CN1569382A - Chemical tin solution for flexible printed circuit board - Google Patents
Chemical tin solution for flexible printed circuit board Download PDFInfo
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- CN1569382A CN1569382A CN 03130404 CN03130404A CN1569382A CN 1569382 A CN1569382 A CN 1569382A CN 03130404 CN03130404 CN 03130404 CN 03130404 A CN03130404 A CN 03130404A CN 1569382 A CN1569382 A CN 1569382A
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- printed wiring
- wiring board
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Abstract
The invention provides a tin solution for soft printed circuit board; it includes tin salt compound, complexant, inorganic acid or organic acid with the functional group to tin salt compound, corrosion inhibitor, surface activator, conformity agent, and antioxidant. The corrosion inhibitor can prevent the corrosion phenomenon on the copper surface under the covering material bond, avoids from tin pit, the fluorine surface activator is used as wetter, it can upgrade the outlook of the plating layer.
Description
Technical field
The present invention relates to the material that the flexible printed wiring board surface treatment is used, relate in particular to a kind of flexible printed wiring board chemical tin solution.
Background technology
Flexible circuit is the interior type of attachment of a kind of printed wire that design forms on base material thin and bending arbitrarily, it can fold in minimum three dimensions or be crooked, this is that hard circuit board can't be realized, therefore, flexible circuit board be widely used in have minimum three dimensions, and need long-time and repeatedly crooked and folding, guarantee in the product in reliable service life for example mobile phone, digital camera, digital camcorder, facsimile machine, notebook computer, printer, hard disk drive, CD drive and instrument board etc.
The material that existing flexible circuit board uses mainly comprises: base material, and it generally adopts polyimide film, mylar, glass fibre to add epoxy resin polyester film or resin coated paper etc. and makes; Conductor, it adopts the metal material with electric conductivity, for example Copper Foil, stainless steel foil, aluminium foil etc.; Laminate (adhesive base material), it adopts adhesion type materials such as epoxy resin, acrylic acid or phenolic resin; Adhesive phase generally adopts adhesives such as epoxy resin, acrylic acid, phenolic resin, perhaps pressure-sensitive adhesive; Cover layer generally adopts polyimide film, mylar, the special-purpose welding resistance printing ink of flexible circuit board etc.; Strengthening material adopts polyimide film, mylar, glass fibre to add epoxy resin polyester film or metallic plate.Wherein, it is the main distinction of flexible circuit board and hard circuit board that cover layer is set, it is the mechanical protection sheath of crisp fritter conductor on the flexible circuit board, the standard material that the special-purpose welding resistance printing ink of film class cover layer and flexible circuit board is existing flexible circuit board, in order to satisfy the strict demand that connects flexible circuit board in some high density, develop several photosensitive cover lay materials on the market, it mainly adopts remains the film capstock, these coverlays all scribble the epoxy resin of one deck semi-solid preparation or acrylic resin as adhesive, for example, the product that E.I.Du Pont Company produces, (commodity are called Pyralux LF) it scribbles one deck acrylic resin; What the products C ISV that the company that builds day produces used is the adhesive of epoxy resin.Circuit board by the above-mentioned material moulding also needs through final surface treatment (as hot air leveling technology etc.), to keep the solderability of base material.
In recent years, the chemical tin technology is to substitute the hot air leveling tin spray process and as a kind of good selection of the final processing method on copper wire surface exposed on the printed circuit board (PCB) by extensive cognition, through the printed circuit board (PCB) after the chemical tin PROCESS FOR TREATMENT, can produce a layer thickness evenly and the pure tin coating of surfacing by chemical replacement reaction, make follow-up electronical elements surface mount the easy to operate of program, can use large-scale continuous automated production pattern, and mount quality and improve, it is uneven and be uneven so that influence the problem that electronic component automation surface mounts to have solved circuit table face thickness that existing hot air leveling tin spray process exists; In addition, this technology can be avoided using the lead that bans use of in the electronics industry industry, and new technology type such as chemical tin technology and other chemical nickel and gold, chemical silver, chemical palladium etc. compares, and has the low advantage of cost again.Therefore, the chemical tin technology is widely used in handling copper and alloy thereof, BP GB1058210 for example, and U.S. Pat 6063172, US4175894, US4657632 all are described in European patent EP 0545218 patent documentation such as grade.The main component that existing chemical tin solution comprises is: pink salt compounds, complexing agent, inorganic acid or the organic acid identical with pink salt compounds functional group; Wherein, the pink salt compounds of use has: stannous sulfate, stannous chloride, stannous fluoboric acid, stannous methanesulfonate or other water-soluble pink salts; Be used alone inorganic acid or the organic acid identical with pink salt compounds functional group, perhaps contain other acid compounds simultaneously, for example have: sulfuric acid, hydrochloric acid, fluoboric acid, alkyl sulfonic acid, alkanols sulfonic acid etc., during such as the selection stannous sulfate, can adopt sulfuric acid; The complexing agent that uses has: thiocarbamide and derivative thereof, perhaps imidazoles-2-thioketone etc.; In addition, also can add proper quantity of antioxidant in the chemical tin solution, to stop Bivalent Tin to become tetravalent tin, the inferior sodium phosphate of using among the BP GB1058210 for example, add an amount of surfactant in the chemical tin coating bath as wetting agent, as the surfactant types that is fit to that discloses in detail in the U.S. Pat 20020064676.
