KR101567076B1 - Driving film and editing method for driving film - Google Patents

Abstract

A method of editing a driving film and a driving film according to an embodiment, cutting both ends of a defective section existing in a driving film; Arranging the drive films of the good section where the defect section is cut at a position where the drive films can be mutually adhered; And forming an adhesive film layer on both sides of the driving film of the good section.

Driving film, FPCB, film carrier

Description

TECHNICAL FIELD [0001] The present invention relates to a driving film,

The embodiment relates to a driving film and a driving film editing method.

A flexible printed circuit board (FPCB) uses a flexible material such as a polyimide (hereinafter referred to as PI) film as a base film. For example, a flexible circuit board is completed by coating a PI film with a cover layer of a circuit constituted by a copper foil on a PI film. Such a flexible circuit board is excellent in flexibility and can be continuously produced.

Accordingly, the flexible circuit board is manufactured in the form of a drive film in which the same circuit is continuously formed on the base film, and the drive film section in which the circuit is formed is cut and mounted on the product. The manufactured drive film is inspected for the presence or absence of abnormality in each circuit, the state of the punching groove, and the like, and the defective section is edited.

1 is an editing state view of a driving film according to the prior art.

The driving film shown in (a) illustrates a driving film having a connection section S connecting between a circuit section A in which a circuit is formed and a circuit section A. FIG. The sizes of the circuit section A and the connection section S are determined to be constant depending on the apparatus in which the driving film is used.

In the drive film shown in (a), the circuits e1, e2 and e3 are judged to be defective successively, and good circuits a1, a2 and a3 and a4 are connected to both sides of the defective circuit section. Therefore, the defective circuits e1, e2 and e3 must be removed and edited. The edited driving film must conform to the specifications of the circuit section (A) and the connection section (S).

According to the conventional driving film and driving film editing method, an adhesive tape is adhered to the front and back surfaces of the driving film in the good section remaining after the defect section is cut, and the driving films are bonded to each other. As the adhesive tape, a PI adhesive tape of the same material as the base film of the driving film may be used.

(B) shows a driving film edited according to the prior art.

(B) illustrates a case where an adhesive tape is adhered to both sides of a driving film after editing a part of the e1 circuit and a part of the e3 circuit and removing the remaining defective section including e2. a part of the e1 circuit and a part of the e3 circuit are connected with an adhesive tape so that the size of the edit section E to which the adhesive tape is attached conforms to the specification of the circuit section A. Thus, the driving film is edited in such a manner that good-quality circuits of a1, a2, a3 and a4 are arranged and an editing section E exists in the middle.

On the other hand, even when only one defective circuit occurs, it is impossible to attach the adhesive tape in the connection section S, so that the size of the edit section E to which the adhesive tape is attached matches the size of the circuit section A It should be edited. When one defective circuit is removed, the size of the connection section S is about 200 to 800 μm, while the width of the adhesive tape is about 10 to 15 mm, and the adhesive surface of the adhesive tape is larger than the size of the connection section S , And an adhesive tape is attached to a part of the circuit which is a good product. If an adhesive tape is attached to a good circuit, the circuit can not be used, and a defective section also exists on the edited drive film.

FIG. 2 is a view showing an adhesion state of a driving film edited according to a conventional editing method, and is a side view showing the driving film shown in FIG. 1 (B) from the side.

As shown in FIG. 2, the driving film edited according to the conventional editing method includes a first adhesive tape 10 attached to the rear surface of the driving film, a second adhesive tape 15 attached to the front surface of the driving film Thereby bonding the both side driving films. Thus, the second adhesive tape 15 is bonded onto the e1 circuit and the e3 circuit. Thus, the driving film is edited in such a manner that good-quality circuits of a1, a2, a3 and a4 are arranged and an editing section E exists in the middle. Here, when there is one defective circuit, the second adhesive tape 15 adhered to the front surface of the drive film is also bonded to a part of the good circuit. Therefore, a defective section that becomes unusable due to the second adhesive tape 15 adhered to the front surface of the driving film is generated.

