CN110724982A - Gold-fog electroplating process - Google Patents
Gold-fog electroplating process Download PDFInfo
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- CN110724982A CN110724982A CN201911258085.2A CN201911258085A CN110724982A CN 110724982 A CN110724982 A CN 110724982A CN 201911258085 A CN201911258085 A CN 201911258085A CN 110724982 A CN110724982 A CN 110724982A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/04—Electrophoretic coating characterised by the process with organic material
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
Abstract
The application discloses electroplating fog gold technology, the material of work piece is metal, specifically includes following operating procedure: step 1: firstly, preprocessing a workpiece to remove impurities on the surface of the workpiece; step 2: performing electrolytic copper plating and bottoming on the workpiece treated in the step 1, and then washing with water; and step 3: grinding and atomizing the workpiece treated in the step 2; and 4, step 4: cleaning the workpiece treated in the step 3 with hydrochloric acid solution before plating, and then washing with water; and 5: electroplating white copper tin on the workpiece treated in the step 4, and then washing with water; step 6: performing gold electroplating on the workpiece treated in the step 5, then washing with water, and drying; and 7: and (4) performing electrophoretic coating on the workpiece treated in the step (6), then washing with water, and drying. The gold-fog electroplating process provided by the invention has the advantages that the metal surface has uniform and fine atomization degree, is not easy to oxidize and fade, and has good matte retro effect.
Description
Technical Field
The invention relates to the technical field of electroplating, in particular to an electroplating gold spraying process.
Background
Gold is popular with people in gorgeous color, but the application of pure gold ornaments is limited due to high price, low hardness and poor wear resistance of gold, while in decorative electroplating, gold plating refers to that gold plating or gold plating alloy is sprayed on the surface of a non-gold material, so that the gold has golden color, the decorative requirement can be met, the mechanical properties of the plating layer such as hardness, wear resistance and the like are improved, the gold is saved, and the pure gold ornaments have obvious economic benefit and wide development prospect.
Along with the popularity of ancient style recovery in recent years, people increasingly like to increase ancient elements in life, and ancient and antique artware and ornaments are touted by people. In the existing antique gold electroplating process, the effect of antique matte is usually achieved by sand blasting or wire drawing on the surface of metal, but the problems of rough surface, easy oxidation and color change and the like exist, and the quality of the product is influenced.
Disclosure of Invention
Aiming at the problems, the invention provides an electroplating gold fog process, which has the advantages of uniform and fine metal surface atomization degree, difficult oxidation and color fading, and good matte retro effect.
The technical scheme adopted by the invention is as follows: the invention provides an electroplating gold-spraying process, wherein a workpiece is made of metal, and the electroplating gold-spraying process specifically comprises the following operation steps:
step 1: firstly, preprocessing a workpiece to remove impurities on the surface of the workpiece;
step 2: performing electrolytic copper plating and bottoming on the workpiece treated in the step 1, and then washing with water;
and step 3: grinding and atomizing the workpiece treated in the step 2;
and 4, step 4: cleaning the workpiece treated in the step 3 with hydrochloric acid solution before plating, and then washing with water;
and 5: electroplating white copper tin on the workpiece treated in the step 4, and then washing with water;
step 6: performing gold electroplating on the workpiece treated in the step 5, then washing with water, and drying;
and 7: and (4) performing electrophoretic coating on the workpiece treated in the step (6), then washing with water, and drying.
In an embodiment of the present invention, the preprocessing in the step 1 includes: acid washing, primary wax removal, chemical polishing, secondary wax removal and alkaline oil removal, and the method comprises the following specific operation steps: firstly, pickling a workpiece by using a hydrochloric acid solution to remove an oxide film on the surface, and then washing by using water; then wax and dirt are removed for the first time through concentrated sulfuric acid, and then water washing is carried out; polishing and decontaminating by using chemical polishing solution, and then washing by using water; then, carrying out secondary wax removal and decontamination by ultrasonic cleaning, and then washing with water; then, removing oil by using an alkaline oil removing solution, and then washing;
the hydrochloric acid solution is prepared from hydrochloric acid with the mass concentration of 37% and water according to the volume ratio of 1:1, and the pickling time is 5-10 s; the mass concentration of the concentrated sulfuric acid is 98%, and the treatment time is 5-10 s; the chemical polishing solution comprises the following components: the polishing agent comprises sulfuric acid, water, sodium nitrate, a chemical polishing agent and hydrochloric acid, wherein the proportion of each component is 30L: 30L of water: 10kg of sodium nitrate: 1L of chemical polishing agent: 0.05L of hydrochloric acid, and the treatment time is 5-10 s; the ultrasonic cleaning liquid is prepared from wax removal water and water in a volume ratio of 1:20, the treatment time is 60-180s, and the temperature is 65-80 ℃; the alkaline degreasing solution comprises the following components: electrolytic powder and water, wherein the proportion of each component is 25kg of electrolytic powder: 300L of water, and the treatment time is 30-60 s.
