1310295 &、發明說明： 【發明所屬之技術領域】 本發明係關於一種軟硬結合板之製作方法，尤指—種 同時形成填充部以縮短製程時間的軟硬結合板之 型方法。 x [先前技術】 剛性-撓性結合板（Rigid-Flex)簡稱軟硬結合板，其 :有可撓曲性…前已逐漸被廣泛運用於具可撓曲部 勺電=裝置中，如掀蓋式手機或筆記型電腦。 —/看第十-圖所不’軟硬結合板-般係主要由至少 :更板（8 〇 )(不具撓曲性電路板)及至少一軟板（ 、具繞曲性電路板）組成， 崚別狄置有電路相互連接並 ;I成型，其中硬板（8 〇 )部份鐫空形成一凹穴 可藉由露出於凹穴 ：出…軟硬結合板即 曲的效果。 83)的軟板（9〇)彎折來達到撓 此外’軟硬結合板_般在凹々（^ 〇、 設置有至少—仵護声（8^ “83)形成後’皆另 門二二 以覆蓋軟硬結合板表面，以防止加工期 日1有/、馱鹼性或其他侵蝕 破壞；填充π "…水參入軟硬結合板内造成 具兄邛（8 2 )係置於凹穴（ 〇)與保護層（81)之門Α 83)内的軟板（9 令保護層（8 11: 的除填充…83) 防止因凹穴（8 3 )內^ / 製作外，還可以 (8 3 )内軟板（9 〇)與保護層（8 "間 U10295 隙容納的空氣過多，導致 硬結合板板體戋t #中恥脹造成爆炸而破壞軟 而現右h p業界所謂的爆板。 見有技術的軟硬結合板， (9 0 )壓合成型、 ’、更板（8 〇 )與軟板 工制方法進行挖鑽形成凹穴 直4妾’衣度 然而如此以挖鑽的方式 使軟板（9 0 )露出， 不當而破壞到軟板（9 仃17工不僅很容易因深度控制 的板厚不-而須逐—加工，：表：，且亦會因軟硬結合板 不僅會降低產。的σ μ &化費更多製程時間，如此 千丨&座口口的品質及良 品的生產效益。 且製程時間太長影響到產 另外，目前業界對於製 的填充部（8 2 )，凹穴（8…（8 3 )-度大小 成，以及懕人 8 3 )處的保護層（8丄）形 成以及壓合、蝕刻後填 M h μ m m .. ( 8 2 )的移除，亦有其實 才力上的困難’盍因填充部 成创德谊古 1 y 2 ) 一般係於凹穴（8 3 ) 成i後填充入凹穴（83)内，苴古 ^ ( Q Ο \ ^ , ，、同度掌握不易，且填充 4 C 8 2 )為包覆於保護層（ τ更尽與軟板（9〇)之間， 其私除時須先將凹穴（β 9 (8 3 )處的保護層（8 1 )剝離， 然而保護層（8 i ) 一般係盥 ，、狀硬結合板表面黏合，所以 剝样隹時一方面需|尤藝审 而要化費更多的時間及人力成本，另一方面 則有可能會在過程中傷害到軟硬結合板的板體或其電路， 以上所述皆是現行軟硬結合板製作過程中常面臨的困難 點。 【發明内容】 有馨於現有技術製作軟硬結合板的方法，其對於凹穴 1310295 的成型與填充部、保護 的I作及移除上有其困難，本發 月者！過多年實務經驗， 荆+知展出數種軟硬結合板之凹穴成 法，能輕易在軟硬社人板卜a a、 丄梭麻 、，口 口板上元成凹穴及其填充部與保 5隻層’且令其都能在贺 ± 在I耘取後直接移除，如此有效的縮短 製程時間’並減少時間及人力成本的浪費。 為達到前述各項目的 本發明之軟硬結合板之 凹八成里方法’其係將軟 先以刀模娜工且：° 5板中的硬板於麗合成型前 面藉… 斷或雷射切穿-封閉面積，以封閉 形成保護層： ”真充再運用以下幾種方式 1 ·將前述硬板表面舖 — — A °又一層銅洎作為保護層，藉此，填 行時銅泊可形成-平坦的表面’且於後段製程進 ^除，令填充部露出於軟硬板表面，可直接 年夕除以離型形成凹穴。 2 ’以一含雙面銅箔 層，其内…右 前述硬板表面作為保護 填充積稍切填充部的_，可作為 冉兄口 的屏蔽，而去 除時，再用带射士更板麼合成型後’填充部欲移 當雷射進一士田相對填充部處的硬板並移除；而 ^ 相對填充部處的内層鋼箔可阻_ ψ + 内邛的電路或板體，且同時祜+斛+ 出切痕，如此該鋼笮 破田射切 出。 / 「可輕易被移除以便將填充部取 以一含外層銅结 ^ , , v . 更板壓合於前述硬板表面作為^ 層，以外層㈣作為 作為保蠖 真充。P的屏敝，先以内部雷射切 1310295 牙一封閉面積’並於軟硬板壓合後形成電路之前，先 以成型加工方式截斷相對填充部之外圍，令填充部於 形成電路之同時可直接脫落。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of fabricating a soft and hard bonding plate, and more particularly to a method of forming a soft and hard bonding plate at the same time to form a filling portion to shorten a process time. x [Prior Art] Rigid-Flex is abbreviated as soft and hard bonding board. It has flexibility. It has been widely used in flexible electric devices, such as 掀. Cover phone or laptop. - / see the tenth - the picture is not 'soft and hard combination board - the general system consists of at least: the board (8 〇) (without flexible circuit board) and at least one soft board (with a flexible circuit board) , 崚别狄置 has a circuit connected to each other; I molding, in which the hard plate (8 〇) part of the hollow to form a cavity can be exposed by the cavity 83) The soft board (9〇) is bent to achieve the flexibility. In addition, the 'soft and hard combination board' is in the concave 々 (^ 〇, and at least the 仵 仵 ( (8^ “83) is formed. To cover the surface of the soft and hard bonding board to prevent the processing of the day 1 /, alkaline or other erosion damage; filling π " ... water into the soft and hard bonding plate to create a brother (8 2) in the pocket ( 〇 ) and the protective layer (81) threshold ) 83) soft board (9 order protective layer (8 11: in addition to filling ... 