CN108728029A - A kind of production method of heat conductive insulating medium glued membrane - Google Patents
A kind of production method of heat conductive insulating medium glued membrane Download PDFInfo
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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Abstract
The present invention provides a kind of heat conductive insulating medium glued membranes, are made by following steps：One, polyurethane acrylate resin, hydroxyethyl methacrylate, photoinitiator and coupling agent are uniformly mixed, obtains glue A；Two, bisphenol A epoxide resin, cycloaliphatic epoxy resin, two amido diphenyl sulphone (DPS)s and boron trifluoride ethylamine are uniformly mixed, obtain glue liquid B, then glue A is added in glue liquid B and is uniformly mixed, obtains glue C；Three, different-grain diameter spherical shape SiC mixed powders are added in glue C and are uniformly mixed, obtain glue D, then glue D is evenly applied on release film, the heat conductive insulating medium glued membrane that can be used for metal substrate and high-density multi-layered wiring board is can be obtained after ultraviolet light curing process.The glued membrane flexibility that the present invention is produced is fabulous, and has many advantages, such as that thermal conductivity is high, dielectric constant is low, peel strength is big, breakdown voltage is high, resistance to dip solderability good after hot-press solidifying.
Description
Technical field
The invention belongs to metal substrates and high-density multi-layered wiring board encapsulating material technical field, and in particular to a kind of heat conduction
Dielectric glued membrane and its production method.
Background technology
With the rapid development of artificial intelligence, electronic product is also gradually to slimming, high-density development, this is to electronic product
The performances such as heat dissipation just propose requirements at the higher level.How to seek the best approach of heat dissipation and structure design, just becomes current electronics
One huge challenge of industrial design, and two that metal substrate and multilayer circuit board are undoubtedly solution heat dissipation and are thinned are big effectively
Means.Metal substrate is used mainly as large power supply, military electronic and high frequency microelectronic device and new-energy automobile illumination
Mainstream substrate, the comprehensive performance for how improving it has become the active demand in market.High-density multi-layered wiring board is usual
As the package substrate of the portable electronic products such as mobile phone, digital camera, laptop computer, IC package substrate is by there is core substrate
Development to thinner coreless substrate direction, but also focus and emphasis of the improvement of high-density multi-layered wiring board as research.
According to the publication of prediction industrial research institute《LED industry market is looked forward to the prospect reports with investment strategy planning application》Data are aobvious
Show, the permeability of global LED illumination in 2016 is 31% or so, it is contemplated that LED illumination market scale is up to 40,400,000,000 within 2017
Dollar, permeability is up to 37%, it is contemplated that the whole world 2017-2021 LED illumination annual compound growth rate is 12%, and metal substrate can
To account for 10% or so of the LED output values.
Materialogy meeting copper-clad plate association of China Electronics " 2016 years Chinese copper-clad plate industry survey Statistical Analysis Report " refers to
Go out, all kinds of copper-clad plate aggregated capacities in China in 2016 increase by a small margin 2.7% on year-on-year basis, and total output increases by 6.9% on a year-on-year basis, total sales volume and
Sales volume increases by 13.8% and 16.7% respectively on year-on-year basis.Due to the rapid development of portable electronic product, multilayer circuit board occupies
The market share also among continuous expand.
Metal substrate is a kind of metal base circuit board with good heat radiating function, is the extremely important base of printed circuit board
Plinth material.It is made of unique three-decker, specifically by circuit layer (copper foil), thermally conductive insulating layer and metal-based layer in high temperature
Under suppress.The core technology of high heat conduction type metal substrate is high heat conductive insulating medium glued membrane, it primarily serves bonding, electricity absolutely
Edge, heat conduction and the function of heat dissipation, this requires dielectric glued membrane with very well it is flexible simultaneously, solidification after should also have
There is the features such as thermal conductivity is high, dielectric constant is low, peel strength is big, breakdown voltage is high, resistance to Solder resistance good.As high heat conduction type metal
The core of substrate, dielectric glued membrane is generally mainly by epoxy resin, curing agent, accelerating agent, diluent, filler, dispersant etc.
Composition.The method that China makes high heat conductive insulating medium glued membrane generally use at present has the tape casting, scrapes roller method, silk screen process etc..
On the one hand it is compared with previous resin system due to high thermal conductive resin system, solid content higher, viscosity bigger；On the other hand
High thermal conductive resin system it is also desirable to have good flexibility, can serialization gluing, have after solidification good glass transformation temperature,
Thermal conductivity, breakdown voltage and peel strength, table body resistivity and dielectric properties are low, resistance to dip solderability will be good the features such as, this just gives exhausted
The composition of edge medium glued membrane and making bring huge challenge.In addition, these techniques can all use during making glued membrane
Volatile organic solvent, and the breakdown voltage, resistance to dip solderability and resistance to of metal substrate can be influenced by preparing glued membrane using organic solvent
Hou Xing.And it is solvent-free prepare high heat conductive insulating glued membrane technology and then only required adapt to solvent-free prepare high heat conductive insulating medium glued membrane
Resin system and particular process film build method.