In an embodiment of the present invention, the step 2 of electroplating copper includes:
electroplating copper cyanide, wherein the cathode is a workpiece to be plated, the anode is a copper plate, and the electroplating solution comprises the following components: 30g/L of cuprous cyanide, 60g/L of sodium cyanide, 10g/L of potassium sodium tartrate and 1-1.5A/dm of current density2The treatment time is 120 s-180 s;
bright copper plating, wherein the cathode is a workpiece to be plated, the anode is a titanium mesh, and the electroplating solution comprises the following components: copper sulfate 200g/L, sulfuric acid 32ml/L, chloride ion 60ppm, and phosphor copper horn added into the electroplating solution, with current density of 3A/dm2At the time of treatmentThe time is 6-10min, and the temperature is 28 ℃; and
electroplating sand copper, wherein the cathode is a workpiece to be plated, the anode is a titanium mesh, and the electroplating solution comprises the following components: 200g/L of copper sulfate, 60g/L of sulfuric acid, 100ppm of chloride ions and 300cc/L of additive, and phosphor-copper corners are added into the electroplating solution, and the current density is 1.5-6A/dm2The treatment time is 60-120s, and the temperature is 20-35 ℃.
In an embodiment of the present invention, the grinding and atomizing in the step 3 includes the following steps: and (3) vibrating the workpiece treated in the step (2) in a rotary vibrator for 12-18min by using 600-800-mesh conical or triangular resin grinding stones with the diameter of 3-8 mm.
In one embodiment of the present invention, the workpiece processed in step 3 is polished in a magnetic polisher for 30-60 s.
In an embodiment of the present invention, the hydrochloric acid solution in step 4 is prepared from 37% by mass of hydrochloric acid and water according to a volume ratio of 1:1, the acid washing time is 5-10s, and then the water washing is performed.
In an embodiment of the present invention, in the step 5, the cathode is a workpiece to be plated, the anode is a carbon plate, and the electroplating solution includes the following components: 10g/L of metallic copper, 20g/L of metallic tin, 1.5g/L of metallic zinc, 20g/L of potassium hydroxide and 38g/L of free sodium cyanide, wherein the pH value is 11-13, the temperature is 50 ℃, and the current density is 1A/dm2The processing time is 300-600 s.
In one embodiment of the present invention, the thickness of the cupronickel-tin plating layer is 1-3 μm.
In an embodiment of the present invention, in step 6, the cathode is a workpiece to be plated, the anode is a ruthenium mesh, and the electroplating solution includes the following components: 2g/L of metal gold, a cylinder opening agent, a conductive salt and a supplement agent, wherein the pH is 3.6-3.8, the temperature is 35 ℃, and the current density is 1A/dm2The processing time is 180-300 s.
In an embodiment of the invention, in the step 7, the polyurethane acrylate is used as the cathode electrophoretic coating, the curing temperature is 125-140 ℃, and the drying time is 90 min.
The invention has the beneficial effects that: the invention provides an electroplating gold-spraying process, wherein a workpiece to be treated is made of copper alloy, and the electroplating gold-spraying process is prepared by pretreatment, copper electroplating and priming, grinding and atomizing, cleaning before plating, white copper tin electroplating, gold electroplating, electrophoretic coating and drying. The electrolytic copper plating bottoming can make workpiece surface generate the better and atomizing metal copper layer of adhesive force, and it is fine and smooth to make the metal copper layer degree of atomization homogeneous through grinding atomizing again, and can make subsequent cladding material homogeneous fine and smooth, and the white copper tin layer has better wear resistance and antioxidant capacity, avoids inside copper plate to take place the oxidation, and the gild makes workpiece surface have golden yellow matt color and luster, and electrophoretic coating can form the protection film on gild layer surface, strengthens the anticorrosive antirust ability of cladding material, keeps the matt ancient ways effect of work piece for a long time.
Drawings
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is the appearance of the sand copper plated (left) and bright copper plated (right) products of the present invention.
Detailed Description
The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown.
The invention provides an electroplating gold-spraying process, wherein a workpiece is made of metal, and the electroplating gold-spraying process specifically comprises the following operation steps: step 1: firstly, preprocessing a workpiece to remove impurities on the surface of the workpiece; step 2: performing electrolytic copper plating and bottoming on the workpiece treated in the step 1, and then washing with water; and step 3: grinding and atomizing the workpiece treated in the step 2; and 4, step 4: cleaning the workpiece treated in the step 3 with hydrochloric acid solution before plating, and then washing with water; and 5: electroplating white copper tin on the workpiece treated in the step 4, and then washing with water; step 6: performing gold electroplating on the workpiece treated in the step 5, then washing with water, and drying; and 7: and (4) performing electrophoretic coating on the workpiece treated in the step (6), then washing with water, and drying. Optionally, the workpiece is made of copper or copper alloy. The electrolytic copper plating bottoming can make workpiece surface generate the better and atomizing metal copper layer of adhesive force, and it is fine and smooth to make the metal copper layer degree of atomization homogeneous through grinding atomizing again, and can make subsequent cladding material homogeneous fine and smooth, and the white copper tin layer has better wear resistance and antioxidant capacity, avoids inside copper plate to take place the oxidation, and the gild makes workpiece surface have golden yellow matt color and luster, and electrophoretic coating can form the protection film on gild layer surface, strengthens the oxidation resistance of cladding material, keeps the matt ancient ways effect of work piece for a long time.