But, above-mentioned this existing chemical tin solution can only be applied on the hard circuit board, be not suitable for being applied on the flexible circuit board, particularly can not be applied in and use acrylic compounds or epoxyn type thin-film material as on the tectal flexible circuit board, because this chemical tin solution is after use, can on the copper surface below the adhesive at covering layer material and copper base material point of interface place, form a kind of Xi Keng, the appearance of Xi Keng can make the firm degree of interface reduce, and the thickness of below, tin hole copper base material is reduced, like this, circuit board is through after repeatedly crooked and folding, just might cause circuit fracture and can't operate as normal, impair greatly and use the reliability of flexible circuit board as the electronic device performance of interconnecting piece.In addition, adopt the flexible circuit board surface color of this chemical tin solution-treated inhomogeneous, near the surface cover layer and exposed copper joint particularly, brightless pure white, present grey or Dark grey to a certain extent, the bad zone of these surface colors influences follow-up assembling procedure because of solderability is low.
Summary of the invention
In order to overcome the above-mentioned shortcoming that existing product exists, the invention provides a kind of flexible printed wiring board chemical tin solution, its prescription to chemical tin solution improves, the one, in chemical tin solution, add corrosion inhibitor, prevent from the copper surface below the covering layer material adhesive, corrosion phenomenon to take place, avoid producing the phenomenon of Xi Keng; Two are to use perfluorinated surfactant as wetting agent, can improve the appearance tactile impression of coating, and the surface that makes whole copper base material color and luster after treatment is pure white evenly, does not have aberration and flaw; Be convenient to the operation that follow-up electronic component automation surface mounts operation, guarantee product quality.
The technical solution adopted for the present invention to solve the technical problems is:
Flexible printed wiring board of the present invention chemical tin solution, it is the aqueous solution that comprises pink salt compounds, complexing agent, the inorganic acid identical with pink salt compounds functional group or organic acid, corrosion inhibitor, surfactant, chelating agent.
Aforesaid flexible printed wiring board chemical tin solution, wherein corrosion inhibitor can be a carboxyalkyl dimercaptosuccinic acid compounds, its general formula is:
HOOC——(CH
2)
n----S----CH----COOH
R----CH----COOH
In the general formula, n is 1 to 3 positive integer, and R represents a hydrogen atom or a methyl.
Aforesaid flexible printed wiring board chemical tin solution, wherein corrosion inhibitor can be a triazole compound.
Aforesaid flexible printed wiring board chemical tin solution, wherein corrosion inhibitor can be the mixture of carboxyalkyl dimercaptosuccinic acid compounds and triazole compound.
Aforesaid flexible printed wiring board chemical tin solution, wherein surfactant is made of at least a above perfluor class surfactant, and its general formula is:
F(CF
2CF
2)
nCH
2CH
2O(CH
2CH
2O)
mH
In the general formula, n is 0 to 25 positive integer, and m is 1 to 9 positive integer.
Aforesaid flexible printed wiring board chemical tin solution, wherein chelating agent is more than one.
Aforesaid flexible printed wiring board chemical tin solution, wherein the pink salt kind compound content is 1 to 100 grams per liter; Complexing agent content is 5 to 200 grams per liters; Inorganic acid identical with pink salt compounds functional group or organic acid content are 40 to 500 grams per liters; Corrosion inhibitor content is 5 to 50 grams per liters; Surface-active contents is 0.001 to 10 grams per liter; Chelating agent content is 1 to 50 grams per liter.