China's metal substrate intermediate insulating layer mostly uses greatly glass-fiber-fabric epoxy prepreg, and thermal coefficient is about in 0.3W/
MK, yield have accounted for 70%, also prepare heat conductive insulating medium glued membrane using solvent method, but due to residual solvent presence and toughening
The reasons such as agent, breakdown voltage, thermal resistance and moisture-proof cannot reach the technology requirement of metal-based copper-clad plate needed for LED illuminations, make
LED life, weatherability, brightness and coloration substantially reduce, and the service life that cannot meet LED illumination, (the external LED illumination service life was up to 6~8
Ten thousand hours, and China was less than 20,000 hours) and reliability requirement.If according to illumination association of China for breakdown voltage " D-
48/50+D-0.5/23≤46kV/mm " is required, domestic metal-based copper-clad plate cannot all reach moisture-proof requirement.
China is the production and consumption big country of metal substrate, but because can not dash forward without advanced dielectric membrane technology
Break external monopolization.Foreign countries are entirely secrecy to metal substrate dielectric membrane technology, although domestic opened in this respect
Opened up the research of more than ten years, but the film forming of made dielectric glued membrane is bad, heat distortion temperature, thermal conductivity and peel strength according to
It is old relatively low, while the laundering period of dielectric glued membrane is shorter, cannot meet the needs of domestic high heat conduction type metal substrate.It is this
Dielectric glued membrane is mainly from U.S. Bei Gesi (Bergquist), Laird, Japan Electric chemical (DENKA) and TaiWan, China
Area's import.This has been considerably improved the cost of metal substrate, therefore researchs and develops the metal substrate with independent intellectual property right and produce
Industry correlation high added value auxiliary material is conducive to the complete and benign development of China's electronic industry chain, promotes China's photoelectron device
The production domesticization of part high-performance package material.
High-density multi-layered wiring board refers on insulating substrate or on traditional dual platen or multi-layer board, and coating is taken to insulate
Medium is forming conducting wire and connecting hole, such multiple stacking through electroless copper and electro-coppering, and accumulation forms the multilayer of the required number of plies
Printed wiring board.Traditional multilayer circuit board preparation process is that is, on copper-clad laminate surface, there is selection by subraction
Property remove part copper foil the method that obtains conductive pattern.This way process is more, control is difficult, of high cost.As high density is more
How the reduction of sandwich circuit board copper thickness ensures that the performance of multilayer circuit board becomes a difficult point.The scheme solved at present is
Semi-additive process (SAP) or half processing method of modified (MSAP), this is also current HDI (high density interconnected multilayer wiring board) most advanced
Technique is made.With portable electronic product high density, the development of slimming, market also proposes multilayer circuit board performance
Requirements at the higher level, and it is key technology prepared by high-density multi-layered wiring board wherein to bond the dielectric material used in insulating layer.
The key problem in technology of semi-additive process is laminated material -- insulating film material, that is, ABF thin-film materials, it is shadow
The widely applied key points and difficulties of HDI technologies are rung, it determines the performance, stability and reliability of high-density multi-layered wiring board.
Conventional multilayer wiring board mainly realizes bonding between layers using epoxy prepreg and resin coated copper foil.Glass-fiber-fabric half
Cured sheets are made of fiber impregnation epoxy resin, curing system and volatile solvent, so that solvent is volatilized by heating, asphalt mixtures modified by epoxy resin
Fat semi-solid preparation and obtain.Thickness (the glass-fiber-fabric prepreg thickness 70- of wiring board can be increased by being bonded using glass-fiber-fabric prepreg
120μm)；And the solvent of system remnants can also influence the breakdown voltage and weatherability of wiring board, cause finished product unstable；Meeting simultaneously
Multilayer circuit board is set the shortcomings that glass fiber wire drawing occur in drilling, perforating.Resin coated copper foil is in thin electrolytic copper foil (thickness one
As≤18 μm) roughening face on coat the resin glue of the special composition of one or two layers, typically modified epoxy, then with
Gluing machine production copper-clad plate bonding sheet is such, and solvent is sloughed through baking oven heat drying, and resin semi-solid preparation reaches B-stage and formed, and one
As resin layer thickness also at 30-100 μm.Either semi-solid preparation epoxy glass fabric or resin coated copper foil, they and copper foil layer
The lamination of pressure is all difficult to reach the requirement of fine-line, realizes that complete SAP and MSAP are excellent in terms of cost of manufacture from fine-line
Gesture is more obvious.SAP and MSAP technological requirement laminated films material will be in glass transformation temperature, dielectric constant, dielectric loss, stripping
Meet HDI requirements from power, shrinking percentage etc..
Current international HDI laminated materials are mainly the ABF/GX series of products of Japanese aginomoto company, separately there is Japan
The similar thin film lamination material of Plot water chemistry company, Taiwan ITRI also develop such material.China is circuit
Plate produces and big export country, but is not wiring board power, the wiring board in China in quality, manufacturing technology level with American-European, day
This similar product is compared, and there is also very big gaps.It is the low roughening degree in surface, low thermal expansion rate required by ABF thin-film materials, low
The characteristics such as dielectric loss and high glass transformation temperature, the country also cannot achieve at present, therefore the ABF thin-film materials in China are always
Dependent on import, this has been considerably improved the cost of multilayer circuit board, totally unfavorable to the sound development of China's circuit board industry.
Shown in sum up, there is an urgent need for a kind of heat conduction that disclosure satisfy that for metal substrate and high-density multi-layered wiring board of independent research
Dielectric glued membrane.
