CN113046009B - Glue solution for coating television circuit board and preparation method thereof - Google Patents
Glue solution for coating television circuit board and preparation method thereof Download PDFInfo
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- CN113046009B CN113046009B CN202110356777.1A CN202110356777A CN113046009B CN 113046009 B CN113046009 B CN 113046009B CN 202110356777 A CN202110356777 A CN 202110356777A CN 113046009 B CN113046009 B CN 113046009B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C—CHEMISTRY; METALLURGY
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- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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Abstract
The invention discloses glue solution for coating a television circuit board and a preparation method thereof, and particularly relates to the technical field of circuit board glue solution, wherein the glue solution comprises component A liquid and component B liquid, wherein the component A liquid comprises epoxy resin, a curing agent, pyrolytic graphite, nano silicon dioxide and an organic solvent; the component B liquid comprises polyurethane, a curing accelerator, nano-cellulose, hexagonal boron nitride micro-sheets and an organic solvent. The invention can effectively improve the heat resistance and high temperature resistance of the glue solution, can effectively ensure the toughness, flexibility and protection effect of the glue solution on a circuit board in a high-temperature environment, can avoid the glue solution from being dried and hardened in the high-temperature environment when being coated on the circuit board, can effectively compound double modification treatment on the basis of ensuring the self performance of the epoxy resin, can effectively compound double modification treatment on the basis of ensuring the self performance of polyurethane, and can effectively enhance the heat resistance and stability of the component A liquid and the component B liquid.
Description
Technical Field
The invention relates to the technical field of circuit board glue solution, in particular to glue solution for coating a television circuit board and a preparation method thereof.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. Circuit boards are commonly used in home appliances. The circuit board is mainly composed of a bonding pad, a through hole, a mounting hole, a lead, a component, a connector assembly, filling, an electrical boundary and the like. In the processing process of the circuit board, glue solution is often used for coating treatment, the glue solution is circuit board pouring sealant, the circuit board pouring sealant has stable dielectric insulation property, is an effective guarantee for preventing environmental pollution, and can eliminate stress generated by impact and vibration within a large temperature and humidity range. The circuit board pouring sealant is based on a condensation system and an addition curing system, does not need secondary curing, can meet the special requirements of bonding, heat conduction, flame retardance, high transparency and the like, and becomes a flexible elastomer after curing; the curing speed is uniform and is irrelevant to the encapsulation thickness and the sealing degree of the environment. The circuit board pouring sealant is also called as: the circuit board is encapsulated with silica gel, the circuit board is encapsulated with silicon rubber, and the circuit board is encapsulated with silicon rubber.
The existing glue solution for coating the television circuit board has poor heat resistance, is easy to dry and harden when used in a high-temperature environment, and reduces the protection effect on the circuit board.
Disclosure of Invention
In order to overcome the above defects in the prior art, embodiments of the present invention provide a glue solution for coating a television circuit board and a preparation method thereof.
In order to achieve the purpose, the invention provides the following technical scheme: a glue solution for coating a television circuit board comprises an A component liquid and a B component liquid, wherein the A component liquid and the B component liquid are formed according to the weight ratio of 10: 1, and the A component liquid comprises the following components in percentage by weight: 48.56-50.24% of epoxy resin, 5.64-6.16% of curing agent, 2.15-2.65% of pyrolytic graphite, 2.56-2.74% of nano silicon dioxide and the balance of organic solvent; the component B liquid comprises the following components in percentage by weight: 56.64-57.26% of polyurethane, 4.50-5.30% of curing accelerator, 15.43-17.57% of nano cellulose, 12.25-12.65% of hexagonal boron nitride micro-tablets and the balance of organic solvent.
Further, the component A liquid comprises the following components in percentage by weight: 48.56 percent of epoxy resin, 5.64 percent of curing agent, 2.15 percent of pyrolytic graphite, 2.56 percent of nano silicon dioxide and 41.09 percent of organic solvent; the component B liquid comprises the following components in percentage by weight: 56.64% of polyurethane, 4.50% of curing accelerator, 15.43% of nanocellulose, 12.25% of hexagonal boron nitride micro-tablets and 11.18% of organic solvent.