As described above, according to the conventional driving film and driving film editing method, there is an editing section E in which the edited driving film becomes unusable due to the attachment of the adhesive tape. Therefore, even if the editing is completed, there is a problem that the driving film has an unusable section.

In addition, the design factor of the connection section S is usually about 200 to 800 μm, while the width of the adhesive tape is about 10 to 15 mm. Since the adhesive surface of the adhesive tape is relatively wide, There is a problem that it can not be done.

Embodiments provide a driving film and a driving film editing method capable of minimizing the size of a defective section caused by bonding between driving films to improve the yield of the driving film.

A driving film editing method according to an embodiment includes: cutting both ends of a defective section existing in a driving film; Arranging the drive films of the good section where the defect section is cut at a position where the drive films can be mutually adhered; And forming an adhesive film layer on both sides of the driving film of the good section.

The driving film according to an embodiment includes a circuit section having a predetermined size in which a circuit is formed on a base film; A connection section formed on the base film and having a predetermined size to connect the circuit sections; And an editing section attached to both sides of the base film to interconnect the cut surfaces of the base film within the connection section.

According to the driving film and the driving film editing method of the embodiment, it is possible to minimize the size of the defective section caused by the bonding between the driving films and to improve the yield of the driving film.

Hereinafter, a driving film and a driving film editing method according to an embodiment will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail to avoid unnecessarily obscuring the subject matter of the present invention.

3 is an editing state view of the driving film according to the embodiment.

(A) shows an example of the editing target film P to be edited. The editing target drive film P is arranged such that the circuit section A in which the circuit is formed and the connection section S connecting the circuit section A are alternately arranged and the circuit section A and the connection section S are arranged alternately, Is determined according to the apparatus in which the driving film P is used. E1, e2 and e3 circuits judged to be defective are present in succession in the editing target drive film P, and good circuits a1, a2 and a3 and a4 are connected to both sides of the defective circuit section.

(B) shows a state in which the defective section (e) is cut off in order to remove the circuits e1, e2 and e3 from the driving film (P). When both ends of the defective section e are cut off from the driving film P, the first good section P-1 including the good circuits a1 and a2 and the second good section P-1 including the good elements a3 and a4 (P-2) remains.

(C) shows a drive film P 'that has been edited. The first good section P-1 and the second good section P-2 are adhered to each other on the rear side of the film and edited into one driving film P '. Here, since the adhesive films are adhered to the back surfaces of the both good sections P-1 and P-2 on which no circuit is formed, there is no problem in using the circuits a and a4. Therefore, the editing space E, which becomes unusable due to adhesion at the front surface of the driving film P ', is substantially not required. The editing space E shown in Fig. 3C is the formation interval A of the circuit a3 of the a2 circuit of the first good section P-1 and the a3 circuit of the second good section P- If the size of the connection section S can be satisfied without a space between the two side drive films P-1 and P-2 as a space allocated to satisfy the dimensions of the connection section S connecting the editing sections (E) may appear on the boundary line between the first good section P-1 and the second good section P-2.

As described above, since the editing space E, which can not be used due to the adhesion of the both-side good sections P-1 and P-2, does not substantially exist, the driving films are mutually adhered in the connection section S It is possible.

FIG. 4 illustrates a process of adhering a driving film according to an embodiment of the present invention, in which a driving film is adhered using an adhesive film.

As shown in Fig. 4, the embodiment is characterized in that in order to adhere the first good section P-1 including a1 and a2 to the second good section P-2 including the circuits a3 and a4, The adhesive films 100 are attached to the lower surfaces of the side sections P-1 and P-2. The lower surface of the cut surface on which the adhesive film 100 is adhered is a surface on which the circuits a2 and a3 are not formed in the driving film with respect to the driving film and the adhesive film 100 is coated only on the rear surface of the driving film, It is possible to prevent the circuits a2 and a3 formed in the semiconductor device 10 from being damaged. Accordingly, the size of the adhesive film 100 can be freely set in consideration of the adhesive strength of the both good sections P-1 and P-2.