Aforesaid flexible printed wiring board chemical tin solution, wherein chelating agent is citric acid (salt), malic acid (salt), tartaric acid (salt), gluconic acid (salt), ethylenediamine tetra-acetic acid (salt), diazotising triacetic acid (salt), p-hydroxybenzenyl sulfonate, p-methyl benzenesulfonic acid, benzoic acid.
Aforesaid flexible printed wiring board chemical tin solution wherein also comprises antioxidant, and this antioxidant is ortho phosphorous acid, inferior sodium phosphate or sulfanilic acid.
The invention has the beneficial effects as follows,, prevent from effectively on the copper surface below the covering layer material adhesive, corrosion phenomenon to take place, avoid producing the phenomenon of Xi Keng owing to add corrosion inhibitor in the chemical tin solution; Use perfluorinated surfactant as wetting agent, can improve the appearance tactile impression of coating, color and luster is pure white evenly after treatment to make the surface of whole copper base material, does not have aberration and flaw; Be convenient to the operation that follow-up electronic component automation surface mounts operation, guarantee product quality.Consult shown in the annex, picture has shown the corresponding state that adopts the copper substrate surface effect of prior art and chemical tin solution-treated of the present invention in the annex; Wherein, what Image to right showed is the copper base material that adopts prior art to handle, and the copper substrate surface of the interface adhesive below of its covering layer material and copper base material is formed with Xi Keng; Image to left shows the effect of the copper substrate surface that uses chemical tin solution-treated of the present invention, and it does not form Xi Keng on the copper surface below covering layer material and the copper base material interface adhesive glue, and the copper circuit surface forms the pure white and fine and close pure stannum layer of one deck.
The specific embodiment
Flexible printed wiring board of the present invention with the compound method of chemical tin solution is: under the room temperature, in 1 premium on currency, add 1 to 100 gram pink salt compounds, 5 to 200 gram complexing agents, 40 to 500 grams inorganic acid or the organic acid identical, 5 to 50 gram corrosion inhibitors with pink salt compounds functional group; 0.001 to 10 gram surfactants, 1 to 50 gram chelating agent, 5 to 50 gram antioxidants.
The pink salt compounds that the present invention uses can be: the borofluoride of the halide of the oxide of tin, the sulfate of tin, tin, the acetate of tin, tin, the alkylsulfonate of tin, the sulfamate of tin etc.; Complexing agent can be: thiocarbamide and derivative thereof, imidazole thione compounds, its effect are to guarantee carrying out smoothly of displacement reaction; Can be with a kind of inorganic acid or the organic acid identical with pink salt compounds functional group, or a kind of inorganic acid identical with pink salt compounds functional group or organic acid and other acid compounds are used with; The corrosion inhibitor that uses can be the mixture of carboxyalkyl dimercaptosuccinic acid compounds, triazole compound or carboxyalkyl dimercaptosuccinic acid compounds and triazole compound; The surfactant that uses can be more than one perfluor class surfactant; The chelating agent that uses can be to be citric acid (salt), malic acid (salt), tartaric acid (salt), gluconic acid (salt), ethylenediamine tetra-acetic acid (salt), diazotising triacetic acid (salt), p-hydroxybenzenyl sulfonate, p-methyl benzenesulfonic acid, benzoic acid; The antioxidant that uses can be: ortho phosphorous acid, inferior sodium phosphate or sulfanilic acid.
Flexible printed wiring board of the present invention chemical tin solution, its using method is same as the prior art, that is, may further comprise the steps: 1, with acidic cleaner cleaning circuit plate substrate surface, water fully washes then; 2, further clean substrate surface with the microcorrosion solution that contains sulfuric acid and mix with hydrogen peroxide, and fully washing; 3, pre-immersion plating promptly, will at room temperature be immersed in the chemical tin solution about 1 to 5 minute through the base material that above-mentioned two step process are crossed; 4, immersion plating is about to chemical tin solution and heats to 50 to 70 ℃, makes base material immersion plating 5 to 30 minutes in the chemical tin solution of this temperature, reaches the pure tin cover layer of required thickness; 5, the circuit board after the taking-up immersion plating, fully the washing back is dry.
