CN202475934U

CN202475934U - Inner layer thin plate structure

Info

Publication number: CN202475934U
Application number: CN2012200503613U
Authority: CN
Inventors: 李仕伟; 彭江义
Original assignee: SUNLITE ELECTRONIC TECHNOLOGY (SHENZHEN) Co Ltd
Current assignee: SUNLITE ELECTRONIC TECHNOLOGY (SHENZHEN) Co Ltd
Priority date: 2012-02-16
Filing date: 2012-02-16
Publication date: 2012-10-03
Anticipated expiration: 2022-02-16

Abstract

The utility model is an inner layer thin plate structure which comprises a thin plate and a copper edge. The edge of the thin plate is covered by the copper edge. In a subsequent processing, the thin plate with the copper edge will not get stuck while the subsequent processing is carried out rapidly and accurately.

Description

A kind of internal layer thin-slab structure

Technical field

The utility model relates to pcb board, the thin-slab structure of a kind of pcb board processing of saying so exactly.

Background technology

Wiring board is the basic raw material of electronic industry, and it will play the effect that connects each electronic devices and components and the mutual conducting of interlayer, transmits signal.In the wiring board internal layer manufacturing process, surface treatment, etching process all need pass through horizontal line, because of the thin plate of inner plating appearance at present is also a lot, are thinned to not cupric of 0.05mm most, cause thin plate to be easy to the quality defect of clamp.

China's wiring board manufacturing technology also is not very ripe; Most of flow process does not also adopt whole automations; And many equipment also are in a backward condition, and more or less there is certain defective in equipment, and wiring board develops towards live width, line-spacing direction little, that plate is thin at present; Like this thin plate just be easy to clamp cause bad with scrap, and present equipment also is difficult to avoid the generation of these problems.

Summary of the invention

For this reason, the purpose of the utility model provides a kind of internal layer thin-slab structure, and this structure can improve working (machining) efficiency effectively, avoids the clamp phenomenon, cuts the waste, and reduces cost of manufacture, promotes the processing quality of thin plate.

Another purpose of the utility model provides a kind of internal layer thin-slab structure, and this structure construction is simple, is convenient to realize and produce.

For this reason, the utility model is realized according to following mode.

A kind of internal layer thin-slab structure is characterized in that this internal layer thin-slab structure includes: thin plate and copper bound, and said copper bound is covered in the edge of thin plate, and there is copper bound at the thin plate edge in follow-up processing, can carry out following process quickly and accurately, and can not cause clamp.

Said copper bound, its height is consistent with thin plate, and promptly the surface of the surface of copper bound and thin plate is positioned on the same horizontal plane, is convenient to guide thin plate to carry out following process.

Said thin plate, the edge around it all has copper bound, so that following process.

Said thin plate, the edge around it has the step carrier that is lower than thin plate, and carrier is provided with copper bound.

Said copper bound, its outside is concordant because of the edge of thin plate, carries out following process with accurate guiding thin plate.

The utility model is through to the architecture advances of thin plate, and the problem of clamp in the time of can effectively improving thin plate and cross horizontal line is to cut the waste; Reduce cost of manufacture, promote quality, and production operation is convenient; Production efficiency is higher, is a kind of very desirable method that thin plate is crossed the horizontal line clamp of improving.

Description of drawings

The structural representation that Fig. 1 implements for the utility model.

The side sectional view that Fig. 2 implements for the utility model.

Embodiment

Shown in accompanying drawing, the practical implementation of the utility model is elaborated.

Shown in Figure 1, be a kind of internal layer thin-slab structure that the utility model is realized, this internal layer thin-slab structure includes: thin plate 1 and copper bound 2, copper bound 2 is covered in the edge of thin plate 1.

And the edge around the thin plate 1 all has copper bound 2, so that following process.

Combine shown in Figure 2ly again, the edge around the thin plate 1 has the step carrier 11 that is lower than thin plate, and carrier 11 is provided with copper bound 2.

The height of copper bound 2 is consistent with thin plate 1, and promptly the surface of copper bound 2 and thin plate 1 are positioned on the same horizontal plane; And the outside of copper bound 2 is concordant because of the edge of thin plate 1, can pass through the horizontal line of following process with thin plate 1 smoothly like this, and can be by clamp.

Adding man-hour; Multi-layer sheet internal layer exposure egative film frame commonly used is generally to be designed to opaque shape, the film is designed especially: it is designed to transparence, like this; In exposure process, just can well protect thin plate edges of boards printing ink to make its exposure; Make edges of boards printing ink generation polymerization send out should and the back printing ink that cross to develop remains in also that the Copper Foil and the printing ink of edges of boards is also keeping together after edges of boards, the etching, move back film after edges of boards also leave copper bar, copper bar promptly forms copper bound.

Copper bound has increased the integral thickness of thin plate edges of boards, is blocked and scraps by the row rumble being not easy when the horizontal line.

Use the thin plate of the method design, the product quality of making has obvious lifting, and edges of boards have reduced processing cost because of being etched into tabula rasa clamp when crossing horizontal line easily before effectively having improved, and have improved working (machining) efficiency.

The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model; Any modification of being done within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included within the protection range of the utility model.

Claims

1. internal layer thin-slab structure, it is characterized in that this internal layer thin-slab structure includes: thin plate and copper bound, said copper bound is covered in the edge of thin plate.

2. internal layer thin-slab structure as claimed in claim 1 is characterized in that the surface of said copper bound and the surface of thin plate are positioned on the same horizontal plane.

3. internal layer thin-slab structure as claimed in claim 1 is characterized in that said thin plate, and the edge around it all has copper bound.

4. internal layer thin-slab structure as claimed in claim 3 is characterized in that said thin plate, and the edge around it has the step carrier that is lower than thin plate, and carrier is provided with copper bound.

5. internal layer thin-slab structure as claimed in claim 1 is characterized in that said copper bound, and its outside is concordant because of the edge of thin plate.