CN105101672A - Asymmetric rigid-flex board manufacturing method - Google Patents
Asymmetric rigid-flex board manufacturing method Download PDFInfo
- Publication number
- CN105101672A CN105101672A CN201510491179.XA CN201510491179A CN105101672A CN 105101672 A CN105101672 A CN 105101672A CN 201510491179 A CN201510491179 A CN 201510491179A CN 105101672 A CN105101672 A CN 105101672A
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- China
- Prior art keywords
- rigid
- wiring board
- rigid wiring
- groove
- flexible printed
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses an asymmetric rigid-flex board manufacturing method. The method mainly comprises steps: a flexible circuit board for completing circuit manufacturing is provided, and a rigid circuit board is provided; a groove is cut in the rigid circuit board, and the cut depth of the groove is smaller than the thickness of the rigid circuit board; hot pressing is carried out on the flexible circuit board and the rigid circuit board; circuit manufacturing is carried out on the rigid circuit board; cutting is carried out along a track formed by the groove in a surrounding mode, and the region surrounded by the groove on the rigid circuit board is cut off. A twice cutting forming mode is adopted, and bad influences on hot pressing and circuit manufacturing on the rigid circuit board by a hollow region on the rigid circuit board can be effectively avoided.
Description
Technical field
The present invention relates to wiring board and make field, be specifically related to a kind of asymmetric rigid-flex combined board manufacture method.
Background technology
In wiring board techniques field, rigid-flex combined board refers to combining of Flexible Printed Circuit and rigid wiring board, is filmated flexible bottom and rigid bottom to be combined, then is laminated in a single component, the circuit board of formation.Flexible Printed Circuit merges with rigid circuit board structure by rigid-flex combined board mutually, both having had flexible, the folding feature of Flexible Printed Circuit, for making custom circuit, having utilized free space substantially; Comprise again the hardness of rigid wiring board, for ensureing the anti-shot ability under intensity of wiring board.Therefore, rigid-flex combined board is applied on a large scale in fields such as Aero-Space, advanced Medical Devices, digital cameras.Common rigid-flex combined board structure comprises symmetric form, asymmetric, book-type, flies tail type and shield type.Wherein, asymmetric rigid-flex combined board refers in manufacturing process, only Flexible Printed Circuit one side wherein and rigid pcb layer is pressed and combines and the circuit board structure that formed.
In the prior art, the manufacture method of rigid-flex combined board mainly comprises:
Step 1, needs exposed region for Flexible Printed Circuit, carries out shaping hollow out in advance in rigid wiring board corresponding region;
Step 2, carries out circuit making to rigid wiring board;
Step 3, takes high-temperature laminating by Flexible Printed Circuit and rigid wiring board.
By above-mentioned manufacture method, rigid-flex combined board achieves flexible, folding function at the position of Flexible Printed Circuit exposed region, and rigid-flex combined board is achieved high strength, function that anti-shot ability is strong in Flexible Printed Circuit by the position that rigid wiring board covers.But there is many deficiencies in prior art.The deficiencies in the prior art are mainly, the void region on rigid wiring board can be caused: rigid wiring board, when circuit makes, causes line short, open circuit or breach because of ill-exposed; Rigid wiring board with Flexible Printed Circuit carry out high-temperature laminating make time, cause because of discontinuity insulating barrier gummosis uneven, finally reduce the adhesion of rigid wiring board between Flexible Printed Circuit, the thickness of slab uniformity of rigid-flex combined board can be reduced equally.
For above-mentioned the deficiencies in the prior art, those skilled in the art have the void region covering filler proposed on rigid wiring board to be improved.But cover filler and add cost input on the one hand, increase technological process, the uniformity of filler filling thickness is difficult to control on the other hand, and actual improved effect is undesirable.
Summary of the invention
In view of this, the present invention discloses a kind of asymmetric rigid-flex combined board manufacture method.
The object of the invention is to be achieved through the following technical solutions:
Asymmetric rigid-flex combined board manufacture method, the method mainly comprises the steps:
Step 1, provide one complete circuit make Flexible Printed Circuit, it comprises Flexible Printed Circuit stitching surface and Flexible Printed Circuit exposed surface, described Flexible Printed Circuit stitching surface primarily of exposed region and pressing district composition; There is provided a rigid wiring board, it comprises rigid wiring board stitching surface and rigid wiring board exposed surface;
Step 2, cut-in groove on rigid wiring board, the region that described groove surrounds is corresponding with the exposed region on Flexible Printed Circuit stitching surface, and cut-in groove is longitudinally carried out to rigid wiring board exposed surface by rigid wiring board stitching surface, and the degree of depth of groove cutting is less than the thickness of rigid wiring board;
Step 3, carries out hot pressing after laying polypropylene resin layer between Flexible Printed Circuit stitching surface and rigid wiring board stitching surface;
Step 4, makes in the enterprising row line of rigid wiring board exposed surface;
Step 5, from rigid wiring board exposed surface to rigid wiring board stitching surface longitudinal direction, and cuts along the track that described groove surrounds, by the Regional resection that rigid wiring board upper groove surrounds.
