CN102605398B - Method for treating surface of faucet - Google Patents

Method for treating surface of faucet Download PDF

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CN102605398B
CN102605398B CN201210109897.2A CN201210109897A CN102605398B CN 102605398 B CN102605398 B CN 102605398B CN 201210109897 A CN201210109897 A CN 201210109897A CN 102605398 B CN102605398 B CN 102605398B
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base material
plating
bath temperature
solution contains
nickel dam
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CN102605398A (en
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王发东
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Moen (Changshu) Sanitary Ware Co., Ltd.
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GUANGZHOU MOEN PLUMBING PRODUCTS CO Ltd
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Abstract

The invention discloses a method for treating the surface of a faucet. The method comprises the following steps of: A, polishing: polishing the surface of a base material to be treated, so that the surface of the base material is flatter and smother; B, electro-plating: placing the polished base material in electro-plating liquid so as to form a plated layer; C, stringing: scratching wispy marks by a melon-shaped wheel on the plated layer formed by the steps; D, spraying: spraying transparent paint on the surface of the base material, which is processed by the steps, so as to form a protection layer with a measurement angle of 20 degrees and a light intensity of 40-70. Compared with the traditional BN (Boron Nitride) process, the chromium electroplating step is omitted after the stringing step, so that not only can the process be reduced and the cost be saved, but also the pollution of hexavalent chromium to the environment can be avoided. The product treated by the method provided by the invention has the advantages of dirt resistance, no color variation, and no fingerprint, and leaves a good impression to users.

Description

A kind of faucet surface treatment process
Technical field
The present invention relates to a kind of sanitaryware method for treating surface of base, particularly a kind of faucet surface treatment process.
Background technology
At present, for the BN technique (base material+electroplate half light nickel+electroplate full light nickel+wire drawing+electrodeposited chromium+PVD) of sanitaryware substrate surface treatment, its schema refers to Fig. 1, the defect existing for Technology, utilizes the thicknesses of layers of product P VD after this art breading probably at 0.1 ~ 0.5um, the wire drawing lines of nickel layer rear surface can not be filled and led up, in use procedure, dirt oil stain is easy to remain in wire drawing lines, causes product variable color, dirty, easily stamp finger-marks, and not easy to clean.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide one to save technical process, and a kind of faucet surface treatment process of fingerprint is not stayed in product nondiscoloration after process, more resistance to product, use procedure.
In order to solve the problem existing for prior art, method of the present invention comprises the step of following order: A, rubbing down: carry out rubbing down process to pending substrate surface; B, plating: the base material after above-mentioned rubbing down is placed in electrolytic solution, be (50 ~ 60 DEG C) in temperature, current density is (2 ~ 5A/dm 2), voltage is carry out (10 ~ 26min) plating under the condition of (4 ~ 7V) to form coating; C, wire drawing: on the coating formed after above-mentioned steps process, scrape out trickle sleek with snake melon wheel; D, spraying: on the substrate surface after above-mentioned steps process, spray Clear paint to form protective layer, take measurement of an angle be 20 ° time, protective layer brilliance control is in 40 ~ 70 units.
Further, in above-mentioned plating step, when base material is copper material, following electroplating technology is first adopted to electroplate half light nickel to form half light nickel dam: in the electroplating technology of employing, plating solution contains: NiSO 47H 2o:300 ~ 350g/L, NiCl 26H 2o:34 ~ 45g/L, H 3bO 3: 35 ~ 45g/L, sodium laurylsulfonate: 0.1 ~ 0.2g/L, bath temperature: 50 ~ 60 DEG C, current density: 1 ~ 2.5A/dm 2; Then power at half light nickel dam and plate the full light nickel dam of one deck, in the electroplating technology of employing, plating solution contains: NiSO 47H 2o:300 ~ 350g/L, NiCL 26H 2o:34 ~ 45g/L, H 3bO 3: 35 ~ 45g/L, sodium laurylsulfonate: 0.1 ~ 0.2g/L, asccharin: 0.6 ~ 1g/L, 1,4 ?butynediol: 0.3 ~ 1.5g/L, pH:3.8 ~ 4.4, bath temperature: 50 ~ 60 DEG C, current density: 2 ~ 5A/dm 2; Finally carry out plating aftertreatment.
