CN201805640U - Windowing structure for pressed dry film of golden finger of module board before gold plating - Google Patents
Windowing structure for pressed dry film of golden finger of module board before gold plating Download PDFInfo
- Publication number
- CN201805640U CN201805640U CN2010205490659U CN201020549065U CN201805640U CN 201805640 U CN201805640 U CN 201805640U CN 2010205490659 U CN2010205490659 U CN 2010205490659U CN 201020549065 U CN201020549065 U CN 201020549065U CN 201805640 U CN201805640 U CN 201805640U
- Authority
- CN
- China
- Prior art keywords
- golden finger
- plated
- module board
- dry film
- via hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model discloses a windowing structure for a pressed dry film of a golden finger of a module board before gold plating. A bonding pad, a connecting line, a via ring and a golden finger to be plated are formed on a metal layer on the surface of a substrate of the module board; the dry film is pressed on the surface of the module board; a window is arranged in the dry film at the golden finger to be plated; solder-resisting ink covers part of the surface of the module board except the via ring of the golden finger, the connecting line between the via hole of the golden finger and the golden finger to be plated and the surface of the golden finger to be plated; the windowing part of the dry film extends and is exposed out of the via ring of the golden finger and the connecting line between the via ring of the golden finger and the golden finger to be plated, thus enabling the golden finger, the via ring of the golden finger and the connecting line in between to be plated with a gold layer, and further guaranteeing the golden fingers fabricated by the module board to have consistent appearance, and greatly reducing the scrap rate.
Description
Technical field
The utility model relates to the fenestration that wiring board is electroplated preceding pressing dry film, the fenestration of pressing dry film before especially a kind of golden finger plating of module board.
Background technology
During the golden finger of original module board (MODULE plate) is made, the copper that removes the orifice ring part of golden finger part to be plated and golden finger via hole exposes, all the other copper parts all are coated with anti-solder ink, before golden finger to be plated is gold-plated, in module board surface pressing dry film to be plated, because liquid medicine has aggressiveness to the dry film that covers during the electrogilding finger, the part that part is windowed from the dry film of correspondence golden finger to be plated is infiltrated a point liquid medicine by dry film and module board surface gap, causing the orifice ring of golden finger via hole under the dry film (VIA hole) partly to have part to be stained with gold at last has part not to be stained with golden phenomenon, be called accident and be stained with gold, thereby cause inconsistent causing of module board outward appearance to be scrapped.
Summary of the invention
In order to overcome above-mentioned defective, the utility model provides a kind of fenestration of the preceding pressing dry film of golden finger plating of module board, can guarantee the outward appearance unanimity after the module board golden finger is made.
The utility model for the technical scheme that solves its technical problem and adopt is:
The fenestration of pressing dry film before a kind of golden finger plating of module board, the metal level of the substrate surface of this module board is formed with pad, connection line, via hole orifice ring and golden finger to be plated, described dry film pressing is covered on the surface of module board, this dry film is windowed in the position of golden finger to be plated and is exposed golden finger to be plated, and the position of the surface of described module board except that the surface of the via hole orifice ring of the via hole orifice ring of golden finger, golden finger and connection line between the golden finger to be plated and golden finger to be plated all is coated with anti-solder ink; The part that described dry film is windowed extends to via hole orifice ring and the via hole orifice ring of described golden finger and the connection line between the golden finger to be plated that exposes golden finger.
The beneficial effects of the utility model are: the via hole orifice ring of golden finger is removed on the surface of module board, the outer position, surface of the via hole orifice ring of golden finger and connection line between the golden finger to be plated and golden finger to be plated all is coated with anti-solder ink, and the part that dry film is windowed extends to via hole orifice ring and the via hole orifice ring of golden finger and the connection line between the golden finger to be plated that exposes golden finger, thereby make golden finger to be plated, connection line between the via hole orifice ring of golden finger and the via hole orifice ring of golden finger and the golden finger to be plated is the plated with gold layer all, thereby guarantee the outward appearance unanimity after the module board golden finger is made, greatly reduced and scrapped probability.
Description of drawings
Fig. 1 is a fenestration schematic diagram of the present utility model;
Fig. 2 is the existing fenestration schematic diagram that the utility model contrasted;
Fig. 3 is the part finished product schematic diagram of module board golden finger of the present utility model;
Fig. 4 is the part finished product schematic diagram of the existing module board golden finger that the utility model contrasted.