As optimal technical scheme, the mode of cut-in groove described in step 2 is laser cutting.
As optimal technical scheme, the cutting mode described in step 5 is the shaping cutting of CNC.
As optimal technical scheme, described in step 2, the degree of depth of groove cutting is 4/5 of rigid circuit plate thickness.
In order to prevent in hot pressing process, in the groove of inflow step 2 cutting that the resin of acrylic resin melting layer is too much, thus increase the difficulty that rigid wiring board upper groove is surrounded Regional resection by step 5, inventor is when carrying out the design of step 3 hot pressing technique, in advance according to rigid wiring board, polypropylene resin layer, Flexible Printed Circuit order from top to bottom carry out superimposed after, then carry out hot pressing.
Further; circuit described in step 4 makes and mainly comprises press mold, exposure, development, etching, striping technological process; when carrying out striping and making; press mold protection is carried out to rigid wiring board stitching surface; when exposure film makes; rigid wiring board stitching surface exposure film is set to full transparent area, and developing, etching is when making, by rigid wiring board according to exposed surface upward, the ventricumbent mode of pressing places.
Preferably, when step 5 carries out groove cutting, the degree of depth of groove cutting is 2/5 of rigid circuit plate thickness.
The present invention has the following advantages and beneficial effect compared to existing technology:
(1) molding mode of the cutting twice of the present invention's employing, the vacancy section that effectively prevent on rigid wiring board makes to hot pressing, hard rays line circuit the harmful effect produced.
(2) the present invention takes two step cuttings, and the direction of cutting twice is relative, has effectively evaded after pressing, and the degree of depth of second time time cutting damages the risk of polypropylene resin layer and Flexible Printed Circuit stitching surface owing to cannot accurately control.
(3) the present invention takes the cutting mode of laser cutting and the shaping cutting collocation of CNC, cutting first adopts laser cutting, utilize the feature of laser cutting otch carefully narrow, surface smoothing, effectively prevent the liquid medicine made at circuit easily to remain to groove and bring lateral erosion, the gummosis that pressing makes easily remains to groove and strengthens the difficulty of second time cutting; Cutting adopts the mode of the shaping cutting of CNC again, mainly considers the advantage of production cost.
Accompanying drawing explanation
Fig. 1 is the structural representation after rigid wiring board completes first time groove cutting.
Fig. 2 is the structural representation after rigid wiring board and Flexible Printed Circuit carry out hot pressing.
Fig. 3 is asymmetric rigid-flex combined board structural representation of the present invention.
Embodiment
The present invention to be described in further detail below in conjunction with accompanying drawing and embodiment for the ease of it will be appreciated by those skilled in the art that:
Embodiment 1
Referring to figs. 1 through Fig. 3, the asymmetric rigid-flex combined board manufacture method that the present embodiment provides mainly comprises the steps:
Step 1, provide one complete circuit make Flexible Printed Circuit 1, it comprises Flexible Printed Circuit stitching surface 11 and Flexible Printed Circuit exposed surface 12, and Flexible Printed Circuit stitching surface 11 forms primarily of exposed region 111 and pressing district 112; There is provided a rigid wiring board 2, it comprises rigid wiring board stitching surface 21 and rigid wiring board exposed surface 22.
The circuit of Flexible Printed Circuit 1 makes and can realize traditionally, repeats no more here.Exposed region 111 on Flexible Printed Circuit stitching surface 11 refers in subsequent technique, and the rigid wiring board 2 above it is by the region of hollow out, and pressing district 112 refers to other regions Flexible Printed Circuit stitching surface 11 removing exposed region 111.
Step 2, cut-in groove 41 on rigid wiring board 2, the region that groove 41 surrounds is corresponding with the exposed region 111 on Flexible Printed Circuit stitching surface.In cut direction design, cut-in groove 41 is longitudinally carried out to rigid wiring board exposed surface 22 by rigid wiring board stitching surface 21.In the design of groove 41 depth of cut, consider the difficulty of follow-up secondary cut and cut the incident fracture in the region deeply causing groove 41 to surround, loosening risk, in principle, the degree of depth that groove 41 cuts is less than the thickness of rigid wiring board 2, wherein through test, the degree of depth that groove 41 cuts is 4/5 of rigid wiring board 2 thickness is preferred plan.By checking, the degree of depth that groove 41 cuts is the design of 4/5 of rigid wiring board 2 thickness, be the region that groove 41 surrounds without fracture, loosen risk prerequisite under, the depth capacity that groove 41 can cut.
