JP3367805B2 - Processing method of copper foil for printed circuit - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for treating a copper foil for a printed circuit, and more particularly to a copper foil on the surface of the copper foil.
After the roughening treatment by cobalt-nickel alloy plating, by forming a cobalt-nickel alloy plating layer, it has alkali etching properties, and also has good heat-resistant peel strength and heat-oxidation resistance, and a black surface tone. The present invention relates to a method for treating a copper foil for a printed circuit, which further improves thermal oxidation resistance by forming a zinc plating layer in the treatment method for producing a copper foil for a printed circuit. The copper foil of the present invention is, for example, a fine pattern printed circuit and an FPC (Flexible Printed Circuit) for a magnetic head.
Especially suitable as

[0002]

2. Description of the Related Art Copper and copper alloy foils (hereinafter referred to as copper foils)
Contributes greatly to the development of the electrical and electronic related industries,
In particular, it is indispensable as a printed circuit material. Copper foil for printed circuits is generally manufactured by laminating and adhering to a base material such as a synthetic resin board or a film via an adhesive or under high temperature and high pressure without using an adhesive to produce a copper clad laminate, and then the purpose. After the required circuits are printed through resist coating and exposure steps to form the desired circuits, an etching process for removing unnecessary portions is performed. Finally, the required elements are soldered to form various printed circuit boards for electronic devices. Quality requirements for copper foil for printed circuit boards differ between the surface (roughened surface) bonded to the resin substrate and the non-bonded surface (glossy surface), and many methods have been proposed for each.

For example, the requirements for the roughened surface are mainly that there is no oxidative discoloration during storage and that the peel strength from the substrate is sufficient even after high temperature heating, wet treatment, soldering, chemical treatment, etc. That is, there is no so-called laminated stain that occurs after the lamination with the substrate and the etching.

The roughening treatment plays a major role in determining the adhesion between the copper foil and the substrate. As the roughening treatment, a copper roughening treatment in which copper was initially electrodeposited was adopted, but various techniques have been proposed thereafter, in particular, heat-resistant peel strength,
Copper-nickel roughening treatment has become established as a typical treatment method for the purpose of improving the resistance to hydrochloric acid and the resistance to oxidation. The applicant of the present invention has proposed a copper-nickel roughening treatment in Japanese Patent Laid-Open No. 52-145769 and has achieved results. The copper-nickel treated surface exhibits a black color, and in particular, in the rolled foil for flexible substrates, the black color of the copper-nickel treatment has been recognized as a symbol as a product.

However, the copper-nickel roughening treatment is
Although it has excellent heat-resistant peel strength, oxidation resistance, and hydrochloric acid resistance, it is difficult to etch with an alkaline etching solution, which has recently become important as fine pattern processing.
When a fine pattern having a circuit width of 150 μm pitch or less is formed, the processing layer remains as an etching residue.

Therefore, as fine pattern processing,
The applicant of the present invention firstly applied Cu-Co treatment (Japanese Patent Publication No.
58 and Japanese Patent Application No. 1-112227) and Cu-Co.
-Ni treatment (Japanese Patent Application No. 1-112226) was developed.
These roughening treatments were good in terms of etching property, alkali etching property and hydrochloric acid resistance, but it was found again that the heat-resistant peel strength was reduced when an acrylic adhesive was used, and oxidation resistance was also found. The period was not sufficient and the color tone did not reach black, and it was brown to dark brown.

With the recent trend toward fine patterning and diversification of printed circuits, it has heat-resistant peel strength (especially when an acrylic adhesive is used) and hydrochloric acid resistance comparable to those of Cu-Ni treatment. Being able to etch printed circuits with a circuit width of 150 μm or less with an alkaline etching solution, oxidation resistance (180 ° C) as in the case of Cu-Ni treatment.
It was further required to improve the (oxidation resistance in an oven for 30 minutes) and to perform the same blackening treatment as in the Cu—Ni treatment. That is, when the circuit becomes thin, the tendency that the circuit is easily peeled off by the hydrochloric acid etching solution becomes stronger, and it is necessary to prevent it. When the circuit becomes thin,
The high temperature during processing such as soldering also makes the circuit easy to peel off, and it is necessary to prevent it. At present, fine patterning is progressing, for example, with a CuCl ₂ etching solution, 150
The ability to etch a printed circuit with a pitch width of μm or less is an essential requirement, and alkali etching is becoming a necessary requirement as resists are diversified.
The black surface is also important from the viewpoint of copper foil fabrication and chip mounting in terms of enhancing alignment accuracy and heat absorption.