Invention content
Technical problem to be solved by the present invention lies in view of the above shortcomings of the prior art, provide a kind of heat conductive insulating Jie
Matter glued membrane and preparation method thereof.Heat conductive insulating medium glued membrane using this method production has good film-forming property, heat distortion temperature, heat
The characteristics of function admirables such as conductance, peel strength, disclosure satisfy that domestic high heat conduction type metal substrate and high-density multi-layered wiring board
Demand, application prospect is very extensive, be suitable for large-scale industrial production.
The present invention provides a kind of heat conductive insulating medium glued membrane, is made by following methods：
Step 1: in mass ratio by polyurethane acrylic resin, hydroxyethyl methacrylate, photoinitiator and coupling agent
(28~32): (60~65): (4~6): 1 is uniformly mixed, and obtains glue A；
Step 2: by epoxy resin, cycloaliphatic epoxy resin, two amido diphenyl sulphone (DPS)s and boron trifluoride ethylamine in mass ratio 40
: 60: (30~40): 1 is uniformly mixed, and obtains glue liquid B；
Step 3: by glue liquid B in mass ratio 1 described in glue A described in step 1 and step 2: (2.5~3) mixing
Uniformly, glue C is obtained；
It is uniformly mixed Step 4: different-grain diameter SiC mixed powders are added in glue C described in step 3, obtains glue D,
Then the glue D is evenly applied on release film, later by the glue D after coating under conditions of ultraviolet light into
Row ultraviolet light curing process, you can obtain the heat conductive insulating medium glued membrane.
Heat conductive insulating medium glued membrane of the present invention can be used for being used as heat conduction in metal substrate and high-density multi-layered wiring board
Dielectric glued membrane.
Heat conductive insulating medium glued membrane of the present invention, thermal coefficient are 5W/mK~15W/mK.
Heat conductive insulating medium glued membrane of the present invention, thickness are 100 μm.
The present invention also provides the production method of heat conductive insulating medium glued membrane simultaneously, and this approach includes the following steps：
Step 1: in mass ratio by polyurethane acrylic resin, hydroxyethyl methacrylate, photoinitiator and coupling agent
(28~32): (60~65): (4~6): 1 is uniformly mixed, and obtains glue A；
Step 2: by epoxy resin, cycloaliphatic epoxy resin, two amido diphenyl sulphone (DPS)s and boron trifluoride ethylamine in mass ratio 40
: 60: (30~40): 1 is uniformly mixed, and obtains glue liquid B；
Step 3: by glue liquid B in mass ratio 1 described in glue A described in step 1 and step 2: (2.5~3) mixing
Uniformly, glue C is obtained；
Step 4: by the SiC powder in mass ratio 90 of 5 μm and 1 μm of grain size:10 are uniformly mixed, then by mixed SiC powder
It is added in glue C described in step 3 and is uniformly mixed, obtain glue D, then the glue D is evenly applied on release film,
Later the glue D after coating is subjected to ultraviolet light curing process under conditions of ultraviolet light, obtains heat conductive insulating medium glue
Film；The thermal coefficient of the heat conductive insulating medium glued membrane is 5W/mK~15W/mK.
A kind of production method of above-mentioned heat conductive insulating medium glued membrane, photoinitiator described in step 1 are preferably light-initiated
Agent 184.
A kind of production method of above-mentioned heat conductive insulating medium glued membrane, coupling agent described in step 1 are preferably silane coupled
Agent KH-540.
The viscosity of a kind of production method of above-mentioned heat conductive insulating medium glued membrane, glue A described in step 1 is 900cps
~1000cps.
A kind of production method of above-mentioned heat conductive insulating medium glued membrane, epoxy resin described in step 2 are bisphenol-A type ring
Oxygen resin and cycloaliphatic epoxy resin 2021P, mass ratio 40: 60.
A kind of production method of above-mentioned heat conductive insulating medium glued membrane, the quality of SiC powder in glue D described in step 4
Percentage composition is 75%~80%.
A kind of production method of above-mentioned heat conductive insulating medium glued membrane, in SiC mixed powders described in step 45 μm of grain size and
The mass ratio of 1 μm of SiC powder is：90:10.
A kind of production method of above-mentioned heat conductive insulating medium glued membrane, the thickness of the glued membrane of heat conductive insulating medium described in step 4
Degree is 100 μm.
Use the method for heat conductive insulating medium glued membrane of the present invention production metal substrate for：Glued membrane is located in aluminum base layer and electricity
Between road floor (copper foil), first, 80 DEG C, soaking time 5min are warming up under 1.5MPa pressure, secondly under 4.5MPa pressure
Be warming up to 120 DEG C, soaking time 20min, then keep the temperature 30min at 6MPa pressure and 180 DEG C, finally in 6MPa pressure and
Soaking time 1.5h obtains metal substrate at 190 DEG C.