83) to prevent the inside of the pocket (8 3) ^ / production, you can ( 8 3) Inner soft board (9 〇) and protective layer (8 "U10295 gap contains too much air, resulting in hard-bonded board body 戋t#. The swell of the swell caused the explosion and destroyed the soft and the right hp industry called the explosion See the technical soft and hard board, (9 0) press-composite type, ', more board (8 〇) and soft board work method to drill the hole to form the pocket straight 4 妾 '衣度 however to drill The way to make the soft board (90) exposed, improperly destroyed to the soft board (9 仃 17 work is not only easy because of the depth control of the thickness is not - and must be processed separately: table: and also due to soft The hard-bonded board will not only reduce the production. The σ μ & ration costs more process time, so the quality of the mouth and the mouth and the production efficiency of the good product. And the process time is too long to affect the production, the current industry The filling portion (8 2 ), the protective layer (8丄) at the recess (8...(8 3 )-degree, and the 8人 8 3 ) are formed and pressed, and the M h μ mm is filled after etching. (8 2 ) removal, there are also difficulties in the actual power.] The filling part is created by Deyi Ancient 1 y 2 ) Generally, it is filled in the pocket (83) after being filled into the pocket (83). , 苴古^ (Q Ο \ ^ , ,, is not easy to master, and filled with 4 C 8 2 ) is covered with a protective layer ( between τ and soft board (9〇), it must be privately The protective layer (8 1 ) at the recess (β 9 (8 3 ) is peeled off, but the protective layer (8 i ) is generally 盥, and the surface of the hard-bonded plate is bonded, so when the sputum is removed, it is necessary to In the process of trial, it will cost more time and labor costs. On the other hand, it may damage the board of the hard and soft board or its circuit in the process. All of the above are the current soft and hard combination. Difficulties that are often encountered in the manufacturing process. [Summary of the Invention] There is a method for making a soft and hard bonding plate in the prior art, which has difficulty in forming and filling the cavity 1310295, protecting and removing it. Months! For many years of practical experience, Jing + Zhi exhibits several kinds of soft and hard combination of the hole forming method, which can easily be used in the soft and hard society board aa, 丄 麻 hemp, and the mouth plate The filling part and the 5 layers are guaranteed and can be directly