Chemical tin solution ratio and the result of use thereof of tabulating preferred embodiment of the present invention below compare.
Table one: be the chemical tin solution of four kinds of different formulations of the present invention
(volume of every kind of solution is 1 liter in the table, and each components contents is a grams per liter)
| Solution component | ????A1 | ????A2 | ????A3 | ????A4 |
| Stannous methanesulfonate | ????5.3 | ????5.3 | ????5.3 | ????5.3 |
| Pyrovinic acid | ????100 | ????100 | ????100 | ????100 |
| Tartaric acid | ????25.4 | ????25.4 | ????25.4 | ????25.4 |
| Thiocarbamide | ????90 | ????90 | ????0 | ????0 |
| 2-methyl-3-propyl group-imidazoles-2-thioketones | ????0 | ????0 | ????82.4 | ????82.4 |
| The carboxyethyl dimercaptosuccinic acid | ????0 | ????21.2 | ????0 | ????21.2 |
| Nonionic perfluorinated surfactant (ZONYL FSN-100) | ????0.02 | ????0.02 | ????0.02 | ????0.02 |
| Inferior sodium phosphate | ????5 | ????5 | ????5 | ????5 |
Table two: be the chemical tin solution of four kinds of different formulations of the present invention
(volume of every kind of solution is 1 liter in the table, and each components contents is a grams per liter)
| Solution component | ????B1 | ????B2 | ????B3 | ????B4 |
| Stannous methanesulfonate | ????5.3 | ????5.3 | ????5.3 | ????5.3 |
| Pyrovinic acid | ????100 | ????100 | ????100 | ????100 |
| Tartaric acid | ????25.4 | ????25.4 | ????25.4 | ????25.4 |
| Thiocarbamide | ????90 | ????90 | ????0 | ????0 |
| 2-methyl-3-propyl group-imidazoles-2-thioketones | ????0 | ????0 | ????0 | ????0 |
| The carboxyethyl dimercaptosuccinic acid | ????0 | ????21.2 | ????0 | ????21.2 |
| Nonionic perfluorinated surfactant (ZONYL FSN-100) | ????0.03 | ????0 | ????0.03 | ????0 |
| Common hydrocarbon nonionic perfluorinated surfactant (MACOL LA-23) | ????0 | ????5 | ????0 | ????5 |
| Inferior sodium phosphate | ????5 | ????5 | ????5 | ????5 |
Use the chemical tin solution of A1 to A4 and eight kinds of different formulations of B1 to B4 in above-mentioned table one, the table two, to handling with a kind of flexible circuit board, the covering layer material of this soft board is the Pyralux LF film of E.I.Du Pont Company's production and has one deck crylic acid resin adhesive.Carry out Xi Keng with the sample after the solution-treated of A1 to A4 and detect relatively, the outward appearance and the color and luster that carry out coating with the sample after the solution-treated of B1 to B4 compare, and comparative result is as follows:
Example one: get 10 same soft board A1 solution-treated, the pre-immersion plating time is 1 minute, and temperature is 30 ℃; The immersion tin time is 10 minutes, and temperature is 65 ℃.Experimental result shows that the thickness of pure tin coating is 0.84 micron, and the horizontal tangent plane of all samples is all observed, and has formed Xi Keng on the copper surface below the point of interface place of covering layer material and the copper base material adhesive, and mean depth is 5.8 microns.
Example two: get 10 same soft board A2 solution-treated, the pre-immersion plating time is 1 minute, and temperature is 30 ℃; The immersion tin time is 10 minutes, and temperature is 65 ℃.Experimental result shows that the thickness of pure tin coating is 0.85 micron, and the horizontal tangent plane of all samples is not all observed tin hole phenomenon.
Example three: get 10 same soft board A3 solution-treated, the pre-immersion plating time is 1 minute, and temperature is 30 ℃; The immersion tin time is 10 minutes, and temperature is 65 ℃.Experimental result shows that the thickness of pure tin coating is 0.79 micron, and the horizontal tangent plane of all samples is all observed, and has formed Xi Keng on the copper surface below the point of interface place of covering layer material and the copper base material adhesive, and mean depth is 5.2 microns.
Example four: get 10 same soft board A4 solution-treated, the pre-immersion plating time is 1 minute, and temperature is 30 ℃; The immersion tin time is 10 minutes, and temperature is 65 ℃.Experimental result shows that the thickness of pure tin coating is 0.77 micron, and the horizontal tangent plane of all samples is not all observed tin hole phenomenon.