The present invention the mechanism of action be：The present invention uses two kinds of resins during producing high heat conductive insulating medium glued membrane
System：One is epoxy-resin systems, the present invention is screened by the type to curing agent and accelerating agent, finally uses diamines
Base diphenyl sulphone (DPS) is curing agent, uses boron trifluoride ethylamine for accelerating agent, and by being optimized to its dosage, make epoxy resin body
It ties up in glued membrane preparation process that the crosslinking reaction may not occur (only being crosslinked during follow-up hot pressing is for metal substrate), carries
Curing degree of the high epoxy systems in metal substrate preparation, storage stability, peel strength and resistance to dip solderability, to ensure
The stability of metal substrate quality；Another kind is ultraviolet using polyurethane acrylic resin as the acrylic acid photosensitive resin of key component
Photocuring system, acrylic acid photosensitive resin UV curing system are the film forming matters of glued membrane, by high heat conductive insulating medium-glue
After liquid D is coated on release film, photoinitiator generates living radical under the action of uv light, and living radical causes poly- ammonia
Unsaturated double-bond in ester acrylate and crosslinking agent is copolymerized conjunction reaction.Meanwhile free radical can also cause crosslinking agent
Double bond in monomer molecule, occur homopolymerization reaction, be allowed to after generating the larger homopolymer of relative molecular mass, then with line style knot
The polyurethane acrylate resin of structure is copolymerized, to realize crosslinking curing.During ultraviolet light solidification, it is coated on release film
Glue D can be converted into solid-state by liquid in a few seconds, to complete the film forming of high heat conductive insulating medium glued membrane.
Compared with the prior art, the present invention has the following advantages：
1, two kinds of resin systems, epoxy resin are used during present invention production high heat conductive insulating medium glued membrane
System can the crosslinking reaction may not occur in glued membrane preparation process, is only cured reaction during the substrate of pressed metal,
Curing degree, storage stability, peel strength and resistance to dip solderability of the epoxy systems in metal substrate preparation are improved, to protect
Demonstrate,prove the stability of metal substrate quality.
2, the present invention from epoxy resin solidifying system, acrylic acid photosensitive resin ultra-violet curing system type and dosage in terms of
It is screened and is optimized, and by studying each technological parameter for glue film performance such as density, hardness, tensile strength, screen resilience, stripping
From intensity, high-frequency dielectric constant, resistance to dip solderability etc. influence, be eventually developed it is a kind of it is high performance, meet high heat conduction type
The dielectric glued membrane of metal substrate and high-density multi-layered wiring board demand.Glued membrane produced by the invention has flexible well
Property, and have that thermal conductivity is high, dielectric constant is low, peel strength is big, breakdown voltage is high, the resistance to Solder resistance spies such as good after its heat cure
Point.
3, the viscosity of glue A produced by the invention is low, flexibility is good, volatility is small.Wherein, low viscosity can guarantee that glue is filled out
75% or more inorganic heat filling is filled, flexibility well can be in the compacting of the winding of dielectric glued membrane, transport and aluminum substrate
Cheng Zhongyou is operational well.
4, a kind of good film-forming property of independent research of the present invention, the function admirables such as heat distortion temperature, thermal conductivity, peel strength,
The production technology for meeting domestic high heat conduction type metal substrate and the heat conductive insulating medium glued membrane of high-density multi-layered wiring board demand, is answered
It is extensive with foreground, it is suitable for large-scale industrial production.
With reference to embodiment, invention is further described in detail.
Specific implementation mode
Embodiment 1
The production method of the present embodiment heat conductive insulating medium glued membrane includes the following steps：
Step 1: in mass ratio by polyurethane acrylate resin, hydroxyethyl methacrylate, photoinitiator and coupling agent
Be uniformly mixed at 30: 64: 5: 1, obtains glue A；The polyurethane acrylate resin, hydroxyethyl methacrylate, photoinitiator
It is existing commercially available product with coupling agent, photoinitiator is preferably photoinitiator 184, used coupling used by the present embodiment
Agent is preferably silane coupling agent KH-540, and used polyurethane acrylate resin is preferably what Sartomer of the U.S. produced
965 A80 of urethane acrylate CN；
Viscosity measurements are carried out to the glue A, the viscosity for measuring glue A is 900cps~1000cps；
Step 2: by epoxy resin, cycloaliphatic epoxy resin, diaminodiphenylsulfone and boron trifluoride ethylamine in mass ratio 40
: be uniformly mixed at 60: 35: 1, obtains glue liquid B；The epoxy resin, cycloaliphatic epoxy resin, two amido diphenyl sulphone (DPS)s and boron trifluoride
Ethamine is existing commercially available product, and the epoxy resin employed in the present embodiment is preferably the bis-phenol of Huan Ya Chemical Co., Ltd.s production
A type epoxy resin E126, used cycloaliphatic epoxy resin 2021P are the big of Japanese Daisel chemical industry Co., Ltd
Match fine jade CEL2021P；
Step 3: glue A described in step 1 is uniformly mixed with glue liquid B described in step 2 in mass ratio 1: 2.8,
Obtain glue C；
Step 4: the SiC powder in mass ratio 90 for being 5 μm and 1 μm by grain size:Glue C described in step 3 is added in 10 mixing
In be uniformly mixed, obtain SiC powder in glue D, the glue D mass percentage be 76%, it is then that the glue D is uniform
Coated on release film, ultraviolet light curing process is carried out later, obtains the heat conductive insulating medium glued membrane that thickness is 100 μm.
The performance data of the glued membrane of the present embodiment production is shown in Table 1.
The performance data of 1 embodiment of table, 1 heat conductive insulating medium glued membrane
The glued membrane that the present embodiment produces is located between aluminum base layer and circuit layer (copper foil), first, in 1.5MPa pressure
Under be warming up to 80 DEG C, soaking time 5min, secondly 120 DEG C are warming up under 4.5MPa pressure, then soaking time 20min exists
30min is kept the temperature at 6MPa pressure and 180 DEG C, finally soaking time 1.5h obtains metal substrate warp at 6MPa pressure and 190 DEG C
Detection, the heat conductive insulating medium glued membrane coefficient are 10W/mK, and breakdown voltage is more than 5kV, and resistance to immersed solder is more than 300S, peel strength
More than 1.5N/mm.It follows that the present embodiment production glued membrane, density, hardness, tensile strength, screen resilience, peel strength,
The function admirables such as high-frequency dielectric constant, thermal conductivity meet the associated specifications of high heat conduction type metal substrate.
