CN105228371A - A kind of method making ladder golden finger circuit board - Google Patents
A kind of method making ladder golden finger circuit board Download PDFInfo
- Publication number
- CN105228371A CN105228371A CN201510546806.5A CN201510546806A CN105228371A CN 105228371 A CN105228371 A CN 105228371A CN 201510546806 A CN201510546806 A CN 201510546806A CN 105228371 A CN105228371 A CN 105228371A
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- CN
- China
- Prior art keywords
- golden finger
- circuit board
- make
- copper bar
- diaphragm
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
Abstract
The invention provides a kind of method making ladder golden finger circuit board, comprise the steps, at least one side of substrate makes the copper bar of golden finger and encirclement golden finger; Enclose covered with protective film above region at copper bar, and diaphragm is fixedly connected with the end face of copper bar; Laminate on substrate upper strata and close prepreg and Copper Foil; Remove part prepreg, Copper Foil and diaphragm and form step trough, golden finger is exposed, thus making obtains ladder golden finger circuit board.The present invention makes the method for ladder golden finger circuit board, accurately can not only control the setting position of golden finger, and golden finger can also be protected not contaminated, and can all adopt machinery to complete, and thus has and makes the advantage that precision is high, make efficiency is high.
Description
Technical field
The present invention relates to circuit board manufacturing method technical field, be specifically related to a kind of method making ladder golden finger circuit board.
Background technology
Golden finger (GoldFinger) is the golden yellow conducting strip arranging on circuit boards and in a row arrange, for be plugged to another parts slot in electrically conduct with another parts.Golden finger because of its surface gold-plating and conducting strip arrangement as finger-shaped, therefore be called golden finger.The existing circuit board with golden finger, golden finger is generally produced on the surface of plate circuit board, and adjacent board edge.But according to the market demand, need making to have step trough and be provided with the circuit board of golden finger in step trough bottom surface, be also ladder golden finger circuit board.
A kind of manufacture method of ladder golden finger circuit board is disclosed in prior art, first on step trough bottom surface, golden finger figure is produced, then High temperature-resistanadhesive adhesive tape is pasted at golden finger patterned surface, then at the stacked multi-layer sheet block in High temperature-resistanadhesive adhesive tape surface, after pressing multilayer plate, then the plate milling be positioned at above High temperature-resistanadhesive adhesive tape is removed, finally remove High temperature-resistanadhesive adhesive tape, and to golden finger graphic plating, thus prepare golden finger circuit board.There is following technological deficiency in the manufacture method in this patent documentation: 1) (platen temperature is at 180 DEG C for a long time at high temperature under high pressure for High temperature-resistanadhesive adhesive tape, more than 60min, pressure is at 350PSI, sterling/square inch), easily agingly to be clamminess, not easily remove on the surface from golden finger, easily golden finger is polluted, cause golden finger of poor quality; 2) need manually High temperature-resistanadhesive adhesive tape to be covered in golden finger surface, precision is low, and production efficiency is low.
Summary of the invention
Therefore, the technical problem to be solved in the present invention is to overcome the method for making ladder golden finger circuit board of the prior art, easily golden finger is polluted, cause golden finger of poor quality and the low technological deficiency of production efficiency, thus provide one can not pollute golden finger, the thus high and making ladder golden finger method that production efficiency is high of golden finger quality.
For this reason, the invention provides a kind of method making ladder golden finger circuit board, comprise the steps
At least one side of substrate makes golden finger, and surrounds the copper bar of described golden finger;
Enclose covered with protective film above region at described copper bar, and described diaphragm is fixedly connected with the end face of described copper bar;
Described substrate one side being coated with described diaphragm stacks gradually pressing prepreg and Copper Foil;
Remove the described prepreg of part, described metal forming and described diaphragm to form step trough, and expose described golden finger.
As a kind of preferred version, also comprise: on the side relative with the side being manufactured with described golden finger of described substrate, stack gradually pressing prepreg and Copper Foil.
As a kind of preferred version, described substrate is central layer, or pressing has the central layer of at least one deck prepreg and Copper Foil.
As a kind of preferred version, the width G reatT.GreaT.GT 20mil of described copper bar.
As a kind of preferred version, enclosing above region before covered with protective film to described copper bar, also comprising:
Make through hole and/or blind hole on the substrate, and copper facing is carried out to described through hole and/or blind hole, thus make the step of other conductive layer electric connections of described golden finger and described substrate.
As a kind of preferred version, also comprise the step of described through hole or blind hole being carried out to resin filling.
