CN103096641A - Manufacture method of contiguous circuit board - Google Patents
Manufacture method of contiguous circuit board Download PDFInfo
- Publication number
- CN103096641A CN103096641A CN2011103340088A CN201110334008A CN103096641A CN 103096641 A CN103096641 A CN 103096641A CN 2011103340088 A CN2011103340088 A CN 2011103340088A CN 201110334008 A CN201110334008 A CN 201110334008A CN 103096641 A CN103096641 A CN 103096641A
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- circuit board
- connecting sheet
- board unit
- bonding pad
- unit
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Abstract
The invention provides a manufacture method of a contiguous circuit board. The manufacture method of the contiguous circuit board comprises the following steps of providing a first contiguous circuit board, wherein the first contiguous circuit board comprises at least one first circuit board unit which is failure in electrical measuring, providing a second contiguous circuit board, wherein the second contiguous circuit board comprises at least one second circuit board unit which is good in electrical measuring, and the second circuit board unit is the same to the first circuit board unit, removing the first circuit board unit and separating the second circuit board unit respectively through cutting, splicing the separated second circuit board unit onto the first contiguous circuit board after the first circuit board unit is removed from the first contiguous circuit board through the stair-shaped cut surface of the separated second circuit board unit, and forming a third contiguous circuit board.
Description
Technical field
The present invention relates to the circuit board making technology, relate in particular to a kind of manufacture method of connecting sheet circuit board.
Background technology
Usually, the manufacturing process of circuit board comprises: make a connecting sheet circuit board, described connecting sheet circuit board is for forming the circuit board of circuit, described connecting sheet circuit board comprises a plurality of circuit board units, garbage area and little bonding pad, circuit board unit namely after circuit board is completed one by one separately and the zone that has separately circuit function, garbage area namely needs the part removed after the circuit board piece.Wherein, each described circuit board unit is connected with garbage area by little bonding pad, and each described circuit board unit comprises at least one piece district, and this piece district is for mounting part; In the piece district of each described circuit board unit print solder paste; Piece district in print solder paste mounts part; Be separated from each other by described little bonding pad being disconnected, make each the described circuit board unit that mounts after part, form the circuit board finished product.if in each described circuit board unit, the electrical measurement defective products is arranged, need to be on described defective products print solder paste and mount part, to save tin cream and part, but because of the position of defective products indefinite, need to cover according to the position of defective products on each connecting sheet circuit board opening with the diverse location of the steel plate of print solder paste, in addition, also needing position adjustment according to defective products on each connecting sheet circuit board to mount program when mounting part mounts, therefore aforesaid operations can greatly reduce print solder paste and mount the efficient of part, for improving printing and mounting efficient, usually can be on described defective products in actual production also print solder paste and mount part, obviously, described defective products can not use after mounting part, therefore, caused the waste of tin cream and part, and the quantity of defective products is more, waste larger.
Summary of the invention
In view of this, be necessary to provide a kind of method that forms a fairly large number of connecting sheet circuit board of non-defective unit by transplanting, the tin cream that is caused by defective products during with the minimizing piece and the waste of part.
A kind of manufacture method of connecting sheet circuit board, it comprises the following steps: first connecting sheet circuit board is provided, described the first connecting sheet circuit board comprises a plurality of circuit board units, and first garbage area that surrounds described a plurality of circuit board units and be connected with described a plurality of circuit board units, described a plurality of circuit board unit comprises at least one first circuit board unit, and described at least one first circuit board unit is the electrical measurement defective products; Second connecting sheet circuit board is provided, described the second connecting sheet circuit board comprises a plurality of circuit board units, and second garbage area that surrounds described a plurality of circuit board units and be connected with described a plurality of circuit board units, in described a plurality of circuit board unit, at least one is the electrical measurement defective products, described a plurality of the second connecting sheet circuit board unit comprises at least one second circuit board unit, described at least one second circuit board unit is the electrical measurement non-defective unit, and described at least one second circuit board unit is identical with described at least one first circuit board unit; The position that described at least one first circuit board unit is connected with described the first garbage area cuts off, and forms stair-stepping the first section on described the first connecting sheet circuit board, and removes described at least one first circuit board unit; The position that described at least one second circuit board unit is connected with described the second garbage area cuts off, form stair-stepping the second section on described at least one second circuit board unit, separate described second circuit board at least unit, wherein, described the second section and described the first section are complementary; And described the second section cooperation is bonded on described the first section, thereby described at least one second circuit board unit that will separate is bonded on described the first connecting sheet circuit board that removes behind described at least one first circuit board unit, forms the 3rd connecting sheet circuit board.