The pretreatment in the step 1 comprises: acid washing, primary wax removal, chemical polishing, secondary wax removal and alkaline oil removal, and the method comprises the following specific operation steps: firstly, pickling a workpiece by using a hydrochloric acid solution to remove an oxide film on the surface, and then washing by using water; then wax and dirt are removed for the first time through concentrated sulfuric acid, and then water washing is carried out; polishing and decontaminating by using chemical polishing solution, and then washing by using water; then, carrying out secondary wax removal and decontamination by ultrasonic cleaning, and then washing with water; then, removing oil by using an alkaline oil removing solution, and then washing; the hydrochloric acid solution is prepared from hydrochloric acid with the mass concentration of 37% and water according to the volume ratio of 1:1, and the pickling time is 5-10 s; the mass concentration of the concentrated sulfuric acid is 98%, and the treatment time is 5-10 s; the chemical polishing solution comprises the following components: the polishing agent comprises sulfuric acid, water, sodium nitrate, a chemical polishing agent and hydrochloric acid, wherein the proportion of each component is 30L: 30L of water: 10kg of sodium nitrate: 1L of chemical polishing agent: 0.05L of hydrochloric acid, and the treatment time is 5-10 s; the ultrasonic cleaning liquid is prepared from wax removal water and water in a volume ratio of 1:20, the treatment time is 60-180s, and the temperature is 65-80 ℃; the alkaline degreasing solution comprises the following components: electrolytic powder and water, wherein the proportion of each component is 25kg of electrolytic powder: 300L of water, and the treatment time is 30-60 s. The pretreatment removes impurities on the surface of the workpiece, such as oil stain, rust, wax and the like, and ensures the flatness of the subsequent plating layer. Wherein, the manufacturers of the chemical polishing agent, the wax removing water and the electrolytic powder are Kunshan Jihua electroplating raw materials, Inc.
The copper electroplating in the step 2 comprises the following steps: electroplating copper cyanide, wherein the cathode is a workpiece to be plated, the anode is a copper plate, and the electroplating solution comprises the following components: 30g/L of cuprous cyanide, 60g/L of sodium cyanide, 10g/L of potassium sodium tartrate and 1-1.5A/dm of current density2The processing time is 120 s-180 s, and the thickness of the obtained copper cyanide layer is 8-12 microns; bright copper plating, wherein the cathode is a workpiece to be plated, the anode is a titanium mesh, and the electroplating solution comprises the following components: copper sulfate 200g/L, sulfuric acid 32ml/L, chloride ion 60ppm, and phosphor copper horn added into the electroplating solution, with current density of 3A/dm2The treatment time is 6-10min, and the temperature is 28 deg.CThe thickness of the obtained bright copper layer is 30-50 microns; and electroplating sand copper, wherein the cathode is a workpiece to be plated, the anode is a titanium mesh, and the electroplating solution comprises the following components: 200g/L of copper sulfate, 60g/L of sulfuric acid, 100ppm of chloride ions and 300cc/L of additive, and phosphor-copper corners are added into the electroplating solution, and the current density is 1.5-6A/dm2The treatment time is 60-120s, the temperature is 20-35 ℃, and the thickness of the obtained sand copper layer is 20-30 microns. The electroplating copper cyanide is loaded on the surface of the workpiece through the copper dissolved in the anode copper plate, so that fine sand holes on the surface of the workpiece can be initially filled and leveled, and the adhesive force on the surface of the workpiece is increased. The bright copper plating can further block tiny sand holes on the surface of the workpiece after the electroplating of the copper cyanide, so that the bright copper plating layer has smooth and mirror-surface gloss effects, and the subsequent plating layer is ensured to be smooth. The electroplating of the sand copper can enable the bright plating layer obtained after bright copper plating to be delustered and atomized so as to increase the roughness of the surface of the sand copper layer. Bright copper facing and electroplating sand copper all use the titanium net as the positive pole, and the titanium net plays the electrically conductive effect, and copper ion is dissolved out at phosphorus copper angle to guarantee that copper ion concentration is stable in the electroplate liquid, contain phosphorus in the phosphorus copper angle and can reduce the production of anode mud, and the interpolation of phosphorus copper angle is convenient, easy operation. In one embodiment, the titanium mesh is made into a basket-shaped structure, and the phosphor-copper corners are placed in the titanium mesh basket so as to facilitate the electric conduction between the titanium mesh and the phosphor-copper corners and also facilitate the addition of the phosphor-copper corners. The phosphor-copper corner may be a phosphor-copper-containing structure having other shapes such as a phosphor-copper ball, but the present application is not limited thereto. The ADDITIVE used in the electroplating sand copper is a nonionic surfactant, the manufacturer is Donggangyi Limited company, the product name is CUMAT ADDITIVE, the ADDITIVE of CUMAT ADDITIVE can form small liquid beads when being added into the electroplating sand copper solution, the small liquid beads are adsorbed on the surface of a bright copper layer, and when the electroplating sand copper is carried out, the adsorption points of the small liquid beads can form tiny pits.