Further, the component A liquid comprises the following components in percentage by weight: 50.24% of epoxy resin, 6.16% of curing agent, 2.65% of pyrolytic graphite, 2.74% of nano silicon dioxide and 38.21% of organic solvent; the component B liquid comprises the following components in percentage by weight: 57.26% of polyurethane, 5.30% of curing accelerator, 17.57% of nanocellulose, 12.65% of hexagonal boron nitride micro-tablets and 7.22% of organic solvent.
Further, the component A liquid comprises the following components in percentage by weight: 49.40% of epoxy resin, 5.90% of curing agent, 2.40% of pyrolytic graphite, 2.65% of nano silicon dioxide and 39.65% of organic solvent; the component B liquid comprises the following components in percentage by weight: 56.95% of polyurethane, 4.90% of curing accelerator, 16.50% of nanocellulose, 12.45% of hexagonal boron nitride micro-tablets and 9.20% of organic solvent.
Further, the curing agent is dicyandiamide solution, the curing accelerator is 2-methylimidazole, and the organic solvent is one or more of N-methylpyrrolidone (NMP), Ethylene Glycol (EG), N-butanol and terpineol.
The invention also provides a preparation method of the glue solution for coating the television circuit board, which comprises the following specific preparation steps:
the method comprises the following steps: weighing the epoxy resin, the curing agent, the pyrolytic graphite, the nano silicon dioxide and the organic solvent in the component A liquid, and the polyurethane, the curing accelerator, the nano cellulose, the hexagonal boron nitride micro-tablets and the organic solvent in the component B liquid according to the weight percentage;
step two: mechanically stirring, mixing and heating pyrolytic graphite in the liquid raw material of the component A in the step one, one third of epoxy resin and organic solvent in parts by weight for 30-40 min, and simultaneously performing ultrasonic oscillation treatment to obtain a modified base liquid a;
step three: mechanically stirring, mixing and heating the nano-silica in the liquid raw material of the component A, one third of epoxy resin and organic solvent by weight for 30-40 min, and simultaneously performing ultrasonic oscillation treatment to obtain a modified base solution b;
step four: mechanically stirring, mixing and heating the modified base liquid a prepared in the step two, the modified base liquid b prepared in the step three and the residual curing agent, epoxy resin and organic solvent in the component liquid raw materials in the step one for 50-60 min, and simultaneously performing ultrasonic oscillation treatment to obtain a component liquid A;
step five: mechanically stirring, mixing and heating the nano-cellulose in the liquid raw material of the component B in the step one, one third of polyurethane and an organic solvent in parts by weight for 20-30 min, and simultaneously performing ultrasonic oscillation treatment to obtain a modified base liquid c;
step six: mechanically stirring, mixing and heating the hexagonal boron nitride micro-tablets in the liquid raw material of the component B in the step one, one third of polyurethane and an organic solvent in parts by weight for 20-30 min, and simultaneously performing ultrasonic oscillation treatment to obtain a modified base liquid d;
step seven: mechanically stirring, mixing and heating the modified base liquid c prepared in the fifth step, the modified base liquid d prepared in the sixth step and the residual polyurethane, the curing accelerator and the organic solvent in the liquid raw materials of the component B in the first step for 30-40 min, and simultaneously performing ultrasonic oscillation treatment to obtain a component B liquid;
step eight: and (4) fully performing heating mechanical stirring and mixing on the component A liquid prepared in the fourth step and the component B liquid prepared in the seventh step according to the weight ratio of 10: 1 to prepare the glue solution for coating the television circuit board.
Further, the heating temperature in the second step and the third step is 50-60 ℃, the heating temperature in the fourth step is 70-80 ℃, the heating temperature in the fifth step and the sixth step is 60-70 ℃, the heating temperature in the seventh step is 80-90 ℃, and the heating temperature in the eighth step is 70-80 ℃.
Further, the heating temperature in step two and step three was 50 ℃, the heating temperature in step four was 70 ℃, the heating temperature in step five and step six was 60 ℃, the heating temperature in step seven was 80 ℃, and the heating temperature in step eight was 70 ℃.
Further, the heating temperature in step two and step three was 60 ℃, the heating temperature in step four was 80 ℃, the heating temperature in step five and step six was 70 ℃, the heating temperature in step seven was 90 ℃, and the heating temperature in step eight was 80 ℃.