As a kind of preferred version, described golden finger is common golden finger, any one or a few in grading connecting finger and long and short golden finger.
As a kind of preferred version, described diaphragm is Copper Foil, and the side towards the described diaphragm of described golden finger is the light face of Copper Foil.
As a kind of preferred version, the thickness < 15um of described diaphragm.
As a kind of preferred version, in the step that described diaphragm is fixedly connected with the end face of described copper bar, comprising:
At described copper bar end face coating solder mask;
Described solder mask is exposed, is clamminess to make described solder mask;
Described diaphragm pressing is fixed on described copper bar end face.
As a kind of preferred version, before stacked pressing prepreg and Copper Foil are carried out to the side being coated with described diaphragm of described substrate, also comprise:
Outer rim along described copper bar is cut described diaphragm, thus is removed by the described diaphragm being positioned at described copper bar and enclosing area periphery.
As a kind of preferred version, the mode of the dark milling of control or laser cutting is used to form described step trough on described circuit board.
The method of making ladder golden finger circuit board provided by the invention, has the following advantages:
1. the method for making ladder golden finger circuit board of the present invention, first on substrate, golden finger is made, then laminate on substrate upper strata and close multilayer prepreg and Copper Foil, finally remove part prepreg, Copper Foil and diaphragm form step trough, golden finger is exposed, this production method accurately can control the setting position of golden finger, overcome and use the dark milling plate method processing of control to obtain step trough basal surface position inaccuracy traditionally, so that the accurate not technological deficiency of golden finger setting position, thus can make and obtain the higher circuit board with ladder golden finger of golden finger positional precision, in addition, copper bar and diaphragm can be protected golden finger, when on substrate top surface during pressing prepreg, prepreg can not flow into golden finger area and pollute golden finger, thus guarantee fund can point quality, and the diaphragm covering golden finger top also facilitates offering of step trough, finally, manufacture method of the present invention, Overall Steps can use machinery to complete, and thus can improve make efficiency, reduces human cost.
2. the method for making ladder golden finger circuit board of the present invention, golden finger can be produced on central layer, also can be produced on surperficial pressing has on the core plate surface of at least one deck prepreg and Copper Foil, because be first make golden finger on substrate, and then circuit board made by pressing prepreg and Copper Foil, therefore be on central layer or pressing has that the surface of prepreg and Copper Foil to make golden finger all very convenient, and can ensure to make quality.
3. the method for making ladder golden finger circuit board of the present invention, diaphragm is preferably Copper Foil, can not occur bonding between Copper Foil and golden finger, thus can not pollute golden finger; The one side towards golden finger of diaphragm is the light face of Copper Foil, and when above diaphragm, pressing prepreg and Copper Foil make circuit board, damage also can not be caused to golden finger surface in light face.
Accompanying drawing explanation
In order to be illustrated more clearly in technical scheme of the present invention, below the accompanying drawing described needed for embodiment is briefly described.
Fig. 1 is the structural representation forming golden finger and copper bar metacoxal plate in embodiment through step S1 on substrate one side.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the structural representation enclosing covered with protective film metacoxal plate above region in embodiment through step S2 at copper bar.
Fig. 4 is the structural representation through step S3 circuit board after substrate one side top being coated with diaphragm laminates unification layer prepreg and Copper Foil in embodiment.
Fig. 5 is the structural representation offering circuit board after step trough in embodiment through step S4 on circuit boards.
Reference numeral: 1-substrate, 11-central layer, 12-blind hole, 2-golden finger, 3-copper bar, 4-diaphragm, 5-prepreg, 6-Copper Foil, 7-solder mask.
Embodiment
Be described technical scheme of the present invention below in conjunction with Figure of description, obviously, following embodiment is not the whole embodiment of the present invention.Based on following embodiment described in the invention, those of ordinary skill in the art, not making the expansion or distortion that obtain under other creative work prerequisites, belongs to protection scope of the present invention.
It should be noted that, in describing the invention, term " first ", " second ", only for describing, not should be understood to instruction or hint relative importance.In addition, just can be combined with each other as long as the technical characteristic involved by the different execution mode of the present invention does not form conflict each other.