Referring to fig. 2, the left side is the appearance of the product after sand copper electroplating, and the right side is the appearance of the bright copper-plated product, and the product after sand copper electroplating has frosted texture.
The grinding atomization in the step 3 comprises the following steps: and (3) vibrating the workpiece treated in the step (2) in a rotary vibrator for 12-18min by using 600-800-mesh conical or triangular resin grinding stones with the diameter of 3-8mm, so that the surface atomization degree of the sand copper layer is uniform and fine, and the subsequent coating layer can be ensured to be uniform and fine.
And (4) performing magnetic polishing on the workpiece processed in the step (3) in a magnetic polishing machine for 30-60 s. If the surface atomization degree of the sand copper layer after grinding atomization is fine or the uniformity effect is not good, polishing by a magnetic polishing machine is carried out, and the surface of the sand copper layer is ensured to have a good atomization effect.
The hydrochloric acid solution in the step 4 is prepared from hydrochloric acid with the mass concentration of 37% and water according to the volume ratio of 1:1, the acid washing time is 5-10s, and then the washing is carried out to remove an oxide film and stains on the surface of the sand copper layer, so that the surface of the sand copper layer has high activity and flatness, and the subsequent electroplating is facilitated.
In the step 5, the cathode is a workpiece to be plated, the anode is a carbon plate, and the electroplating solution comprises the following components: 10g/L of metallic copper, 20g/L of metallic tin, 1.5g/L of metallic zinc, 20g/L of potassium hydroxide and 38g/L of free sodium cyanide, wherein the pH value is 11-13, the temperature is 50 ℃, and the current density is 1A/dm2The processing time is 300-600 s. The cupronickel tin plating layer has high hardness, good oxidation resistance and good discoloration resistance, can effectively protect the internal copper plating layer from being oxidized, and can maintain the brightness of the bottom layer, thereby increasing the brightness of the whole plating layer and having metal texture. The carbon plate of the anode is only used for electric conduction, and after metal copper, metal tin and metal zinc are dissolved, the anode is electroplated on a workpiece of the cathode.
The thickness of the cupronickel-tin plating layer is 1-3 μm. Preferably, the thickness of the cupronickel-tin plating layer is 2 μm, and the cupronickel-tin plating layer has good oxidation resistance and wear resistance without affecting the subsequent plating layer.
In the step 6, the cathode is a workpiece to be plated, the anode is a ruthenium mesh, and the electroplating solution comprises the following components: 2g/L of metal gold, a cylinder opening agent, a conductive salt and a supplement agent, wherein the pH is 3.6-3.8, the temperature is 35 ℃, and the current density is 1A/dm2And the treatment time is 180-300s, so that the surface of the workpiece has golden matte color. Wherein, the manufacturers of the jar opener, the conductive salt and the replenisher are Shanghai Aoqu chemical Co. The ruthenium network of the anode is used only for conducting electricity, and the metal is usedAfter the gold is dissolved, the gold is electroplated on the workpiece of the cathode.
In the step 7, polyurethane acrylate is used as the cathode electrophoretic coating, the curing temperature is 125-140 ℃, and the drying time is 90min, so that a protective film is formed on the surface of the gold-plated layer, the corrosion prevention and rust prevention capability of the plating layer is enhanced, the surface of the plating layer can have better luster, and the matte retro effect of the workpiece is kept for a long time. The polyurethane acrylate contains acrylic acid functional group and urethane bond in the molecule, and the film formed after curing has high wear resistance, adhesion, flexibility, high peeling strength and excellent low temperature resistance of polyurethane, and the excellent optical property and weather resistance of polyacrylate.
Example 1
Referring to fig. 1, a gold fog electroplating process is disclosed, in which a workpiece is made of copper and is electroplated with copper as a base material, and the specific operation steps are as follows:
1. firstly, pickling a copper alloy for 5s in a hydrochloric acid solution prepared from hydrochloric acid and water in a volume ratio of 1:1 to remove an oxide layer on the surface of the copper alloy, then carrying out first wax removal for 5s in 98% concentrated sulfuric acid, and then carrying out chemical polishing for 5s by using a chemical polishing solution, wherein the chemical polishing solution comprises the following components: the polishing agent comprises sulfuric acid, water, sodium nitrate, a chemical polishing agent and hydrochloric acid, wherein the proportion of each component is 30L: 30L of water: 10kg of sodium nitrate: 1L of chemical polishing agent: 0.05L of hydrochloric acid, improving the flatness of the surface of the copper alloy, then performing secondary wax removal (4) in an ultrasonic cleaning solution prepared from wax removal water and water in a volume ratio of 1:20 for 60s, and then performing alkaline oil removal (5) in an alkaline oil removal solution for 30s, wherein the alkaline oil removal solution comprises the following components: electrolytic powder and water, wherein the proportion of each component is 25kg of electrolytic powder: and (5) 300L of water, and finishing the pretreatment of the copper alloy workpiece.