Further, above-mentioned plating step comprises, when base material is zinc alloy base material, A, first base material is electroplated before except cured process; B, through except after cured process, in substrate surface plating last layer layers of copper, in the electroplating technology of employing, plating solution contains: CuSO 4: 150 ~ 250g/L, H 2sO 4: 40 ~ 110g/, bath temperature: 20 ~ 50 DEG C, current density: 1 ~ 3A/dm 2; C, in layers of copper, electroplate half light nickel dam again, in the electroplating technology of employing, plating solution contains: NiSO 47H 2o:300 ~ 350g/L, NiCL 26H 2o:34 ~ 45g/L, H 3bO 3: 35 ~ 45g/L, sodium laurylsulfonate: 0.1 ~ 0.2g/L, bath temperature: 50 ~ 60 DEG C, current density: 1 ~ 2.5A/dm 2; D, then power at half light nickel dam and plate full light nickel dam, in the electroplating technology of employing, plating solution contains: NiSO 47H 2o:300 ~ 350g/L, NiCL 26H 2o:34 ~ 45g/L, H 3bO 3: 35 ~ 45g/L, sodium laurylsulfonate: 0.1 ~ 0.2g/L, asccharin: 0.6 ~ 1g/L, 1,4 ?butynediol: 0.3 ~ 1.5g/L, pH:3.8 ~ 4.4, bath temperature: 50 ~ 60 DEG C, current density: 2 ~ 5A/dm 2; E, finally carry out plating aftertreatment.
Further, above-mentioned plating step comprises, when base material is ABS plastic base material, A, first base material is electroplated before except cured process; B, through plating one deck nickel dam except the base material after cured powers on, in the electroplating technology of employing, plating solution contains: NiSO 47H 2o:20g/L, NH 4cl:30g/L, NaH 2pO 2h 2o:30g/L, Trisodium Citrate: 10g/L, pH value: 9 ~ 10, bath temperature: 25 ~ 40 DEG C; C, then power at nickel dam and plate layers of copper, in the electroplating technology of employing, plating solution contains: CuSO 4: 150 ~ 250g/L, H 2sO 4: 40 ~ 110g/, bath temperature: 20 ~ 50 DEG C, current density: 1 ~ 3A/dm 2; D, in layers of copper, electroplate half light nickel dam again, in the electroplating technology of employing, plating solution contains: NiSO 47H 2o:300 ~ 350g/L, NiCl 26H 2o:34 ~ 45g/L, H 3bO 3: 35 ~ 45g/L, sodium laurylsulfonate: 0.1 ~ 0.2g/L, bath temperature: 50 ~ 60 DEG C, current density: 1 ~ 2.5A/dm 2; E also powers at half light nickel dam and plates full light nickel dam, and in the electroplating technology of employing, plating solution contains: NiSO 47H 2o:300 ~ 350g/L, NiCl 26H 2o:34 ~ 45g/L, H 3bO 3: 35 ~ 45g/L, sodium laurylsulfonate: 0.1 ~ 0.2g/L, asccharin: 0.6 ~ 1g/L, 1,4 ?butynediol: 0.3 ~ 1.5g/L, pH:3.8 ~ 4.4; Bath temperature: 50 ~ 60 DEG C; Current density: 2 ~ 5A/dm 2; F, finally carry out plating aftertreatment.
Further, described plating post-processing step comprises washing and drying and processing.
Further, described rubbing down process comprises first frosted, again polished finish.
Further, described Clear paint is acroleic acid polyurethane.