Embodiment 2
The production method of the present embodiment heat conductive insulating medium glued membrane includes the following steps：
Step 1: in mass ratio by polyurethane acrylate resin, hydroxyethyl methacrylate, photoinitiator and coupling agent
Be uniformly mixed at 28: 60: 4: 1, obtains glue A；The polyurethane acrylate resin, hydroxyethyl methacrylate, photoinitiator
It is existing commercially available product with coupling agent, photoinitiator is preferably photoinitiator 184, used coupling used by the present embodiment
Agent is preferably silane coupling agent KH-540, and used polyurethane acrylate resin is preferably what Sartomer of the U.S. produced
966 H90 of urethane acrylate CN；
Viscosity measurements are carried out to the glue A, the viscosity for measuring glue A is 900cps~40:600cps；Step 2: will
Epoxy resin, cycloaliphatic epoxy resin, two amido diphenyl sulphone (DPS)s and boron trifluoride ethylamine in mass ratio 40: 60: 33: 1 are uniformly mixed,
Obtain glue liquid B；The epoxy resin, cycloaliphatic epoxy resin, two amido diphenyl sulphone (DPS)s and boron trifluoride ethylamine are existing commercially available
Product, the epoxy resin employed in the present embodiment are preferably the E128 bisphenol A type epoxy resins of Huan Ya Chemical Co., Ltd.s production,
Used cycloaliphatic epoxy resin 2021P is the Daicel CEL2021P of Japanese Daisel chemical industry Co., Ltd；
Step 3: glue A described in step 1 is uniformly mixed with glue liquid B described in step 2 in mass ratio 1: 2.5,
Obtain glue C；
Step 4: the SiC powder in mass ratio 90 for being 5 μm and 1 μm by grain size:10 are added after mixing described in step 3
It is uniformly mixed in glue C, the mass percentage for obtaining SiC powder in glue D, the glue D is 75%, then by the glue
D is evenly applied on release film, carries out ultraviolet light curing process later, obtains the heat conductive insulating medium glued membrane that thickness is 100 μm.
The performance data of the glued membrane of the present embodiment production is shown in Table 1.
The performance data of 2 embodiment of table, 2 heat conductive insulating medium glued membrane
The glued membrane that the present embodiment produces is located between aluminum base layer and circuit layer (copper foil), first, in 1.5MPa pressure
Under be warming up to 80 DEG C, soaking time 5min, secondly 120 DEG C are warming up under 4.5MPa pressure, then soaking time 20min exists
30min is kept the temperature at 6MPa pressure and 180 DEG C, finally soaking time 1.5h obtains metal substrate warp at 6MPa pressure and 190 DEG C
The thermal coefficient of detection, the metal substrate is 7.5W/mK, and breakdown voltage is more than 4.8kV, and resistance to immersed solder is more than 300S, and stripping is strong
Degree is more than 1.48N/mm.It follows that the glued membrane of the present embodiment production, density, hardness, tensile strength, screen resilience, stripping are strong
The function admirables such as degree, high-frequency dielectric constant, thermal conductivity meet the associated specifications of high heat conduction type metal substrate.
Embodiment 3
The production method of the present embodiment heat conductive insulating medium glued membrane includes the following steps：
Step 1: in mass ratio by polyurethane acrylate resin, hydroxyethyl methacrylate, photoinitiator and coupling agent
Be uniformly mixed at 32: 65: 6: 1, obtains glue A；The polyurethane acrylate resin, hydroxyethyl methacrylate, photoinitiator
It is existing commercially available product with coupling agent, photoinitiator is preferably photoinitiator 184, used coupling used by the present embodiment
Agent is preferably silane coupling agent KH-540, and used polyurethane acrylate resin is preferably Taiwan Changxing chemistry
The polyurethane acrylate resin 6148J75 of industrial group's production；
Viscosity measurements are carried out to the glue A, the viscosity for measuring glue A is 900cps~1000cps；
Step 2: by epoxy resin, cycloaliphatic epoxy resin, two amido diphenyl sulphone (DPS)s and boron trifluoride ethylamine in mass ratio 40
: be uniformly mixed at 60: 40: 1, obtains glue liquid B；The epoxy resin, cycloaliphatic epoxy resin, two amido diphenyl sulphone (DPS)s and boron trifluoride
Ethamine is existing commercially available product, and the epoxy resin employed in the present embodiment is preferably the bis-phenol of Huan Ya Chemical Co., Ltd.s production
A type epoxy resin E127, used cycloaliphatic epoxy resin 2021P are the Tao Shi ERL4221 of Dow Chemical；Step
Three, glue A described in step 1 is uniformly mixed with glue liquid B described in step 2 in mass ratio 1: 3, obtains glue C；
Step 4: the SiC powder in mass ratio 90 for being 5 μm and 1 μm by grain size:10 are added after mixing described in step 3
It is uniformly mixed in glue C, the mass percentage for obtaining SiC powder in glue D, the glue D is 80%, then by the glue
D is evenly applied on release film, carries out ultraviolet light curing process later, obtains the heat conductive insulating medium glued membrane that thickness is 100 μm.