2. After the pretreatment is finished, the surface of the copper alloy has no impurities, and the workpiece comprises the following components: in 30g/L cuprous cyanide, 60g/L sodium cyanide and 10g/L potassium sodium tartrate electroplating solution, the cathode is a workpiece to be plated, the anode is a copper plate, and the current density is 1A/dm2Electroplating copper cyanide (6) for 180s under the condition to preliminarily fill and level up fine sand holes on the surface of the workpiece, thereby obtaining a bottoming copper plating layer.
3. Then comprises the following components: in the electroplating solution containing phosphor copper corner, copper sulfate 200g/L, sulfuric acid 32ml/L and chloride ion 60ppm, the cathode is the workpiece to be plated, the anode is a titanium net, and the current density is 3A/dm2Bright copper plating (7) is carried out for 6min under the condition that the temperature of the electroplating solution is 28 ℃, extremely fine sand holes on the surface of the workpiece after copper cyanide electroplating are blocked, and the surface of the obtained copper plating layer has smooth and mirror-surface gloss effect and smooth and mirror-surface gloss effect.
4. Then comprises the following components: in the electroplate liquid of phosphor copper horn, copper sulfate 200g/L, sulfuric acid 60g/L, chloride ion 100ppm and additive 300cc/L, the cathode is the workpiece to be plated, the anode is titanium net, the current density is 1.5A/dm2Electroplating sand copper (8) for 120s under the condition that the electroplating liquid temperature is 20-35 ℃. And plating sand copper on the surface of the bright copper layer, so that the sand copper layer is relatively smooth, and the surface of the sand copper layer is atomized.
5. And (3) grinding and atomizing (9) the sand copper layer for 12min by adopting 600-mesh 800-mesh conical or triangular resin grinding stones with the diameters of 3-8mm in a rotary oscillator, so that the surface atomization degree of the sand copper layer is uniform and fine, and the subsequent plating layer can be ensured to be uniform and fine. And if the surface atomization degree of the ground atomized sand copper layer is fine or the uniformity effect is not good, performing magnetic polishing (10) by using a magnetic polishing machine to ensure that the surface of the sand copper layer has a good atomization effect.
6. And (3) cleaning the atomized workpiece for 5s before plating in hydrochloric acid solution prepared from hydrochloric acid with the mass concentration of 37% and water according to the volume ratio of 1:1 to remove an oxide film and stains on the surface of the sand copper layer, so that the surface of the sand copper layer has higher activity and flatness.
7. Then comprises the following components: 10g/L of metallic copper, 20g/L of metallic tin, 1.5g/L of metallic zinc, 20g/L of potassium hydroxide and 38g/L of free sodium cyanide, the pH value is 11-13, the temperature is 50 ℃, the cathode is a workpiece to be plated, the anode is a carbon plate, and the current density is 1A/dm2The white copper tin (12) plating is carried out for 300s under the condition of (1) to obtain a compact white copper tin plating layer with the thickness of 2 mu m, and the internal copper plating layer is effectively protected from being oxidized.
8. Then comprises the following components: 2g/L of metal gold, a cylinder opening agent, a conductive salt and a supplement agent, the pH is 3.6-3.8, the temperature is 35 ℃, the cathode is a workpiece to be plated, the anode is a ruthenium net, and the current density is 1A/dm2Plating gold (13) for 180s under the condition to ensure that the surface of the workpiece has golden matte color, and cleaning and drying after the electroplating is finished.
9. And finally, carrying out electrophoretic coating (14) on the gold-plated workpiece by using polyurethane acrylate as a cathode electrophoretic coating, and curing the workpiece at the temperature of 125-140 ℃ for 90min after the electrophoretic coating (14) is finished, so that a protective film is formed on the surface of the gold-plated layer, the corrosion resistance and the rust resistance of the coating are enhanced, the surface of the coating can have better gloss, and the matte retro effect of the workpiece is kept for a long time.
Example 2
Referring to fig. 1, a gold-fog electroplating process is disclosed, in which a workpiece is made of a copper alloy, and the copper alloy is used as a base material for electroplating, and the specific operation steps are as follows:
1. firstly, pickling a copper alloy for 10s in a hydrochloric acid solution prepared from hydrochloric acid and water in a volume ratio of 1:1 to remove an oxide layer on the surface of the copper alloy, then carrying out first wax removal for 10s in 98% concentrated sulfuric acid, and then carrying out chemical polishing for 10s by using a chemical polishing solution (3), wherein the chemical polishing solution comprises the following components: the polishing agent comprises sulfuric acid, water, sodium nitrate, a chemical polishing agent and hydrochloric acid, wherein the proportion of each component is 30L: 30L of water: 10kg of sodium nitrate: 1L of chemical polishing agent: 0.05L of hydrochloric acid, improving the flatness of the surface of the copper alloy, then performing secondary wax removal (4) for 180s in an ultrasonic cleaning solution prepared from wax removal water and water in a volume ratio of 1:20, and then performing alkaline oil removal (5) for 60s in an alkaline oil removal solution, wherein the alkaline oil removal solution comprises the following components: electrolytic powder and water, wherein the proportion of each component is 25kg of electrolytic powder: and (5) 300L of water, and finishing the pretreatment of the copper alloy workpiece.