removed after the I is taken, so that the process time is effectively shortened and the waste of time and labor costs is reduced. In order to achieve the above-mentioned items, the method of the concave and convex occlusion of the soft and hard bonding board of the present invention is as follows: the soft board is first softened by the knife and the hard board of the 5th board is used in front of the Li synthetic type. Wear-closed area to form a protective layer by sealing: "There are several ways to use the following: 1. The surface of the hard board is paved - A ° and another layer of copper enamel is used as a protective layer, whereby copper can be formed during filling. - Flat surface 'and in the back-end process to remove, so that the filling part is exposed on the surface of the soft and hard board, can be divided into the shape of the recessed form directly. 2 'With a double-sided copper foil layer, inside ... right The surface of the hard plate is used as a shield to fill the filling portion. It can be used as a shield for the scorpion. When it is removed, it can be used as a synthetic slab. The hard plate at the filling portion is removed; and the inner steel foil at the filling portion can block the circuit or the plate of the inner enthalpy, and at the same time 祜+斛+ outcut, so that the steel smashes the field Cut out. / "It can be easily removed to take the filling part with an outer copper knot ^ , v. The plate is pressed against the surface of the hard plate as a layer, and the outer layer (4) is used as a screen for protecting the true charge. P is first cut with an internal laser to cut the area of 1310295 teeth and form a circuit after the soft and hard plates are pressed together. First, the periphery of the opposite filling portion is cut by a molding process, so that the filling portion can be directly detached while forming the circuit.
4 .以一覆膠銅箔直接藉由壓合方式，使其膠層黏合至硬 板表面作為保護層，而由於其膠層可凝固於硬板表面 的電路上，故此可對軟硬結合板提供更好的防護。而 由於該膠層在壓合時即受熱轉變成脆性材質，故軟硬 結合板成型後可直接彎折使凝固的膠層破裂，如此以 輕易移除填充部並形成凹穴使軟板露出。 ^上所述，本發明軟硬結合板之凹穴成型方法i利用 成型前對硬板沖斷形成凹穴同時，形成填充部，如此較不 會傷害到軟板表面，且縮短了凹穴與填充部的製作時間， 可=有效節省人力及時間成本；再則，其保護層在製作上， 亦較具有方便性且可確保 〇并凹八處呈一平面，且凹六内 不易具有容納空氣的間陽 :，如此可有利表面電路的製作且 防止爆板的發生。 【實施方式】 (—或_樹脂〜 醯氨樹脂（Polyimide)哎嘹Γ 』士 次汆乙烯酯樹脂（P〇lyste 1 表面可藉由製程前段的濺鍍/電鍍、涂 八 ^佈、屢合及或且他丰 段貼附銅结，且於製程後段 ，、他手 丁又〜挪刻製程中藉影後 他蝕刻區域控制手段令銅箔形成電路。 £ 〃、 請參看第一及二圖所+ , ^ 所不本發明之實施方式可先於硬 8 1310295 板 u 、杈或沖壓工具預沖或雷射切穿出# 開口（ 1 1 )，以伋；… 刀穿出複數個 填充部（i 2 )。