Example five: get 10 same soft board B1 solution-treated, the pre-immersion plating time is 1 minute, and temperature is 30 ℃; The immersion tin time is 10 minutes, and temperature is 65 ℃.Experimental result shows that the thickness of pure tin coating is 0.85 micron, is all covered by the pure white tin layer of one deck light on the whole exposed copper surface, without any shade deviation.
Example six: get 10 same soft board B2 solution-treated, the pre-immersion plating time is 1 minute, and temperature is 30 ℃; The immersion tin time is 10 minutes, and temperature is 65 ℃.Experimental result shows that the thickness of pure tin coating is 0.84 micron, and some the local coating on surface is Dark grey near cover layer and exposed copper joint.
Example seven: get 10 same soft board B3 solution-treated, the pre-immersion plating time is 1 minute, and temperature is 30 ℃; The immersion tin time is 10 minutes, and temperature is 65 ℃.Experimental result shows that the thickness of pure tin coating is 0.77 micron, is all covered by the pure white tin layer of one deck light on the whole exposed copper surface, without any shade deviation.
Example eight: get 10 same soft board B4 solution-treated, the pre-immersion plating time is 1 minute, and temperature is 30 ℃; The immersion tin time is 10 minutes, and temperature is 65 ℃.Experimental result shows that the thickness of pure tin coating is 0.79 micron, near some local coating gray on surface cover layer and exposed copper joint.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, every foundation technical spirit of the present invention all still belongs in the scope of technical solution of the present invention any simple modification, equivalent variations and modification that above embodiment did.
Claims (9)
1, a kind of flexible printed wiring board chemical tin solution, it is the aqueous solution that comprises pink salt compounds, complexing agent, the inorganic acid identical with pink salt compounds functional group or organic acid, corrosion inhibitor, surfactant, chelating agent.
2, flexible printed wiring board according to claim 1 chemical tin solution is characterized in that, described corrosion inhibitor can be a carboxyalkyl dimercaptosuccinic acid compounds, and its general formula is:
HOOC-(CH
2)
n----S----CH----COOH
R----CH----COOH
In the general formula, n is 1 to 3 positive integer, and R represents a hydrogen atom or a methyl.
3, flexible printed wiring board according to claim 1 chemical tin solution is characterized in that, described corrosion inhibitor can be a triazole compound.
4, flexible printed wiring board according to claim 1 chemical tin solution is characterized in that, described corrosion inhibitor can be the mixture of carboxyalkyl dimercaptosuccinic acid compounds and triazole compound.
5, flexible printed wiring board according to claim 1 chemical tin solution is characterized in that, described surfactant is made of at least a above perfluor class surfactant, and its general formula is:
F(CF
2CF
2)
nCH
2CH
2O(CH
2CH
2O)
mH
In the general formula, n is 0 to 25 positive integer, and m is 1 to 9 positive integer.
6, flexible printed wiring board according to claim 1 chemical tin solution is characterized in that, described chelating agent is more than one.
7, flexible printed wiring board according to claim 1 chemical tin solution is characterized in that, described pink salt kind compound content is 1 to 100 grams per liter; Complexing agent content is 5 to 200 grams per liters; Inorganic acid identical with pink salt compounds functional group or organic acid content are 40 to 500 grams per liters; Corrosion inhibitor content is 5 to 50 grams per liters; Surface-active contents is 0.001 to 10 grams per liter; Chelating agent content is 1 to 50 grams per liter.
8, flexible printed wiring board according to claim 1 chemical tin solution, it is characterized in that described chelating agent is citric acid (salt), malic acid (salt), tartaric acid (salt), gluconic acid (salt), ethylenediamine tetra-acetic acid (salt), diazotising triacetic acid (salt), p-hydroxybenzenyl sulfonate, p-methyl benzenesulfonic acid, benzoic acid.