The performance data of the glued membrane of the present embodiment production is shown in Table 3.
The performance data of 3 embodiment of table, 3 heat conductive insulating medium glued membrane
The glued membrane that the present embodiment produces is located between aluminum base layer and circuit layer (copper foil), first, in 1.5MPa pressure
Under be warming up to 80 DEG C, soaking time 5min, secondly 120 DEG C are warming up under 4.5MPa pressure, then soaking time 20min exists
30min is kept the temperature at 6MPa pressure and 180 DEG C, finally soaking time 1.5h obtains metal substrate at 6MPa pressure and 190 DEG C.Through
Detection, metal substrate thermal coefficient are 15W/mK, and breakdown voltage is more than 4.9kV, and resistance to immersed solder is more than 300S, and peel strength is more than
1.4N/mm.It follows that the glued membrane of the present embodiment production, density, hardness, tensile strength, screen resilience, peel strength, high frequency
The function admirables such as dielectric constant, thermal conductivity meet the associated specifications of high heat conduction type metal substrate.
Embodiment 4
The production method of the present embodiment heat conductive insulating medium glued membrane includes the following steps：
Step 1: in mass ratio by polyurethane acrylate resin, hydroxyethyl methacrylate, photoinitiator and coupling agent
Be uniformly mixed at 28: 60: 6: 1, obtains glue A；The polyurethane acrylate resin, hydroxyethyl methacrylate, photoinitiator
It is existing commercially available product with coupling agent, photoinitiator is preferably photoinitiator 184, used coupling used by the present embodiment
Agent is preferably silane coupling agent KH-540, and used polyurethane acrylate resin is preferably what Sartomer of the U.S. produced
966 J75 of urethane acrylate CN；
Viscosity measurements are carried out to the glue A, the viscosity for measuring glue A is 900cps~1000cps；
Step 2: by epoxy resin, cycloaliphatic epoxy resin, two amido diphenyl sulphone (DPS)s and boron trifluoride ethylamine in mass ratio 40
: be uniformly mixed at 60: 38: 1, obtains glue liquid B；The epoxy resin, cycloaliphatic epoxy resin, two amido diphenyl sulphone (DPS)s and boron trifluoride
Ethamine is existing commercially available product, and the epoxy resin employed in the present embodiment is preferably the bis-phenol of Huan Ya Chemical Co., Ltd.s production
A type epoxy resin E126, used cycloaliphatic epoxy resin 2021P are the big of Japanese Daisel chemical industry Co., Ltd
Match fine jade CEL2021P；
Step 3: glue A described in step 1 is uniformly mixed with glue liquid B described in step 2 in mass ratio 1: 2.6,
Obtain glue C；
Step 4: the SiC powder in mass ratio 90 for being 5 μm and 1 μm by grain size:10 are added after mixing described in step 3
It is uniformly mixed in glue C, the mass percentage for obtaining SiC powder in glue D, the glue D is 78%, then by the glue
D is evenly applied on release film, carries out ultraviolet light curing process later, obtains the heat conductive insulating medium glued membrane that thickness is 100 μm.
The performance data of the glued membrane of the present embodiment production is shown in Table 4.
The performance data of 4 embodiment of table, 4 heat conductive insulating medium glued membrane
The glued membrane that the present embodiment produces is located between aluminum base layer and circuit layer (copper foil), first, in 1.5MPa pressure
Under be warming up to 80 DEG C, soaking time 5min, secondly 120 DEG C are warming up under 4.5MPa pressure, then soaking time 20min exists
30min is kept the temperature at 6MPa pressure and 180 DEG C, finally soaking time 1.5h obtains metal substrate at 6MPa pressure and 190 DEG C.Through
Detection, metal substrate thermal coefficient are 13W/mK, and breakdown voltage is more than 4.7kV, and resistance to immersed solder is more than 300S, and peel strength is more than
1.46N/mm.It follows that the glued membrane of the present embodiment production, density, hardness, tensile strength, screen resilience, peel strength, height
The function admirables such as frequency dielectric constant, thermal conductivity meet the associated specifications of high heat conduction type metal substrate.
Embodiment 5
The production method of the present embodiment heat conductive insulating medium glued membrane includes the following steps：
Step 1: polyurethane acrylate resin, hydroxyethyl methacrylate, photoinitiator and coupling agent are pressed quality
Than:30:64：Be uniformly mixed at 5: 1, obtains glue A；It is the polyurethane acrylate resin, hydroxyethyl methacrylate, light-initiated
Agent and coupling agent are existing commercially available product, and photoinitiator is preferably photoinitiator 184, used idol used by the present embodiment
It is preferably silane coupling agent KH-540 to join agent, and used polyurethane acrylate resin is preferably the long Xinghua in Taiwan
Learn the polyurethane acrylate resin 6148J75 of industrial group's production；
Viscosity measurements are carried out to the glue A, the viscosity for measuring glue A is 900cps~1000cps；
Step 2: by epoxy resin, cycloaliphatic epoxy resin, two amido diphenyl sulphone (DPS)s and boron trifluoride ethylamine in mass ratio 40
: be uniformly mixed at 60: 31: 1, obtains glue liquid B；The epoxy resin, cycloaliphatic epoxy resin, two amido diphenyl sulphone (DPS)s and boron trifluoride
Ethamine is existing commercially available product, and the epoxy resin employed in the present embodiment is preferably the bis-phenol of Huan Ya Chemical Co., Ltd.s production
A type epoxy resin E110, used cycloaliphatic epoxy resin 2021P are the big of Japanese Daisel chemical industry Co., Ltd
Match fine jade CEL2021P；
Step 3: glue A described in step 1 is uniformly mixed with glue liquid B described in step 2 in mass ratio 1: 2.8,
Obtain glue C；
Step 4: the SiC powder in mass ratio 90 for being 5 μm and 1 μm by grain size:10 are added after mixing described in step 3
It is uniformly mixed in glue C, the mass percentage for obtaining SiC powder in glue D, the glue D is 76%, then by the glue
D is evenly applied on release film, carries out ultraviolet light curing process later, obtains the heat conductive insulating medium glued membrane that thickness is 100 μm.