In response to such a demand, the applicant of the present invention forms a cobalt plating layer or a cobalt-nickel alloy plating layer on the surface of a copper foil after a roughening treatment by copper-cobalt-nickel alloy plating to form a printed circuit. In addition to having many of the above-mentioned general characteristics as a copper foil, it has the above-mentioned various characteristics that are particularly comparable to those of Cu-Ni treatment, and lowers the heat-resistant peel strength when an acrylic adhesive is used. In other words, we succeeded in developing a copper foil treatment method that is excellent in oxidation resistance and has a black surface color tone (Japanese Patent Publication No. 6-54831). The cobalt-nickel alloy plating layer is superior to the cobalt plating layer in heat deterioration resistance.
Preferably, after forming the cobalt plating layer or the cobalt-nickel alloy plating layer, a rust prevention represented by a single film treatment of chromium oxide or a mixed film treatment of chromium oxide and zinc and / or zinc oxide. Processing is performed.

[0009]

After that, as the electronic equipment has advanced, the miniaturization and high integration of semiconductor devices have further progressed, and the processing performed in the manufacturing process of these printed circuits has become even higher in temperature. After that, heat generation during the use of the device caused a decrease in the bonding force between the copper foil and the resin base material, which became a problem. The object of the present invention is to
In a method for treating a copper foil for a printed circuit, which comprises a cobalt plating layer or a cobalt-nickel alloy plating layer after a roughening treatment by copper-cobalt-nickel alloy plating on the surface of a copper foil established in Japanese Patent Publication No. 6-54831. ,
When forming a cobalt-nickel alloy plating layer which is more excellent in heat deterioration resistance than the cobalt plating layer after the roughening treatment, it is to further improve the heat-resistant peelability.

[0010]

As a result of the research conducted by the present inventors, after a roughening treatment by copper-cobalt-nickel alloy plating on the surface of a copper foil, a cobalt-nickel alloy plating layer is formed, and further thereon. It has been clarified that by forming the galvanized layer, the heat-resistant peeling property can be further improved while keeping the above advantages. Based on this finding,
In the method for treating a copper foil for a printed circuit according to the present invention, after a roughening treatment by copper-cobalt-nickel alloy plating on the surface of the copper foil, a cobalt-nickel alloy plating layer is formed, and a zinc plating layer is further formed. A method for treating a copper foil for a printed circuit is provided. Preferably, after forming the zinc plating layer, a rust preventive treatment represented by a single film treatment of chromium oxide or a mixed film treatment of chromium oxide and zinc and / or zinc oxide is performed.

Specifically, in the method for treating a copper foil for a printed circuit, the adhesion amount on the surface of the copper foil is 15 to 40 mg / dm ^2.
Copper-100 to 3000 μg / dm ² , preferably 200
0-3000μg / dm ² Cobalt-100-900μ
g / dm ^2, preferably 200~400μg / dm ² of nickel copper - cobalt - after roughening treatment with nickel alloy plating, the amount of adhesion 200~3000μg / dm ^2, preferably 500~3000μg / dm ² of cobalt -100
To 700 μg / dm ² , preferably 200 to 600 nickel nickel-cobalt-nickel alloy plating layer is formed, and the adhesion amount is 10 to 80 μg / dm ² , preferably 20 to 6
0 μg / dm ² , more preferably 30 to 50 μg / dm 2.
² galvanized layer is formed. Desirably, in the roughened copper-cobalt-nickel alloy plated layer and the cobalt-nickel alloy plated layer thereon, the total amount of cobalt deposited is 300 to 5000 μg / dm ² , preferably 25.
00~5000μg / dm ² and 200~1000μg / dm ² the total deposition amount of nickel, preferably 400
˜1000 μg / dm ² .

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The copper foil used in the present invention is
Either electrolytic copper foil or rolled copper foil may be used. Usually, the surface of the copper foil that is bonded to the resin substrate, that is, the roughened surface, has the purpose of improving the peeling strength of the copper foil after lamination, and for the purpose of improving the peeling strength of the copper foil after degreasing. A roughening process is carried out for the coating. The electrolytic copper foil has irregularities at the time of manufacturing, but the roughening treatment enhances the convex portions of the electrolytic copper foil to further increase the irregularities. In the present invention, this roughening treatment is performed by copper-cobalt-nickel alloy plating. Ordinary copper plating or the like may be performed as a pretreatment before roughening, and ordinary copper plating or the like may be performed as a finishing treatment after roughening to prevent the electrodeposit from falling off. The rolled copper foil and the electrolytic copper foil may have slightly different contents of treatment. In the present invention, known treatments related to copper foil roughening, including such pretreatment and finishing treatment, are collectively referred to as roughening treatment, if necessary.

