CN102054712A - Method for controlling surface roughness of circuit board - Google Patents
Method for controlling surface roughness of circuit board Download PDFInfo
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- CN102054712A CN102054712A CN 201010179210 CN201010179210A CN102054712A CN 102054712 A CN102054712 A CN 102054712A CN 201010179210 CN201010179210 CN 201010179210 CN 201010179210 A CN201010179210 A CN 201010179210A CN 102054712 A CN102054712 A CN 102054712A
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- gold
- surface roughness
- copper
- plating
- roughness
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Abstract
The invention discloses a method for controlling the surface roughness of a circuit board. When the traditional circuit board is subjected to a secondary electroplating operation, because direct copper plating and gold plating operations are used for electroplating at present, after electroplating, a gold surface or a copper surface is smoother, thus the surface roughness of the circuit board is not enough, and the problem of poor lead bonding capacity usually occurs. In the invention, when the circuit board is electroplated, the method comprises the following steps of: carrying out a copper plating operation; carrying out a nickel plating operation; and carrying out a gold plating operation. The method ensures that the roughness of the gold surface is increased, thus the bonding capacity of gold wires is enhanced, and meanwhile, the problem of appearance defect is also solved.
Description
Technical field
The invention belongs to the substrate production field that the present invention relates to, particularly a kind of method of control circuit board surface roughness.
Background technology
In the substrate production process, when the pad that particularly back operation need be carried out the lead-in wire bonding of wafer-level package is operated, need substrate surface to keep certain roughness, to ensure stronger lead-in wire binding ability.
At present, such as in the manufacturing process of TAPP (ultra-thin chip level base plate for packaging), substrate is carrying out the second time during electroplating operations, because direct copper facing, gold-plated operation are generally taked in plating at present, electroplate the back because copper face or golden face smoother like this, thereby cause the substrate surface roughness not enough, the problem of lead-in wire binding ability difference usually occurs.Be difficult to reach requirement of client, consequent open defect is also apparent in view simultaneously, and the method that well addresses these problems also is not provided in the prior art.
Summary of the invention
Not enough in order to solve the substrate surface roughness that prior art exists, the problem of lead-in wire binding ability difference usually appears, the invention provides a kind of method of control circuit board surface roughness.
Method of the present invention is specially:
When substrate is electroplated, adopt following steps:
Carry out copper-plated operation;
Carry out the operation of nickel plating;
Carry out gold-plated operation.
More excellent, described copper is bright copper.
More excellent, also comprise the operation of the mute copper of plating after the plating bright copper.
More excellent, the THICKNESS CONTROL after described mute copper is electroplated is between 9-12um.
More excellent, carry out gold-plated operation and be specially:
At first plate the operation of dodging gold;
Plate the operation of thick gold again.
More excellent, being operating as of gold dodged in described plating: directly gold is dodged in plating on nickel dam, and the described thickness of gold that dodges is less than 0.2um.
More excellent, the nickel layer thickness after described nickel is electroplated is controlled between the 5-9um.
By method of the present invention, the roughness of golden face is increased, thereby the binding ability of gold thread strengthen, and has also solved the problem of consequent open defect simultaneously.
Description of drawings
Fig. 1 is the invention process method flow diagram;
Fig. 2 is that mute copper thickness changes the lab diagram that influences to the substrate surface roughness;
Fig. 3 is the influence lab diagram of ambrose alloy varied in thickness to the substrate surface roughness.
Embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is set forth.
Substrate can carry out follow-up operation after production is finished, one of them needs the bonding that goes between exactly, whether the lead-in wire binding ability is up to standard need verify substrate to the lead-in wire bonding apparatus, main operation is to stamp gold thread on the gold solder dish, guy hook with device-specific removes to draw the gold thread of beating on pad by different dynamics, golden face is not peeled off when going to draw with the dynamics of customer requirement, and the expression binding ability is up to standard.If the substrate surface roughness is not enough, then often binding ability is poor in bonding process.Therefore purpose of the present invention is exactly to be optimized electroplating flow process when electroplating for the second time, and roughness that can the control basal plate surface solves the problem of lead-in wire binding ability difference, makes the lead-in wire binding ability reach different requirement of client.