Further, the heating temperature in step two and step three was 55 ℃, the heating temperature in step four was 75 ℃, the heating temperature in step five and step six was 65 ℃, the heating temperature in step seven was 85 ℃, and the heating temperature in step eight was 75 ℃.
The invention has the technical effects and advantages that:
1. the glue solution for coating the television circuit board, which is prepared by adopting the raw material formula, can effectively improve the heat resistance and high temperature resistance in the glue solution for coating the circuit board, and can effectively ensure the toughness and flexibility of the glue solution in a high-temperature environment and the protection effect on the circuit board; the pyrolytic graphite is doped in the epoxy resin, so that the high-temperature resistance and the sealing performance of the epoxy resin can be effectively enhanced; the nano silicon dioxide is more uniformly distributed in the glue solution; the high-temperature-resistant and anti-deformation glue has good reinforcing and thickening effects, so that the high-temperature resistance and the material stability of the glue can be further improved, and the toughness, the flexibility and the anti-deformation performance of the glue are further ensured; the nano-cellulose can effectively enhance the flexibility and toughness of the glue solution; the hexagonal boron nitride micro-sheet can remarkably improve the thermal conductivity of the glue solution and can keep the electrical insulation, thereby effectively improving the high-temperature resistance of the glue solution, avoiding the occurrence of dry and harden in a high-temperature environment when the glue solution is coated on a circuit board, and ensuring the toughness and flexibility of the glue solution, thereby ensuring the protection effect on the circuit board;
2. in the process of preparing the glue solution for coating the television circuit board, in the second step, the pyrolytic graphite and one third of epoxy resin are subjected to mixed modification treatment, and the performance of the pyrolytic graphite is compounded into the epoxy resin, so that the performance of the epoxy resin can be effectively enhanced; in the third step, the nano silicon dioxide and one third of epoxy resin are mixed and modified, and the performance of the nano silicon dioxide is compounded into the epoxy resin, so that the performance of the epoxy resin can be effectively enhanced; in the fourth step, the modified base liquid and the rest raw materials are mixed, so that double modification treatment can be effectively compounded on the basis of ensuring the self performance of the epoxy resin, and the heat resistance and stability of the component A liquid can be effectively enhanced; in the fifth step, mixing modification treatment is carried out on the nanocellulose and one third of polyurethane, so that the performance of the nanocellulose is compounded into the polyurethane, and the performance of the polyurethane can be effectively enhanced; in the sixth step, the hexagonal boron nitride micro-sheets and one third of polyurethane are subjected to mixing modification treatment, and the performance of the hexagonal boron nitride micro-sheets is compounded into the polyurethane, so that the performance of the polyurethane can be effectively enhanced; and seventhly, mixing the modified base liquid and the rest raw materials, so that double modification treatment can be effectively compounded on the basis of ensuring the self performance of polyurethane, and the heat resistance and stability of the component B liquid can be effectively enhanced.
Detailed Description
The following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
the invention provides glue solution for coating a television circuit board, which comprises A component liquid and B component liquid, wherein the A component liquid and the B component liquid are formed according to the weight ratio of 10: 1, and the A component liquid comprises the following components in percentage by weight: 48.56 percent of epoxy resin, 5.64 percent of curing agent, 2.15 percent of pyrolytic graphite, 2.56 percent of nano silicon dioxide and 41.09 percent of organic solvent; the component B liquid comprises the following components in percentage by weight: 56.64% of polyurethane, 4.50% of a curing accelerator, 15.43% of nanocellulose, 12.25% of hexagonal boron nitride micro-tablets and 11.18% of an organic solvent;
