CN202503808U - Circuit board with protection film for protecting binding area - Google Patents
Circuit board with protection film for protecting binding area Download PDFInfo
- Publication number
- CN202503808U CN202503808U CN2012200706497U CN201220070649U CN202503808U CN 202503808 U CN202503808 U CN 202503808U CN 2012200706497 U CN2012200706497 U CN 2012200706497U CN 201220070649 U CN201220070649 U CN 201220070649U CN 202503808 U CN202503808 U CN 202503808U
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- Prior art keywords
- layer
- protection
- binding area
- circuit board
- nation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
A circuit board with a protection film for protecting the binding area comprises a substrate (10), a copper conductive layer (20) provided on the surface of the substrate (10), a covering film layer (30) covering the copper conductive layer (20) and a electroless nickel and immersion gold layer (40) coated on the opening of the covering film layer (30). The electroless nickel and immersion gold layer (40) is also covered with a PI adhesive protection layer (50). The circuit board with the protection film for protecting the binding area provided by the utility model has the beneficial effects that scratch and abrasion problems of a golden surface of the binding product binding area can be effectively avoided, and the product qualification rate is improved.
Description
Technical field
The utility model relates to wiring board, particularly the structural design of the covered with protective film in the wiring board course of processing.
Background technology
At present the flow process of production nation fixed output quota article generally also must be passed through electrical measurement, silk-screen, assembling, lamination, towards operations such as external forms with generally the FPC production procedure is the same in the industry behind commercialization nickel gold.
Production procedure behind the change nickel gold is long more, and it is bound regional golden face and is collided in process of production easily more, rubs, and causes nation's fixed output quota article to bind regional golden face and scratches, wipes the flower problem.The quality of customer requirement is also increasingly high, and can not there be the scuffing phenomenon in nation during the deposit line, if bind the zone occur scratching, wipe the flower phenomenon will cause can't nation's deposit line or bind adhesion and do not reach, cause product rejection.This also is production nation fixed output quota article one of main points the most rambunctious in the present industry to scratch, wipe flower.
Summary of the invention
The utility model provides a kind of wiring board with the fixed zone of protection glued membrane protection nation, is employed in the method for binding regional covered with protective film at product in the processing intermediate link, solves the technical problem that product scratches in the prior art.
The utility model is to solve the problems of the technologies described above this a kind of wiring board with the fixed zone of protection glued membrane protection nation that provides; Comprise substrate, be arranged at this substrate surface the copper conductive layer, cover on this copper conductive layer the change nickel-gold layer that covers rete and on this covering rete institute windowing, plate, also be coated with the protective layer of PI glue on this change nickel-gold layer.
The beneficial effect of the utility model is, effectively avoided the binding product to bind regional golden face and scratched, wipes the flower problem, improved the qualification rate of producing.
Description of drawings
Fig. 1 is the schematic perspective view that the utlity model has the diaphragm wiring board.Fig. 2 is the cross-sectional schematic that the utlity model has the diaphragm wiring board.
Embodiment
Specific embodiment in conjunction with above-mentioned description of drawings the utility model.
By knowing among Fig. 1 and Fig. 2; This wiring board with the fixed zone of protection glued membrane protection nation comprises substrate 10, is arranged at the copper conductive layer 20 on these substrate 10 surfaces, covers the change nickel-gold layer 40 that covers rete 30 and plating on 30 windowings 31 of this covering rete on this copper conductive layer 20; Also be coated with the protective layer 50 of PI glue on this change nickel-gold layer 40; Said protective layer 50 covers all change nickel-gold layers 40, and said protective layer 50 is for having the adhesive tape of PI glue.
The utility model solves nation and locates the scheme that golden face scratches surely and be: after commercialization nickel gold, its electric property of electrical testing are qualified, are affixed on high temperature resistant PI adhesive tape and bind regional golden face place, the PI adhesive tape than bind regional golden face big a little.In the subsequent production process be like this operation process or production process its bind regional golden face one deck PI adhesive tape protection all can be arranged, product tears when accomplishing to tear this protective tapes behind the finished product again or let the client in assembling more then.Institute causes the binding product to bind regional golden face scuffing, problem is spent in wiping effectively to have avoided product behind change nickel gold, to be collided, to rub in the production process.
Above content is to combine concrete preferred implementation to the further explain that the present invention did, and can not assert that practical implementation of the present invention is confined to these explanations.For the those of ordinary skill of technical field under the present invention, under the prerequisite that does not break away from the present invention's design, can also make some simple deduction or replace, all should be regarded as belonging to protection scope of the present invention.
Claims (3)
1. one kind has the fixed regional wiring board of protection glued membrane protection nation; Comprise substrate (10), be arranged at the surperficial copper conductive layer (20) of this substrate (10), cover the change nickel-gold layer (40) that this copper conductive layer (20) is gone up covering rete (30) and on this covering rete (30) institute windowing, plated, it is characterized in that: the protective layer (50) that also is coated with PI glue on this change nickel-gold layer (40).
2. according to the said wiring board with the fixed zone of protection glued membrane protection nation of claim 1, it is characterized in that: said protective layer (50) covers all change nickel-gold layers (40).
3. according to claim 1 or 2 said wiring boards with the fixed zone of protection glued membrane protection nation, it is characterized in that: said protective layer (50) is for having the adhesive tape of PI glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200706497U CN202503808U (en) | 2012-02-29 | 2012-02-29 | Circuit board with protection film for protecting binding area |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200706497U CN202503808U (en) | 2012-02-29 | 2012-02-29 | Circuit board with protection film for protecting binding area |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202503808U true CN202503808U (en) | 2012-10-24 |
Family
ID=47040406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200706497U Expired - Lifetime CN202503808U (en) | 2012-02-29 | 2012-02-29 | Circuit board with protection film for protecting binding area |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202503808U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103338587A (en) * | 2013-07-10 | 2013-10-02 | 苏州联易昌工业材料有限公司 | Circuit board and fabrication technology thereof |
| CN107845620A (en) * | 2016-09-20 | 2018-03-27 | 矽品精密工业股份有限公司 | Substrate structure and method for fabricating the same |
-
2012
- 2012-02-29 CN CN2012200706497U patent/CN202503808U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103338587A (en) * | 2013-07-10 | 2013-10-02 | 苏州联易昌工业材料有限公司 | Circuit board and fabrication technology thereof |
| CN107845620A (en) * | 2016-09-20 | 2018-03-27 | 矽品精密工业股份有限公司 | Substrate structure and method for fabricating the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121024 |