Embodiment 1:
In order to solve the problem of substrate surface roughness difference, when electroplating for the second time, adopt following plating order:
At first carry out copper-plated operation;
Next carries out the operation of nickel plating;
Carry out gold-plated operation at last.
Keep nickel layer thickness 5-9um when carrying out the operation of nickel plating, help roughness and be controlled within the intended scope, particularly thickness is the nickel dam of 6-8um, and is apparent in view to the reflection of roughness, therefore can solve the problem of surface roughness difference substantially.
Embodiment 2:
In order better to solve the problem of substrate surface roughness difference, present embodiment can adopt following electro-plating method:
Carry out copper-plated operation;
Carry out the operation of nickel plating;
Plate the operation of dodging gold;
Plate the operation of thick gold.
Finish by gold and thick gold by dodging for electrogilding herein, and it is directly gold-plated on nickel dam dodging gold, will get well with the adhesion of nickel face because dodge gold, but the sudden strain of a muscle gold is very thin, is generally less than 0.2um, in order to make the binding ability of golden face good, realizes by plating thick gold herein.
Parameter according to following table when carrying out above-mentioned plating is electroplated.
By top plating flow process, particularly dodge respectively after the plating of gold and thick gold, the roughness of golden face is effectively improved, also can solve the problem of golden surface roughness.
Embodiment 3:
In order better to solve the problem of substrate surface roughness difference, as shown in Figure 1, when electroplating for the second time, adopt following plating order:
Plate the operation of bright copper;
Plate the operation of mute copper;
Carry out the operation of nickel plating;
Plate the operation of dodging gold;
Plate the operation of thick gold.
The difference of bright copper and mute copper maximum is the outward appearance and the roughness of electroplating the back copper face, the surperficial smoother of general bright copper, smooth, and the surface ratio of mute copper is more coarse, hole, concavo-concave hole is more, more helps the control adjustment of roughness.
Parameter according to following table when electroplating is electroplated.
By top plating flow process, increased the operation of electroplating mute copper, in order to control the scope of golden surface roughness, we have used by the method for controlling mute copper thickness and have controlled golden surface roughness.
Mute copper layer wherein is the main source that the TAPP plate has coarse performance, and nickel dam has certain leveling effect to mute copper layer, and the gold layer then is the visualize to roughness.The roughness of gold face has extremely important influence to the quality of lead-in wire bonding performance.
After increasing the mute copper layer of plating, the roughness of golden face is increased.When the roughness value of golden face exists
Scope the time, the binding ability of gold thread is best, and can make the TAPP product better carry out whole inspection by AFI (automated optical detection).
The tank liquor that the mute copper brightener of LP-1 that the new mute copper that uses can adopt common on the market happy think of chemistry to be produced among the present invention is disposed, its coating has the effect on good alligatoring copper surface.
The roughness concentration of gold face uses step tester " Alpha step IQ surface profiler " to measure.
Through a series of DOE experiments, when we find that mute copper thickness is controlled at 9-12um, roughness is maintained substantially
Scope in.Experiment effect as shown in Figure 1.
In addition, find also that through experiment the varied in thickness of nickel dam also has certain contribution to roughness.Help roughness during nickel layer thickness 5-9um and be controlled within the intended scope, particularly thickness is the nickel dam of 6-8um, and is apparent in view to the reflection of roughness.Thickening of nickel dam helps to cover the roughness that mute copper is produced, and the roughness that is reflected on the golden face is reduced.Experiment effect as shown in Figure 2.
By said method of the present invention, the roughness of golden face is increased, thereby the binding ability of gold thread strengthen, and has also solved the problem of consequent open defect simultaneously.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, if of the present invention these are revised and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.