Here, the adhesive film 100 may be a polyimide adhesive film of the same material as the driving film, a film of a material filled with epoxy and inorganic fillers in a glass fiber, a general cellophane adhesive film, The various adhesive films 100 provided can be applied.

FIGS. 5 and 6 illustrate a process of adhering a driving film according to another embodiment of the present invention, in which a driving film is adhered by a laminating method.

As shown in Fig. 5, according to another embodiment, a first good section P-1 including a1 and a2 and a second good section P-2 including circuits a3 and a4 are bonded to each other The adhesive layer 200 is coated on the lower surfaces of the cut surfaces of the both-side good sections P-1 and P-2. The lower surface of the cut surface on which the adhesive layer 200 is coated is a surface on which the circuits a2 and a3 are not formed in the driving film on the basis of the driving film and the adhesive layer 200 is coated only on the rear surface of the driving film, It is possible to prevent the circuits a2 and a3 from being damaged. The adhesive layer 200 may include an epoxy-based or acrylic-based adhesive material, and may be an instant adhesive, a thermosetting adhesive, a laser-curing adhesive, an ultrasonic curing adhesive, or the like.

6 shows a state in which the thin film 300 is laminated on the adhesive layer 200 to adhere the two good sections P-1 and P-2.

The thickness of the thin film 300 can be determined within a range in which the edited driving film P 'can be used. Considering the design factor of the driving film that is typically used, the thickness of the thin film 300 May be set to 30 mu m or less.

When the thin film 300 is laminated, a process of curing the adhesive layer 200 proceeds after the thin film 300 is adhered to the adhesive layer 200. Accordingly, a part of the adhesive layer 200 can penetrate into the spacing space between the cut surfaces and can be solidified. The size of the editing space E caused by the infiltration of the adhesive layer 200 can be minimized by adjusting the application amount of the adhesive material 200 so that the size of the editing space E is smaller than the size of the a2 circuit and the a3 circuit circuit section A Of the connection section S to which the connection section S is connected. Therefore, the defective section of the driving film due to the editing space E can be minimized.

FIG. 7 is a flowchart of a method of editing a driving film according to an embodiment, in which a laminated film is laminated for forming an adhesive film layer.

The section e in which the defect has occurred in the drive film P for editing the drive film P is determined (S100). This can be judged by the operator with the naked eye or by using the failure discrimination apparatus using the vision camera to determine the failure section e.

The defective section e is judged, and both ends of the defective section e are cut off and removed (S110).

And the both good sections P-1 and P-2 from which the defective section e has been removed are aligned to the adhering position (S120). The edited driving film P 'can be matched with the design factor in consideration of the sizes of the circuit section A and the connection section S set as the design factors in the both side good sections P-1 and P- .

The adhesive layer 200 is formed by applying an adhesive material to the lower surface of the mutually contacted cut surfaces (S130). Depending on the type of the thin film 300 to be adhered later, an adhesive material such as an epoxy series or an acrylic series may be applied to the adhesive layer 200.

When the adhesive layer 200 is formed, the thin film 300 is laminated to the adhesive layer 200 (S140).

Thus, when the cut surfaces of the both good sections P-1 and P-2 are adhered and edited, it is determined whether or not the edited film P 'is defective (S150). The operator can check whether the edited film P 'is defective or not by confirming the adhesion strength of the edited film P', the adhesion position, the adhesion state, the thickness and width of the editing space E, and the like.

When the inspection is completed, the edited driving film P 'can be shipped to the purchaser (S160). Here, if it is confirmed that a bad section is generated in the edited driving film P ', the process returns to step S110 and the editing operation can be performed.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Fig. 1 is an editing view of a driving film according to the prior art. Fig.