The performance data of the glued membrane of the present embodiment production is shown in Table 1.
The performance data of 5 embodiment of table, 5 heat conductive insulating medium glued membrane
The glued membrane that the present embodiment produces is located between aluminum base layer and circuit layer (copper foil), first, in 1.5MPa pressure
Under be warming up to 80 DEG C, soaking time 5min, secondly 120 DEG C are warming up under 4.5MPa pressure, then soaking time 20min exists
30min is kept the temperature at 6MPa pressure and 180 DEG C, finally soaking time 1.5h obtains metal substrate at 6MPa pressure and 190 DEG C.Through
The thermal coefficient of detection, the metal substrate is 8W/mK, and breakdown voltage is more than 5kV, and resistance to immersed solder is more than 300S, and peel strength is big
In 1.5N/mm.It follows that the glued membrane of the present embodiment production, density, hardness, tensile strength, screen resilience, peel strength, height
The function admirables such as frequency dielectric constant, thermal conductivity meet the associated specifications of high heat conduction type metal substrate.
Embodiment 6
The production method of the present embodiment heat conductive insulating medium glued membrane includes the following steps：
Step 1: in mass ratio by polyurethane acrylate resin, hydroxyethyl methacrylate, photoinitiator and coupling agent
Be uniformly mixed at 30: 64: 5: 1, obtains glue A；The polyurethane acrylate resin, hydroxyethyl methacrylate, photoinitiator
It is existing commercially available product with coupling agent, photoinitiator is preferably photoinitiator 184, used coupling used by the present embodiment
Agent is preferably silane coupling agent KH-540, and used polyurethane acrylate resin is preferably what Sartomer of the U.S. produced
966 J75 of urethane acrylate CN；
Viscosity measurements are carried out to the glue A, the viscosity for measuring glue A is 900cps~1000cps；
Step 2: by epoxy resin, cycloaliphatic epoxy resin, two amido diphenyl sulphone (DPS)s and boron trifluoride ethylamine in mass ratio 40
: be uniformly mixed at 60: 34: 1, obtains glue liquid B；The epoxy resin, cycloaliphatic epoxy resin, two amido diphenyl sulphone (DPS)s and boron trifluoride
Ethamine is existing commercially available product, and the epoxy resin employed in the present embodiment is preferably the bis-phenol of Huan Ya Chemical Co., Ltd.s production
A type epoxy resin E126, used cycloaliphatic epoxy resin 2021P are the Tao Shi ERL4221 of Dow Chemical；Step
Three, glue A described in step 1 is uniformly mixed with glue liquid B described in step 2 in mass ratio 1: 3, obtains glue C；
Step 4: the SiC powder in mass ratio 90 for being 5 μm and 1 μm by grain size:10 are added after mixing described in step 3
It is uniformly mixed in glue C, the mass percentage for obtaining SiC powder in glue D, the glue D is 77%, then by the glue
D is evenly applied on release film, carries out ultraviolet light curing process later, obtains the heat conductive insulating medium glued membrane that thickness is 100 μm.
The performance data of the glued membrane of the present embodiment production is shown in Table 6.
The performance data of 6 embodiment of table, 6 heat conductive insulating medium glued membrane
The glued membrane that the present embodiment produces is located between aluminum base layer and circuit layer (copper foil), first, in 1.5MPa pressure
Under be warming up to 80 DEG C, soaking time 5min, secondly 120 DEG C are warming up under 4.5MPa pressure, then soaking time 20min exists
30min is kept the temperature at 6MPa pressure and 180 DEG C, finally soaking time 1.5h obtains metal substrate at 6MPa pressure and 190 DEG C.Through
The thermal coefficient of detection, the metal substrate is 11.2W/mK, and breakdown voltage is more than 5kV, and resistance to immersed solder is more than 300S, peel strength
More than 1.5N/mm.It follows that the present embodiment production glued membrane, density, hardness, tensile strength, screen resilience, peel strength,
The function admirables such as high-frequency dielectric constant, thermal conductivity meet the associated specifications of high heat conduction type metal substrate.
The above is only presently preferred embodiments of the present invention, is not imposed any restrictions to the present invention.It is every according to invention skill
Art essence still falls within technical solution of the present invention to any simple modification, change and equivalence change made by above example
Protection domain in.