The present embodiment provides a kind of method making ladder golden finger circuit board, to have the circuit board of 6 layers of conductive layer, comprises the steps:
Step S1, as shown in Figure 1-2, central layer 11 two sides are formed L3 conductive layer and L4 conductive layer respectively, then difference lamination prepreg 5 and Copper Foil 6 successively on L3 and L4 conductive layer, form L2 conductive layer and L5 conductive layer, thus obtained substrate 1, then on substrate 1 end face, make golden finger 2, and surround the copper bar 3 of golden finger 2;
Step S2, as shown in Figure 3, encloses covered with protective film 4 above region at copper bar 3, and diaphragm 4 is fixedly connected with the end face of copper bar 3;
Step S3, as shown in Figure 4, at the two sides of the substrate 1 stacked pressing prepreg 5 of difference and Copper Foil 6, forms L1 conductive layer and L6 conductive layer;
Step S4, as shown in Figure 5, removes part prepreg 5, Copper Foil 6 and diaphragm 4 and form step trough, golden finger 2 is exposed, thus making obtains ladder golden finger circuit board.
The method of the making ladder golden finger circuit board of the present embodiment, first on substrate 1 golden finger 2 is made, then stacked pressing multilayer prepreg 5 and Copper Foil 6 on substrate 1, finally remove part prepreg 5 again, Copper Foil 6 and diaphragm 4 form step trough, golden finger 2 is exposed, this production method accurately can control the setting position of golden finger 2, overcome and use the dark milling plate method processing of control to obtain step trough basal surface position inaccuracy traditionally, so that the accurate not technological deficiency of golden finger setting position, thus can make and obtain the higher circuit board with ladder golden finger of golden finger positional precision, in addition, copper bar 3 and diaphragm 4 can be protected golden finger 2, when on substrate 1 end face during pressing prepreg 5, prepreg 5 can not flow into golden finger area and pollute golden finger 2, thus guarantee fund can point 2 quality, and the diaphragm 4 covering golden finger 2 top also facilitates offering of step trough, finally, the manufacture method that the present embodiment provides, Overall Steps can use machinery to complete, and thus can improve make efficiency, reduces human cost.
In above-mentioned steps S1, substrate 1 is for having the printed circuit board of 4 layers of conductive layer, in fact, according to demand, substrate 1 can also be have printed circuit board that is more multi-layered or fewer layers conductive layer, also can be an independent central layer 11, and golden finger 2 is set directly on L3 conductive layer and/or L4 conductive layer that Fig. 1 shows.Because be first make golden finger 2 on substrate 1, and then circuit board made by pressing prepreg 5 and Copper Foil 6, therefore be on central layer 11 or pressing has that the surface of prepreg 5 and Copper Foil 6 to make golden finger 2 all very convenient, and can ensure to make quality.
In this step, golden finger 2 is common golden finger, according to demand, people also golden finger 2 can be designed in common golden finger, grading connecting finger and long and short golden finger any one or a few; The width of copper bar 3 is 25mil, and copper bar 3 also can be set to other width by those skilled in the art, as long as > 20mil can.
In addition, can also the through hole running through substrate 1 be set on substrate 1, or to the blind hole 12 (as shown in Figure 2) of L3 layer, L4 layer by L2 layer, then copper facing is carried out to this through hole or blind hole 12, make golden finger 2 and L3 layer, L4 layer or L5 layer electric connection.When having requirement, resin filling can also be carried out, to meet actual requirement to through hole or blind hole 12.
In above-mentioned steps S2, diaphragm 4 for thickness be the Copper Foil of 14um, and the side towards golden finger 2 side of diaphragm 4 is the light face of Copper Foil.The thickness of Copper Foil can have multiple choices, as long as < 15um just can meet the demands.Can not occur bonding between Copper Foil and golden finger 2, thus can not pollute golden finger 2; The one side towards golden finger 2 of diaphragm 4 is the light face of Copper Foil, and when above diaphragm 4, pressing prepreg 5 and Copper Foil 6 make circuit board, damage also can not be caused to golden finger 2 surface in light face.
The mode be fixed on by diaphragm 4 on copper bar 3 end face is: as shown in Figure 3; at copper bar 3 applied on top surface solder mask 7, and solder mask 7 exposure is clamminess, then Copper Foil is covered on copper bar 3; use pressure to be pressed together on by Copper Foil on copper bar 3 end face, make Copper Foil cover golden finger 2 completely.When Copper Foil being pressed together on copper bar 3 end face, preferably operating under the environment of 150 DEG C, pressing quality can be improved.
Improve as one, after being pressed together on by Copper Foil on copper bar 3 end face, use laser to cut diaphragm 4 along copper bar 3 surrounding, will copper bar 3 will be positioned at enclose diaphragm 4 complete resection of area periphery.In this step, preferably use the laser of UV type, and control aperture size is 5mil.