Fig. 2 is an adhesive state diagram of a driving film edited according to the prior art. Fig.

3 is an editing state view of a driving film according to an embodiment.

4 is a view showing an adhesion state of a driving film according to an embodiment.

FIGS. 5 and 6 are views showing a bonding process of a driving film according to another embodiment. FIG.

7 is a flowchart of a method of editing a driving film according to an embodiment.

Claims (12)

Preparing a base film and a driving film on which a circuit pattern is formed on an upper surface of the base film; Dividing the driving film into a first driving film and a second driving film by cutting both ends of a defective section existing in the prepared driving film; Arranging the first driving film and the second driving film at a mutually adhering position with a predetermined distance therebetween; Forming an adhesive layer on the lower surfaces of the first and second driving films to adhere the first and second driving films to each other, The adhesive layer A first portion attached to a lower surface of the base film of the first driving film, A second portion attached to a lower surface of the base film of the second driving film, And a third portion formed in the spacing space between the first and second driving films and partially embedding the spacing space, And the upper surface of the third portion of the adhesive layer, Wherein the adhesive layer is higher than the upper surfaces of the first and second portions of the adhesive layer, Wherein the first portion of the adhesive layer At least a part of which overlaps with a circuit pattern formed on the upper surface of the base film of the first driving film, The second portion of the adhesive layer Wherein the second driving film is overlapped at least partially with a circuit pattern formed on an upper surface of the base film of the second driving film. The method according to claim 1, And the upper surface of the third portion of the adhesive layer, Wherein the upper surface of the first and second driving films is lower than the upper surfaces of the first and second driving films. The method according to claim 1, Further comprising the step of attaching a thin film below the adhesive layer. The method of claim 3, The adhesive layer A method for editing a driving film comprising at least one of an acryl-based adhesive, an epoxy-based adhesive, an instant adhesive, a thermosetting adhesive, a laser-curing adhesive, and an ultrasonic curing adhesive. The method of claim 3, Wherein the thickness of the thin film is set to be larger than 0 mu m and smaller than or equal to 30 mu m. The method according to claim 1, Wherein the arranging comprises: And bonding the cut surfaces of the first and second drive films to each other in a connection section connecting circuits formed on the first and second drive films. A circuit section of a predetermined size in which a circuit is formed on the base film; A connection section formed on the base film and having a predetermined size to connect circuit sections; And an editing section which is attached to both sides of the base film and interconnects the cut surfaces of the base film in the connection section, The base film is divided into a first base film and a second base film spaced apart from each other by a predetermined distance around the editing section, Wherein the editing section includes an adhesive layer adhered to lower surfaces of the first and second base films, The adhesive layer A first portion attached to a lower surface of the first base film, A second portion attached to a lower surface of the second base film, A third portion formed in the spacing space between the first and second base films and partially embedding the spacing space, And the upper surface of the third portion of the adhesive layer, Wherein the adhesive layer is higher than the upper surfaces of the first and second portions of the adhesive layer, Wherein the first portion of the adhesive layer At least a part of which overlaps with a circuit pattern formed on the upper surface of the base film of the first driving film, The second portion of the adhesive layer And a circuit pattern formed on an upper surface of the base film of the second driving film. delete 8. The method of claim 7, And the upper surface of the third portion of the adhesive layer, And lower than the upper surface of the first and second base films. 8. The method of claim 7, The edit section And a thin film layer adhered under the adhesive layer. 11. The method of claim 10, The adhesive layer A driving film comprising at least one of an acryl-based adhesive, an epoxy-based adhesive, an instant adhesive, a thermosetting adhesive, a laser-curing adhesive, and an ultrasonic curing adhesive. 11. The method of claim 10, Wherein the thickness of the thin film is set to be larger than 0 mu m and smaller than or equal to 30 mu m.

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