Claims (9)
1. a kind of heat conductive insulating medium glued membrane, which is characterized in that be made by following methods：
Step 1: by polyurethane acrylic resin, hydroxyethyl methacrylate, photoinitiator and coupling agent in mass ratio (28~
32): (60~65): (4~6): 1 is uniformly mixed, and obtains glue A；
Step 2: by epoxy resin, cycloaliphatic epoxy resin, two amido diphenyl sulphone (DPS)s and boron trifluoride ethylamine in mass ratio 40: 60:
(30~40): 1 is uniformly mixed, and obtains glue liquid B；
Step 3: by glue liquid B in mass ratio 1 described in glue A described in step 1 and step 2: (2.5~3) are uniformly mixed,
Obtain glue C；
It is uniformly mixed Step 4: different-grain diameter SiC mixed powders are added in glue C described in step 3, obtains glue D, then
The glue D is evenly applied on release film, is later carried out the glue D after coating under conditions of ultraviolet light ultraviolet
Photocuring processing, you can obtain the heat conductive insulating medium glued membrane.
2. heat conductive insulating medium glued membrane described in claim 1 can be used for being used as heat conduction in metal substrate and high-density multi-layered wiring board
Dielectric glued membrane.
3. heat conductive insulating medium glued membrane according to claim 1, which is characterized in that its thermal coefficient is 5W/mK~15W/
m·K。
4. heat conductive insulating medium glued membrane according to claim 1, which is characterized in that its thickness is 100 μm.
5. a kind of production method of heat conductive insulating medium glued membrane, this method mainly have following steps：
Step 1: by polyurethane acrylic resin, hydroxyethyl methacrylate, photoinitiator and coupling agent in mass ratio (28~
32): (60~65): (4~6): 1 is uniformly mixed, and obtains glue A；
Step 2: by epoxy resin, cycloaliphatic epoxy resin, two amido diphenyl sulphone (DPS)s and boron trifluoride ethylamine in mass ratio 40: 60:
(30~40): 1 is uniformly mixed, and obtains glue liquid B；
Step 3: by glue liquid B in mass ratio 1 described in glue A described in step 1 and step 2: (2.5~3) are uniformly mixed,
Obtain glue C；
It is uniformly mixed Step 4: different-grain diameter SiC mixed powders are added in glue C described in step 3, obtains glue D, then
The glue D is evenly applied on release film, is later carried out the glue D after coating under conditions of ultraviolet light ultraviolet
Photocuring processing, obtains the heat conductive insulating medium glued membrane that can be used for metal substrate and high-density multi-layered wiring board.
6. a kind of production method of heat conductive insulating medium glued membrane according to claim 5, which is characterized in that institute in step 1
It is photoinitiator 184 to state photoinitiator.
7. a kind of production method of heat conductive insulating medium glued membrane according to claim 5, which is characterized in that institute in step 1
It is silane coupling agent KH-540 to state coupling agent.
8. a kind of production method of heat conductive insulating medium glued membrane according to claim 5, which is characterized in that institute in step 1
The viscosity for stating glue A is 900cps~1000cps.
9. a kind of production method of heat conductive insulating medium glued membrane according to claim 5, which is characterized in that institute in step 4
The mass percentage for stating SiC powder in glue D is 75%~80%；5 μm and 1 μm SiC powder of grain size in the SiC mixed powders
Mass ratio is：90:10.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113046009A (en) * | 2021-04-01 | 2021-06-29 | 青岛汇元海泰电子有限公司 | Glue solution for coating television circuit board and preparation method thereof |
| CN116622320A (en) * | 2023-07-25 | 2023-08-22 | 广州硅芯材料科技有限公司 | Mini LED screen packaging adhesive film, preparation method and packaging method |
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| TW201033316A (en) * | 2008-12-11 | 2010-09-16 | Cheil Ind Inc | Composition for circuit connection film and circuit connection film using the same |
| CN105062006A (en) * | 2015-08-28 | 2015-11-18 | 西安科技大学 | Method for producing aluminum-based copper-clad laminate highly-thermally conductive and insulating medium glue film |
| CN105199619A (en) * | 2015-09-21 | 2015-12-30 | 金安国纪科技（珠海）有限公司 | Method for preparing high-thermal-conductivity coating for aluminum-based copper-clad plate |
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| TW201033316A (en) * | 2008-12-11 | 2010-09-16 | Cheil Ind Inc | Composition for circuit connection film and circuit connection film using the same |
| CN105062006A (en) * | 2015-08-28 | 2015-11-18 | 西安科技大学 | Method for producing aluminum-based copper-clad laminate highly-thermally conductive and insulating medium glue film |
| CN105199619A (en) * | 2015-09-21 | 2015-12-30 | 金安国纪科技（珠海）有限公司 | Method for preparing high-thermal-conductivity coating for aluminum-based copper-clad plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113046009A (en) * | 2021-04-01 | 2021-06-29 | 青岛汇元海泰电子有限公司 | Glue solution for coating television circuit board and preparation method thereof |
| CN113046009B (en) * | 2021-04-01 | 2022-07-08 | 青岛汇元海泰电子有限公司 | Glue solution for coating television circuit board and preparation method thereof |
| CN116622320A (en) * | 2023-07-25 | 2023-08-22 | 广州硅芯材料科技有限公司 | Mini LED screen packaging adhesive film, preparation method and packaging method |
| CN116622320B (en) * | 2023-07-25 | 2023-10-10 | 广州硅芯材料科技有限公司 | Mini LED screen packaging adhesive film, preparation method and packaging method |
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