Claims (7)
1. the method for a control circuit board surface roughness is characterized in that, when substrate is electroplated, adopts following steps:
Carry out copper-plated operation;
Carry out the operation of nickel plating;
Carry out gold-plated operation.
2. the method for control basal plate surface roughness as claimed in claim 1 is characterized in that: described copper is bright copper.
3. the method for control basal plate surface roughness as claimed in claim 2 is characterized in that: also comprise the operation of the mute copper of plating after the plating bright copper.
4. the method for control basal plate surface roughness as claimed in claim 3 is characterized in that: the THICKNESS CONTROL after described mute copper is electroplated is between 9-12um.
5. as the method for the described control basal plate surface roughness of claim 1-4, it is characterized in that: carry out gold-plated operation and be specially:
At first plate the operation of dodging gold;
Plate the operation of thick gold again.
6. the method for control basal plate surface roughness as claimed in claim 5 is characterized in that: being operating as of gold dodged in described plating: directly gold is dodged in plating on nickel dam, and the described thickness of gold that dodges is less than 0.2um.
7. the method for control basal plate surface roughness as claimed in claim 6 is characterized in that: the nickel layer thickness after described nickel is electroplated is controlled between the 5-9um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010179210 CN102054712A (en) | 2009-11-05 | 2010-05-21 | Method for controlling surface roughness of circuit board |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910237202 | 2009-11-05 | ||
| CN200910237202.7 | 2009-11-05 | ||
| CN 201010179210 CN102054712A (en) | 2009-11-05 | 2010-05-21 | Method for controlling surface roughness of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102054712A true CN102054712A (en) | 2011-05-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010179210 Pending CN102054712A (en) | 2009-11-05 | 2010-05-21 | Method for controlling surface roughness of circuit board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104704929A (en) * | 2013-07-11 | 2015-06-10 | 深圳崇达多层线路板有限公司 | Printed circuit board preparation method and printed circuit board |
| CN106567130A (en) * | 2015-10-10 | 2017-04-19 | 盛美半导体设备（上海）有限公司 | Method for improving roughness of wafers |
| CN110724982A (en) * | 2019-03-18 | 2020-01-24 | 杭州埃迷丽珠宝有限公司 | Gold-fog electroplating process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1182660A (en) * | 1996-11-20 | 1998-05-27 | 揖斐电株式会社 | Anti-welding composition and printed-circuit board |
| JP2001185836A (en) * | 1999-12-24 | 2001-07-06 | Hitachi Ltd | Wiring board, method and device for producing wiring board |
| CN101469420A (en) * | 2007-04-16 | 2009-07-01 | 上村工业株式会社 | Electroless gold-plating method and electronic component |
-
2010
- 2010-05-21 CN CN 201010179210 patent/CN102054712A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1182660A (en) * | 1996-11-20 | 1998-05-27 | 揖斐电株式会社 | Anti-welding composition and printed-circuit board |
| JP2001185836A (en) * | 1999-12-24 | 2001-07-06 | Hitachi Ltd | Wiring board, method and device for producing wiring board |
| CN101469420A (en) * | 2007-04-16 | 2009-07-01 | 上村工业株式会社 | Electroless gold-plating method and electronic component |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104704929A (en) * | 2013-07-11 | 2015-06-10 | 深圳崇达多层线路板有限公司 | Printed circuit board preparation method and printed circuit board |
| CN104704929B (en) * | 2013-07-11 | 2017-06-27 | 深圳崇达多层线路板有限公司 | A kind of printed circuit board preparation method and printed circuit board |
| CN106567130A (en) * | 2015-10-10 | 2017-04-19 | 盛美半导体设备（上海）有限公司 | Method for improving roughness of wafers |
| CN110724982A (en) * | 2019-03-18 | 2020-01-24 | 杭州埃迷丽珠宝有限公司 | Gold-fog electroplating process |
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Application publication date: 20110511 |