2. After the pretreatment is finished, the surface of the copper alloy has no impurities, and the workpiece comprises the following components: in 30g/L cuprous cyanide, 60g/L sodium cyanide and 10g/L potassium sodium tartrate electroplating solution, the cathode is a workpiece to be plated, the anode is a copper plate, and the current density is1.5A/dm2Electroplating copper cyanide (6) for 120s under the condition to preliminarily fill and level up fine sand holes on the surface of the workpiece, thereby obtaining a bottoming copper plating layer.
3. Then comprises the following components: in the electroplating solution containing phosphor copper corner, copper sulfate 200g/L, sulfuric acid 32ml/L and chloride ion 60ppm, the cathode is the workpiece to be plated, the anode is a titanium net, and the current density is 3A/dm2Bright copper plating (7) is carried out for 10min under the condition that the temperature of the electroplating solution is 28 ℃, extremely fine sand holes on the surface of the workpiece after copper cyanide electroplating are blocked, and the surface of the obtained copper plating layer has smooth and mirror-surface gloss effect and smooth and mirror-surface gloss effect.
4. Then comprises the following components: in the electroplate liquid of phosphor copper horn, copper sulfate 200g/L, sulfuric acid 60g/L, chloride ion 100ppm and additive 300cc/L, the cathode is the workpiece to be plated, the anode is titanium net, the current density is 6A/dm2Electroplating sand copper (8) for 60s under the condition that the electroplating liquid temperature is 20-35 ℃. And plating sand copper on the surface of the bright copper layer, so that the sand copper layer is relatively smooth, and the surface of the sand copper layer is atomized.
5. And (3) grinding and atomizing (9) the sand copper layer for 18min by adopting 600-mesh 800-mesh conical or triangular resin grinding stones with the diameters of 3-8mm in a rotary oscillator, so that the surface atomization degree of the sand copper layer is uniform and fine, and the subsequent plating layer can be ensured to be uniform and fine. And if the surface atomization degree of the ground atomized sand copper layer is fine or the uniformity effect is not good, performing magnetic polishing (10) by using a magnetic polishing machine to ensure that the surface of the sand copper layer has a good atomization effect.
6. And (3) cleaning the atomized workpiece before plating in hydrochloric acid solution prepared from 37% hydrochloric acid and water according to the volume ratio of 1:1 for 10s to remove an oxide film and stains on the surface of the sand copper layer, so that the surface of the sand copper layer has high activity and flatness.
7. Then comprises the following components: 10g/L of metallic copper, 20g/L of metallic tin, 1.5g/L of metallic zinc, 20g/L of potassium hydroxide and 38g/L of free sodium cyanide, the pH value is 11-13, the temperature is 50 ℃, the cathode is a workpiece to be plated, the anode is a carbon plate, and the current density is 1A/dm2Under the conditions ofThe white copper tin (12) is plated for 600s to obtain a compact white copper tin plating layer with the thickness of 2 mu m, and the internal copper plating layer is effectively protected from being oxidized.
8. Then comprises the following components: 2g/L of metal gold, a cylinder opening agent, a conductive salt and a supplement agent, the pH is 3.6-3.8, the temperature is 35 ℃, the cathode is a workpiece to be plated, the anode is a ruthenium net, and the current density is 1A/dm2Plating gold (13) for 300s under the condition to ensure that the surface of the workpiece has golden matte color, and cleaning and drying after the electroplating is finished.
9. And finally, carrying out electrophoretic coating (14) on the gold-plated workpiece by using polyurethane acrylate as a cathode electrophoretic coating, and curing the workpiece at the temperature of 125-140 ℃ for 90min after the electrophoretic coating (14) is finished, so that a protective film is formed on the surface of the gold-plated layer, the corrosion resistance and the rust resistance of the coating are enhanced, the surface of the coating can have better gloss, and the matte retro effect of the workpiece is kept for a long time.
The plating layer formed by the electroplating foggy gold process provided by the embodiment 1 and the embodiment 2 of the application has uniform thickness, the atomization degree of the metal surface is uniform and fine, the metal surface is not easy to crack, and the artificial sweat test detects that compared with the matte gold artware produced by the sand blasting process, the artificial foggy gold artware has the phenomena of color fading and corrosion within 20 hours, and the artware produced by the electroplating foggy gold process provided by the embodiment 1 and the embodiment 2 of the application has no phenomena of color fading and corrosion after the 48-hour test. Therefore, the gold spraying electroplating process provided by the invention has better oxidation resistance.
The above description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the present specification and the drawings can be directly or indirectly applied to other related technical fields and are included in the scope of the present invention.