In the copper-cobalt-nickel alloy plating as the roughening treatment in the present invention, the amount of adhesion is 15-40 mg / dm ² copper-100-3000 μg by electrolytic plating.
/ Dm ² Cobalt-100 to 900 μg / dm ² Nickel is performed to form a ternary alloy layer. When the amount of Co deposited is less than 100 μg / dm ² , the heat resistance deteriorates and the etching property deteriorates. Co deposition amount is 30
If it exceeds 00 μg / dm ² , it is not preferable when the influence of magnetism must be taken into consideration, etching stains occur, and deterioration of acid resistance and chemical resistance can be considered.
If the Ni deposition amount is less than 100 μg / dm ² , the heat resistance will be poor. On the other hand, when the amount of Ni adhered exceeds 900 μg / dm ² , etching residues increase. However, if the amount of Ni deposited exceeds 500 μg / dm ² , the etching property tends to deteriorate. In other words, it is difficult to form a fine pattern, although it does not reach a level where etching residue or etching cannot be performed. The preferable amount of Co deposited is 2
000-3000 μg / dm ² , and the preferred nickel coverage is 200-400 μg / dm ² .
Here, the etching stain means that Co is left undissolved when etched with copper chloride, and the etching residue is left undissolved when alkali-etched with ammonium chloride. It means that.

The general bath and plating conditions for forming such a ternary copper-cobalt-nickel alloy plating are as follows: (copper-cobalt-nickel alloy plating) Cu: 10-20 g / liter Co: 1 to 10 g / liter Ni: 1 to 10 g / liter pH: 1 to 4 Temperature: 40 to 50 ° C. Current density D _k : 20 to 30 A / dm ² hours: 1 to 5 seconds

According to the present invention, after the roughening treatment, the adhered amount is 200 to 3000 μg / dm ² cobalt-100 to 7 on the roughened surface.
A cobalt-nickel alloy plating layer of 00 μg / dm ² nickel is formed. In a broad sense, this treatment can be regarded as a kind of rust prevention treatment. The cobalt-nickel alloy plating layer needs to be formed to the extent that the adhesive strength between the copper foil and the substrate is not substantially reduced. The amount of cobalt deposited is 200μ
When it is less than g / dm ² , the heat-resistant peel strength is lowered, and the oxidation resistance and the chemical resistance are deteriorated. Another reason is that if the amount of cobalt is small, the treated surface becomes reddish, which is not preferable. Cobalt deposition amount is 3000 μg
When it exceeds / dm ² , it is not preferable when the influence of magnetism has to be taken into consideration, and etching spots occur, and
The deterioration of acid resistance and chemical resistance is considered. The preferable cobalt deposition amount is 500 to 3000 μg / dm ² . On the other hand, when the amount of deposited nickel is less than 100 μg / dm ² , the heat-resistant peel strength is lowered and the oxidation resistance and chemical resistance are deteriorated. If the nickel content exceeds 700 μg / dm ² , the alkali etching property will deteriorate. The preferred nickel coverage is 200
˜600 μg / dm ² .

The conditions for cobalt-nickel alloy plating are as follows: (Cobalt-nickel alloy plating) Co: 1 to 20 g / liter Ni: 1 to 20 g / liter pH: 1.5 to 3.5 Temperature: 30 -80 ° C Current density _Dk : 1.0-20.0 A / dm ² hours: 0.5-4 seconds

According to the present invention, a zinc plating layer having a deposition amount of 10 to 80 μg / dm ² is further formed on the cobalt-nickel alloy plating. If the amount of zinc adhered is less than 10 μg / dm ² , there is no effect of improving the heat deterioration rate. On the other hand, when the zinc adhesion amount exceeds 80 μg / dm ² , the hydrochloric acid deterioration resistance becomes extremely poor. Preferably, the zinc coverage is 20-60 μg / dm
² and particularly preferably 30 to 50 μg / dm ² . The zinc plating conditions are as follows: (Zinc plating) Zn: 100 to 300 g / liter pH: 3 to 4 Temperature: 50 to 60 ° C. Current density D _k : 0.1 to 0.5 A / dm ² hours: 1 ~ 3 seconds