The manufacture method of the connecting sheet circuit board of the technical program has following advantage: the circuit board unit that the electrical measurement in one second connecting sheet circuit board is non-defective unit is transplanted in one first connecting sheet circuit board, non-defective unit circuit board unit quantity in described the first connecting sheet circuit board is increased, the tin cream that is caused by defective products in the time of can reducing piece and the waste of part; And mutually bonding with the stair-stepping section that laser cutting forms, can increase the circuit board unit of transplanting and the adhesion between the first connecting sheet circuit board, the circuit board unit of transplanting when preventing piece comes off.
Description of drawings
Fig. 1 is the floor map of the first connecting sheet circuit board of providing of the technical program embodiment.
Fig. 2 is the generalized section of the first connecting sheet circuit board of providing of the technical program embodiment.
Fig. 3 is the floor map of the second connecting sheet circuit board of providing of the technical program embodiment.
Fig. 4 is the generalized section of the first connecting sheet circuit board of providing of the technical program embodiment.
Fig. 5 is the generalized section after the first circuit board unit in Fig. 2 removes.
Fig. 6 is the generalized section after the tertiary circuit plate unit in Fig. 4 separates.
Fig. 7 is the cutaway view of the 3rd connecting sheet circuit board after the transplanting that provides of the technical program embodiment.
The main element symbol description
| The first connecting |
10 |
| The first |
101 |
| The second |
102 |
| The |
103 |
| First |
104 |
| The |
1041 |
| The |
1042 |
| The |
1043 |
| The |
1044 |
| The |
1045 |
| The |
1046 |
| The |
1047 |
| The first |
11 |
| The second |
12 |
| The first insulating barrier | 13 |
| First covers |
14 |
| Second covers |
15 |
| The second connecting |
20 |
| Tertiary |
201 |
| The 4th |
202 |
| The |
203 |
| Second |
204 |
| The |
2041 |
| The |
2042 |
| The |
2043 |
| The 11 |
2044 |
| The 12 |
2045 |
| The 13 |
2046 |
| The 14 |
2047 |
| The |
105 |
| The |
106 |
| The |
107 |
| The |
205 |
| The |
206 |
| The |
207 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
The connecting sheet circuit board that the technical program is provided below in conjunction with drawings and Examples and the manufacture method of connecting sheet circuit board are described in further detail.
The manufacture method of described connecting sheet circuit board comprises the following steps:
The first step provides first connecting sheet circuit board 10.
see also Fig. 1, plane graph for described the first connecting sheet circuit board 10, described the first connecting sheet circuit board 10 is rectangle, it comprises a square first circuit board unit 101, one with square second circuit board unit 102 side by side, first circuit board unit 101, first garbage area 103 that surrounds described first circuit board unit 101 and second circuit board unit 102 and be positioned at described the first connecting sheet circuit board 10 peripheries, and first little bonding pad 104, wherein, described first circuit board unit 101 is the electrical measurement non-defective unit, described second circuit board unit 102 is the electrical measurement defective products.Described first circuit board unit 101, second circuit board unit 102 and the first garbage area 103 all have the space between any two with the space, the described first little bonding pad 104 is used for interconnected between described first circuit board unit 101, second circuit board unit 102 and the first garbage area 103, makes described first circuit board unit 101, second circuit board unit 102 and 103 one-tenth of the first garbage areas as a whole.Described first little bonding pad 104 comprises the first to the 7th bonding pad 1041,1042,1043,1044,1045,1046,1047, and described the first to the 7th bonding pad 1041,1042,1043,1044,1045,1046,1047 all is strip.Wherein, described the first to the 3rd bonding pad 1041,1042,1043 is connected described first circuit board unit 101 with described the first garbage area 103; Described the 4th bonding pad 1044 is connected described first circuit board unit 101 with described second circuit board unit 102; Described the 5th to the 7th bonding pad 1045,1046,1047 is connected described second circuit board unit 102 with described the first garbage area 103.Described the first to the 3rd bonding pad 1041,1043,1042 respectively with described the 5th to the 7th bonding pad 1045,1046,1047 symmetrical along the perpendicular bisector of the bearing of trend of described the 4th bonding pad 1044.In the present embodiment, described the first connecting sheet circuit board 10 is as the circuit board of accepting to transplant circuit board unit.