Further, before above-mentioned spraying process, first base material carried out successively oil removing, passivation, wash, dry up, baking processing.
Further, described base material carries out baking-curing process again after above-mentioned spray treatment.
Further, described protective layer thickness is 20 ~ 100 μm.
Compared with prior art, the invention has the beneficial effects as follows:
With traditional BN technics comparing, the electrodeposited chromium step after present invention omits wire drawing, both shortened operation, cost-saving, and sexavalent chrome can be avoided again the pollution of environment; Adopt Clear paint to replace PVD after wire drawing, the lines produced fully can be covered, improve the microtexture of shaping rear product surface after wire drawing.Particularly, the nickel dam formed after electroplating because adopting electroplating technology of the present invention has good corrosion-resisting function, and the Clear paint adopted is acroleic acid polyurethane, has the pencil hardness of excellent weathering resistance, photostabilization and more than 1H.Therefore, the product after invention of the present invention process more bears dirty, and nondiscoloration, can not remain finger line, leaves favorable impression to user.
Accompanying drawing explanation
Fig. 1 is the process flow sheet of traditional B N technique;
Fig. 2 is process flow sheet of the present invention;
Fig. 3 is the process flow sheet for electroplating work procedure (ABS substrate) in the embodiment of the present invention 1;
Fig. 4 is product subsurface laminate structure schematic diagram in embodiment 1;
Fig. 5 is the process flow sheet of electroplating work procedure in the embodiment of the present invention 2 (zinc-base material);
Fig. 6 is the process flow sheet of electroplating work procedure (Copper base material) in the embodiment of the present invention 3.
Embodiment
Surface treatment method of the present invention is applicable to the water tap made by base material such as copper, zinc, stainless steel, aluminium, ABS, PC, in the following embodiments, respectively detailed explanation and explanation will be done to the surface treatment method of the water tap of ABS plastic base material, zinc-base material water tap and Copper base material water tap.
Embodiment 1
Water tap involved by the present embodiment is made up of ABS plastic, and its substrate surface treatment operation is as follows:
First, injection moulding blank out, makes any surface finish of base material, smooth by the operation of rubbing down, during process, first with dry sanding paper, blank is carried out to frosted process, carries out polished finish again.
Then, please refer to Fig. 3, to the base material after rubbing down process by adopting electroless plating last layer nickel after paraffin removal, oil removing, roughening treatment, successively, again with electroplating one deck copper, then electroplating one deck half light nickel in layers of copper, finally adopting electro-plating method to plate the full light nickel of one deck.After above-mentioned process, the base material with four layers of coating is carried out wash, then dry stand-by.
In the electroplating technology adopted during electroless nickel layer, contain in plating solution: NiSO 47H 2o:20g/L, NH 4cl:30g/L, NaH 2pO 2h 2o:30g/L, Trisodium Citrate: 10g/L; Bath pH value is: 9 ~ 10, bath temperature: 25 ~ 40 DEG C.
In the electroplating technology adopted during copper electroplating layer, plating solution contains: CuSO 4: 150 ~ 250g/L, H 2sO 4: 40 ~ 110g/; And bath temperature is: 20 ~ 50 DEG C, during plating, current density is: 1 ~ 3A/dm 2.
In the electroplating technology adopted when electroplating half light nickel dam, plating solution contains: NiSO 47H 2o:300 ~ 350g/L, NiCL 26H 2o:34 ~ 45g/L, H 3bO 3: 35 ~ 45g/L, sodium laurylsulfonate: 0.1 ~ 0.2g/L; During plating, bath temperature is: 50 ~ 60 DEG C, current density: 1 ~ 2.5A/dm 2.