Embodiment
Embodiment: the fenestration of pressing dry film before a kind of golden finger plating of module board, the metal level of the substrate surface of this module board is formed with pad, connection line, via hole orifice ring 3 and golden finger to be plated 2, described dry film 1 pressing is covered on the surface of module board, this dry film is windowed in the position of golden finger 2 to be plated and is exposed golden finger 2 to be plated, and the position of the surface of described module board except that the surface of the via hole orifice ring 3 of the via hole orifice ring 3 of golden finger, golden finger and connection line 4 between the golden finger to be plated 2 and golden finger to be plated 2 all is coated with anti-solder ink 5; The part 10 that described dry film is windowed extends to via hole orifice ring 3 and the via hole orifice ring 3 of described golden finger and the connection line 4 between the golden finger to be plated 2 that exposes golden finger.
Claims (1)
1. the fenestration of pressing dry film before the golden finger of a module board plates, the metal level of the substrate surface of this module board is formed with pad, connection line, via hole orifice ring (3) and golden finger to be plated (2), described dry film (1) pressing is covered on the surface of module board, this dry film is windowed in the position of golden finger to be plated (2) and exposed golden finger to be plated (2), it is characterized in that: the via hole orifice ring (3) of golden finger is removed on the surface of described module board, the outer position, surface of the via hole orifice ring (3) of golden finger and connection line (4) between the golden finger to be plated (2) and golden finger to be plated (2) all is coated with anti-solder ink (5); The part that described dry film is windowed (10) extends to via hole orifice ring (3) and the via hole orifice ring (3) of described golden finger and the connection line (4) between the golden finger to be plated (2) that exposes golden finger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205490659U CN201805640U (en) | 2010-09-29 | 2010-09-29 | Windowing structure for pressed dry film of golden finger of module board before gold plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205490659U CN201805640U (en) | 2010-09-29 | 2010-09-29 | Windowing structure for pressed dry film of golden finger of module board before gold plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201805640U true CN201805640U (en) | 2011-04-20 |
Family
ID=43875137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205490659U Expired - Fee Related CN201805640U (en) | 2010-09-29 | 2010-09-29 | Windowing structure for pressed dry film of golden finger of module board before gold plating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201805640U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113923870A (en) * | 2021-09-18 | 2022-01-11 | 宏华胜精密电子(烟台)有限公司 | Preparation method of circuit board |
-
2010
- 2010-09-29 CN CN2010205490659U patent/CN201805640U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113923870A (en) * | 2021-09-18 | 2022-01-11 | 宏华胜精密电子(烟台)有限公司 | Preparation method of circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205847725U (en) | A kind of improvement is uncapped the damaged Rigid Flex of flow process copper | |
| CN103060870B (en) | A kind of ceramic LGA package casing pad selective electroplating technique | |
| CN205028884U (en) | Electronic packing piece and package substrate | |
| CN102324412A (en) | Island-free lead frame structure prefilled with plastic encapsulating material, plated firstly and etched later and production method thereof | |
| CN102045963A (en) | Method for plating gold on equilong connecting fingers | |
| CN103384452A (en) | Circuit pattern manufacturing method | |
| CN201805640U (en) | Windowing structure for pressed dry film of golden finger of module board before gold plating | |
| CN104023483A (en) | Gold finger three-surface plating method | |
| CN109661124A (en) | A kind of IC support plate novel surface processing method | |
| CN103002661B (en) | Post production process of thin panels | |
| CN107708333B (en) | Preparation method of copper-reducing circuit board of new energy automobile battery | |
| CN109714903A (en) | A kind of IC support plate surface treatment method | |
| CN202388905U (en) | Formwork for various types | |
| CN102076175A (en) | Full gold-plated board manufacturing technology | |
| CN105225972A (en) | A kind of manufacture method of semiconductor package | |
| CN102014585A (en) | Process for plating gold on long and short gold fingers | |
| CN102438403A (en) | Windowing structure for pressing dry film before plating of goldfinger of module board | |
| CN205428910U (en) | SMD for discrete device lead frame of semiconductor | |
| CN103847162B (en) | A kind of golden reinforcing chip of surface gold-plating and preparation technology thereof | |
| CN205622971U (en) | Printed circuit board with compound gold plated layer | |
| CN203951684U (en) | Environmental protection backing plate | |
| CN203839407U (en) | Paster type diode | |
| CN208434179U (en) | A kind of circuit board | |
| CN106503690A (en) | Layer-stepping fingerprint recognition module | |
| CN102054712A (en) | Method for controlling surface roughness of circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110420 Termination date: 20140929 |
|
| EXPY | Termination of patent right or utility model |