It should be noted that, in step 2, the cutting mode of groove 41 can select the shaping cutting of CNN, laser cutting or other cutting modes, and wherein laser cutting is most preferably scheme.This is mainly based on laser cutting otch carefully narrow, surface smoothing, like this liquid medicine when effectively preventing rigid wiring board 2 conducting transmission line to make easily is remained to the risk bringing lateral erosion in groove 41.
Step 3, carries out hot pressing after laying polypropylene resin layer 3 between Flexible Printed Circuit stitching surface 11 and rigid wiring board stitching surface 21.Polypropylene resin layer 3 mainly plays insulation of the prior art, cementation.Consider in high-temperature laminating process, polypropylene resin layer 3 can spread through melting the colloid produced on Flexible Printed Circuit stitching surface 11 and rigid wiring board stitching surface 21, in easy inflow groove 41, thus increase the difficulty of follow-up secondary cut, in the specific implementation, the present invention's design is carried out superimposed according to rigid wiring board 2, polypropylene resin layer 3, Flexible Printed Circuit 1 order from top to bottom, and then is carried out hot pressing in advance.Lamination in advance, makes rigid wiring board 2 be positioned at the top of polypropylene resin layer 3, and consider that gravity effect and groove 41 adopt the advantage of laser cutting, the gummosis that polypropylene resin layer 3 produces in hot pressing process can not be wandered in groove 41.
Step 4, makes in the enterprising row line of rigid wiring board exposed surface 22, and circuit makes and mainly comprises press mold, exposure, development, etching and striping technological process.The present invention, when the enterprising row line of rigid wiring board exposed surface 22 makes, takes following innovative technology:
When carrying out striping and making, press mold protection is carried out to rigid wiring board stitching surface 21, when exposure film makes, the exposure film of rigid wiring board stitching surface 21 is set to full transparent area.According to technological design like this, light-sensitive surface is protected rigid wiring board stitching surface 21 and groove 41 by covering all the time in development, etch phase, prevents from developing, the chemical medicinal liquid of etch phase remains in groove 41, produce the bad quality of lateral erosion.
Further, in order to reduce the risk of lateral erosion, developing, etching is when making, by rigid wiring board 2 according to exposed surface 22 upward, stitching surface 21 mode down places.
Step 5, from rigid wiring board exposed surface 22 to rigid wiring board stitching surface 21 longitudinal direction, and cuts along the track that groove 41 surrounds, the Regional resection that rigid wiring board 2 upper groove 41 surrounds by the mode of the shaping cutting of preferred CNC.
When step 5 is cut, the degree of depth of concrete cutting is preferably 2/5 of rigid wiring board 2 thickness.Based on this depth of cut, depth of cut is designed to 2/5 of rigid wiring board 2 thickness mainly both can ensure that the region by rigid wiring board 2 upper groove 41 surrounds was excised completely, being unlikely to again affects working (machining) efficiency and damage polypropylene resin layer 3 and Flexible Printed Circuit 1 because depth of cut is too high.
After above-mentioned steps, the region that groove 41 on rigid wiring board 2 surrounds is cut, the polypropylene resin layer 3 of the correspondence below this region is exposed, although the exposed region 111 on Flexible Printed Circuit stitching surface 11 is still hidden by polypropylene resin layer 3, but polypropylene resin layer 3 is plastic cement material, and Flexible Printed Circuit 1 combines and still can realize flexible, the folding function of rigid-flex combined board; And the part that rigid wiring board 2, polypropylene resin layer 3 and Flexible Printed Circuit 1 are combined closely, achieve again rigid-flex combined board high strength, function that anti-shot ability is strong.
Be more than wherein specific implementation of the present invention, it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these apparent replacement forms all belong to protection scope of the present invention.
Claims (7)
1. asymmetric rigid-flex combined board manufacture method, is characterized in that the method mainly comprises the steps:
Step 1, provide one complete circuit make Flexible Printed Circuit, it comprises Flexible Printed Circuit stitching surface and Flexible Printed Circuit exposed surface, described Flexible Printed Circuit stitching surface primarily of exposed region and pressing district composition; There is provided a rigid wiring board, it comprises rigid wiring board stitching surface and rigid wiring board exposed surface;
Step 2, cut-in groove on rigid wiring board, the region that described groove surrounds is corresponding with the exposed region on Flexible Printed Circuit stitching surface, and cut-in groove is longitudinally carried out to rigid wiring board exposed surface by rigid wiring board stitching surface, and the degree of depth of groove cutting is less than the thickness of rigid wiring board;
Step 3, carries out hot pressing after laying polypropylene resin layer between Flexible Printed Circuit stitching surface and rigid wiring board stitching surface;
Step 4, makes in the enterprising row line of rigid wiring board exposed surface;
Step 5, from rigid wiring board exposed surface to rigid wiring board stitching surface longitudinal direction, and cuts along the track that described groove surrounds, by the Regional resection that rigid wiring board upper groove surrounds.