On half light nickel dam during the full light nickel dam of re-plating, in the electroplating technology of employing, plating solution contains: NiSO 47H 2o:300 ~ 350g/L, NiCL 26H 2o:34 ~ 45g/L, H 3bO 3: 35 ~ 45g/L, sodium laurylsulfonate: 0.1 ~ 0.2g/L, asccharin: 0.6 ~ 1g/L, Isosorbide-5-Nitrae-butynediol: 0.3 ~ 1.5g/L; The pH value of plating solution is: 3.8 ~ 4.4; Bath temperature: 50 ~ 60 DEG C; Current density: 2 ~ 5A/dm 2.
Then, enter wire-drawing process, on the coating formed after above-mentioned steps process, scrape out trickle sleek with snake melon wheel.
Finally; it is spraying process; base material after wire drawing carried out successively oil removing, passivation, wash, dry up, toast, dust removal process; again with the acroleic acid polyurethane spraying base material as BASF C23-35; making its surface form thickness is the protective layer of 20 ~ 100um, carries out drying and processing, solidify to make protective layer after spraying; solidification after protective layer take measurement of an angle be 20 ° time, brightness be 40 ~ 70 international candles/square metre.
After above-mentioned art breading, the surface structure of ABS plastic base material, from outside to inside successively: protective layer 1, full light nickel dam 2, half light nickel dam 3, layers of copper 4, electroless nickel layer 5, ABS substrate, refers to Fig. 4.
Base material is after treatment by the numerous test strictly of industry, and test event comprises:
1. fall husky experiment: fall from the husky 12L of the special Buddha's warrior attendant of imported from America vertical tube that is high by 1m, appointment bore the product surface placed in 45° angle, the sprayed coating of product surface does not gall and is by (with reference to ASTM ?968 and ASMEA.112.18.1/CSA B125.1).
2. sticking power test: (distance is 1mm to draw 11 with icking tool on product, length is 20mm) grid, adhere to by specific sticking power test tape, 90+/?complete in 30S (with reference to ASTM D ?3359: experimental technique B ?grid cutting experiment).
3. water moves back experiment: immerse temperature be 38 DEG C of+/ ?2 water in 24+/?after 0.5h, take out, relative humidity be 50%+/?5% environment under, product is placed naturally 24+/?0.5h (reference ASTM D ?870).
4. chemical resistance experiment: temperature be 23+/?2 DEG C, relative humidity be 50%+/?5% environment in, drip two specific chemical reagent and keep on product 16 hours (reference ASTM D ?013087.3 part).
5. corrosion experiment: copper accelerated (with reference to ASTM B368) in 8 hours.
Outward appearance/color/brightness: visual/contrast model (with reference to industry standard: DS ?500).
Embodiment 2
Water tap involved by the present embodiment is made up of zinc alloy, its base material pre-electroplating treatment and post-treating method identical with embodiment 1, after process, the surface property of product is consistent with embodiment 1, but its electro-plating method is as follows:
Please refer to Fig. 5, first, to the base material after rubbing down process by after paraffin removal, oil removal treatment;
Then, first electroplate last layer copper successively, then in layers of copper, electroplate one deck half light nickel, finally electroplate the full light nickel of last layer.
In the electroplating technology that substrate surface copper electroplating layer adopts, plating solution contains: CuSO 4: 150 ~ 250g/L, H 2sO 4: 40 ~ 110g/; Bath temperature during plating: 20 ~ 50 DEG C, current density: 1 ~ 3A/dm 2.
Layers of copper is electroplated in the electroplating technology that half light nickel dam adopts, plating solution contains: NiSO 47H 2o:300 ~ 350g/L, NiCl 26H 2o:34 ~ 45g/L, H 3bO 3: 35 ~ 45g/L, sodium laurylsulfonate: 0.1 ~ 0.2g/L; Bath temperature during plating: 50 ~ 60 DEG C, current density: 1 ~ 2.5A/dm 2.
