane adhesive.
The thermosetting resin layer comprises the following components in percentage by weight: 40% of epoxy resin, 20% of organic silicon resin, 10% of phenolic resin and 30% of polyimide.
The high-strength polystyrene layer comprises the following components in percentage by weight: 50% of polystyrene, 20% of polyethylene, 20% of polyolefin, 9% of antioxidant and 1% of antistatic dispersant.
The antistatic dispersing agent comprises the following components in percentage by weight: 40% of carbon nano tube, 10% of polyacrylamide, 10% of sodium dodecyl sulfate and the balance of water.
a method for manufacturing a high-strength carrier tape includes the following steps:
s1, adding the carbon nano tube and a proper amount of organic solvent into a ball mill, fully grinding to obtain carbon nano tube slurry, adding the carbon nano tube slurry, polyacrylamide and sodium dodecyl sulfate into an ultrasonic dispersion machine, and ultrasonically dispersing for 15min to obtain the antistatic dispersing agent;
S2, adding the antistatic dispersing agent, the script laundry detergent, the polyethylene, the polyolefin and the antioxidant into a stirrer, stirring for 60min at the rotating speed of 300r/min, uniformly mixing, adding into a double-screw extruder, and extruding into a forming die to obtain an upper-layer carrier material;
s3, adding epoxy resin, organic silicon resin, phenolic resin and polyimide into a stirrer, stirring for 40min at the rotating speed of 120r/min to obtain thermosetting resin, and coating the thermosetting resin on the surface of a copper foil to obtain a lower-layer carrier tape material;
S4, respectively coating adhesive layers on the upper end surface and the lower end surface of the anti-static PC layer, placing the anti-static PC layer, the upper surface layer and the lower surface layer in a laminating machine from top to bottom in sequence for hot pressing, and baking for 120min at 160 ℃ for curing to obtain the finished carrier tape.
example two:
the utility model provides a high strength carrier band, includes basic unit, upper epidermis and lower top layer, the upper and lower both ends face of basic unit has all coated the viscose layer, upper epidermis and lower top layer are respectively through viscose layer fixed connection at the top and the bottom of basic unit, the upper epidermis is high strength polystyrene layer, the top layer is the copper foil layer down, the copper foil layer has thermosetting resin layer towards the one end surface coating of basic unit, and this department adopts the carrier band of copper foil layer to be applicable to the circumstances that require high, the carrier band degree of depth is less than 0.5mm simultaneously to electrically conductive and hardness, is greater than 0.5 mm's demand to the degree of depth, and the lower top layer of carrier band also can adopt high strength polystyrene layer.
the basic unit is antistatic PC layer.
The weight ratio of the upper surface layer, the base layer and the lower surface layer is 2: 5: 3.
the adhesive layer is any one of thermoplastic polyester adhesive, rubber modified epoxy adhesive and polyurethane adhesive.
the thermosetting resin layer comprises the following components in percentage by weight: 45% of epoxy resin, 15% of silicone resin, 7% of phenolic resin and 33% of polyimide.
The high-strength polystyrene layer comprises the following components in percentage by weight: 55% of polystyrene, 15% of polyethylene, 15% of polyolefin, 14% of antioxidant and 1% of antistatic dispersant.
The antistatic dispersing agent comprises the following components in percentage by weight: 45% of carbon nano tube, 7% of polyacrylamide, 7% of sodium dodecyl sulfate and the balance of water.
A method for manufacturing a high-strength carrier tape includes the following steps:
s1, adding the carbon nano tube and a proper amount of organic solvent into a ball mill, fully grinding to obtain carbon nano tube slurry, adding the carbon nano tube slurry, polyacrylamide and sodium dodecyl sulfate into an ultrasonic dispersion machine, and ultrasonically dispersing for 18min to obtain the antistatic dispersing agent;
S2, adding the antistatic dispersing agent, the script laundry detergent, the polyethylene, the polyolefin and the antioxidant into a stirrer, stirring for 45min at the rotating speed of 400r/min, uniformly mixing, adding into a double-screw extruder, and extruding into a forming die to obtain an upper-layer carrier material;
S3, adding epoxy resin, organic silicon resin, phenolic resin and polyimide into a stirrer, stirring for 30min at the rotating speed of 130r/min to obtain thermosetting resin, and coating the thermosetting resin on the surface of a copper foil to obtain a lower-layer carrier tape material;
S4, respectively coating adhesive layers on the upper end face and the lower end face of the anti-static PC layer, placing the anti-static PC layer, the upper surface layer and the lower surface layer in a laminating machine from top to bottom in sequence to carry out hot pressing, and then baking for 60min at 180 ℃ to carry out curing to obtain the finished carrier tape.
