CN205160900U - Printed wiring plate structure - Google Patents
Printed wiring plate structure Download PDFInfo
- Publication number
- CN205160900U CN205160900U CN201520603542.8U CN201520603542U CN205160900U CN 205160900 U CN205160900 U CN 205160900U CN 201520603542 U CN201520603542 U CN 201520603542U CN 205160900 U CN205160900 U CN 205160900U
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- CN
- China
- Prior art keywords
- printed wiring
- wiring board
- groove
- utility
- model
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a printed wiring plate structure, which comprises a substrate, the base plate comprises copper aspect and insulating face, vertically is provided with the recess of certain degree of depth to the copper aspect by insulating, and the depth of groove is 45 of base plate thickness, and the recess width is 0.15 -0.3mm. The utility model provides a printed wiring plate structure is provided with the structure of fretwork according to traditional mode, but realizes the precut through groove structure, has effectively avoided the harmful effects that the fretwork district on the printed wiring board produced to hot pressing, the preparation of printed wiring printed line way.
Description
Technical field
The utility model relates to wiring board art, is specifically related to the printed wiring board structure be applied on rigid-flex combined board, refers in particular to the printed wiring board structure be applied on asymmetric rigid-flex combined board.
Background technology
In wiring board techniques field, rigid-flex combined board refers to combining of Flexible Printed Circuit and rigid wiring board (specifically referring to printed wiring board), is filmated flexible bottom and rigid bottom to be combined, then is laminated in a single component, the circuit board of formation.Wherein, asymmetric rigid-flex combined board refers in manufacturing process, only Flexible Printed Circuit one side is wherein combined with printed wiring board lamination and the circuit board structure that formed.
In the prior art, the manufacture method of rigid-flex combined board mainly comprises:
Step 1, needs exposed region for Flexible Printed Circuit, carries out shaping hollow out in advance in printed wiring board corresponding region;
Step 2, carries out circuit making to printed wiring board;
Step 3, takes high-temperature laminating by Flexible Printed Circuit and printed wiring board.
By above-mentioned manufacture method, rigid-flex combined board achieves flexible, folding function at the position of Flexible Printed Circuit exposed region, and rigid-flex combined board is achieved high strength, function that anti-shot ability is strong in Flexible Printed Circuit by the position that rigid wiring board covers.But there is many deficiencies in prior art.The deficiencies in the prior art are mainly, the void region on printed wiring board can be caused: printed wiring board, when circuit makes, causes line short, open circuit or breach because of ill-exposed; Printed wiring board with Flexible Printed Circuit carry out high-temperature laminating make time, cause because of discontinuity insulating barrier gummosis uneven, finally reduce the adhesion of printed wiring board between Flexible Printed Circuit, the thickness of slab uniformity of rigid-flex combined board can be reduced equally.
For above-mentioned the deficiencies in the prior art, those skilled in the art have the void region covering filler proposed on printed wiring board to be improved.But cover filler and add cost input on the one hand, increase technological process, the uniformity of filler filling thickness is difficult to control on the other hand, and actual improved effect is undesirable.
Utility model content
In view of this, the utility model discloses a kind of printed wiring board structure, the rigid-flex combined board be made up of this printed wiring board structure efficiently solves the problem that circuit makes and pressing is bad caused conventional printed wiring board vacancy section.
The purpose of this utility model is achieved through the following technical solutions:
A kind of printed wiring board structure, comprise substrate, described substrate is made up of layers of copper face and insulating surfaces, is vertically arranged with the groove of certain depth by insulating surfaces to layers of copper face, and depth of groove is 4/5 of substrate thickness, and recess width is 0.15-0.3mm.
As optimal technical scheme, the width of described groove is 0.25mm.
The present invention has the following advantages and beneficial effect compared to existing technology:
(1) printed wiring board structure that the utility model provides conventionally does not arrange vacancy section, but realized precut by groove structure, effectively prevent vacancy section on printed wiring board and the harmful effect produced is made to hot pressing, printing line circuit.