According to the present invention, the copper-cobalt-nickel alloy plating layer, the cobalt-nickel alloy plating layer and the zinc plating layer are successively formed as the roughening treatment. Have been found to be important. Although the reason is not clear, the copper-cobalt-nickel alloy plating layer as the roughening treatment and the cobalt-nickel alloy plating layer thereon act integrally. Total amount of cobalt deposited is 300-5000 μg / d
m ² and a total nickel coverage of 200 to 10
It is preferably set to 00 μg / dm ² . If the total amount of cobalt deposited is less than 300 μg / dm ² , the heat resistance and chemical resistance will deteriorate. On the other hand, the total amount of cobalt deposited is 50
If it exceeds 00 μg / dm ² , etching spots occur. When the total amount of nickel deposited is less than 200 μg / dm ² , heat resistance and chemical resistance are deteriorated. If the total amount of nickel deposited exceeds 1000 μg / dm ² , etching residues will occur. Preferably, the total amount of cobalt deposited is 250.
A 0~5000μg / dm ² and the total deposition amount of nickel are 400~1000μg / dm ^2.

After that, a rust preventive treatment is carried out if necessary. In the present invention, the preferred rust preventive treatment is a coating treatment of chromium oxide alone or a coating treatment of a mixture of chromium oxide and zinc / zinc oxide. Chromium oxide and zinc / zinc oxide mixture coating treatment means zinc or zinc consisting of zinc oxide and chromium oxide by electroplating using a plating bath containing zinc salt or zinc oxide and chromate.
This is a treatment for coating the anticorrosion layer of the chromium-based mixture. The plating bath is typically K ₂ Cr ₂ O ₇ , at least one dichromate such as Na ₂ Cr ₂ O ₇ or CrO ₃ , and a water-soluble zinc salt,
For example, a mixed aqueous solution of at least one of ZnO, ZnSO ₄ .7H ₂ O and alkali hydroxide is used. Representative plating bath compositions and examples of electrolysis conditions are as follows: (Chromium rust preventive treatment) K ₂ Cr ₂ O ₇ (Na ₂ Cr ₂ O ₇ or CrO ₃ ): 2 to 10 g / liter NaOH or KOH: 10 to 50 g / liter ZnO or ZnSO ₄ .7H ₂ O: 0.05 to 10 g / liter pH: 7 to 13 Bath temperature: 20 to 80 ° C. Current density D _k : 0.05 to 5 A / dm ² hours: 5 to 5 30 second anode: Pt-Ti plate, stainless steel plate, etc. Chromium oxide is required to have a chromium amount of 15 μg / dm ² or more, and zinc is required to have a coating amount of 30 μg / dm ² or more.

The copper foil thus obtained has excellent heat resistant peel strength, oxidation resistance and hydrochloric acid resistance, and moreover CuCl
_{2 The} etching solution can etch printed circuits with a circuit width of 150 μm or less and can also perform alkaline etching. Examples of the alkaline etching solution include NH ₄ O
H: 6 mol / l; NH ₄ Cl: 5 mol / l; CuCl ₂ :
Liquids such as 2 mol / liter (temperature 50 ° C.) are known.

More importantly, the obtained copper foil is Cu
-It has a black color as in the case of Ni treatment. Such black color is important in terms of alignment accuracy and high heat absorption rate. Specifically, printed circuit boards, including rigid boards and flexible boards, are equipped with parts such as ICs, resistors, and capacitors in an automated process.
At that time, the chip is mounted while reading the circuit with the sensor. At this time, alignment on the copper foil treated surface may be performed through a film such as Kapton. The same applies to positioning when forming through holes. At this time, the closer the processed surface is to black, the better the light absorption, and the higher the positioning accuracy. Furthermore, when a substrate is produced, the copper foil and the film are often cured and bonded to each other while applying heat. At this time, when heating is performed by using a long wavelength wave such as far infrared rays or infrared rays, the heating efficiency is improved when the color tone of the treated surface is dark.

Finally, if necessary, a silane treatment for applying a silane coupling agent to at least the roughened surface of the rust-preventive layer is performed for the main purpose of improving the adhesive force between the copper foil and the resin substrate. The coating method may be spraying of a silane coupling agent solution, coating with a coater, dipping, pouring, or the like. For example, Japanese Examined Patent Publication No. 60-15654 describes that the adhesion between the copper foil and the resin substrate is improved by subjecting the rough surface side of the copper foil to a chromate treatment and then a silane coupling agent treatment. . For details, refer to this. Thereafter, if necessary, an annealing treatment may be performed for the purpose of improving the ductility of the copper foil.