Example three:
The utility model provides a high strength carrier band, includes basic unit, upper epidermis and lower top layer, the upper and lower both ends face of basic unit has all coated the viscose layer, upper epidermis and lower top layer are respectively through viscose layer fixed connection at the top and the bottom of basic unit, the upper epidermis is high strength polystyrene layer, the top layer is the copper foil layer down, the copper foil layer has thermosetting resin layer towards the one end surface coating of basic unit, and this department adopts the carrier band of copper foil layer to be applicable to the circumstances that require high, the carrier band degree of depth is less than 0.5mm simultaneously to electrically conductive and hardness, is greater than 0.5 mm's demand to the degree of depth, and the lower top layer of carrier band also can adopt high strength polystyrene layer.
The basic unit is antistatic PC layer.
the weight ratio of the upper surface layer, the base layer and the lower surface layer is 2: 5: 3.
The adhesive layer is any one of thermoplastic polyester adhesive, rubber modified epoxy adhesive and polyurethane adhesive.
The thermosetting resin layer comprises the following components in percentage by weight: 50% of epoxy resin, 10% of organic silicon resin, 5% of phenolic resin and 35% of polyimide.
The high-strength polystyrene layer comprises the following components in percentage by weight: 60% of polystyrene, 10% of polyethylene, 10% of polyolefin, 18% of antioxidant and 2% of antistatic dispersant.
the antistatic dispersing agent comprises the following components in percentage by weight: 50% of carbon nano tube, 5% of polyacrylamide, 5% of sodium dodecyl sulfate and the balance of water.
A method for manufacturing a high-strength carrier tape includes the following steps:
s1, adding the carbon nano tube and a proper amount of organic solvent into a ball mill, fully grinding to obtain carbon nano tube slurry, adding the carbon nano tube slurry, polyacrylamide and sodium dodecyl sulfate into an ultrasonic dispersion machine, and ultrasonically dispersing for 20min to obtain the antistatic dispersing agent;
S2, adding the antistatic dispersing agent, the script laundry detergent, the polyethylene, the polyolefin and the antioxidant into a stirrer, stirring for 30min at the rotating speed of 500r/min, uniformly mixing, adding into a double-screw extruder, and extruding into a forming die to obtain an upper-layer carrier material;
S3, adding epoxy resin, organic silicon resin, phenolic resin and polyimide into a stirrer, stirring for 20min at the rotating speed of 150r/min to obtain thermosetting resin, and coating the thermosetting resin on the surface of a copper foil to obtain a lower-layer carrier tape material;
S4, respectively coating adhesive layers on the upper end surface and the lower end surface of the anti-static PC layer, placing the anti-static PC layer, the upper surface layer and the lower surface layer in a laminating machine from top to bottom in sequence for hot pressing, and baking for 30min at 200 ℃ for curing to obtain the finished carrier tape.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (8)

1. the utility model provides a high strength carrier band, includes basic unit, upper epidermis and lower top layer, its characterized in that, the upper and lower both ends face of basic unit has all coated the viscose layer, upper epidermis and lower top layer are respectively through viscose layer fixed connection in the top and the bottom of basic unit, the upper epidermis is high strength polystyrene layer, the top layer is the copper foil layer down, the one end surface coating of copper foil layer towards the basic unit has the thermosetting resin layer.
2. the carrier tape of claim 1, wherein the base layer is an antistatic PC layer.
3. the carrier tape of claim 1, wherein the weight ratio of the top, base and bottom layers is 2: 5: 3.
4. The carrier tape of claim 1, wherein the adhesive layer is any one of thermoplastic polyester adhesive, rubber modified epoxy adhesive, and polyurethane adhesive.