、歼 β可移除的塊體作為 5月芩看第二及四圖所示，兩 板（2〇)，且其間可置入至少—不、i可失合—軟 該不溢流膠片（30丄二 勝片（3〇)，4. A rubberized copper foil is directly bonded to the surface of the hard plate as a protective layer by pressing, and since the rubber layer can be solidified on the circuit of the hard surface, the soft and hard bonding board can be Provide better protection. Since the rubber layer is thermally converted into a brittle material when pressed, the soft and hard bonding plate can be directly bent to rupture the solidified rubber layer, so that the filling portion can be easily removed and a cavity is formed to expose the soft plate. As described above, the cavity forming method i of the soft and hard bonding plate of the present invention forms a filling portion by punching the hard plate before forming, thereby forming a filling portion, so that the surface of the soft plate is less damaged, and the concave portion is shortened. The production time of the filling part can save manpower and time cost effectively; in addition, the protective layer is more convenient in production, and can ensure that the ridge is concave and concave in eight planes, and the concave six is not easy to accommodate air. Inter-yang: This can facilitate the fabrication of surface circuits and prevent the occurrence of bursts. [Embodiment] (- or _ resin ~ Polyimide ( 』 士 汆 vinyl acetate resin (P〇lyste 1 surface can be sprayed / electroplated by the front of the process, coated with eight cloth, repeated And or he has a copper knot attached to the section, and in the latter part of the process, he borrowed the film from the hand-cutting process and etched the area control to make the copper foil form the circuit. £ 〃, please refer to the first and second figures +, ^ The embodiment of the invention may be pre-punched or laser-cut through the hard 8 1310295 plate u, 杈 or punching tool to open the # opening ( 1 1 ), to 汲;... the knife passes through a plurality of filling portions (i 2 )., 歼β removable block as shown in the second and fourth figures in May, two boards (2〇), and at least can be placed in between - no, i can be lost - soft No overflow film (30 丄 two wins (3 〇),
(1〇"開口（…相對應，其可在壓合上：: 化形成一膠合層令軚板（2 〇 )與硬板 U 成-堆疊層結構，以作為内層。 目互黏固 或者，内層亦可又目# > / ^ 請參看第四圖所亍H Μ僅含軟板“Ο)。 硬板Ο。）㈣充部（；：==結構壓合成型後’ 3)使軟板（2Q)露出。 直接移除形成凹穴（1 請參看第五圖所示， 兩内層硬…0)的外層鏡面對稱型結構’其於 為保護層。 刀別舖設有銅辖（4 0 )作 前述結構於壓合時笋由 並於之後㈣刻製程中：表:::勝片（3〇)緊密結合， 時，將相對於硬板（丄Q S $ ( 4 Q >形成電路的同 移除，如此使填充部（丄^ ( 1 1 >處的㈣（4 1 ) 0)的開口（ 11)處^可輕易被移除，且硬板（1 露出（如第四圖所示） 穴（13)使軟板（2。） 而當前述三層鏡面對 若還要繼續進行蝕列m、、D構，其表面電路完成後’ 订姓刻或其他相關m其表面還是 9 1310295 舖設保護層作為保護，此時可用具有膠層（5 1 )的覆膠 銅、名（Resin Coating Copper) ( 5 0 )取代銅箔作為保 護層，其保護效果更優異。 請芩看第六圖所示，該覆膠銅箔（5〇)可藉由壓合 方式，使其膠層（51)黏合於内層硬板（1〇)表面， 且膠層（5 1 )可凝固於其電路上，如此以對軟硬結合板 提供更好的防護。 一 / '心〜不則则泊L ΰ在蝕刻 :程去除並留下膠層（5 1 )，由於該膠層（5 i )在壓 5時即受熱轉變成脆性材質，故可藉由軟硬結合板的彎折 ::破裂，並輕易移除填充部（丄2 使軟板（20)露出（如第四圖所示）。 （13) 此外，亦可利用呈雷 矢電路的外層硬板來作為保護層，請 參看弟七圖所示，其係包 " 稱結構，其包括古u 卜盾硬板（6 0 )的鏡面型對 夹八於内；；八、面電路的兩内層硬板（10)，及 天口方、内層硬板（i ◦) 及 層硬板（“）的相對軟)，該兩内 硬板（6〇)作為保護層二另面分別具有-外層 内層硬板（1 〇、）g x °、卜層硬板（6 0 )的相對 、丄υ )另面分別舖执 開口（U)外圍以形^又有銅治（Η)位於相對 面積稍大於填充部（ 且底面舖設有一層相對且 2 )的屏蔽。 勺鋼7备（6 2 )作為填充部（1 前述各堆疊層以複數 結成-結構體，並於成㉟1不溢流膠片（3Q)塵合固 之前以雷射於該兩外層硬板與鋼 10 1310295 6 1 )同面切割出與開口（丄丄）相對應的切 3) ’以使外層硬板（6〇)形成一切塊（“） 進行切割日寺’銅结（62)可阻指雷射以保護内部的二 或板體’在此同時該鋼箱（62)亦被雷射切出切 此該賴6 2)即可輕易被移除使填充部（12)露出， 如此外層硬板（6 Π、Λ k b υ )的切塊（6 4 )及内層硬板（丄 的填充部（12)即可輕易被移除，且形成凹穴 〇) 使軟板（2 0 )露出（如第四圖所示）。 