CN100351428C - Chemical tin solution for flexible printed circuit board - Google Patents
Chemical tin solution for flexible printed circuit board Download PDFInfo
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- CN100351428C CN100351428C CNB031304044A CN03130404A CN100351428C CN 100351428 C CN100351428 C CN 100351428C CN B031304044 A CNB031304044 A CN B031304044A CN 03130404 A CN03130404 A CN 03130404A CN 100351428 C CN100351428 C CN 100351428C
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- printed wiring
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
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Abstract
The present invention provides a chemical tin solution for a flexible printed circuit board, which is an aqueous solution comprising a tin salt compound, a complexing agent, mineral acid or organic acid of the identical functional group with the tin salt compound, a corrosion inhibitor, a surface-active agent, a chelating agent and an oxidation inhibitor. The present invention has the technical scheme that the corrosion inhibitor is added in the chemical tin solution for a flexible printed circuit board, which can prevent a corrosion phenomenon from occurring on the surface of copper below a material adhesive agent of a covering layer so as to avoid generating a tinpit phenomenon; an aqueous solution surface-active agent is adopted to serve as a wetting agent, which can enhance the external appearance texture of a plating layer. The color and luster of the surface of an entire copper base material is pure white and uniform without color difference and flaws after treatment, which is convenient for the operation of an automatic surface sticking procedure of following electronic components so as to ensure product quality.
Description
Technical field
The present invention relates to the material that the flexible printed wiring board surface treatment is used, relate in particular to a kind of flexible printed wiring board chemical tin solution.
Background technology
Flexible circuit is the interior type of attachment of a kind of printed wiring that design forms on base material thin and bending arbitrarily, it can fold in minimum three-dimensional space or be crooked, this is that hard circuit board can't be realized, therefore, flexible circuit board be widely used in have minimum three-dimensional space, and need long-time and repeatedly crooked and folding, guarantee in the product in reliable work-ing life for example mobile telephone, digital camera, digital camcorder, facsimile recorder, notebook computer, printer, hard disk drive, CD drive and panel board etc.
The material that existing flexible circuit board uses mainly comprises: base material, and it generally adopts polyimide film, mylar, glass fibre to add Resins, epoxy polyester film or resin coated paper etc. and makes; Conductor, it adopts the metal material with conductivity, for example Copper Foil, stainless steel foil, aluminium foil etc.; Veneer sheet (tackiness agent base material), it adopts adhesion type materials such as epoxy resin, vinylformic acid or phenolic resin; Binder layer generally adopts tackiness agents such as epoxy resin, vinylformic acid, phenolic resin, perhaps pressure-sensitive adhesive; Tectum generally adopts polyimide film, mylar, the special-purpose welding resistance printing ink of flexible circuit board etc.; Strengthening material adopts polyimide film, mylar, glass fibre to add Resins, epoxy polyester film or metal sheet.Wherein, it is the key distinction of flexible circuit board and hard circuit board that tectum is set, it is the mechanical protection sheath of crisp fritter conductor on the flexible circuit board, the standard material that the special-purpose welding resistance printing ink of film class tectum and flexible circuit board is existing flexible circuit board, in order to satisfy the strict demand that connects flexible circuit board in some high-density, develop several photosensitive cover lay materials on the market, it mainly adopts remains the film capstock, these mulch films all scribble the Resins, epoxy of one deck semicure or acrylic resin as tackiness agent, for example, the product that E.I.Du Pont Company produces, (commodity are called Pyralux LF) it scribbles one deck acrylic resin; What the products C ISV that the company that builds day produces used is the tackiness agent of epoxy resin.Circuit card by the above-mentioned materials moulding also needs through final surface treatment (as hot air leveling technology etc.), to keep the weldability of base material.