the curing agent is dicyandiamide solution, the curing accelerator is 2-methylimidazole, and the organic solvent is one or more of N-methylpyrrolidone (NMP), Ethylene Glycol (EG), N-butanol and terpineol;
the invention also provides a preparation method of the glue solution for coating the television circuit board, which comprises the following specific preparation steps:
the method comprises the following steps: weighing the epoxy resin, the curing agent, the pyrolytic graphite, the nano silicon dioxide and the organic solvent in the component A liquid, and the polyurethane, the curing accelerator, the nano cellulose, the hexagonal boron nitride micro-tablets and the organic solvent in the component B liquid according to the weight percentage;
step two: mechanically stirring, mixing and heating pyrolytic graphite in the liquid raw material of the component A in the step one, one third of epoxy resin and organic solvent in parts by weight for 30-40 min, and simultaneously performing ultrasonic oscillation treatment to obtain a modified base liquid a;
step three: mechanically stirring, mixing and heating the nano silicon dioxide in the liquid raw material of the component A, one third of epoxy resin and organic solvent by weight for 30-40 min, and simultaneously performing ultrasonic oscillation treatment to obtain a modified base liquid b;
step four: mechanically stirring, mixing and heating the modified base liquid a prepared in the step two, the modified base liquid b prepared in the step three and the residual curing agent, epoxy resin and organic solvent in the component liquid raw materials in the step one for 50-60 min, and simultaneously performing ultrasonic oscillation treatment to obtain a component liquid A;
step five: mechanically stirring, mixing and heating the nano-cellulose in the liquid raw material of the component B in the step one, one third of polyurethane and an organic solvent in parts by weight for 20-30 min, and simultaneously performing ultrasonic oscillation treatment to obtain a modified base liquid c;
step six: mechanically stirring, mixing and heating the hexagonal boron nitride micro-tablets in the liquid raw material of the component B in the step one, one third of polyurethane and an organic solvent in parts by weight for 20-30 min, and simultaneously performing ultrasonic oscillation treatment to obtain a modified base liquid d;
step seven: mechanically stirring, mixing and heating the modified base liquid c prepared in the fifth step, the modified base liquid d prepared in the sixth step and the residual polyurethane, the curing accelerator and the organic solvent in the liquid raw materials of the component B in the first step for 30-40 min, and simultaneously performing ultrasonic oscillation treatment to obtain a component B liquid;
step eight: and (4) fully performing heating mechanical stirring and mixing on the component A liquid prepared in the fourth step and the component B liquid prepared in the seventh step according to the weight ratio of 10: 1 to prepare the glue solution for coating the television circuit board.
The heating temperature in step two and step three was 50 ℃, the heating temperature in step four was 70 ℃, the heating temperature in step five and step six was 60 ℃, the heating temperature in step seven was 80 ℃ and the heating temperature in step eight was 70 ℃.
Example 2:
different from the embodiment 1, the component A liquid comprises the following components in percentage by weight: 50.24% of epoxy resin, 6.16% of curing agent, 2.65% of pyrolytic graphite, 2.74% of nano silicon dioxide and 38.21% of organic solvent; the component B liquid comprises the following components in percentage by weight: 57.26% of polyurethane, 5.30% of curing accelerator, 17.57% of nanocellulose, 12.65% of hexagonal boron nitride micro-tablets and 7.22% of organic solvent.
Example 3:
unlike examples 1-2, the component a liquid comprises, in weight percent: 49.40% of epoxy resin, 5.90% of curing agent, 2.40% of pyrolytic graphite, 2.65% of nano silicon dioxide and 39.65% of organic solvent; the component B liquid comprises the following components in percentage by weight: 56.95% of polyurethane, 4.90% of curing accelerator, 16.50% of nanocellulose, 12.45% of hexagonal boron nitride micro-tablets and 9.20% of organic solvent.