9, flexible printed wiring board according to claim 1 chemical tin solution is characterized in that, it also comprises antioxidant, and this antioxidant is ortho phosphorous acid, inferior sodium phosphate or sulfanilic acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031304044A CN100351428C (en) | 2003-07-15 | 2003-07-15 | Chemical tin solution for flexible printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031304044A CN100351428C (en) | 2003-07-15 | 2003-07-15 | Chemical tin solution for flexible printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN1569382A true CN1569382A (en) | 2005-01-26 |
| CN100351428C CN100351428C (en) | 2007-11-28 |
Family
ID=34469728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031304044A Expired - Fee Related CN100351428C (en) | 2003-07-15 | 2003-07-15 | Chemical tin solution for flexible printed circuit board |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101234460B (en) * | 2007-02-01 | 2010-11-10 | 上海化工研究院 | Water-solubility dip coating tin scaling powder and preparation thereof |
| CN103909358A (en) * | 2014-03-13 | 2014-07-09 | 江苏科技大学 | Water-washing type solder paste and preparation method thereof |
| CN104532216A (en) * | 2014-12-27 | 2015-04-22 | 贝迪斯电子有限公司 | Chemical tin plating solution for lead of electronic component |
| CN106939417A (en) * | 2017-04-28 | 2017-07-11 | 深圳市创智成功科技有限公司 | The chemical plating stannum formula of printed wiring board |
| CN110760826A (en) * | 2019-11-29 | 2020-02-07 | 苏州天承化工有限公司 | Copper-based metal surface tin immersion liquid and application thereof |
| CN112210770A (en) * | 2019-07-11 | 2021-01-12 | 深圳市英诺泰克科技有限公司 | Chemical tin-precipitating solution |
| CN112534311A (en) * | 2018-05-23 | 2021-03-19 | Lg伊诺特有限公司 | Liquid lens, camera module, and optical apparatus including camera module |
| CN115404471A (en) * | 2022-08-30 | 2022-11-29 | 江西住井新材料有限公司 | Electroless tin plating solution and application |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4220678A (en) * | 1978-08-17 | 1980-09-02 | Nathan Feldstein | Dispersions for activating non-conductors for electroless plating |
| JPH0686666B2 (en) * | 1988-01-12 | 1994-11-02 | 清 岡林 | Sensitizing activator for chemical plating |
| JPH05125598A (en) * | 1991-10-31 | 1993-05-21 | Kawasaki Steel Corp | Continuous electrolytic tin plating equipment |
| US6063172A (en) * | 1998-10-13 | 2000-05-16 | Mcgean-Rohco, Inc. | Aqueous immersion plating bath and method for plating |
-
2003
- 2003-07-15 CN CNB031304044A patent/CN100351428C/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101234460B (en) * | 2007-02-01 | 2010-11-10 | 上海化工研究院 | Water-solubility dip coating tin scaling powder and preparation thereof |
| CN103909358A (en) * | 2014-03-13 | 2014-07-09 | 江苏科技大学 | Water-washing type solder paste and preparation method thereof |
| CN103909358B (en) * | 2014-03-13 | 2016-01-13 | 江苏科技大学 | A kind of washing tin cream and preparation method thereof |
| CN104532216A (en) * | 2014-12-27 | 2015-04-22 | 贝迪斯电子有限公司 | Chemical tin plating solution for lead of electronic component |
| CN106939417A (en) * | 2017-04-28 | 2017-07-11 | 深圳市创智成功科技有限公司 | The chemical plating stannum formula of printed wiring board |
| CN106939417B (en) * | 2017-04-28 | 2018-01-09 | 深圳市创智成功科技有限公司 | The chemical plating stannum solution of printed wiring board |
| CN112534311A (en) * | 2018-05-23 | 2021-03-19 | Lg伊诺特有限公司 | Liquid lens, camera module, and optical apparatus including camera module |
| CN112534311B (en) * | 2018-05-23 | 2023-04-07 | Lg伊诺特有限公司 | Liquid lens, camera module, and optical apparatus including camera module |
| CN112210770A (en) * | 2019-07-11 | 2021-01-12 | 深圳市英诺泰克科技有限公司 | Chemical tin-precipitating solution |
| CN110760826A (en) * | 2019-11-29 | 2020-02-07 | 苏州天承化工有限公司 | Copper-based metal surface tin immersion liquid and application thereof |
| CN110760826B (en) * | 2019-11-29 | 2021-07-27 | 苏州天承化工有限公司 | Copper-based metal surface tin immersion liquid and application thereof |
| CN115404471A (en) * | 2022-08-30 | 2022-11-29 | 江西住井新材料有限公司 | Electroless tin plating solution and application |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100351428C (en) | 2007-11-28 |
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