See also Fig. 2, profile for described the first connecting sheet circuit board 10, in the present embodiment, the first connecting sheet circuit board 10 has been for being formed with the double-sided flex circuit plate of conducting wire, it comprise the first insulating barrier 13 between the first conductive layer 11, the second conductive layer 12, the first conductive layer 11 and the second conductive layer 12 and lay respectively at the first conductive layer 11 and second conductive layer 12 outsides first cover rete 14 and the second covering rete 15.Wherein, the material of described the first insulating barrier 13 is polyester (PET) or polyimides (PI) etc.; described the first covering rete 14 and second covers rete 15 and all comprises one deck glue-line and layer protective layer; the glue-line that the described first glue-line and second that covers rete 14 covers rete 15 bonds with described the first conductive layer 11 and the second conductive layer 12 respectively; the material of glue-line is epoxy resin or acrylic resin etc., and the material of protective layer is polyester (PET) or polyimides (PI) etc.
Wherein, described the first connecting sheet circuit board 10 also can be the single or multiple lift flexible circuit board, also can be individual layer, bilayer or multilayer hard circuit board.Need to prove, on described the first connecting sheet circuit board 10, the quantity of circuit board unit is not limit.In the present embodiment, only to comprise that two circuit board units give an example, in fact generally speaking the quantity of connecting sheet circuit board is more than two.As the circuit board of accepting to transplant circuit board unit, on described the first connecting sheet circuit board 10, the number needs of electrical measurement defective products is no less than one, and electrical measurement non-defective unit quantity is quite a few in one.Recommend the quantity of electrical measurement non-defective unit more than the quantity of electrical measurement defective products, transplant number of times to reduce, improve the efficient of transplanting.Described first circuit board unit 101 and second circuit board unit 102 also can be other shapes.The quantity of the bonding pad that described first little bonding pad 104 comprises also can be other, as long as can will couple together between described circuit board unit and garbage area.
Second step sees also Fig. 3 and Fig. 4, and second connecting sheet circuit board 20 is provided.The electrical connection situation that described the second connecting sheet circuit board 20 and described the first connecting sheet circuit board 10 record except electrical measurement was different, other was basic identical.
described the second connecting sheet circuit board 20 comprises a tertiary circuit plate unit 201, the 4th circuit board unit 202 with tertiary circuit plate unit 201 symmetries, the second garbage area 203 and second a little bonding pad 204 that surrounds described the second connecting sheet circuit board 20 peripheries of being positioned at of described tertiary circuit plate unit 201 and the 4th circuit board unit 202, wherein, described tertiary circuit plate unit 201 is the electrical measurement defective products, described the 4th circuit board unit 202 is the electrical measurement non-defective unit, and described second little bonding pad 204 comprises the 8th to the 14 bonding pad 2041, 2042, 2043, 2044, 2045, 2046, 2047, wherein, described the 8th to the tenth bonding pad 2041, 2042, 2043 are connected described tertiary circuit plate unit 201 with described the second garbage area 203, described the 11 bonding pad 2044 is connected described tertiary circuit plate unit 201 with described the 4th circuit board unit 202, described the 12 to the 14 bonding pad 2045, 2046, 2047 are connected described the 4th circuit board unit 202 with described the second garbage area 203.In the present embodiment, described the second connecting sheet circuit board 20 is as the circuit board that the non-defective unit circuit board unit is provided.
Wherein, on described the second connecting sheet circuit board 20, the quantity of circuit board unit also can be for more than two, circuit board as the circuit board unit that non-defective unit is provided, on described the second connecting sheet circuit board 20, electrical measurement non-defective unit quantity is no less than one, recommend the quantity of electrical measurement defective products more than the quantity of electrical measurement non-defective unit, make it that necessity as the circuit board of the circuit board unit that non-defective unit is provided be arranged.Certainly, described the second connecting sheet circuit board 20 also can be different from described the first connecting sheet circuit board 10, have at least one circuit board unit identical with second circuit board unit 102 to get final product.
The 3rd step saw also Fig. 5, by laser cutting, removed described second circuit board unit 102.That is to say, by laser cutting, described the 4th to the 7th bonding pad is cut off, described second circuit board unit 102 and described the first garbage area 103 and first circuit board unit 101 are separated, to remove described second circuit board unit 102.