Power at half light nickel dam and plate in electroplating technology that full light nickel dam adopts, plating solution contains: NiSO 47H 2o:300 ~ 350g/L, NiCL 26H 2o:34 ~ 45g/L, H 3bO 3: 35 ~ 45g/L, sodium laurylsulfonate: 0.1 ~ 0.2g/L, asccharin: 0.6 ~ 1g/L, Isosorbide-5-Nitrae-butynediol: 0.3 ~ 1.5g/L; The pH value of plating solution is: 3.8 ~ 4.4; Bath temperature during plating: 50 ~ 60 DEG C, current density: 2 ~ 5A/dm 2.
After above-mentioned process, the base material with three layers of coating is carried out wash, then dry stand-by.
Embodiment 3
Water tap involved by the present embodiment is made of copper, its base material pre-electroplating treatment and post-treating method identical with embodiment 1, after process, the surface property of product is consistent with embodiment 1, but its electro-plating method is as follows:
Please refer to Fig. 6, first, to the base material after rubbing down process by after paraffin removal, oil removal treatment;
Then, first electroplate last layer half light nickel successively, then the full light nickel of re-plating last layer just can on half light nickel dam.
In the electroplating technology adopted when electroplating half light nickel dam on substrate surface, plating solution contains: NiSO 47H 2o:300 ~ 350g/L, NiCL 26H 2o:34 ~ 45g/L, H 3bO 3: 35 ~ 45g/L, sodium laurylsulfonate: 0.1 ~ 0.2g/L; Bath temperature during plating: 50 ~ 60 DEG C; Current density: 1 ~ 2.5A/dm 2.
In the electroplating technology adopted when half light nickel dam electroplates full light nickel dam, plating solution contains: NiSO 47H 2o:300 ~ 350g/L, NiCL 26H 2o:34 ~ 45g/L, H 3bO 3: 35 ~ 45g/L, sodium laurylsulfonate: 0.1 ~ 0.2g/L, asccharin: 0.6 ~ 1g/L, Isosorbide-5-Nitrae-butynediol: 0.3 ~ 1.5g/L; The pH value of plating solution is: 3.8 ~ 4.4; Bath temperature during plating: 50 ~ 60 DEG C, current density: 2 ~ 5A/dm 2.
After above-mentioned process, the base material with three layers of coating is carried out wash, then dry stand-by.

Claims (7)

1. an ABS plastic faucet surface treatment process, is characterized in that the step comprising following order:
A. rubbing down: rubbing down process is carried out to pending substrate surface;
B. before on the basis of the above-described procedure base material being electroplated except Lasaxing Oilfield;
C. through except electroless plating last layer nickel dam on the base material after cured, in the technique of employing, plating solution contains: NiSO 47H 2o:20g/L, NH 4cl:30g/L, NaH 2pO 2h 2o:30g/L, Trisodium Citrate: 10g/L, pH value: 9 ~ 10, bath temperature: 25 ~ 40 DEG C;
D. then power at nickel dam and plate layers of copper, in the electroplating technology of employing, plating solution contains: CuSO 4: 150 ~ 250g/L, H 2sO 4: 40 ~ 110g/, bath temperature: 20 ~ 50 DEG C, current density: 1 ~ 3A/dm 2;
E. electroplate half light nickel dam, in the electroplating technology of employing, plating solution contains: NiSO 47H 2o:300 ~ 350g/L, NiCl 26H 2o:34 ~ 45g/L, H 3bO 3: 35 ~ 45g/L, sodium laurylsulfonate: 0.1 ~ 0.2g/L, bath temperature: 50 ~ 60 DEG C, current density: 1 ~ 2.5A/dm 2;
F. power at half light nickel dam and plate full light nickel dam, in the electroplating technology of employing, plating solution contains: NiSO 47H 2o:300 ~ 350g/L, NiCl 26H 2o:34 ~ 45g/L, H 3bO 3: 35 ~ 45g/L, sodium laurylsulfonate: 0.1 ~ 0.2g/L, asccharin: 0.6 ~ 1g/L, 1,4 ?butynediol: 0.3 ~ 1.5g/L, pH:3.8 ~ 4.4, bath temperature: 50 ~ 60 DEG C, current density: 2 ~ 5A/dm 2, finally carry out plating aftertreatment;
G. wire drawing: scrape out trickle sleek with snake melon wheel on the coating formed after above-mentioned steps process;
H. pre-treatment is sprayed: the base material after wire drawing carried out successively oil removing, passivation, wash, dry up, baking processing;
I. spray: on the substrate surface after above-mentioned steps process, spray acroleic acid polyurethane to form protective layer, take measurement of an angle be 20 ° time, protective layer brilliance control is in 40 ~ 70 units.