[0023]

EXAMPLES Examples and comparative examples will be presented below. The rolled copper foil is subjected to a roughening treatment by copper-cobalt-nickel alloy plating in the condition range shown below to give copper at 17 mg / dm 2.
² , cobalt was deposited at 2200 μg / dm ² and nickel was deposited at 300 μg / dm ² , and then washed with water to form a cobalt-nickel alloy plating layer or a cobalt plating layer thereon. Cobalt was deposited in the range 800-1400 μg / dm ² and nickel in the range 0-800 μg / dm ² . Therefore, the total amount of cobalt deposited is 3000-36.
00 μg / dm ² and total nickel coverage was 300-1100 μg / dm ² . After washing with water, 1
The rust-preventive treatment was carried out and dried with or without the application of 0-100 μg / dm ² of zinc. Sample No. was a comparative example sample in which zinc was deposited after depositing only cobalt instead of cobalt-nickel alloy plating. It was set to 5, 10. A comparative example sample in which zinc does not adhere to the cobalt-nickel alloy plating layer after the roughening treatment is sample No. It was set to 19.

The sample was laminated and adhered to a glass cloth base epoxy resin plate, and the normal state (room temperature) peel strength (kg / cm)
The deterioration due to heat resistance is shown as the deterioration rate (%) of the peel strength after heating at 180 ° C. for 48 hours, and the deterioration against hydrochloric acid is 1
The peel strength after immersion in 8% hydrochloric acid for 1 hour is shown as the deterioration rate (%) when measured with a 0.2 mm width × 10 circuits. In the alkali etching, the etching state was visually observed using the following liquids. (Alkaline etching solution) NH ₄ OH: 6 mol / liter NH ₄ Cl: 5 mol / liter CuCl ₂ · 2H ₂ O: 2 mol / liter Temperature: 50 ° C. Etching spots use the following copper chloride-hydrochloric acid solution. The etching state was visually observed. (Copper chloride etching solution) CuCl ₂ .2H ₂ O: 200 g / liter HCl: 150 g / liter Temperature: 40 ° C.

The bath composition and plating conditions used were as follows: [Bath composition and plating conditions] (A) Roughening treatment (Cu-Co-Ni alloy plating) Cu: 15 g / liter Co: 8.5 g / Liter Ni: 8.6 g / liter pH: 2.5 Temperature: 38 ° C. Current density D _k : 20 A / dm ² hours: 2 seconds Copper adhesion amount: 17 mg / dm ² Cobalt adhesion amount: 2200 μg / dm ² Nickel adhesion amount : 300 μg / dm ² (B) Anticorrosion treatment (Co-Ni alloy plating or Co plating) Co: 4 to 7 g / liter Ni: 0 to 10 g / liter pH: 2.5 Temperature: 50 ° C. Current density D _k : 8 .9~13.3A / dm ² Time: 0.5 seconds cobalt deposition amount: 800~1400μg / dm ² of nickel adhesion amount: 0~800μg / dm ² (C) thermal peeling resistance improving process (Zn) Zn: 200g / Liter pH: 3.7 Temperature: 56 ° C. Current density D _k: 0~0.5A / dm ² Time: 1 second Zn deposition amount: 0~100μg / dm ² (D) rust (chromate) K ₂ Cr ₂ O ₇ (Na ₂ Cr ₂ O ₇ or CrO
_3): 5 g / l NaOH or KOH: 30 g / liter ZnO or _{ZnSO 4 · 7H 2 O: 5g} / liter pH: 10 Temperature: 40 ° C. Current density D _k: 2A / dm ² Time: 10 seconds anode: Pt-Ti Board

[0026]

[Table 1]