Described the 4th to the 7th bonding pad 1044,1045,1046,1047 cut-out mode are identical, describe with the example that is cut to of the 7th bonding pad 1047 in scheming.Surperficial and two faces that the described second surface that covers rete 15 is connected that define described the 7th bonding pad 1047 and described the first covering rete 14 are the side.At first, first of described the first connecting sheet circuit board 10 is covered one of rete 14 carry out laser cutting facing to laser rays, wherein laser cuts from the first surface that covers rete 14, and the direction of illumination of laser is perpendicular to the surface of described the first covering rete 14, depth of cut is half of thickness of described the first connecting sheet circuit board 10, and the 7th bonding pad 1047 on described the first connecting sheet circuit board 10 forms the first sections 105.
Then, described the first connecting sheet circuit board 10 overturns, make second of described the first connecting sheet circuit board 10 cover rete 15 and carry out laser cutting towards laser rays, wherein laser cuts from the second surface that covers rete 15, and the direction of illumination of laser is perpendicular to the surface of described the second covering rete 15, depth of cut is also half of thickness of described the first connecting sheet circuit board 10, and the 7th bonding pad 1047 on described the first connecting sheet circuit board 10 forms the second sections 106.Wherein, the first section 105 and the second section 106 stagger on the bearing of trend of the 7th bonding pad 1047 mutually, wherein the first more close described second circuit board of section 105 unit 102.
Further, described the first connecting sheet circuit board 10 overturns, make the side of described the 7th bonding pad 1047 towards laser rays, laser cutting is carried out at middle part along described the first insulating barrier 13, the 7th bonding pad 1047 on described the first connecting sheet circuit board 10 forms the 3rd section 107, wherein, cut direction extends to the end of described the second section 106 in described the first insulating barrier 13 from the end of described the first section 105 in described the first insulating barrier 13, thereby described the 7th bonding pad 1047 is disconnected.The section that is the 7th bonding pad 1047 on described the first connecting sheet circuit board 10 is stepped, is in turn connected to form by the first section 105, the 3rd section 107 and the second section 106.Then, according to the cutting method of described the 7th bonding pad 1047 cutting described the 4th to the 6th bonding pad 1044,4045,1046, described second circuit board unit 102 and described the first garbage area 103 and first circuit board unit 101 are separated from each other.At last, remove described second circuit board unit 102.
Be appreciated that because of above-mentioned cutting do not need very accurate, therefore also can use other cutting means to carry out above-mentioned cutting, as milling cutter cutting etc.
The 4th step saw also Fig. 6, and is identical with the 3rd method that goes on foot, and by laser cutting, described the 4th circuit board unit 202 separated with described the second connecting sheet circuit board 20.
pass through laser cutting, described the 4th circuit board unit 202 is separated with described the second connecting sheet circuit board 20, wherein said the 11 to the 14 bonding pad 2044, 2045, 2046, 2047 off-position, the degree of depth and described the 4th to the 7th bonding pad 1044, 1045, 1046, 1047 off-position, degree of depth correspondence is identical, the 14 bonding pad 2047 on described the 4th circuit board unit 202 is as example, the section of described the 14 bonding pad 2047 is stepped, by the 4th section 205, the 5th section 206 and the 6th section 207 are in turn connected to form, because of described the 11 to the 14 bonding pad 2044, 2045, 2046, 2047 off-position, the degree of depth and described the 4th to the 7th bonding pad 1044, 1045, 1046, 1047 off-position, degree of depth correspondence is identical, therefore described the 4th section 205, the 5th section 206 and the 6th section 207 respectively with described the first section 105, the 3rd section 107 and the second section 106 are complementary.
Be appreciated that, if described the second connecting sheet circuit board 20 is incomplete same with described the first connecting sheet circuit board 10, but as long as the second connecting sheet circuit board 20 has at least one circuit board unit identical with second circuit board unit 102, also can separate according to the method for the step 3 circuit board unit identical with second circuit board unit 102 with the second connecting sheet circuit board 20.
The 5th step saw also Fig. 5-7, by gluing mode, described the 4th circuit board unit 202 was bonded on described the first connecting sheet circuit board 10, formed the 3rd connecting sheet circuit board 30 of the full non-defective unit after transplanting.