In recent years, the chemical tin technology is to substitute the hot air leveling tin spray process and as a kind of good selection of the final treatment process on copper wire surface exposed on the printed circuit board (PCB) by extensive cognition, through the printed circuit board (PCB) after the chemical tin art breading, can produce a layer thickness evenly and the pure tin coating of surfacing by chemical replacement reaction, make follow-up electronical elements surface mount the easy to operate of program, can use large-scale continuous automatic production pattern, and mount quality and improve, it is uneven and be uneven so that influence the problem that electronic component automatization surface mounts to have solved circuit table face thickness that existing hot air leveling tin spray process exists; In addition, this technology can be avoided using the lead that bans use of in the electronic industry industry, and new technology type such as chemical tin technology and other chemical nickel and gold, chemical silver, chemical palladium etc. compares, and has the low advantage of cost again.Therefore, the chemical tin technology is widely used in handling copper and alloy thereof, English Patent GB1058210 for example, and U.S. Pat 6063172, US4175894, US4657632 all are described in European patent EP 0545218 patent documentation such as grade.The main component that existing chemical tin solution comprises is: pink salt compounds, complexing agent, mineral acid or the organic acid identical with pink salt compounds functional group; Wherein, the pink salt compounds of use has: stannous sulfate, tin protochloride, stannous fluoboric acid, stannous methanesulfonate or other water-soluble pink salts; Be used alone mineral acid or the organic acid identical with pink salt compounds functional group, perhaps contain other acid compounds simultaneously, for example have: sulfuric acid, hydrochloric acid, fluoroboric acid, alkylsulphonic acid, alkanols sulfonic acid etc., during such as the selection stannous sulfate, can adopt sulfuric acid; The complexing agent that uses has: thiocarbamide and derivative thereof, perhaps imidazoles-2-thioketone etc.; In addition, also can add proper quantity of antioxidant in the chemical tin solution, to stop Bivalent Tin to become tetravalent tin, the inferior sodium phosphate of using among the English Patent GB1058210 for example, add an amount of tensio-active agent in the chemical tin coating bath as wetting agent, as the surfactant types that is fit to that discloses in detail in the U.S. Pat 20020064676.
But, above-mentioned this existing chemical tin solution can only be applied on the hard circuit board, be not suitable for being applied on the flexible circuit board, particularly can not be applied in and use acrylic acid or the like or metabond type thin-film material as on the tectal flexible circuit board, because this chemical tin solution is after use, can on the copper surface below the tackiness agent at covering layer material and copper base material point of interface place, form a kind of Xi Keng, the appearance of Xi Keng can make the firm degree of interface reduce, and the thickness of below, tin hole copper base material is reduced, like this, circuit card is through after repeatedly crooked and folding, just might cause circuit fracture and can't works better, impair greatly and use the reliability of flexible circuit board as the electron device performance of interconnecting piece.In addition, adopt the flexible circuit board surface color of this chemical tin solution-treated inhomogeneous, near the surface tectum and exposed copper joint particularly, brightless pure white, present grey or Dark grey to a certain extent, the bad zone of these surface colors influences follow-up assembling procedure because of weldability is low.
Summary of the invention
In order to overcome the above-mentioned shortcoming that currently available products exists, the invention provides a kind of flexible printed wiring board chemical tin solution, its prescription to chemical tin solution improves, the one, in chemical tin solution, add corrosion inhibitor, prevent from the copper surface below the covering layer material tackiness agent, corrosion phenomenon to take place, avoid producing the phenomenon of Xi Keng; Two are to use perfluorinated surfactant as wetting agent, can improve the appearance tactile impression of coating, and the surface that makes whole copper base material color and luster after treatment is pure white evenly, does not have aberration and flaw; Be convenient to the operation that follow-up electronic component automatization surface mounts operation, guarantee quality product.
The technical solution adopted for the present invention to solve the technical problems is:
Flexible printed wiring board of the present invention chemical tin solution, it is to comprise pink salt compounds, complexing agent, the mineral acid identical with pink salt compounds functional group or the aqueous solution of organic acid, corrosion inhibitor, tensio-active agent and sequestrant.
Aforesaid flexible printed wiring board chemical tin solution, wherein corrosion inhibitor can be a carboxyalkyl dimercaptosuccinic acid compounds, its general formula is:
HOOC——(CH
2)
n----S----CH----COOH
R----CH----COOH
In the general formula, n is 1 to 3 positive integer, and R represents a hydrogen atom or a methyl.
Aforesaid flexible printed wiring board chemical tin solution, wherein corrosion inhibitor can be a triazole compound.