The glue solution for coating the television circuit board prepared in the above examples 1-3 and the glue solution for coating the circuit board of the first control group, the glue solution for coating the circuit board of the second control group, the glue solution for coating the circuit board of the third control group, the glue solution for coating the circuit board of the fourth control group and the glue solution for coating the circuit board of the fifth control group are respectively taken, the glue solution for coating the circuit board of the first control group is a common glue solution for coating the circuit board on the market, the glue solution for coating the circuit board of the second control group has no pyrolytic graphite compared with the examples, the glue solution for coating the circuit board of the third control group has no nano silicon dioxide compared with the examples, the glue solution for coating the circuit board of the fourth control group has no nano cellulose compared with the examples, the glue solution for coating the circuit board of the fifth control group has no hexagonal boron nitride micro-plate compared with the examples, the glue solutions for coating the circuit board prepared in the three examples and the glue solutions for coating the circuit board of the five control groups are respectively tested in eight groups, each 30 samples were tested in a group, and the test results are shown in table one:
table one:
as can be seen from table one, when the tv circuit board is coated with the glue solution, the raw material ratio is: the component A liquid comprises the following components in percentage by weight: 49.40% of epoxy resin, 5.90% of curing agent, 2.40% of pyrolytic graphite, 2.65% of nano silicon dioxide and 39.65% of organic solvent; the component B liquid comprises the following components in percentage by weight: 56.95% of polyurethane, 4.90% of curing accelerator, 16.50% of nano-cellulose, 12.45% of hexagonal boron nitride micro-sheet and 9.20% of organic solvent, can effectively improve the heat-resistant and high-temperature-resistant performance in the glue solution for coating the circuit board, and can effectively ensure the toughness and flexibility of the glue solution in a high-temperature environment and the protection effect on the circuit board; therefore, the embodiment 3 is a better implementation mode of the invention, and the epoxy resin in the formula is a main supporting material of the glue solution; the pyrolytic graphite has strong chemical inertia, high purity, good high-temperature stability, self-lubricating property and no dust, can form an impermeable layer and can effectively enhance the high-temperature resistance and sealing property of the epoxy resin when doped in the epoxy resin; the nano silicon dioxide has high temperature resistance, large surface area and small particle size, and can effectively improve the high temperature resistance of the glue solution; the dispersion, the suspension property and the vibration liquefaction property are good, and the nano silicon dioxide is more uniformly distributed in the glue solution; the thixotropic property is good; the high-temperature-resistant and anti-deformation glue has good reinforcing and thickening effects, so that the high-temperature resistance and the material stability of the glue can be further improved, and the toughness, the flexibility and the anti-deformation performance of the glue are further ensured; the nano-cellulose has the advantages of fine nano-structure, good mechanical strength, lower thermal expansion coefficient and the like, under the dehydration state, the nano-cellulose can spontaneously form a self-assembled film under the action of non-valence bond forces such as hydrogen bond, van der Waals force or electrostatic force and the like, and the novel film material has the performance advantages of fast ion diffusion, high temperature resistance and the like, and can effectively enhance the flexibility and toughness of glue solution; the hexagonal boron nitride nanosheet is a high-thermal-conductivity filler, and has the structure that equal amounts of boron atoms and nitrogen atoms form bonds with hexagonal III-VA in an SP2 mixed mode, when a hexagonal boron nitride micron powder sheet is peeled to the thickness of several nanometers to dozens of nanometers, the h-BN nanosheet can be obtained, and the thermal conductivity, the electrical insulation property, the optical property and the mechanical property of the h-BN nanosheet can be remarkably changed.
Example 4
In the above preferred technical scheme, the present invention provides a glue solution for coating a television circuit board, comprising an a-component liquid and a B-component liquid, wherein the a-component liquid and the B-component liquid are in a weight ratio of 10: 1, and the a-component liquid comprises, by weight: 49.40% of epoxy resin, 5.90% of curing agent, 2.40% of pyrolytic graphite, 2.65% of nano silicon dioxide and 39.65% of organic solvent; the component B liquid comprises the following components in percentage by weight: 56.95% of polyurethane, 4.90% of curing accelerator, 16.50% of nano-cellulose, 12.45% of hexagonal boron nitride micro-tablets and 9.20% of organic solvent.
The curing agent is dicyandiamide solution, the curing accelerator is 2-methylimidazole, and the organic solvent is one or more of N-methylpyrrolidone (NMP), Ethylene Glycol (EG), N-butanol and terpineol.