请參看第八圖所示，前述五層鏡面型對稱結構之軟硬 結合板，其作為保護層之外声 更 π之外層硬板（6 0 )亦可於相對内 層硬板另面舖設銅错（65)形成另一保護層，另面再以 雷射切割出與開口（1 1)相對位置及大小的切口（63)， 且刀口（ 6 3 )外圍可舖設銅箔（6 6 )以形成内部電路； 其經過塵合固結成—結構體，當製程完成欲將填充部(1〇"opening (...correspondingly, it can be pressed:: to form a glue layer to make the slab (2 〇) and the hard board U-stack layer structure to serve as the inner layer. The inner layer can also be ###################################################################################################### The soft board (2Q) is exposed. The outer mirror-symmetric structure of the recess is directly removed (1 see the fifth figure, the inner layer is hard...0). It is a protective layer. 0) For the above structure during the pressing, the bamboo shoots and the subsequent (four) engraving process: Table::: Win film (3〇) tightly combined, when compared to the hard board (丄QS $ ( 4 Q > forming a circuit With the same removal, the opening (11) of the filling portion ((^) (4 1 (4 1) 0) can be easily removed, and the hard plate (1 exposed) (as shown in the fourth figure) The hole (13) makes the soft plate (2.) and when the aforementioned three-layer mirror faces, if it continues to etch m, D structure, after the surface circuit is completed, the surface is ordered or other related m surface Still 9 1310295 laying guarantee As a protective layer, the protective layer can be replaced by a copper foil with a rubber layer (5 1 ) and a resin layer (Resin Coating Copper) (50). The protective effect is better. Please see the sixth figure. It is shown that the rubberized copper foil (5〇) can be bonded to the surface of the inner hard board (1〇) by pressing, and the glue layer (5 1 ) can be solidified on the circuit. This provides better protection against the soft and hard bonding plates. One / 'heart ~ no, then the L ΰ etch: the process removes and leaves the glue layer (5 1 ), since the glue layer (5 i ) is under pressure 5 When it is heated to a brittle material, it can be bent by the soft and hard bonding plate: rupture, and the filling portion is easily removed (丄2 exposes the soft plate (20) (as shown in the fourth figure). In addition, the outer hard plate of the Thunder circuit can also be used as the protective layer. Please refer to the figure shown in the middle of the figure, which is called the structure, which includes the mirror type of the ancient u Shield hard plate (60). The two inner hard plates (10) of the eight-sided circuit, and the Tiankou side, the inner hard board (i ◦) and the layer hard board (") are relatively soft), the two inner hard (6〇) as the protective layer, the other side has the outer layer of the outer layer (1 〇, gx °, the layer of the hard layer (60), and the other side of the opening (U) The shape