Aforesaid flexible printed wiring board chemical tin solution, wherein corrosion inhibitor can be the mixture of carboxyalkyl dimercaptosuccinic acid compounds and triazole compound.
Aforesaid flexible printed wiring board chemical tin solution, wherein tensio-active agent is made of at least a above perfluor class tensio-active agent, and its general formula is:
F(CF
2CF
2)
nCH
2CH
2O(CH
2CH
2O)
mH
In the general formula, n is 0 to 25 positive integer, and m is 1 to 9 positive integer.
Aforesaid flexible printed wiring board chemical tin solution, wherein sequestrant is more than one.
Aforesaid flexible printed wiring board chemical tin solution, wherein the pink salt kind compound content is 1 to 100 grams per liter; Complexing agent content is 5 to 200 grams per liters; Mineral acid identical with pink salt compounds functional group or organic acid content are 40 to 500 grams per liters; Corrosion inhibition agent content is 5 to 50 grams per liters; Surfactant content is 0.001 to 10 grams per liter; Sequestrant content is 1 to 50 grams per liter.
Aforesaid flexible printed wiring board chemical tin solution, wherein sequestrant is citric acid, oxysuccinic acid, tartrate, gluconic acid, ethylenediamine tetraacetic acid (EDTA), diazotization nitrilotriacetic, p-hydroxybenzenyl sulfonate, p-methyl benzenesulfonic acid or phenylformic acid.
Aforesaid flexible printed wiring board chemical tin solution wherein also comprises antioxidant, and this antioxidant is ortho phosphorous acid, inferior sodium phosphate or Sulphanilic Acid.
The invention has the beneficial effects as follows,, prevent from effectively on the copper surface below the covering layer material tackiness agent, corrosion phenomenon to take place, avoid producing the phenomenon of Xi Keng owing to add corrosion inhibitor in the chemical tin solution; Use perfluorinated surfactant as wetting agent, can improve the appearance tactile impression of coating, color and luster is pure white evenly after treatment to make the surface of whole copper base material, does not have aberration and flaw; Be convenient to the operation that follow-up electronic component automatization surface mounts operation, guarantee quality product.Consult shown in the annex, picture has shown the corresponding state that adopts the copper substrate surface effect of prior art and chemical tin solution-treated of the present invention in the annex; Wherein, what Image to right showed is the copper base material that adopts prior art to handle, and the copper substrate surface of the interface tackiness agent below of its covering layer material and copper base material is formed with Xi Keng; Image to left shows the effect of the copper substrate surface that uses chemical tin solution-treated of the present invention, and it does not form Xi Keng on the copper surface below covering layer material and the copper base material interface adhesive glue, and the copper circuit surface forms the pure white and fine and close pure stannum layer of one deck.
Embodiment
Flexible printed wiring board of the present invention with the compound method of chemical tin solution is: under the room temperature, in 1 premium on currency, add 1 to 100 gram pink salt compounds, 5 to 200 gram complexing agents, 40 to 500 grams mineral acid or the organic acid identical, 5 to 50 gram corrosion inhibitors with pink salt compounds functional group; 0.001 to 10 gram tensio-active agents, 1 to 50 gram sequestrant, 5 to 50 gram antioxidants.
The pink salt compounds that the present invention uses can be: the fluoroborate of the halogenide of the oxide compound of tin, the vitriol of tin, tin, the acetate of tin, tin, the alkylsulfonate of tin, the sulfamate of tin etc.; Complexing agent can be: thiocarbamide and derivative thereof, imidazole thione compounds, its effect are to guarantee carrying out smoothly of replacement(metathesis)reaction; Can be with a kind of mineral acid or the organic acid identical with pink salt compounds functional group, or a kind of mineral acid identical with pink salt compounds functional group or organic acid and other acid compounds are used with; The corrosion inhibitor that uses can be the mixture of carboxyalkyl dimercaptosuccinic acid compounds, triazole compound or carboxyalkyl dimercaptosuccinic acid compounds and triazole compound; The tensio-active agent that uses can be more than one perfluor class tensio-active agent; The sequestrant that uses can be to be citric acid, oxysuccinic acid, tartrate, gluconic acid, ethylenediamine tetraacetic acid (EDTA), diazotization nitrilotriacetic, p-hydroxybenzenyl sulfonate, p-methyl benzenesulfonic acid or phenylformic acid; The antioxidant that uses can be: ortho phosphorous acid, inferior sodium phosphate or Sulphanilic Acid.