The invention also provides a preparation method of the glue solution for coating the television circuit board, which comprises the following specific preparation steps:
the method comprises the following steps: weighing the epoxy resin, the curing agent, the pyrolytic graphite, the nano silicon dioxide and the organic solvent in the component A liquid, and the polyurethane, the curing accelerator, the nano cellulose, the hexagonal boron nitride micro-tablets and the organic solvent in the component B liquid according to the weight percentage;
step two: mechanically stirring, mixing and heating pyrolytic graphite in the liquid raw material of the component A in the step one, one third of epoxy resin and organic solvent in parts by weight for 30-40 min, and simultaneously performing ultrasonic oscillation treatment to obtain a modified base liquid a;
step three: mechanically stirring, mixing and heating the nano silicon dioxide in the liquid raw material of the component A, one third of epoxy resin and organic solvent by weight for 30-40 min, and simultaneously performing ultrasonic oscillation treatment to obtain a modified base liquid b;
step four: mechanically stirring, mixing and heating the modified base liquid a prepared in the step two, the modified base liquid b prepared in the step three and the residual curing agent, epoxy resin and organic solvent in the component liquid raw materials in the step one for 50-60 min, and simultaneously performing ultrasonic oscillation treatment to obtain a component liquid A;
step five: mechanically stirring, mixing and heating the nano-cellulose in the liquid raw material of the component B in the step one, one third of polyurethane and an organic solvent in parts by weight for 20-30 min, and simultaneously performing ultrasonic oscillation treatment to obtain a modified base liquid c;
step six: mechanically stirring, mixing and heating the hexagonal boron nitride micro-tablets in the liquid raw material of the component B in the step one, one third of polyurethane and an organic solvent in parts by weight for 20-30 min, and simultaneously performing ultrasonic oscillation treatment to obtain a modified base liquid d;
step seven: mechanically stirring, mixing and heating the modified base liquid c prepared in the fifth step, the modified base liquid d prepared in the sixth step and the residual polyurethane, the curing accelerator and the organic solvent in the liquid raw materials of the component B in the first step for 30-40 min, and simultaneously performing ultrasonic oscillation treatment to obtain a component B liquid;
step eight: and C, fully performing heating mechanical stirring and mixing on the component A liquid prepared in the step four and the component B liquid prepared in the step seven according to the weight ratio of 10: 1 to prepare the glue solution for coating the television circuit board.
The heating temperature in step two and step three was 55 ℃, the heating temperature in step four was 75 ℃, the heating temperature in step five and step six was 65 ℃, the heating temperature in step seven was 85 ℃, and the heating temperature in step eight was 75 ℃.
Example 5
Unlike example 4, the heating temperature in step two and step three was 60 ℃, the heating temperature in step four was 80 ℃, the heating temperature in step five and step six was 70 ℃, the heating temperature in step seven was 90 ℃, and the heating temperature in step eight was 80 ℃.
Example 6
Unlike examples 4 to 5, the heating temperature in step two and step three was 50 ℃, the heating temperature in step four was 70 ℃, the heating temperature in step five and step six was 60 ℃, the heating temperature in step seven was 80 ℃ and the heating temperature in step eight was 70 ℃.
Taking the television circuit board coating glue solution prepared in the above examples 4-6, the circuit board coating glue solution of the sixth control group, the circuit board coating glue solution of the seventh control group and the circuit board coating glue solution of the eighth control group respectively to carry out experiments, wherein the circuit board coating glue solution of the sixth control group directly mixes all the liquid raw materials of the component A compared with the examples, then mixes all the liquid raw materials of the component B, directly treats the pyrolytic graphite, all the epoxy resin and the organic solvent in the step two compared with the circuit board coating glue solution of the seventh control group compared with the examples, and directly treats the nano-cellulose, all the polyurethane and the organic solvent in the step five compared with the circuit board coating glue solution of the eighth control group compared with the examples; the glue solutions for coating the circuit boards prepared in the three examples and the glue solutions for coating the circuit boards of the three control groups were respectively tested in six groups, each 30 samples were taken as one group, and the test results are shown in table two:
table two:
as can be seen from table two, in the process of preparing the glue solution for coating the television circuit board, when the preparation method in the fourth embodiment is the preferred scheme of the present invention, in the second step, the pyrolytic graphite and one third of the epoxy resin are mixed and modified, and the performance of the pyrolytic graphite is compounded into the epoxy resin, so that the performance of the epoxy resin can be effectively enhanced; in the third step, the nano silicon dioxide and one third of epoxy resin are mixed and modified, and the performance of the nano silicon dioxide is compounded into the epoxy resin, so that the performance of the epoxy resin can be effectively enhanced; in the fourth step, the modified base liquid and the rest raw materials are mixed, so that double modification treatment can be effectively compounded on the basis of ensuring the self performance of the epoxy resin, and the heat resistance and stability of the component A liquid can be effectively enhanced; in the fifth step, mixing modification treatment is carried out on the nanocellulose and one third of polyurethane, and the performance of the nanocellulose is compounded into the polyurethane, so that the performance of the polyurethane can be effectively enhanced; in the sixth step, mixing modification treatment is carried out on the hexagonal boron nitride micro-tablets and one third of polyurethane, and the performance of the hexagonal boron nitride micro-tablets is compounded into the polyurethane, so that the performance of the polyurethane can be effectively enhanced; mixing the modified base liquid and the rest raw materials in the step seven, so that double modification treatment can be effectively compounded on the basis of ensuring the self performance of polyurethane, and the heat resistance and stability of the component B liquid can be effectively enhanced; and step eight, compounding the component A liquid and the component B liquid to prepare the glue solution for coating the television circuit board.