2. asymmetric rigid-flex combined board manufacture method according to claim 1, is characterized in that: in described step 2, the mode of cut-in groove is laser cutting.
3. asymmetric rigid-flex combined board manufacture method according to claim 1 and 2, is characterized in that: the degree of depth of described step 2 further groove cutting is 4/5 of rigid circuit plate thickness.
4. asymmetric rigid-flex combined board manufacture method according to claim 3, is characterized in that: in described step 3, in advance according to rigid wiring board, polypropylene resin layer, Flexible Printed Circuit order from top to bottom carry out superimposed after, then carry out hot pressing.
5. asymmetric rigid-flex combined board manufacture method according to claim 4, is characterized in that: the circuit in described step 4 makes and mainly comprises press mold, exposure, development, etching, striping technological process; When carrying out striping and making; press mold protection is carried out to rigid wiring board stitching surface, when exposure film makes, rigid wiring board stitching surface exposure film is set to full transparent area; developing, etching is when making, by rigid wiring board according to exposed surface upward, the ventricumbent mode of pressing places.
6. asymmetric rigid-flex combined board manufacture method according to claim 5, is characterized in that: the cutting mode of described step 5 is the shaping cutting of CNC.
7. asymmetric rigid-flex combined board manufacture method according to claim 6, is characterized in that: when described step 5 is cut, and the degree of depth of cutting is 2/5 of rigid circuit plate thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510491179.XA CN105101672A (en) | 2015-08-12 | 2015-08-12 | Asymmetric rigid-flex board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510491179.XA CN105101672A (en) | 2015-08-12 | 2015-08-12 | Asymmetric rigid-flex board manufacturing method |
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| CN105101672A true CN105101672A (en) | 2015-11-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510491179.XA Pending CN105101672A (en) | 2015-08-12 | 2015-08-12 | Asymmetric rigid-flex board manufacturing method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106851993A (en) * | 2017-04-08 | 2017-06-13 | 吉安市满坤科技有限公司 | A kind of new lamp bar sheet metal forming processing method |
| CN111712068A (en) * | 2020-06-28 | 2020-09-25 | 珠海杰赛科技有限公司 | Method for reducing pressing warpage of asymmetric rigid-flex board |
| CN112911810A (en) * | 2021-01-19 | 2021-06-04 | 潍坊歌尔微电子有限公司 | PCB cutting method and sensor packaging structure |
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| CN101695217A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for producing printed board combining rigidness and flexibleness |
| CN102458055A (en) * | 2010-10-20 | 2012-05-16 | 富葵精密组件(深圳)有限公司 | Manufacturing method for rigid-flexible circuit board |
| EP2547183A1 (en) * | 2011-07-15 | 2013-01-16 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof as well as rigid-flex printed circuit board or a sub-assembly thereof |
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2015
- 2015-08-12 CN CN201510491179.XA patent/CN105101672A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101695217A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for producing printed board combining rigidness and flexibleness |
| CN102458055A (en) * | 2010-10-20 | 2012-05-16 | 富葵精密组件(深圳)有限公司 | Manufacturing method for rigid-flexible circuit board |
| EP2547183A1 (en) * | 2011-07-15 | 2013-01-16 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof as well as rigid-flex printed circuit board or a sub-assembly thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106851993A (en) * | 2017-04-08 | 2017-06-13 | 吉安市满坤科技有限公司 | A kind of new lamp bar sheet metal forming processing method |
| CN106851993B (en) * | 2017-04-08 | 2019-04-12 | 吉安满坤科技股份有限公司 | A kind of novel lamp bar sheet metal forming processing method |
| CN111712068A (en) * | 2020-06-28 | 2020-09-25 | 珠海杰赛科技有限公司 | Method for reducing pressing warpage of asymmetric rigid-flex board |
| CN111712068B (en) * | 2020-06-28 | 2021-09-14 | 珠海杰赛科技有限公司 | Method for reducing pressing warpage of asymmetric rigid-flex board |
| CN112911810A (en) * | 2021-01-19 | 2021-06-04 | 潍坊歌尔微电子有限公司 | PCB cutting method and sensor packaging structure |
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Application publication date: 20151125 |
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