and the copper rule (Η) are located at a relatively larger area than the filling portion (and the bottom layer is provided with a layer of opposite and 2). The spoon steel 7 (6 2 ) is used as the filling portion (1 the foregoing stacked layers are formed in plurals - The structure, and before the 351 non-overflow film (3Q) dust is solidified, the two outer layers of the hard plate are cut with the steel 10 1310295 6 1 ) to cut the opening corresponding to the opening (丄丄) 3) 'To make the outer hard board (6〇) form all the pieces (") to cut the day temple 'copper knot (62) can block the laser to protect the inner two or the plate body' at the same time the steel box (62) It can be easily removed by laser cutting and the filling portion (12) is exposed, so that the outer hard plate (6 Π, Λ kb υ ) is cut (6 4 ) and the inner hard plate ( The filling portion (12) of the crucible can be easily removed and a pocket is formed) to expose the soft board (20) (as shown in the fourth figure). Referring to Figure 8, the above five-layer mirror-type symmetrical structure of the soft and hard bonding board, as a protective layer, the sound is more π, the outer layer of the hard board (60) can also be placed on the opposite inner layer of the hard board. (65) forming another protective layer, and further cutting a slit (63) opposite to the opening (1 1) by laser, and laying a copper foil (6 6 ) on the periphery of the knife edge (63) to form Internal circuit; it is consolidated by dust--structure, when the process is completed, the filling part is to be filled
(1 2 )移除時，可釗田μ十， 灯具U 利用蝕刻方式將銅箱（Θ 5 )去除使 切口（…露出’如此切口（63)内的切塊（6:: 及其内部的填充塊（]?、Ρΐ3 π 土 β 、丄2 )即可輕易被移除，且 (")使軟板（20)露出（如第四圖所示）。 射請參看2至十二圖所示，其係具有厚硬板的鏡面型 對稱結構中該厚硬板（？〇)係可為複數層硬板所堆 豐成且設置了電路的結構’ m先以挖鑽方式掏空形成 -與開口（11)_應的開孔（川，且二= 孔（η)處之外舖設有銅羯（72) ’其另 = 羯固合在利用餘刻方式將開？L(7l)外的㈣去除= 11 1310295 ==大於開口且貼附於開孔處的屏蔽部（73) 元成-鐵空但附著有屏蔽部（73)的結構。3) ’ 前述之厚硬板（70)以複數預 與内層硬板（10)及軟板（2 （30) 且在製程後梅（”）二具有電路； 將開孔（71)處附著的屏蔽部\ =路時，-起 板（1〇)的填充部（12)露出表面）’=壤令内層硬 2)即可輕易移除以形成凹穴（13)使軟板：=(1 出（如第四圖所示）。 2〇)露 【圖式簡單說明】 第一圖係本創作之内層硬板俯視圖。 圖係本創作之内層硬板側視剖面圖。 弟二圖係本創作之内層堆疊結構分解圖。 第四圖係本創作之填充塊取出狀態示意圖。 圖係本創作之第一軟硬結合板結構分解圖。 =、圖係本創作之第二軟硬結合板結構分解圖。 87係本創作之第二軟硬結合板結構分解圖。 笛θ系本創作之第四軟硬結合板結構分解圖。 黛九圖係本創作之第五軟硬結合板結構分解圖。 =圖係本創作之第五軟硬結合板之厚硬板結構圖 圖。-圖係本創作之第五軟硬結合板之厚硬板結構 Μ 圖係本創作之第五軟硬結合板之厚硬板結構 12 1310295 十三圖係現有技術之軟硬結合板結構分解圖 第 【主要元件符號說明】 (1〇)硬板 (1 2 )填充部 (2 0 )軟板 (3 1 )開口 (4 1 )銅箔 (51)膠層 (6 0 )外層硬板 (6 2 )銅箔 (6 4 )切塊 (6 6 )銅箔 (7 1 )開孔 (7 3 )屏蔽部 (9 0 )軟板 (81)保護層 (1 1 )開口 (1 3 )凹穴 (3 0 )不溢流膠片 (4 0 )銅猪 (5 0 )覆膠銅箔 (5 2 )表面銅箔 (6 1 )銅猪 (6 3 )雷射切口 (6 5 )銅箔 (7 0 )厚硬板 (7 2 )銅箔 (8 0 )硬板 (8 2 )填充部 (8 3 )凹穴 13(1 2) When removing, the U田μ10, the luminaire U removes the copper box (Θ 5 ) by etching to make the slit (... exposes the dicing in the slit (63) (6:: and its internal The filling block (]?, Ρΐ3 π soil β, 丄2) can be easily removed, and (") exposes the soft board (20) (as shown in the fourth figure). See 2 to 12 for the shot. As shown in the figure, it is a mirror-type symmetrical structure with a thick hard plate. The thick hard plate (?