Flexible printed wiring board of the present invention chemical tin solution, its using method is same as the prior art, that is, may further comprise the steps: 1, with acidic cleaner cleaning circuit plate substrate surface, water fully washes then; 2, with containing sulfuric acid and further clean substrate surface with hydrogen peroxide blended microcorrosion solution, and fully washing; 3, pre-immersion plating promptly, will at room temperature be immersed in the chemical tin solution about 1 to 5 minute through the base material that above-mentioned two step process are crossed; 4, immersion plating is about to chemical tin solution and heats to 50 to 70 ℃, makes base material immersion plating 5 to 30 minutes in the chemical tin solution of this temperature, reaches the pure tin tectum of required thickness; 5, the circuit card after the taking-up immersion plating is fully washed after drying.
Chemical tin solution ratio and the result of use thereof of tabulating preferred embodiment of the present invention below compare.
Table one: be the chemical tin solution of four kinds of different ingredients of the present invention
(volume of every kind of solution is 1 liter in the table, and each components contents is a grams per liter)
| Solution component | A1 | A2 | A3 | A4 |
| Stannous methanesulfonate | 5.3 | 5.3 | 5.3 | 5.3 |
| Methylsulphonic acid | 100 | 100 | 100 | 100 |
| Tartrate | 25.4 | 25.4 | 25.4 | 25.4 |
| Thiocarbamide | 90 | 90 | 0 | 0 |
| 2-methyl-3-propyl group-imidazoles-2-thioketones | 0 | 0 | 82.4 | 82.4 |
| The propyloic dimercaptosuccinic acid | 0 | 21.2 | 0 | 21.2 |
| Non-ionic type perfluorinated surfactant (ZONYL FSN-100) | 0.02 | 0.02 | 0.02 | 0.02 |
| Inferior sodium phosphate | 5 | 5 | 5 | 5 |
Table two: be the chemical tin solution of four kinds of different ingredients of the present invention
(volume of every kind of solution is 1 liter in the table, and each components contents is a grams per liter)
| Solution component | B1 | B2 | B3 | B4 |
| Stannous methanesulfonate | 5.3 | 5.3 | 5.3 | 5.3 |
| Methylsulphonic acid | 100 | 100 | 100 | 100 |
| Tartrate | 25.4 | 25.4 | 25.4 | 25.4 |
| Thiocarbamide | 90 | 90 | 0 | 0 |
| 2-methyl-3-propyl group-imidazoles-2-thioketones | 0 | 0 | 0 | 0 |
| The propyloic dimercaptosuccinic acid | 0 | 21.2 | 0 | 21.2 |
| Non-ionic type perfluorinated surfactant (ZONYL FSN-100) | 0.03 | 0 | 0.03 | 0 |
| Common hydrocarbon non-ionic type perfluorinated surfactant (MACOL LA-23) | 0 | 5 | 0 | 5 |
| Inferior sodium phosphate | 5 | 5 | 5 | 5 |
Use the chemical tin solution of A1 to A4 and eight kinds of different ingredients of B1 to B4 in above-mentioned table one, the table two, to handling with a kind of flexible circuit board, the covering layer material of this soft board is the Pyralux LF film of E.I.Du Pont Company's production and has one deck crylic acid resin tackiness agent.Carry out Xi Keng with the sample after the solution-treated of A1 to A4 and detect relatively, the outward appearance and the color and luster that carry out coating with the sample after the solution-treated of B1 to B4 compare, and comparative result is as follows:
Example one: get 10 same soft board A1 solution-treated, the pre-immersion plating time is 1 minute, and temperature is 30 ℃; The immersion tin time is 10 minutes, and temperature is 65 ℃.Experimental result shows that the thickness of pure tin coating is 0.84 micron, and the horizontal tangent plane of all samples is all observed, and has formed Xi Keng on the copper surface below the point of interface place of covering layer material and the copper base material tackiness agent, and mean depth is 5.8 microns.