5. The carrier tape of claim 1, wherein the thermosetting resin layer comprises the following components in weight percent: 40-50% of epoxy resin, 10-20% of organic silicon resin, 5-10% of phenolic resin and 30-35% of polyimide.
6. The carrier tape of claim 1, wherein the high strength polystyrene layer comprises the following components in weight percent: 50-60% of polystyrene, 10-20% of polyethylene, 10-20% of polyolefin, 9-18% of antioxidant and 1-2% of antistatic dispersing agent.
7. the high strength carrier tape of claim 6, wherein the antistatic dispersion comprises the following components in weight percent: 40-50% of carbon nano tube, 5-10% of polyacrylamide, 5-10% of sodium dodecyl sulfate and the balance of water.
8. The method of manufacturing a high-strength carrier tape according to any one of claims 1 to 7, comprising the steps of:
S1, adding the carbon nano tube and a proper amount of organic solvent into a ball mill, fully grinding to obtain carbon nano tube slurry, adding the carbon nano tube slurry, polyacrylamide and sodium dodecyl sulfate into an ultrasonic dispersion machine, and ultrasonically dispersing for 15-20min to obtain the antistatic dispersing agent;
S2, adding the antistatic dispersing agent, the script laundry detergent, the polyethylene, the polyolefin and the antioxidant into a stirrer, stirring for 30-60min at the rotating speed of 300-500r/min, uniformly mixing, adding into a double-screw extruder, and extruding into a forming die to obtain the upper-layer carrier material;
S3, adding epoxy resin, organic silicon resin, phenolic resin and polyimide into a stirrer, stirring for 20-40min at the rotating speed of 120-150r/min to obtain thermosetting resin, and coating the thermosetting resin on the surface of a copper foil to obtain a lower-layer carrier material;
s4, respectively coating adhesive layers on the upper end surface and the lower end surface of the anti-static PC layer, placing the anti-static PC layer, the upper surface layer and the lower surface layer in a laminating machine from top to bottom in sequence for hot pressing, and baking for 30-120min at 160-200 ℃ for curing to obtain the finished carrier tape.
CN201910869694.5A 2019-09-16 2019-09-16 high-strength carrier tape and manufacturing method thereof Pending CN110562603A (en)

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CN (1) CN110562603A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1628027A (en) * 2002-06-14 2005-06-15 电气化学工业株式会社 Sheet and electronic component packaging container
CN101316702A (en) * 2005-09-27 2008-12-03 葛兰素集团有限公司 Lid sheet for use in a blister pack
CN101475721A (en) * 2009-01-13 2009-07-08 浙江三和塑料有限公司 Antistatic plastic for SMT carrier band, and preparation and use thereof
CN102963064A (en) * 2012-02-29 2013-03-13 深圳光启创新技术有限公司 Metamaterial and preparation method thereof
CN109401654A (en) * 2017-09-12 2019-03-01 广东生益科技股份有限公司 A kind of encapsulation carrier band substrate, double interfaces carrier band and preparation method thereof
CN110001168A (en) * 2019-04-12 2019-07-12 江苏百惠电子新材料有限公司 A kind of antistatic carrier band and its manufacturing method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1628027A (en) * 2002-06-14 2005-06-15 电气化学工业株式会社 Sheet and electronic component packaging container
CN101316702A (en) * 2005-09-27 2008-12-03 葛兰素集团有限公司 Lid sheet for use in a blister pack
CN101475721A (en) * 2009-01-13 2009-07-08 浙江三和塑料有限公司 Antistatic plastic for SMT carrier band, and preparation and use thereof
CN102963064A (en) * 2012-02-29 2013-03-13 深圳光启创新技术有限公司 Metamaterial and preparation method thereof
CN109401654A (en) * 2017-09-12 2019-03-01 广东生益科技股份有限公司 A kind of encapsulation carrier band substrate, double interfaces carrier band and preparation method thereof
CN110001168A (en) * 2019-04-12 2019-07-12 江苏百惠电子新材料有限公司 A kind of antistatic carrier band and its manufacturing method

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Application publication date: 20191213

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