At first, with glue coating on the 6th section 207 of described the 4th circuit board unit 202; Then, described the 4th circuit board unit 202 is placed on described the first connecting sheet circuit board 10, with described the 11 to the 14 bonding pad 2044 that connects on described the 4th circuit board unit 202,2045,2046,2047 stepped sections respectively with described the first connecting sheet circuit board 10 on the merging that matches of the 4th to the 7th bonding pad 1044,1045,1046,1047 the stepped section that are connected be bonded together.Take the 14 bonding pad 2047 as example, described the 4th section 205, the 5th section 206 and the 6th section 207 are affixed with the first section 105, the second section 106 and the 3rd section 107 of described the first connecting sheet circuit board 10 respectively, described the 6th section 207 and the 3rd section 107 are bondd by glue, thereby described the 4th circuit board unit 202 is bonded on described the first connecting sheet circuit board 10; At last, solidify described glue, obtain comprising the 3rd connecting sheet circuit board 30 of first circuit board unit 101 and the 4th circuit board unit 202, described first circuit board unit 101 and the 4th circuit board unit 202 are the electrical measurement non-defective unit.Also namely, described the 4th circuit board unit 202 has been transplanted to the position of the second circuit board unit 102 in the first connecting sheet circuit board 10, forms the 3rd connecting sheet circuit board 30.
Be appreciated that, if tertiary circuit plate unit 201 is non-defective units, and described the 4th circuit board unit 202 is defective productss, also tertiary circuit plate unit 201 can be transplanted to the position of described second circuit board unit 102, if the section of each bonding pad and off-position with remove described second circuit board unit 102 after the first connecting sheet circuit board 10 in section and the off-position of each bonding pad corresponding.
The depth of cut of the first section 105 also can be other degree of depth, be not limited to the middle part of described the first insulating barrier, suitable conveniently to be cut into, and the thickness that the depth of cut sum that only needs the depth of cut of the first section 105 and the 3rd section 107 equals the first connecting sheet circuit board 10 gets final product, and namely need can described the 7th bonding pad 1047 cut-outs for described the first section 105, the second section 106 and the 3rd section 107.
In addition, described glue also can be coated on described the 3rd section 107.Described glue also can change and do solid-state pressure-sensing glue etc.In addition, if described the first connecting sheet circuit board 10 comprises the circuit board unit that plural electrical measurement is bad, it is good circuit board unit that described the second connecting sheet circuit board 20 only has an electrical measurement, can transplant the circuit board unit of several non-defective units to described the first connecting sheet circuit board 10 from other several connecting sheet circuit boards again according to said method.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change and distortion all should belong to the protection range of claim of the present invention.
Claims (8)
1. the manufacture method of a connecting sheet circuit board, it comprises the following steps:
First connecting sheet circuit board is provided, described the first connecting sheet circuit board comprises a plurality of circuit board units, and first garbage area that surrounds described a plurality of circuit board units and be connected with described a plurality of circuit board units, described a plurality of circuit board unit comprises at least one first circuit board unit, and described at least one first circuit board unit is the electrical measurement defective products;
Second connecting sheet circuit board is provided, described the second connecting sheet circuit board comprises a plurality of circuit board units, and second garbage area that surrounds described a plurality of circuit board units and be connected with described a plurality of circuit board units, in described a plurality of circuit board unit, at least one is the electrical measurement defective products, described a plurality of the second connecting sheet circuit board unit comprises at least one second circuit board unit, described at least one second circuit board unit is the electrical measurement non-defective unit, and described at least one second circuit board unit is identical with described at least one first circuit board unit;
The position that described at least one first circuit board unit is connected with described the first garbage area cuts off, and forms stair-stepping the first section on described the first connecting sheet circuit board, and removes described at least one first circuit board unit;
The position that described at least one second circuit board unit is connected with described the second garbage area cuts off, form stair-stepping the second section on described at least one second circuit board unit, separate described second circuit board at least unit, wherein, described the second section and described the first section are complementary; And
Described the second section is coordinated be bonded on described the first section, thereby described at least one second circuit board unit that will separate is bonded on described the first connecting sheet circuit board that removes behind described at least one first circuit board unit, forms the 3rd connecting sheet circuit board.
2. the manufacture method of connecting sheet circuit board as claimed in claim 1, it is characterized in that, described at least one first circuit board unit on described the first connecting sheet circuit board is connected with other circuit board units on described the first garbage area and described the first connecting sheet circuit board by a plurality of first little bonding pad, and described at least one second circuit board unit on described the second connecting sheet circuit board passes through a plurality of second little bonding pad and is connected with other circuit board units on described the second garbage area and described the second connecting sheet circuit board.
3. the manufacture method of connecting sheet circuit board as claimed in claim 2, is characterized in that, described a plurality of first little bonding pad and described a plurality of second little bonding pad are strip.