2. faucet surface treatment process according to claim 1, is characterized in that: described plating post-processing step comprises washing and drying and processing.
3. faucet surface treatment process according to claim 1, is characterized in that: described rubbing down process comprises first frosted, again polished finish.
4. faucet surface treatment process according to claim 1, is characterized in that: described base material carries out baking-curing process again after above-mentioned spray treatment.
5. faucet surface treatment process according to claim 1, is characterized in that: described protective layer thickness is 20 ~ 100 μm.
6. faucet surface treatment process according to claim 1, is characterized in that: when base material is copper material,
Electroplate in the electroplating technology of half light nickel employing, plating solution contains: NiSO 47H 2o:300 ~ 350g/L, NiCl 26H 2o:34 ~ 45g/L, H 3bO 3: 35 ~ 45g/L, sodium laurylsulfonate: 0.1 ~ 0.2g/L, bath temperature: 50 ~ 60 DEG C, current density: 1 ~ 2.5A/dm 2;
In the electroplating technology that the full light nickel dam of plating last layer adopts, plating solution contains: NiSO 47H 2o:300 ~ 350g/L, NiCl 26H 2o:34 ~ 45g/L, H 3bO 3: 35 ~ 45g/L, sodium laurylsulfonate: 0.1 ~ 0.2g/L, asccharin: 0.6 ~ 1g/L, 1,4 ?butynediol: 0.3 ~ 1.5g/L, pH:3.8 ~ 4.4, bath temperature: 50 ~ 60 DEG C, current density: 2 ~ 5A/dm 2;
Finally carry out plating aftertreatment.
7. faucet surface treatment process according to claim 1, is characterized in that: when base material is zinc alloy base material,
A, first base material is electroplated before except cured process;
B, through except after cured process, in substrate surface plating last layer layers of copper, in the electroplating technology of employing, plating solution contains: CuSO 4: 150 ~ 250g/L, H 2sO 4: 40 ~ 110g/, bath temperature: 20 ~ 50 DEG C, current density: 1 ~ 3A/dm 2;
C, in layers of copper, electroplate half light nickel dam again, in the electroplating technology of employing, plating solution contains: NiSO 47H 2o:300 ~ 350g/L, NiCl 26H 2o:34 ~ 45g/L, H 3bO 3: 35 ~ 45g/L, sodium laurylsulfonate: 0.1 ~ 0.2g/L, bath temperature: 50 ~ 60 DEG C, current density: 1 ~ 2.5A/dm 2;
D, then power at half light nickel dam and plate full light nickel dam, in the electroplating technology of employing, plating solution contains: NiSO 47H 2o:300 ~ 350g/L, NiCl 26H 2o:34 ~ 45g/L, H 3bO 3: 35 ~ 45g/L, sodium laurylsulfonate: 0.1 ~ 0.2g/L, asccharin: 0.6 ~ 1g/L, 1,4 ?butynediol: 0.3 ~ 1.5g/L, pH:3.8 ~ 4.4, bath temperature: 50 ~ 60 DEG C, current density: 2 ~ 5A/dm 2;
E, finally carry out plating aftertreatment.
CN201210109897.2A 2012-04-13 2012-04-13 Method for treating surface of faucet Active CN102605398B (en)

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