[0027] In Table 1, Co and Ni deposition amount are expressed as the following total amount: (A) roughening treatment (Cu-Co-Ni) Co : 2200μg / dm 2, Ni: 300μg / dm 2 (B ) Anticorrosion treatment (Co—Ni) Co: 800 to 1400 μg / dm ² , Ni: 0 to 800 μg / dm ² Regarding the etching residue, the total deposition amount of nickel is 10
Observed part in the case of 00μg / dm ^2, the total deposition amount of nickel in the case of 1100μg / dm ^2, the nickel remained undissolved completely. No etching stain was observed in any of the samples. From Table 1, the following can be seen: (1) When the zinc deposition amount is constant, the heat resistance deterioration rate and the hydrochloric acid deterioration rate decrease as the cobalt adhesion amount and the nickel adhesion amount in the cobalt-nickel alloy plating process increase.
(See Nos. 1 to 18 and Nos. 30 to 33) (2) When the nickel deposition amount is constant, the heat deterioration rate can be significantly reduced by increasing the zinc deposition amount. However, when the amount of zinc adhered exceeds 80 μg / dm ² , the hydrochloric acid deterioration resistance rate is extremely deteriorated to 50% or more. (N
o. 19 to 29) From the above, according to the present invention, it is possible to obtain a copper foil for a printed circuit which has a property in which the heat deterioration rate can be greatly reduced and the heat deterioration rate and the hydrochloric acid deterioration rate are well balanced. You can see that

[0028]

INDUSTRIAL APPLICABILITY According to the present invention, copper-cobalt-
After roughening treatment by nickel alloy plating, in a method of treating a copper foil for a printed circuit to form a cobalt-nickel alloy plating layer, while succeeding in further improving the heat-resistant peeling property while keeping its beneficial advantage. Provided is a copper foil processing method capable of coping with a high temperature of processing accompanied by a rapid development of a semiconductor device in recent years and high density and multilayer of a printed circuit.

─────────────────────────────────────────────────── --- Continuation of the front page (56) References JP-A-4-96394 (JP, A) JP-A-4-96393 (JP, A) JP-A-56-87676 (JP, A) JP-A-56- 87675 (JP, A) JP-A-2-292894 (JP, A) Patent 2875186 (JP, B2) Japanese Patent Publication 6-54831 (JP, B2) (58) Fields investigated (Int.Cl. ⁷ , DB name) ) C25D 3/00-7/12 H05K 3/38 H05K 1/09

Claims (8)

(57) [Claims] 1. A method of treating a copper foil for a printed circuit, comprising forming a cobalt-nickel alloy plating layer on a surface of the copper foil after roughening treatment by copper-cobalt-nickel alloy plating,
A method for treating a copper foil for a printed circuit, further comprising forming a galvanized layer. 2. The method for treating a copper foil for a printed circuit according to claim 1, wherein rust prevention treatment is performed after the galvanized layer is formed. 3. The copper foil for a printed circuit according to claim 2, wherein the anticorrosion treatment is a single film treatment of chromium oxide or a mixed film treatment of chromium oxide and zinc and / or zinc oxide. Processing method. 4. A method of treating a copper foil for a printed circuit according to claim 1, wherein an amount of adhesion on the surface of the copper foil is 15 to 40 mg / dm ² copper-100.
~ 3000μg / dm ² Cobalt-100 ~ 900μg
/ Dm ² After the roughening treatment by copper-cobalt-nickel alloy plating of nickel, the adhesion amount is 200 to 3000 μg / d
The cobalt-nickel alloy plating layer of m ² cobalt-100 to 700 μg / dm ² nickel is formed, and further the zinc plating layer having an adhesion amount of 10 to 80 μg / dm ² is formed. A method for treating a copper foil for a printed circuit according to any one of items. 5. The total amount of cobalt deposited is 300 to 500.
0 μg / dm ² and a total nickel coverage of 2
The method for treating a copper foil for a printed circuit according to claim 4, wherein the amount is from 0.00 to 1000 μg / dm ² . 6. A method for treating a copper foil for a printed circuit, wherein the amount of the copper foil attached to the surface of the copper foil is 15 to 40 mg / dm ² copper-200.
0-3000μg / dm ² Cobalt-200-400μ
g / dm ² After the roughening treatment by copper-cobalt-nickel alloy plating of nickel, the adhesion amount is 500 to 3000 μg /
The cobalt-nickel alloy plating layer of dm ² cobalt-200 to 600 μg / dm ² nickel is formed, and further the zinc plating layer having an adhesion amount of 20 to 60 μg / dm ² is formed. A method for treating a copper foil for a printed circuit according to any one of items. 7. The total amount of cobalt deposited is 2500 to 50.
00μg / dm is ² and processing method of a printed circuit copper foil according to claim 6 total deposition amount of nickel is 400~1000μg / dm ^2. 8. The amount of the galvanized layer deposited is 30 to 50 μg.
/ Dm ^{2 The} method for treating a copper foil for a printed circuit according to claim 6.