In above-mentioned steps S3, as shown in Figure 4, in the two sides up and down of substrate 1, the prepreg of pressing simultaneously 5 and Copper Foil 6, be made into the circuit board with 6L layer conductive layer.Obviously, when the number of plies of the circuit board that will make is more multi-layered, people can continue the more multi-layered prepreg of pressing on this basis 5 and Copper Foil 6, thus prepare the circuit board with more multi-layered conductive layer.
In above-mentioned steps S4, as shown in Figure 5, adopt the method for the dark milling of control or laser cutting to form step trough on circuit boards, thus make golden finger 2 expose out.Preferably, the lower cutter position of two kinds of methods is all the position of corresponding copper bar 3, the copper bar 3 needing to cut away and the filler be positioned on copper bar 3, diaphragm 4 is removed, and then prepares the circuit board with ladder golden finger.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (12)
1. make a method for ladder golden finger circuit board, it is characterized in that: comprise the steps
At least one side of substrate (1) makes golden finger (2), and surrounds the copper bar (3) of described golden finger (2);
Enclose the top covered with protective film (4) in region at described copper bar (3), and described diaphragm (4) is fixedly connected with the end face of described copper bar (3);
Described substrate (1) one side being coated with described diaphragm (4) stacks gradually pressing prepreg (5) and Copper Foil (6);
Remove the described prepreg of part (5), described metal forming (6) and described diaphragm (4) to form step trough, and expose described golden finger (2).
2. make the method for ladder golden finger circuit board according to claim 1, it is characterized in that: also comprise: on the side relative with the side being manufactured with described golden finger (2) of described substrate (1), stack gradually pressing prepreg (5) and Copper Foil (6).
3. make the method for ladder golden finger circuit board according to claim 1, it is characterized in that: described substrate (1) is central layer (11), or pressing has the central layer (11) of at least one deck prepreg (5) and Copper Foil (6).
4. make the method for ladder golden finger circuit board according to claim 1, it is characterized in that: the width G reatT.GreaT.GT 20mil of described copper bar (3).
5. make the method for ladder golden finger circuit board according to claim 1, it is characterized in that: before the top covered with protective film (4) described copper bar (3) being enclosed to region, also comprise:
In described substrate (1) upper making through hole and/or blind hole (12), and copper facing is carried out to described through hole and/or blind hole (12), thus make the step of other conductive layer electric connections of described golden finger (2) and described substrate (1).
6. make the method for ladder golden finger circuit board according to claim 5, it is characterized in that: also comprise the step of described through hole or blind hole (12) being carried out to resin filling.
7. make the method for ladder golden finger circuit board according to claim 1, it is characterized in that: described golden finger (2) is common golden finger, any one or a few in grading connecting finger and long and short golden finger.
8. make the method for ladder golden finger circuit board according to claim 1, it is characterized in that: described diaphragm (4) is Copper Foil, the side towards the described diaphragm (4) of described golden finger (2) is the light face of Copper Foil.
9. make the method for ladder golden finger circuit board according to claim 8, it is characterized in that: the thickness < 15um of described diaphragm (4).
10. make the method for ladder golden finger circuit board according to claim 1, it is characterized in that: in the step that described diaphragm (4) is fixedly connected with the end face of described copper bar (3), comprising:
At described copper bar (3) end face coating solder mask (7);
Described solder mask (7) is exposed, is clamminess to make described solder mask (7);
Described diaphragm (4) pressing is fixed on described copper bar (3) end face.
11. methods making ladder golden finger circuit board according to claim 1; it is characterized in that: before stacked pressing prepreg (5) and Copper Foil (6) are carried out to the side being coated with described diaphragm (4) of described substrate (1), also comprise:
Outer rim along described copper bar (3) is cut described diaphragm (4), thus will be positioned at described diaphragm (4) removal that described copper bar (3) encloses area periphery.
