CN110312370A - A kind of production method of printed wiring board memory bar - Google Patents
A kind of production method of printed wiring board memory bar Download PDFInfo
- Publication number
- CN110312370A CN110312370A CN201910503314.6A CN201910503314A CN110312370A CN 110312370 A CN110312370 A CN 110312370A CN 201910503314 A CN201910503314 A CN 201910503314A CN 110312370 A CN110312370 A CN 110312370A
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- China
- Prior art keywords
- pcb board
- pcb
- plate
- carried out
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of production methods of printed wiring board memory bar, comprising the following steps: design meets minimum spacing and line width is required to do the PCB substrate for maximizing compensation；Sanction plate is carried out according to design size to copper foil plate, obtains material issuance substrate: internal layer circuit production being carried out to the PCB substrate according to design parameter, and is examined；PP and the bright face of the PCB substrate are pressed together using the pressure of 300Pa, obtain outer layer pcb board；Just determine pcb board to described according to design parameter and drill；Later after electroplating processes, brushing processing, anti-welding, change gold processing, finished product pcb board is obtained；The technical solution carries out grinding process to the rough surface of copper tooth outwardly using electric mill again later and obtains pcb board by inverting copper foil plate by the bright face of copper foil plate in conjunction with PP, solves the problems, such as that copper residual leads to the long foot of gold, and then the yields of raising pcb board.
Description
Technical field
The present invention relates to printed wiring board preparation technical field, in particular to a kind of production side of printed wiring board memory bar
Method.
Background technique
The traditional technique of pcb board inner layer strips is using plating golden finger production, at present according to the growth requirement in market, for reduce at
Originally the golden production of being changed to, for the part of thin finger, the spacing of finger to finger is also small (original copy spacing is less than 6mil), etches nothing
Bottom CU is completely removed the clean point bottom copper individually that have and remained by method, is changing asking for golden generation Jin Jinchang foot due to bottom CU is remained
Topic scraps height, scrappage is 25% or so because spacing little Jin long foot will affect spacing or short circuit is caused to determine to scrap.
Summary of the invention
In order to solve problems in the prior art, the embodiment of the invention provides a kind of production sides of printed wiring board memory bar
Method effectively improves the yields of pcb board.
In order to achieve the above objectives, technical solution of the present invention is as follows:
A kind of production method of printed wiring board memory bar, comprising the following steps:
Design meets minimum spacing and line width is required to do the PCB substrate for maximizing compensation；
Sanction plate is carried out according to design size to copper foil plate, obtains material issuance substrate:
Internal layer circuit production is carried out to the PCB substrate according to design parameter, and is examined；
PP and the bright face of the PCB substrate are pressed together using the pressure of 300Pa, obtain outer layer pcb board:
Just determine pcb board to described according to design parameter and drill:
According to design parameter to previous step treated just determine pcb board full plate carry out electroplating processes, obtain plating entirely
Copper sheet is processed to obtain half-finished product plate by outer-layer circuit；
Brushing processing is carried out to the half-finished product plate using 1.5-2.0A electric current, linear speed sets 1.0m/min；
Anti-welding processing is carried out to the pcb board in previous step:
To the pcb board gold processing through anti-welding processing, finished product pcb board is obtained.
The technical solution that the present invention provided by reversion copper foil plate by the bright face of copper foil plate in conjunction with PP, use again later
Electric mill carries out grinding process to the rough surface of copper tooth outwardly and obtains pcb board, and efficiently solving copper residual leads to asking for golden long foot
Topic, and then improve the yields of pcb board.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, technical solution in the embodiment of the present invention into
Row clearly and completely describes, it is clear that described embodiments are only a part of the embodiments of the present invention, rather than whole realities
Apply example.Based on the embodiments of the present invention, those of ordinary skill in the art are obtained without making creative work
Every other embodiment, shall fall within the protection scope of the present invention.
A kind of production method of printed wiring board memory bar, the parameter request of specific printed wiring board manufactured in the present embodiment
Are as follows: 6 through-holes, golden finger width and spacing be 5.9mil, copper thickness be 1.6mil, comprising the following steps:
S11 design meets minimum spacing and line width is required to do the PCB substrate for maximizing compensation, specifically, line width/line of finished product
Away from the compensation 1.5mil for 4/4mil, the egative film line width/line-spacing that works is 5.5/2.5mil, piece uploading PAD and finger because managing upper width
Compensation plus 1mil are managed, and work original text is designed as 8.4/3.4mil design at corresponding finger；
S12 carries out sanction plate according to the design size in S11 step to copper foil plate, obtains material issuance substrate:
S13 carries out internal layer circuit production to the PCB substrate according to design parameter in S11 step, and examines；
PP and the bright face of the PCB substrate are pressed together by S14 using the pressure of 300Pa, obtain outer layer pcb board,
Specifically, which does not have copper tooth residual in thin interdigital space of hand, less will lead to Jin Changjiao；
S15 just determines pcb board and drills according to design parameter to described:
S16 according to design parameter to step S15 treated just determine pcb board full plate progress electroplating processes, be electroplated
Full copper sheet is processed to obtain half-finished product plate by outer-layer circuit；
Specifically, electroplating processes process the following steps are included:
Brushing is opened in outer layer pre-treatment, and brush mark controls 10+-2mm, and brushing electric current sets 1.5-2.0A, and linear speed sets 1.0+-
0.2m/min；
It is through brushing that the leveling of outer layer copper tooth is whole
The control of line width lower limit is walked in etching, and line width controls normal Median control mode in 4mil, the practical intermediate value control with 3.75mil
System；
S17 carries out brushing processing to the half-finished product plate using 1.5-2.0A electric current, removes copper removal tooth, and linear speed sets 1.0m/
min；
S18 carries out anti-welding processing to the pcb board after S17 step process:
S19 handles the smooth pcb board gold through anti-welding processing, obtains finished product pcb board.
