CN205622971U - Printed circuit board with compound gold plated layer - Google Patents
Printed circuit board with compound gold plated layer Download PDFInfo
- Publication number
- CN205622971U CN205622971U CN201620168408.4U CN201620168408U CN205622971U CN 205622971 U CN205622971 U CN 205622971U CN 201620168408 U CN201620168408 U CN 201620168408U CN 205622971 U CN205622971 U CN 205622971U
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- China
- Prior art keywords
- gold
- layer
- soft
- hard
- nickel dam
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Abstract
The utility model provides a printed circuit board with compound gold plated layer, include core, pressfitting on the copper layer on core surface, electroplate the nickel dam on the copper layer and electroplate the gold plated layer on the nickel dam, core, copper layer, nickel dam and gold plated layer are set gradually outside to by interior, gold plated layer is including hard gold layer and soft gold layer, the surface at the nickel dam is electroplated on soft gold layer, the surface on hard gold layer is electroplated on soft gold layer, and this soft gold layer presss from both sides establishes between nickel dam and hard gold layer. The utility model has the advantages of the utility model discloses plating soft gold layer and hard gold layer in proper order on the nickel dam, utilizing the soft gold of hard gold protection, utilize soft gold to promote the corrosion stability of cladding material, gold plated layer's hardness can be guaranteed with the laminiform gold plated layer that one -tenth compound of soft gold, one side in hard gold layer, prevents to wipe the flower, and on the other hand can strengthen gold plated layer's corrosion resistance, the qualification rate of improvement product.
Description
Technical field
This utility model relates to a kind of wiring board, particularly relates to a kind of printed substrate with Composite Coatings layer gold.
Background technology
Along with the high speed development of PCB industry, the integrated level of line pattern design is more and more higher.High frequency is believed
From the point of view of number, the requirement to signal transmission quality is more and more higher, designs stricter to the structure of PCB,
For ensureing signal transmission quality, craft of gilding plate arises at the historic moment, and electronickelling technology for gold processes on wiring board surface
Time be widely used.
But the existing pcb board with Gold plated Layer is affected by its structure, exist many not enough, producing
During easily go out cash peel off problem, cause wiring board to scrap, reduce product qualification rate, to producer carry
Lose.It addition, in the prior art, for reducing the probability that gold is peeled off, most of manufacturers adopt one after another
By the way of increase gold thick (gold thickness needs more than 0.25um), due to golden price costly, traditional increasing
Add the thick production method of gold and improve the production cost of producer the most further, reduce the interests space of producer.
Utility model content
Therefore, the purpose of this utility model be to provide a kind of anti-scratch, saving gold consumption there is Composite Coatings
The printed substrate of layer gold.
A kind of printed substrate with Composite Coatings layer gold, the layers of copper including central layer, being pressed together on core plate surface,
Plating nickel dam in layers of copper and plating Gold plated Layer on nickel dam, described central layer, layers of copper, nickel dam and gold-plated
Layer sets gradually from inside to outside, and described Gold plated Layer includes hard gold layer and soft gold layer, and described soft gold layer is electroplated at nickel
The outer surface of layer, the plating of described soft gold layer is at the outer surface of hard gold layer, and this soft gold layer is folded in nickel dam and hard gold
Between Ceng.
Further, the material of soft gold layer is plating proof gold or alloy.
Further, the material of described hard gold layer is electronickelling gold or gold cobalt alloy.
Further, the thickness of described hard gold layer is 0.7～1um, and the thickness of hard gold layer is between 0.8～1um.
The beneficial effects of the utility model are: the present invention plates soft gold layer and hard gold layer on nickel dam successively, profit
Protecting soft gold with hard gold, utilize soft gold to promote the corrosion stability of coating, hard gold layer and soft gold layer are formed compound gold-plated
Layer, on the one hand can ensure that the hardness of Gold plated Layer, prevents from wiping flower, on the other hand can improve the anti-of Gold plated Layer
Corrosivity, improves the qualification rate of product.It addition, the hardness of Composite Coatings layer gold, the performance such as anticorrosive are better than biography
The Gold plated Layer of system, in gold plating process, it is only necessary to the coating of plating layer, saves the consumption of gold, reduces raw
Produce cost, improve the business efficiency of enterprise further.
Accompanying drawing explanation
Fig. 1 is the profile that this utility model has the printed substrate of Composite Coatings layer gold, and wherein central layer does not shows
Show.
Detailed description of the invention
In order to make the technical solution of the utility model can more clearly show, below in conjunction with the accompanying drawings to this reality
It is described further with novel.