Claims (10)
1. The gold spraying electroplating process is characterized in that a workpiece is made of metal, and specifically comprises the following operation steps:
step 1: firstly, preprocessing a workpiece to remove impurities on the surface of the workpiece;
step 2: performing electrolytic copper plating and bottoming on the workpiece treated in the step 1, and then washing with water;
and step 3: grinding and atomizing the workpiece treated in the step 2;
and 4, step 4: cleaning the workpiece treated in the step 3 with hydrochloric acid solution before plating, and then washing with water;
and 5: electroplating white copper tin on the workpiece treated in the step 4, and then washing with water;
step 6: performing gold electroplating on the workpiece treated in the step 5, then washing with water, and drying;
and 7: and (4) performing electrophoretic coating on the workpiece treated in the step (6), then washing with water, and drying.
2. The electroplating haze gold process according to claim 1, wherein the pretreatment in step 1 comprises: acid washing, primary wax removal, chemical polishing, secondary wax removal and alkaline oil removal, and the method comprises the following specific operation steps: firstly, pickling a workpiece by using a hydrochloric acid solution to remove an oxide film on the surface, and then washing by using water; then wax and dirt are removed for the first time through concentrated sulfuric acid, and then water washing is carried out; polishing and decontaminating by using chemical polishing solution, and then washing by using water; then, carrying out secondary wax removal and decontamination by ultrasonic cleaning, and then washing with water; then, removing oil by using an alkaline oil removing solution, and then washing;
the hydrochloric acid solution is prepared from hydrochloric acid with the mass concentration of 37% and water according to the volume ratio of 1:1, and the pickling time is 5-10 s; the mass concentration of the concentrated sulfuric acid is 98%, and the treatment time is 5-10 s; the chemical polishing solution comprises the following components: the polishing agent comprises sulfuric acid, water, sodium nitrate, a chemical polishing agent and hydrochloric acid, wherein the proportion of each component is 30L: 30L of water: 10kg of sodium nitrate: 1L of chemical polishing agent: 0.05L of hydrochloric acid, and the treatment time is 5-10 s; the ultrasonic cleaning liquid is prepared from wax removal water and water in a volume ratio of 1:20, the treatment time is 60-180s, and the temperature is 65-80 ℃; the alkaline degreasing solution comprises the following components: electrolytic powder and water, wherein the proportion of each component is 25kg of electrolytic powder: 300L of water, and the treatment time is 30-60 s.
3. The process of claim 1, wherein the step 2 of electroplating copper comprises:
electroplating copper cyanide, wherein the cathode is a workpiece to be plated, the anode is a copper plate, and the electroplating solution comprises the following components: 30g/L of cuprous cyanide, 60g/L of sodium cyanide, 10g/L of potassium sodium tartrate and 1-1.5A/dm of current density2The treatment time is 120 s-180 s;
bright copper plating, wherein the cathode is a workpiece to be plated, the anode is a titanium mesh, and the electroplating solution comprises the following components: copper sulfate 200g/L, sulfuric acid 32ml/L, chloride ion 60ppm, and phosphor copper horn added into the electroplating solution, with current density of 3A/dm2The treatment time is 6-10min and the temperature is 28 ℃; and
electroplating sand copper, wherein the cathode is a workpiece to be plated, the anode is a titanium mesh, and the electroplating solution comprises the following components: 200g/L of copper sulfate, 60g/L of sulfuric acid, 100ppm of chloride ions and 300cc/L of additive, and phosphor-copper corners are added into the electroplating solution, and the current density is 1.5-6A/dm2The treatment time is 60-120s, and the temperature is 20-35 ℃.
4. The electroplating atomizing process of claim 1, wherein the grinding atomization in the step 3 comprises the following steps: and (3) vibrating the workpiece treated in the step (2) in a rotary vibrator for 12-18min by using 600-800-mesh conical or triangular resin grinding stones with the diameter of 3-8 mm.
5. The process of claim 4, wherein the workpiece treated in step 3 is polished in a magnetic polisher for 30-60 s.
6. The electroplating haze gold process according to claim 1, wherein the hydrochloric acid solution in the step 4 is prepared from 37% by mass of hydrochloric acid and water according to a volume ratio of 1:1, the acid washing time is 5-10s, and then the water washing is carried out.
7. The process of claim 1, wherein in step 5, the cathode is a workpiece to be plated, the anode is a carbon plate, and the electroplating solution comprises the following components: 10g/L of metallic copper, 20g/L of metallic tin, 1.5g/L of metallic zinc and hydrogen hydroxide20g/L potassium, 38g/L free sodium cyanide, pH 11-13, temperature 50 deg.C, and current density 1A/dm2The processing time is 300-600 s.
8. The process of claim 7, wherein the thickness of the cupronickel-tin coating is 1-3 μm.
9. The electroplating fog gold process of claim 1, wherein in step 6, the cathode is a workpiece to be plated, the anode is a ruthenium mesh, and the electroplating solution comprises the following components: 2g/L of metal gold, a cylinder opening agent, a conductive salt and a supplement, wherein the pH is 3.6-3.8, the temperature is 35 ℃, and the current density is 1A/dm2The processing time is 180-300 s.
10. The electroplating haze gold process as claimed in claim 1, wherein in the step 7, polyurethane acrylate is used as the cathode electrophoretic coating, the curing temperature is 125-140 ℃, and the drying time is 90 min.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102054712A (en) * | 2009-11-05 | 2011-05-11 | 北大方正集团有限公司 | Method for controlling surface roughness of circuit board |
| CN102416813A (en) * | 2010-09-28 | 2012-04-18 | 段贵生 | Processing process for electroformed flocking placer gold of copper ware |
| CN102817050A (en) * | 2012-06-20 | 2012-12-12 | 广州杰赛科技股份有限公司 | Brass compact artificial jewelry cadmium-free nickel-free leadless 18K gold electroplating method |
| CN104047041A (en) * | 2013-03-15 | 2014-09-17 | 深圳市九和咏精密电路有限公司 | Preparation method for printed circuit board |
| CN104684266A (en) * | 2015-02-04 | 2015-06-03 | 江门崇达电路技术有限公司 | Manufacturing method of matted gold line of circuit board |
| CN105624745A (en) * | 2014-11-21 | 2016-06-01 | 罗门哈斯电子材料有限责任公司 | Environmentally friendly gold electroplating compositions and methods |
| CN109778270A (en) * | 2019-03-18 | 2019-05-21 | 杭州埃迷丽珠宝有限公司 | Mist gold process is electroplated |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101096769A (en) * | 2006-06-26 | 2008-01-02 | 比亚迪股份有限公司 | Electroplating method |
| CN201062288Y (en) * | 2007-06-21 | 2008-05-21 | 杜强 | Thermostable copper-tin alloy electric plating body |
| CN101899664B (en) * | 2009-05-27 | 2012-06-20 | 比亚迪股份有限公司 | Electroplating method |
| CN102260892B (en) * | 2010-05-31 | 2014-10-08 | 比亚迪股份有限公司 | Titanium and titanium alloy pre-plating solution and electroplating method |
| CN103806056A (en) * | 2012-11-12 | 2014-05-21 | 无锡三洲冷轧硅钢有限公司 | Chromium electroplating process for stainless steel surface |
| CN104152955A (en) * | 2014-07-17 | 2014-11-19 | 广东致卓精密金属科技有限公司 | Plating solution and process for electroplating and brightening white copper-tin by using alkaline solution |
| CN105714346A (en) * | 2014-12-04 | 2016-06-29 | 重庆旭新悦数控机械有限公司 | Electroplating process for zinc alloy |
| CN106637323B (en) * | 2016-10-20 | 2019-05-21 | 张根清 | The bright mist consubstantiality appearance processing technology in metal surface |
| CN108611667B (en) * | 2018-07-13 | 2021-01-15 | 九牧厨卫股份有限公司 | Environment-friendly composite coating on copper alloy substrate and preparation method thereof |
-
2019
- 2019-03-18 CN CN201910204289.1A patent/CN109778270A/en active Pending
- 2019-12-10 CN CN201911258085.2A patent/CN110724982A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102054712A (en) * | 2009-11-05 | 2011-05-11 | 北大方正集团有限公司 | Method for controlling surface roughness of circuit board |
| CN102416813A (en) * | 2010-09-28 | 2012-04-18 | 段贵生 | Processing process for electroformed flocking placer gold of copper ware |
| CN102817050A (en) * | 2012-06-20 | 2012-12-12 | 广州杰赛科技股份有限公司 | Brass compact artificial jewelry cadmium-free nickel-free leadless 18K gold electroplating method |
| CN104047041A (en) * | 2013-03-15 | 2014-09-17 | 深圳市九和咏精密电路有限公司 | Preparation method for printed circuit board |
| CN105624745A (en) * | 2014-11-21 | 2016-06-01 | 罗门哈斯电子材料有限责任公司 | Environmentally friendly gold electroplating compositions and methods |
| CN104684266A (en) * | 2015-02-04 | 2015-06-03 | 江门崇达电路技术有限公司 | Manufacturing method of matted gold line of circuit board |
| CN109778270A (en) * | 2019-03-18 | 2019-05-21 | 杭州埃迷丽珠宝有限公司 | Mist gold process is electroplated |
Non-Patent Citations (5)
| Title |
|---|
| 刘仁志: "《轻松掌握电镀技术》", 28 February 2014, 金盾出版社 * |
| 张允诚 等: "《电镀手册》", 31 January 2007, 国防工业出版社 * |
| 杜强: "电镀白铜锡代镍工艺", 《电镀与环保》 * |
| 金鸿 等: "《印制电路技术》", 31 December 2003, 化学工业出版社 * |
| 陈治良: "《电泳涂装 实用技术》", 30 September 2009, 上海科学技术出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115820039A (en) * | 2022-12-28 | 2023-03-21 | 厦门大学 | Porous conductive ink, preparation method and application thereof |
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