Specifically, change gold processing the following steps are included:
The extension of microetch time is adjusted to 180 seconds before changing gold；
Activation time shortens to 90S；
Washing time is extended for 150S after activation；
In conclusion the present embodiment is by inverting copper foil plate by the bright face of copper foil plate in conjunction with PP, later again using electric mill
Grinding process is carried out to the rough surface of copper tooth outwardly and obtains pcb board, solves the problems, such as that copper residual leads to the long foot of gold, into
And improve the yields of pcb board
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (1)
1. a kind of production method of printed wiring board memory bar, which comprises the following steps:
Design meets minimum spacing and line width is required to do the PCB substrate for maximizing compensation；
Sanction plate is carried out according to design size to copper foil plate, obtains material issuance substrate:
Internal layer circuit production is carried out to the PCB substrate according to design parameter, and is examined；
PP and the bright face of the PCB substrate are pressed together using the pressure of 300Pa, obtain outer layer pcb board:
Just determine pcb board to described according to design parameter and drill:
According to design parameter to previous step treated just determine pcb board full plate progress electroplating processes, obtain that full copper sheet is electroplated,
It processes to obtain half-finished product plate by outer-layer circuit；
Brushing processing is carried out to the half-finished product plate using 1.5-2.0A electric current, linear speed sets 1.0m/min；
Anti-welding processing is carried out to the pcb board in previous step:
To the pcb board gold processing through anti-welding processing, finished product pcb board is obtained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910503314.6A CN110312370A (en) | 2019-06-11 | 2019-06-11 | A kind of production method of printed wiring board memory bar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910503314.6A CN110312370A (en) | 2019-06-11 | 2019-06-11 | A kind of production method of printed wiring board memory bar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110312370A true CN110312370A (en) | 2019-10-08 |
Family
ID=68077118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910503314.6A Pending CN110312370A (en) | 2019-06-11 | 2019-06-11 | A kind of production method of printed wiring board memory bar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110312370A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114885516A (en) * | 2022-05-27 | 2022-08-09 | 东莞联桥电子有限公司 | Double-sided single-layer aluminum substrate manufacturing process |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994021097A2 (en) * | 1993-03-05 | 1994-09-15 | Polyclad Laminates, Inc. | Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture |
| JPH10261871A (en) * | 1997-03-18 | 1998-09-29 | Hitachi Chem Co Ltd | Manufacture of multilayer printed circuit board |
| CN104185377A (en) * | 2014-08-21 | 2014-12-03 | 深圳崇达多层线路板有限公司 | Fine-line PCB manufacturing method |
| CN105228371A (en) * | 2015-08-31 | 2016-01-06 | 珠海方正科技多层电路板有限公司 | A kind of method making ladder golden finger circuit board |
| CN106255348A (en) * | 2016-08-09 | 2016-12-21 | 江门崇达电路技术有限公司 | The process for pressing of precise circuit board |
-
2019
- 2019-06-11 CN CN201910503314.6A patent/CN110312370A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994021097A2 (en) * | 1993-03-05 | 1994-09-15 | Polyclad Laminates, Inc. | Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture |
| JPH10261871A (en) * | 1997-03-18 | 1998-09-29 | Hitachi Chem Co Ltd | Manufacture of multilayer printed circuit board |
| CN104185377A (en) * | 2014-08-21 | 2014-12-03 | 深圳崇达多层线路板有限公司 | Fine-line PCB manufacturing method |
| CN105228371A (en) * | 2015-08-31 | 2016-01-06 | 珠海方正科技多层电路板有限公司 | A kind of method making ladder golden finger circuit board |
| CN106255348A (en) * | 2016-08-09 | 2016-12-21 | 江门崇达电路技术有限公司 | The process for pressing of precise circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 唐宏华等: "一种超高精度同心环PCB的制作工艺探讨", 《印制电路信息》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114885516A (en) * | 2022-05-27 | 2022-08-09 | 东莞联桥电子有限公司 | Double-sided single-layer aluminum substrate manufacturing process |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20191008 |
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| WD01 | Invention patent application deemed withdrawn after publication |