(2) the utility model is offered on direction at groove, selects, from insulating surfaces toward layers of copper face depth, effectively to have evaded after pressing, and the degree of depth of second time time cutting damages the risk of Flexible Printed Circuit owing to cannot accurately control.
(3) the utility model is in recess width design, difficulty and the excessive risk brought of recess width of secondary cut are considered, effectively prevent the liquid medicine made at circuit easily to remain to groove and bring lateral erosion, and the gummosis reducing pressing making easily remains to groove and strengthens the difficulty of second time cutting.
(4) depth design of groove is 4/5 of substrate thickness by the utility model, effectively ensure that the region that surrounds at groove without fracture, loosen risk prerequisite under, the depth capacity that groove can cut.
Accompanying drawing explanation
Fig. 1 is the utility model structure cutaway view.
Fig. 2 is the utility model insulating surfaces structure enlarged diagram.
Embodiment
The present invention to be described in further detail below in conjunction with accompanying drawing and embodiment for the ease of it will be appreciated by those skilled in the art that:
Embodiment 1
Referring to figs. 1 through Fig. 2, the printed wiring board structure that the present embodiment provides, comprise substrate 1, substrate 1 is made up of layers of copper face 12 and insulating surfaces 11, the groove 3 of certain depth is vertically arranged with by insulating surfaces 11 to layers of copper face 12, groove 3 degree of depth is 4/5 of substrate 1 thickness, and groove 3 width is 0.15-0.3mm, and the preferable width of its further groove 3 is 0.25mm.
The process adopting the utility model printed wiring board structure to make asymmetric rigid-flex combined board mainly comprises:
1. after laying polypropylene resin layer between printed wiring board insulating surfaces 11 and Flexible Printed Circuit, carry out hot pressing; Due at groove 3 on width design, inventor has considered difficulty and the excessive risk brought of groove 3 width of secondary cut, therefore, in high-temperature laminating process, polypropylene resin layer can not flow in groove 3 through melting the colloid produced, thus reduces the difficulty of follow-up secondary cut.
2. in printed wiring board layers of copper face 12, enterprising row line makes.
3. secondary cut, from printed wiring board layers of copper face 12 to rigid wiring board insulating surfaces 11 longitudinal direction, and cuts, by the Regional resection that printed wiring board upper groove 3 surrounds along the track that groove 3 surrounds.
After above-mentioned steps, the region that rigid wiring board upper groove 3 surrounds is cut, polypropylene resin layer corresponding below this region is exposed, although the corresponding region in Flexible Printed Circuit is still hidden by polypropylene resin layer, but polypropylene resin layer is plastic cement material, and Flexible Printed Circuit combination still can realize flexible, the folding function of rigid-flex combined board; And the part that printed wiring board, polypropylene resin layer and Flexible Printed Circuit are combined closely, achieve again rigid-flex combined board high strength, function that anti-shot ability is strong.
Be more than wherein specific implementation of the present utility model, it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these apparent replacement forms all belong to protection scope of the present invention.
Claims (2)
1. a printed wiring board structure, comprises substrate, it is characterized in that: described substrate is made up of layers of copper face and insulating surfaces, is vertically arranged with the groove of certain depth by insulating surfaces to layers of copper face, and depth of groove is 4/5 of substrate thickness, and recess width is 0.15-0.3mm.
2. printed wiring board structure according to claim 1, is characterized in that: the width of described groove is 0.25mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520603542.8U CN205160900U (en) | 2015-08-12 | 2015-08-12 | Printed wiring plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520603542.8U CN205160900U (en) | 2015-08-12 | 2015-08-12 | Printed wiring plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205160900U true CN205160900U (en) | 2016-04-13 |
Family
ID=55696537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520603542.8U Expired - Fee Related CN205160900U (en) | 2015-08-12 | 2015-08-12 | Printed wiring plate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205160900U (en) |
-
2015
- 2015-08-12 CN CN201520603542.8U patent/CN205160900U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160413 Termination date: 20190812 |