〇) can be a multi-layer hard plate piled up and a circuit structure is set up. - With the opening (11) _ the opening (Chuan, and the second = hole (η) is placed outside the copper cymbal (72) 'The other = 羯 羯 在 利用 利用 利用 利用 利用 L L ( ( ( ( ( ( ( ( Outer (4) Removal = 11 1310295 == The shield portion (73) which is larger than the opening and attached to the opening is formed into a structure in which the iron portion is attached but the shield portion (73) is attached. 3) 'The aforementioned thick hard plate (70) ) Pre-existing with the inner hard board (10) and the soft board (2 (30) and after the process of the plum (") two circuits; the shielding part attached to the opening (71) \ = road, - board (1〇) filling portion (12) exposed surface) '=The inner layer of the soil is hard 2) can be easily removed to form the pocket (13) to make the soft board: = (1 out (as shown in the fourth figure). 2〇) dew [simple description of the figure] It is a top view of the inner hardboard of the creation. The figure is a side view of the inner hardboard of the creation. The second drawing is an exploded view of the inner stack structure of the creation. The fourth figure is a schematic diagram of the filling state of the creation of the creation. The first soft and hard board structure decomposition diagram of this creation. =, the second soft and hard board structure decomposition diagram of the creation of this picture. 87 is the second soft and hard board structure decomposition diagram of this creation. The fourth soft and hard combination board structure exploded view. The nine-figure diagram is the fifth soft-hard combination board structure decomposition diagram of this creation. = Figure is the fifth soft-hard board combination of the thick and hard board structure diagram. The thick and hard board structure of the fifth soft and hard board of the creation Μ The thick and hard board structure of the fifth soft and hard board of the creation of this book 12 1310295 Thirteen pictures are the decomposition diagram of the soft and hard board structure of the prior art [ Main component symbol description] (1〇) hard plate (1 2 ) filling part (2 0 ) soft board (3 1 ) opening (4 1 ) Copper foil (51) glue layer (60) Outer hard board (6 2 ) Copper foil (6 4 ) Cut (6 6 ) Copper foil (7 1 ) Opening (7 3 ) Shield (9 0) soft board (81) protective layer (1 1 ) opening (1 3 ) recess (3 0) no overflow film (4 0) copper pig (50) coated copper foil (5 2 ) surface copper foil ( 6 1) Copper pig (6 3 ) laser cutting (6 5 ) copper foil (7 0 ) thick hard plate (7 2 ) copper foil (8 0 ) hard plate (8 2 ) filling part (8 3 ) recess 13