It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. The glue solution for coating the television circuit board comprises a component A liquid and a component B liquid, and is characterized in that: the component A liquid and the component B liquid are formed according to the weight ratio of 10: 1, and the component A liquid comprises the following components in percentage by weight: 48.56-50.24% of epoxy resin, 5.64-6.16% of curing agent, 2.15-2.65% of pyrolytic graphite, 2.56-2.74% of nano silicon dioxide and the balance of organic solvent; the component B liquid comprises the following components in percentage by weight: 56.64-57.26% of polyurethane, 4.50-5.30% of curing accelerator, 15.43-17.57% of nanocellulose, 12.25-12.65% of hexagonal boron nitride micro-tablets and the balance of organic solvent;
the preparation method of the glue solution for coating the television circuit board comprises the following specific preparation steps:
the method comprises the following steps: weighing the epoxy resin, the curing agent, the pyrolytic graphite, the nano silicon dioxide and the organic solvent in the component A liquid, and the polyurethane, the curing accelerator, the nano cellulose, the hexagonal boron nitride micro-tablets and the organic solvent in the component B liquid according to the weight percentage;
step two: mechanically stirring, mixing and heating pyrolytic graphite in the liquid raw material of the component A, one third of epoxy resin and organic solvent in parts by weight for 30-40 min, and simultaneously performing ultrasonic oscillation treatment to obtain a modified base liquid a;
step three: mechanically stirring, mixing and heating the nano silicon dioxide in the liquid raw material of the component A, one third of epoxy resin and organic solvent by weight for 30-40 min, and simultaneously performing ultrasonic oscillation treatment to obtain a modified base liquid b;
step four: mechanically stirring, mixing and heating the modified base liquid a prepared in the step two, the modified base liquid b prepared in the step three and the residual curing agent, epoxy resin and organic solvent in the component liquid raw materials in the step one for 50-60 min, and simultaneously performing ultrasonic oscillation treatment to obtain a component liquid A;
step five: mechanically stirring, mixing and heating the nano-cellulose in the liquid raw material of the component B in the step one, one third of polyurethane and an organic solvent in parts by weight for 20-30 min, and simultaneously performing ultrasonic oscillation treatment to obtain a modified base solution c;
step six: mechanically stirring, mixing and heating the hexagonal boron nitride micro-tablets in the liquid raw material of the component B in the step one, one third of polyurethane and an organic solvent in parts by weight for 20-30 min, and simultaneously performing ultrasonic oscillation treatment to obtain a modified base liquid d;
step seven: mechanically stirring, mixing and heating the modified base liquid c prepared in the fifth step, the modified base liquid d prepared in the sixth step and the residual polyurethane, the curing accelerator and the organic solvent in the liquid raw materials of the component B in the first step for 30-40 min, and simultaneously performing ultrasonic oscillation treatment to obtain a component B liquid;
step eight: and C, fully performing heating mechanical stirring and mixing on the component A liquid prepared in the step four and the component B liquid prepared in the step seven according to the weight ratio of 10: 1 to prepare the glue solution for coating the television circuit board.
2. The glue solution for coating the television circuit board according to claim 1, wherein the glue solution comprises: the component A liquid comprises the following components in percentage by weight: 48.56 percent of epoxy resin, 5.64 percent of curing agent, 2.15 percent of pyrolytic graphite, 2.56 percent of nano silicon dioxide and 41.09 percent of organic solvent; the component B liquid comprises the following components in percentage by weight: 56.64% of polyurethane, 4.50% of curing accelerator, 15.43% of nanocellulose, 12.25% of hexagonal boron nitride micro-tablets and 11.18% of organic solvent.