Example two: get 10 same soft board A2 solution-treated, the pre-immersion plating time is 1 minute, and temperature is that 30 ℃ of immersion tin times are 10 minutes, and temperature is 65 ℃.Experimental result shows that the thickness of pure tin coating is 0.85 micron, and the horizontal tangent plane of all samples is not all observed tin hole phenomenon.
Example three: get 10 same soft board A3 solution-treated, the pre-immersion plating time is 1 minute, and temperature is 30 ℃; The immersion tin time is 10 minutes, and temperature is 65 ℃.Experimental result shows that the thickness of pure tin coating is 0.79 micron, and the horizontal tangent plane of all samples is all observed, and has formed Xi Keng on the copper surface below the point of interface place of covering layer material and the copper base material tackiness agent, and mean depth is 5.2 microns.
Example four: get 10 same soft board A4 solution-treated, the pre-immersion plating time is 1 minute, and temperature is 30 ℃; The immersion tin time is 10 minutes, and temperature is 65 ℃.Experimental result shows that the thickness of pure tin coating is 0.77 micron, and the horizontal tangent plane of all samples is not all observed tin hole phenomenon.
Example five: get 10 same soft board B1 solution-treated, the pre-immersion plating time is 1 minute, and temperature is that 30 ℃ of immersion tin times are 10 minutes, and temperature is 65 ℃.Experimental result shows that the thickness of pure tin coating is 0.85 micron, is all covered by the pure white tin layer of one deck light on the whole exposed copper surface, without any shade deviation.
Example six: get 10 same soft board B2 solution-treated, the pre-immersion plating time is 1 minute, and temperature is 30 ℃; The immersion tin time is 10 minutes, and temperature is 65 ℃.Experimental result shows that the thickness of pure tin coating is 0.84 micron, and some the local coating on surface is Dark grey near tectum and exposed copper joint.
Example seven: get 10 same soft board B3 solution-treated, the pre-immersion plating time is 1 minute, and temperature is 30 ℃; The immersion tin time is 10 minutes, and temperature is 65 ℃.Experimental result shows that the thickness of pure tin coating is 0.77 micron, is all covered by the pure white tin layer of one deck light on the whole exposed copper surface, without any shade deviation.
Example eight: get 10 same soft board B4 solution-treated, the pre-immersion plating time is 1 minute, and temperature is 30 ℃; The immersion tin time is 10 minutes, and temperature is 65 ℃.Experimental result shows that the thickness of pure tin coating is 0.79 micron, near some local coating gray on surface tectum and exposed copper joint.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, every foundation technical spirit of the present invention all still belongs in the scope of technical solution of the present invention any simple modification, equivalent variations and modification that above embodiment did.
Claims (9)
1, a kind of flexible printed wiring board chemical tin solution, it is to comprise pink salt compounds, complexing agent, the mineral acid identical with pink salt compounds functional group or the aqueous solution of organic acid, corrosion inhibitor, tensio-active agent and sequestrant.
2, flexible printed wiring board according to claim 1 chemical tin solution is characterized in that, described corrosion inhibitor can be a carboxyalkyl dimercaptosuccinic acid compounds, and its general formula is:
HOOC----(CH
2)
n----S----CH----COOH
R----CH----COOH
In the general formula, n is 1 to 3 positive integer, and R represents a hydrogen atom or a methyl.
3, flexible printed wiring board according to claim 1 chemical tin solution is characterized in that, described corrosion inhibitor can be a triazole compound.
4, flexible printed wiring board according to claim 1 chemical tin solution is characterized in that, described corrosion inhibitor can be the mixture of carboxyalkyl dimercaptosuccinic acid compounds and triazole compound.
5, flexible printed wiring board according to claim 1 chemical tin solution is characterized in that, described tensio-active agent is made of at least a above perfluor class tensio-active agent, and its general formula is:
F(CF
2CF
2)
nCH
2CH
2O(CH
2CH
2O)
mH
In the general formula, n is 0 to 25 positive integer, and m is 1 to 9 positive integer.
6, flexible printed wiring board according to claim 1 chemical tin solution is characterized in that, described sequestrant is more than one.