4. the manufacture method of connecting sheet circuit board as claimed in claim 2, it is characterized in that, the step of cutting off the position that described at least one first circuit board unit is connected with described the first garbage area comprises: described first little bonding pad has two surfaces, distance between two surfaces is H1, from a surface of described first little bonding pad, described first little bonding pad is cut out first otch, described the first notch depth is H2; The position of described first little bonding pad and the first otch being staggered from relative another surface of described first little bonding pad cuts out second otch, and described the second notch depth is H3, wherein H2+H3=H1; Three cuts of horizontal resection between the bottom of the bottom of described the first otch and described the second otch, described the first otch, the second otch and three cuts are connected, thereby described at least one first circuit board unit is separated with described the first connecting sheet circuit board.
5. the manufacture method of connecting sheet circuit board as claimed in claim 2, it is characterized in that, the step of cutting off the position that described at least one second circuit board unit is connected with described the second garbage area comprises: described second little bonding pad has two surfaces, distance between two surfaces is H4, from a surface of described second little bonding pad, described second little bonding pad is cut out the 4th otch, described the 4th notch depth is H5; From another surface of described second little bonding pad, the position that described second little bonding pad and the 4th otch stagger is cut out the 5th otch, described the 5th notch depth is H6, wherein H5+H6=H4; The 6th otch of horizontal resection between the bottom of the bottom of described the 4th otch and described the 5th otch, described the 4th otch, the 5th otch and the 6th otch are connected described at least one second circuit board unit are separated with described the second connecting sheet circuit board.
6. as the manufacture method of claim 4 or 5 described connecting sheet circuit boards, it is characterized in that, the mode of described cutting is laser cutting.
7. the manufacture method of connecting sheet circuit board as claimed in claim 1, is characterized in that, the bonding way of described the second section and described the first section is for bonding by glue.
8. the manufacture method of connecting sheet circuit board as claimed in claim 1, is characterized in that, the bonding way of described the second section and described the first section is for bonding by pressure-sensing glue.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110334008.8A CN103096641B (en) | 2011-10-28 | 2011-10-28 | The manufacture method of connecting sheet circuit board |
| TW100140062A TW201318490A (en) | 2011-10-28 | 2011-11-03 | Method for making printed circuit board assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110334008.8A CN103096641B (en) | 2011-10-28 | 2011-10-28 | The manufacture method of connecting sheet circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103096641A true CN103096641A (en) | 2013-05-08 |
| CN103096641B CN103096641B (en) | 2015-07-29 |
Family
ID=48208583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110334008.8A Active CN103096641B (en) | 2011-10-28 | 2011-10-28 | The manufacture method of connecting sheet circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103096641B (en) |
| TW (1) | TW201318490A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107529277A (en) * | 2016-06-21 | 2017-12-29 | 北大方正集团有限公司 | Circuit board molding method |
| CN109905965A (en) * | 2017-11-30 | 2019-06-18 | 罗伯特·博世有限公司 | Circuit board is in flakes |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101431863A (en) * | 2007-11-05 | 2009-05-13 | 富葵精密组件(深圳)有限公司 | Back glue attaching method for flexible printed circuit board |
| CN101547574A (en) * | 2008-03-28 | 2009-09-30 | 富葵精密组件(深圳)有限公司 | Base plate of a circuit board and a preparing method of a circuit board with a misalignment structure |
| CN101695217A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for producing printed board combining rigidness and flexibleness |
-
2011
- 2011-10-28 CN CN201110334008.8A patent/CN103096641B/en active Active
- 2011-11-03 TW TW100140062A patent/TW201318490A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101431863A (en) * | 2007-11-05 | 2009-05-13 | 富葵精密组件(深圳)有限公司 | Back glue attaching method for flexible printed circuit board |
| CN101547574A (en) * | 2008-03-28 | 2009-09-30 | 富葵精密组件(深圳)有限公司 | Base plate of a circuit board and a preparing method of a circuit board with a misalignment structure |
| CN101695217A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for producing printed board combining rigidness and flexibleness |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107529277A (en) * | 2016-06-21 | 2017-12-29 | 北大方正集团有限公司 | Circuit board molding method |
| CN107529277B (en) * | 2016-06-21 | 2020-03-06 | 北大方正集团有限公司 | Circuit board forming method |
| CN109905965A (en) * | 2017-11-30 | 2019-06-18 | 罗伯特·博世有限公司 | Circuit board is in flakes |
| CN109905965B (en) * | 2017-11-30 | 2022-06-28 | 罗伯特·博世有限公司 | Circuit board connecting piece |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103096641B (en) | 2015-07-29 |
| TW201318490A (en) | 2013-05-01 |
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