3. The glue solution for coating the television circuit board according to claim 1, wherein the glue solution comprises: the component A liquid comprises the following components in percentage by weight: 50.24% of epoxy resin, 6.16% of curing agent, 2.65% of pyrolytic graphite, 2.74% of nano silicon dioxide and 38.21% of organic solvent; the component B liquid comprises the following components in percentage by weight: 57.26% of polyurethane, 5.30% of a curing accelerator, 17.57% of nanocellulose, 12.65% of hexagonal boron nitride micro-tablets and 7.22% of an organic solvent.
4. The glue solution for coating the television circuit board according to claim 1, wherein the glue solution comprises: the component A liquid comprises the following components in percentage by weight: 49.40% of epoxy resin, 5.90% of curing agent, 2.40% of pyrolytic graphite, 2.65% of nano silicon dioxide and 39.65% of organic solvent; the component B liquid comprises the following components in percentage by weight: 56.95% of polyurethane, 4.90% of curing accelerator, 16.50% of nanocellulose, 12.45% of hexagonal boron nitride micro-tablets and 9.20% of organic solvent.
5. The glue solution for coating the television circuit board according to claim 1, wherein the glue solution comprises: the curing agent is dicyandiamide solution, the curing accelerator is 2-methylimidazole, and the organic solvent is one or more of N-methyl pyrrolidone, ethylene glycol, N-butanol and terpineol.
6. The glue solution for coating the television circuit board according to claim 1, wherein the glue solution comprises: the heating temperature in the second step and the third step is 50-60 ℃, the heating temperature in the fourth step is 70-80 ℃, the heating temperature in the fifth step and the sixth step is 60-70 ℃, the heating temperature in the seventh step is 80-90 ℃, and the heating temperature in the eighth step is 70-80 ℃.
7. The glue solution for coating the television circuit board according to claim 6, wherein the glue solution comprises the following components in percentage by weight: the heating temperature in step two and step three was 50 ℃, the heating temperature in step four was 70 ℃, the heating temperature in step five and step six was 60 ℃, the heating temperature in step seven was 80 ℃ and the heating temperature in step eight was 70 ℃.
8. The glue solution for coating the television circuit board according to claim 6, wherein the glue solution comprises the following components in percentage by weight: the heating temperature in step two and step three was 60 ℃, the heating temperature in step four was 80 ℃, the heating temperature in step five and step six was 70 ℃, the heating temperature in step seven was 90 ℃ and the heating temperature in step eight was 80 ℃.
9. The glue solution for coating the television circuit board according to claim 6, wherein the glue solution comprises the following components in percentage by weight: the heating temperature in step two and step three was 55 ℃, the heating temperature in step four was 75 ℃, the heating temperature in step five and step six was 65 ℃, the heating temperature in step seven was 85 ℃, and the heating temperature in step eight was 75 ℃.
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| CN101767481A (en) * | 2009-01-06 | 2010-07-07 | 金安国纪科技股份有限公司 | Method for preparing highly heat-conductive copper-clad plate |
| JP2017078125A (en) * | 2015-10-21 | 2017-04-27 | 新日鉄住金化学株式会社 | Urethane-modified epoxy resin composition and cured product thereof |
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| CN108728029A (en) * | 2018-06-19 | 2018-11-02 | 西安科技大学 | A kind of production method of heat conductive insulating medium glued membrane |
| CN109468101A (en) * | 2018-09-25 | 2019-03-15 | 宿州学院 | A kind of high fire-retardance epoxy resin adhesive |
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2021
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101767481A (en) * | 2009-01-06 | 2010-07-07 | 金安国纪科技股份有限公司 | Method for preparing highly heat-conductive copper-clad plate |
| JP2017078125A (en) * | 2015-10-21 | 2017-04-27 | 新日鉄住金化学株式会社 | Urethane-modified epoxy resin composition and cured product thereof |
| CN108610604A (en) * | 2018-04-27 | 2018-10-02 | 建滔(佛冈)积层板有限公司 | A kind of high-termal conductivity high-insulativity prepreg and preparation method thereof |
| CN108728029A (en) * | 2018-06-19 | 2018-11-02 | 西安科技大学 | A kind of production method of heat conductive insulating medium glued membrane |
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