12. methods making ladder golden finger circuit board according to claim 1, is characterized in that: use the mode of the dark milling of control or laser cutting to form described step trough on described circuit board.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510546806.5A CN105228371B (en) | 2015-08-31 | 2015-08-31 | A kind of method for making ladder golden finger circuit board |
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| CN201510546806.5A CN105228371B (en) | 2015-08-31 | 2015-08-31 | A kind of method for making ladder golden finger circuit board |
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| CN105228371A true CN105228371A (en) | 2016-01-06 |
| CN105228371B CN105228371B (en) | 2018-07-06 |
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Cited By (11)
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| CN105792538A (en) * | 2016-03-31 | 2016-07-20 | 胜宏科技（惠州）股份有限公司 | Internal copper plate copper exposure manufacturing method of power cell circuit board |
| CN107580412A (en) * | 2016-07-04 | 2018-01-12 | 北大方正集团有限公司 | Stepped circuit board and preparation method thereof |
| CN107889377A (en) * | 2017-11-16 | 2018-04-06 | 江门崇达电路技术有限公司 | A kind of preparation method of ladder position golden finger |
| CN108463058A (en) * | 2018-04-16 | 2018-08-28 | 惠州市纬德电路有限公司 | A kind of production technology of staged golden finger pcb board |
| CN108811310A (en) * | 2018-09-04 | 2018-11-13 | 苏州工业园区杰智汇电子材料有限公司 | Form the forming method of the protection structure and wiring board of the copper foil layer of wiring board |
| CN110139504A (en) * | 2019-05-24 | 2019-08-16 | 深圳市景旺电子股份有限公司 | Flexible and hard combined circuit board and preparation method thereof |
| CN110312370A (en) * | 2019-06-11 | 2019-10-08 | 江西弘高科技有限公司 | A kind of production method of printed wiring board memory bar |
| CN112738979A (en) * | 2020-12-10 | 2021-04-30 | 西安易朴通讯技术有限公司 | PCB, chip and electronic equipment |
| CN112739005A (en) * | 2020-11-16 | 2021-04-30 | 淮安特创科技有限公司 | Golden finger circuit board processing method and golden finger circuit board |
| CN114096059A (en) * | 2020-08-25 | 2022-02-25 | 宏恒胜电子科技（淮安）有限公司 | Circuit board and manufacturing method thereof |
| WO2023273202A1 (en) * | 2021-06-29 | 2023-01-05 | 生益电子股份有限公司 | Circuit board and manufacturing method therefor |
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| WO2017166904A1 (en) * | 2016-03-31 | 2017-10-05 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing power cell circuit board while exposing copper of internal copper plate |
| CN105792538B (en) * | 2016-03-31 | 2019-01-15 | 胜宏科技（惠州）股份有限公司 | A kind of internal layer copper sheet dew copper production method of power battery wiring board |
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| CN107580412A (en) * | 2016-07-04 | 2018-01-12 | 北大方正集团有限公司 | Stepped circuit board and preparation method thereof |
| CN107889377A (en) * | 2017-11-16 | 2018-04-06 | 江门崇达电路技术有限公司 | A kind of preparation method of ladder position golden finger |
| CN108463058B (en) * | 2018-04-16 | 2022-03-29 | 惠州市纬德电路有限公司 | Production process of stepped gold finger PCB |
| CN108463058A (en) * | 2018-04-16 | 2018-08-28 | 惠州市纬德电路有限公司 | A kind of production technology of staged golden finger pcb board |
| CN108811310A (en) * | 2018-09-04 | 2018-11-13 | 苏州工业园区杰智汇电子材料有限公司 | Form the forming method of the protection structure and wiring board of the copper foil layer of wiring board |
| CN110139504A (en) * | 2019-05-24 | 2019-08-16 | 深圳市景旺电子股份有限公司 | Flexible and hard combined circuit board and preparation method thereof |
| CN110139504B (en) * | 2019-05-24 | 2020-07-10 | 深圳市景旺电子股份有限公司 | Soft and hard combined circuit board and manufacturing method thereof |
| CN110312370A (en) * | 2019-06-11 | 2019-10-08 | 江西弘高科技有限公司 | A kind of production method of printed wiring board memory bar |
| CN114096059A (en) * | 2020-08-25 | 2022-02-25 | 宏恒胜电子科技（淮安）有限公司 | Circuit board and manufacturing method thereof |
| CN114096059B (en) * | 2020-08-25 | 2023-10-10 | 宏恒胜电子科技（淮安）有限公司 | Circuit board and manufacturing method thereof |
| CN112739005A (en) * | 2020-11-16 | 2021-04-30 | 淮安特创科技有限公司 | Golden finger circuit board processing method and golden finger circuit board |
| CN112738979A (en) * | 2020-12-10 | 2021-04-30 | 西安易朴通讯技术有限公司 | PCB, chip and electronic equipment |
| WO2023273202A1 (en) * | 2021-06-29 | 2023-01-05 | 生益电子股份有限公司 | Circuit board and manufacturing method therefor |
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| CN105228371B (en) | 2018-07-06 |
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Effective date of registration: 20220620 Address after: No. 107, Baishi Road, Qianshan, Xiangzhou District, Zhuhai, Guangdong 519070 Patentee after: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Patentee after: New founder holdings development Co., Ltd Address before: No. 107 Baishi Road, Qianshan, Zhuhai, Guangdong 519070 Patentee before: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Patentee before: Peking University Founder Group Corp |