7, flexible printed wiring board according to claim 1 chemical tin solution is characterized in that, described pink salt kind compound content is 1 to 100 grams per liter; Complexing agent content is 5 to 200 grams per liters; Mineral acid identical with pink salt compounds functional group or organic acid content are 40 to 500 grams per liters; Corrosion inhibition agent content is 5 to 50 grams per liters; Surfactant content is 0.001 to 10 grams per liter; Sequestrant content is 1 to 50 grams per liter.
8, flexible printed wiring board according to claim 1 chemical tin solution, it is characterized in that described sequestrant is citric acid, oxysuccinic acid, tartrate, gluconic acid, ethylenediamine tetraacetic acid (EDTA), diazotization nitrilotriacetic, p-hydroxybenzenyl sulfonate, p-methyl benzenesulfonic acid or phenylformic acid.
9, flexible printed wiring board according to claim 1 chemical tin solution is characterized in that, it also comprises antioxidant, and this antioxidant is ortho phosphorous acid, inferior sodium phosphate or Sulphanilic Acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031304044A CN100351428C (en) | 2003-07-15 | 2003-07-15 | Chemical tin solution for flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031304044A CN100351428C (en) | 2003-07-15 | 2003-07-15 | Chemical tin solution for flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1569382A CN1569382A (en) | 2005-01-26 |
| CN100351428C true CN100351428C (en) | 2007-11-28 |
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ID=34469728
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|---|---|---|---|
| CNB031304044A Expired - Fee Related CN100351428C (en) | 2003-07-15 | 2003-07-15 | Chemical tin solution for flexible printed circuit board |
Country Status (1)
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101234460B (en) * | 2007-02-01 | 2010-11-10 | 上海化工研究院 | Water-solubility dip coating tin scaling powder and preparation thereof |
| CN103909358B (en) * | 2014-03-13 | 2016-01-13 | 江苏科技大学 | A kind of washing tin cream and preparation method thereof |
| CN104532216A (en) * | 2014-12-27 | 2015-04-22 | 贝迪斯电子有限公司 | Chemical tin plating solution for lead of electronic component |
| CN106939417B (en) * | 2017-04-28 | 2018-01-09 | 深圳市创智成功科技有限公司 | The chemical plating stannum solution of printed wiring board |
| KR20190133543A (en) * | 2018-05-23 | 2019-12-03 | 엘지이노텍 주식회사 | Liquid lens, camera module and optical device/instrument including the same |
| CN112210770A (en) * | 2019-07-11 | 2021-01-12 | 深圳市英诺泰克科技有限公司 | Chemical tin-precipitating solution |
| CN110760826B (en) * | 2019-11-29 | 2021-07-27 | 苏州天承化工有限公司 | Copper-based metal surface tin immersion liquid and application thereof |
| CN115404471B (en) * | 2022-08-30 | 2023-07-04 | 江西住井新材料有限公司 | Electroless tin plating solution and application |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4220678A (en) * | 1978-08-17 | 1980-09-02 | Nathan Feldstein | Dispersions for activating non-conductors for electroless plating |
| US4933010A (en) * | 1988-01-12 | 1990-06-12 | Eric F. Harnden | Sensitizing activator composition for chemical plating |
| JPH05125598A (en) * | 1991-10-31 | 1993-05-21 | Kawasaki Steel Corp | Continuous electrolytic tin plating equipment |
| US6063172A (en) * | 1998-10-13 | 2000-05-16 | Mcgean-Rohco, Inc. | Aqueous immersion plating bath and method for plating |
-
2003
- 2003-07-15 CN CNB031304044A patent/CN100351428C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4220678A (en) * | 1978-08-17 | 1980-09-02 | Nathan Feldstein | Dispersions for activating non-conductors for electroless plating |
| US4933010A (en) * | 1988-01-12 | 1990-06-12 | Eric F. Harnden | Sensitizing activator composition for chemical plating |
| JPH05125598A (en) * | 1991-10-31 | 1993-05-21 | Kawasaki Steel Corp | Continuous electrolytic tin plating equipment |
| US6063172A (en) * | 1998-10-13 | 2000-05-16 | Mcgean-Rohco, Inc. | Aqueous immersion plating bath and method for plating |
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|---|---|
| CN1569382A (en) | 2005-01-26 |
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Granted publication date: 20071128 |