As it is shown in figure 1, this utility model provides a kind of printed substrate with Composite Coatings layer gold, this has
The printed substrate of Composite Coatings layer gold includes that central layer, the layers of copper 10 being pressed together on core plate surface, plating are in layers of copper 10
On nickel dam 20 and plating Gold plated Layer 30 on nickel dam 20, described central layer, layers of copper 10, nickel dam 20 and
Gold plated Layer 30 sets gradually from inside to outside.
Described Gold plated Layer 30 includes that hard gold layer 32 and soft gold layer 31, described soft gold layer 31 are electroplated at nickel dam 20
Outer surface, described soft gold layer 31 electroplates the outer surface in hard gold layer 32, and this soft gold layer 31 is folded in nickel dam
Between 20 and hard gold layer 32, the thickness of described hard gold layer 32 is 0.7～1um, and the thickness of hard gold layer 32 is
Between 0.8～1um, it is preferable that the thickness of described Gold plated Layer 30 is 0.16um.Wherein, soft gold layer 31
The plating proof gold softer for hardness or alloy, hard gold layer 32 is that the golden or golden cobalt of electronickelling that hardness is stronger closes
Gold.
The beneficial effects of the utility model are: the present invention plates soft gold layer 31 and hard gold on nickel dam 20 successively
Layer 32, utilizes hard gold to protect soft gold, utilizes soft gold to promote the corrosion stability of coating, hard gold layer 32 and soft gold layer
31 form Composite Coatings layer gold 30, on the one hand can ensure that the hardness of Gold plated Layer 30, prevent from wiping flower, the opposing party
The corrosion resistance of Gold plated Layer 30 can be improved in face, improves the qualification rate of product.It addition, the Composite Coatings of the application
The hardness of layer gold 30, the performance such as anticorrosive are better than traditional Gold plated Layer 30, in gold plating process, it is only necessary to plating one
The coating that layer is relatively thin, saves the consumption of gold, reduces production cost, improves the business efficiency of enterprise further.
Embodiment described above only have expressed a kind of embodiment of the present utility model, its describe more concrete and
In detail, but therefore can not be interpreted as the restriction to this utility model the scope of the claims.It should be pointed out that,
For the person of ordinary skill of the art, without departing from the concept of the premise utility, it is also possible to
Making some deformation and improvement, these broadly fall into protection domain of the present utility model.Therefore, this utility model
The protection domain of patent should be as the criterion with claims.
Claims (4)
1. a printed substrate with Composite Coatings layer gold, it is characterised in that: include central layer, be pressed together on core
The layers of copper on plate surface, the nickel dam electroplated in layers of copper and plating Gold plated Layer on nickel dam, described central layer, copper
Layer, nickel dam and Gold plated Layer set gradually from inside to outside, and described Gold plated Layer includes hard gold layer and soft gold layer, described
Soft gold layer plating is pressed from both sides in the outer surface of hard gold layer, this soft gold layer in the outer surface of nickel dam, the plating of described soft gold layer
It is located between nickel dam and hard gold layer.
There is the printed substrate of Composite Coatings layer gold the most as claimed in claim 1, it is characterised in that soft gold
The material of layer is plating proof gold or alloy.
There is the printed substrate of Composite Coatings layer gold the most as claimed in claim 2, it is characterised in that described
The material of hard gold layer is electronickelling gold or gold cobalt alloy.
There is the printed substrate of Composite Coatings layer gold the most as claimed in claim 2, it is characterised in that described
The thickness of hard gold layer is 0.7～1um, and the thickness of hard gold layer is between 0.8～1um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620168408.4U CN205622971U (en) | 2016-03-04 | 2016-03-04 | Printed circuit board with compound gold plated layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620168408.4U CN205622971U (en) | 2016-03-04 | 2016-03-04 | Printed circuit board with compound gold plated layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205622971U true CN205622971U (en) | 2016-10-05 |
Family
ID=57034255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620168408.4U Active CN205622971U (en) | 2016-03-04 | 2016-03-04 | Printed circuit board with compound gold plated layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205622971U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110184633A (en) * | 2019-05-21 | 2019-08-30 | 上海锦町实业有限公司 | A kind of preparation method of copper aluminum composite material metal film on surface |
-
2016
- 2016-03-04 CN CN201620168408.4U patent/CN205622971U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110184633A (en) * | 2019-05-21 | 2019-08-30 | 上海锦町实业有限公司 | A kind of preparation method of copper aluminum composite material metal film on surface |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |