KR20100112265A - Driving film and editing method for driving film - Google Patents

Abstract

PURPOSE: The drive film and drive film method for editing minimize the size of the defect interval generating according to the junction going the drive film. CONSTITUTION: Both ends of the defect interval existing in the drive film cutes. The drive film of the good section in which the defect interval cuts is arranged in the location canning be adhered to the reciprocity. Circuits(a2, a3) are formed in the front of the drive film. The adhesive film(100) is attached to the lower-part of the drive film of the good section.

Description

DRIVING FILM AND EDITING METHOD FOR DRIVING FILM}

The embodiment relates to a drive film and a drive film editing method.

A flexible printed circuit board (FPCB) uses a flexible material such as a polyimide (hereinafter referred to as PI) film as a base film. For example, a circuit is composed of copper foil on the PI film, and the PI film is coated again with a cover layer of the configured circuit to complete the flexible circuit board. Such flexible circuit boards have excellent flexibility and are capable of continuous production.

Accordingly, the flexible circuit board is manufactured in the form of a drive film in which the same circuit is continuously formed on the base film, and is manufactured in a form in which the driving film section in which the circuit is formed is cut and mounted on a product. The manufactured driving film is inspected for abnormality of each circuit, the state of the punching groove and the like, and the defective section is edited, and then the driving film of the desired length is provided on the reel.

1 is an edit state diagram of a driving film according to the prior art.

The driving film shown in (A) illustrates a driving film having a connection section S connecting the circuit section A and the circuit section A on which a circuit is formed. The size of the circuit section A and the connection section S is determined constantly according to the device in which the driving film is used.

In the driving film shown in (a), e1, e2, and e3 circuits are successively determined to be defective, and good circuits a1, a2, a3, a4 are connected to both sides of the defective circuit section. Therefore, the defective circuits e1, e2, e3 must be removed and edited, and the edited driving film must meet the specifications of the circuit section A and the connection section S.

According to the conventional driving film and the driving film editing method, the adhesive tape is adhered to the front and rear surfaces of the driving film of the remaining good section after cutting the defective section, thereby adhering the driving film to each other. As the adhesive tape, a PI adhesive tape of the same material as the base film of the driving film may be used.

(B) shows a drive film edited according to the prior art.

The driving film of (B) illustrates a case in which a part of the e1 circuit and a part of the e3 circuit are removed and the remaining defective sections including e2 are removed, and then the adhesive tape is adhered to both surfaces of the driving film. A part of the e1 circuit and a part of the e3 circuit are connected with adhesive tape so that the size of the editing section E to which the adhesive tape is attached conforms to the specification of the circuit section A. Thus, the drive film is edited in such a way that a good circuit of a1, a2, a3, a4 is arranged, and an editing section E is present in the middle.

On the other hand, even when only one defective circuit occurs, it is impossible to attach the adhesive tape in the connection section S, so that the size of the editing section E with the adhesive tape is matched with the size of the circuit section A. You must edit it. When one defective circuit is removed, the size of the connection section (S) is about 200 ~ 800㎛, while the width of the adhesive tape is about 10 ~ 15mm, because the adhesive surface of the adhesive tape is larger than the size of the connection section (S) Adhesive tape is attached to a part of the good circuit. If the adhesive tape is attached to a good circuit, the circuit cannot be used, and thus a bad section exists on the drive film where the editing is completed.

FIG. 2 is a side view of the driving film shown in FIG.

As shown in FIG. 2, in the driving film edited according to the conventional editing method, the first adhesive tape 10 is attached to the rear surface of the driving film and the second adhesive tape 15 is attached to the front surface of the driving film. Bond both driving films. Thus, the second adhesive tape 15 is adhered to the e1 circuit and the e3 circuit. Thus, the drive film is edited in such a way that a good circuit of a1, a2, a3, a4 is arranged, and an editing section E is present in the middle. Here, when one defective circuit exists, the second adhesive tape 15 adhered to the front surface of the driving film is also adhered to a part of the good circuit. Therefore, a defective section becomes unusable due to the second adhesive tape 15 adhered to the front surface of the driving film.

As described above, according to the conventional driving film and the driving film editing method, there is an editing section E which cannot be used due to the attachment of the adhesive tape to the driving film after the editing is completed. Therefore, even if the editing is completed, there is a problem that there is a section that cannot be used in the drive film.

In addition, the design factor of the connection section (S) is typically about 200 ~ 800㎛ while the width of the adhesive tape is about 10 ~ 15mm, because the adhesive surface of the adhesive tape is relatively wide, the good quality circuit can be used due to the adhesive tape adhesion There is a problem that can not be.

The embodiment provides a driving film and a driving film editing method capable of improving the yield of the driving film by minimizing the size of the defective section generated by the bonding between the driving films.

The driving film editing method according to the embodiment includes cutting both ends of a defective section existing in the driving film; Arranging the driving film of the non-defective section in which the defective section is cut to be bonded to each other; And forming an adhesive film layer on both lower surfaces of the driving film of the non-defective section.

The driving film according to the embodiment includes a circuit section of a predetermined size having a circuit formed on the base film; A connection section having a predetermined size formed on the base film and connecting the circuit sections; And an editing section attached to both lower surfaces of the base film to interconnect the cut surface of the base film within the connection section.

According to the driving film and the driving film editing method of the embodiment, it is possible to improve the yield of the driving film by minimizing the size of the defective section generated by the bonding between the driving film.

Hereinafter, a driving film and a driving film editing method according to an embodiment will be described in detail with reference to the accompanying drawings. However, in describing the embodiments, when it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, a detailed description thereof will be omitted.

3 is an edit state diagram of the driving film according to the embodiment.

(A) is an example of the editing target drive film (P). The driving film P to be edited is alternately arranged with a connection section S connecting the circuit section A and the circuit section A on which a circuit is formed, and the circuit section A and the connecting section S. The size of is determined according to the device in which the drive film (P) is used. In the editing object drive film P, the circuits e1, e2 and e3 which are determined to be defective are present in succession, and good circuits a1, a2 and a3 and a4 are connected to both sides of the defective circuit section.

(B) shows a state in which the defective section (e) is cut off to remove the circuits e1, e2, and e3 from the driving film (P). When both ends of the defective section e are cut from the driving film P, the first good section P-1 including the good circuits a1 and a2 and the second good section including the good circuits a3 and a4 (P-2) remains.

(C) shows the drive film P 'which has been edited. In the first and second section P-1 and the second and second section P-2, the back surface of the film is bonded to each other and edited as one driving film P '. Here, both side sections (P-1, P-2) is because the adhesive film is bonded to the back of the circuit is not formed, there is no problem in using the circuit (a, a4). Therefore, the editing space E which becomes impossible to use due to the adhesion on the front surface of the driving film P 'is virtually unnecessary. The editing space E shown in (c) is a forming section A of the a2 circuit of the first good section P-1 and forming section A of the a3 circuit of the second good section P-2. The space allocated to satisfy the dimensions of the connection section (S) connecting the connection space, if the size of the connection section (S) without satisfactory space between the two driving film (P-1, P-2) can be edited space (E) may appear as a boundary between the first section P-1 and the second section P-2.

As such, since there is virtually no editing space E, which becomes impossible to use due to the adhesion of the both sides of the article sections P-1 and P-2, the driving films are bonded to each other in the connection section S. It is possible.

4 illustrates a process of adhering a driving film according to an embodiment, and illustrates a case of adhering the driving film using an adhesive film.

As shown in FIG. 4, the embodiment has shown that both of the first product section P-1 including a1 and a2 and the second product section P-2 including the circuits a3 and a4 are bonded to each other. The adhesive film 100 is attached to the lower surfaces of the side article sections P-1 and P-2. The lower surface of the cut surface to which the adhesive film 100 is bonded is a surface on which the circuits a2 and a3 are not formed in the driving film when the driving film is a reference, and the front surface of the driving film is coated only on the rear surface of the driving film. The circuits a2 and a3 formed in the circuit can be prevented from being damaged. Thus, the size of the adhesive film 100 can be freely set in consideration of the adhesive strength of both side sections (P-1, P-2).

Here, the adhesive film 100 in the form of a tape, such as a polyimide adhesive film of the same material as the driving film, a film of a material filled with epoxy and an inorganic filler in glass fiber, a general cellophane adhesive film Various adhesive films 100 may be applied.

5 and 6 illustrate a bonding process of the driving film according to another embodiment, and illustrates a case in which the driving film is bonded by a laminating method.

As shown in FIG. 5, according to another embodiment, mutual bonding of the first product section P-1 including a1 and a2 and the second product section P-2 including circuits a3 and a4 are mutually bonded. In order to coat the adhesive layer 200 on the lower surface of the cut surfaces of both side sections (P-1, P-2). The lower surface of the cut surface on which the adhesive layer 200 is coated is a surface on which the circuits a2 and a3 are not formed in the driving film based on the driving film, and is formed on the front surface by coating the adhesive layer 200 only on the rear surface of the driving film. Damage to the circuits a2 and a3 can be prevented. The adhesive layer 200 may include an epoxy-based or acrylic-based adhesive material, and may also apply an instant adhesive, a thermosetting adhesive, a laser curable adhesive, or an ultrasonic curable adhesive.

FIG. 6 illustrates a state in which the thin film 300 is attached to the adhesive layer 200 to bond both side sections P-1 and P-2.

The thickness of the thin film 300 may be determined within the range in which the edited driving film P 'may be used, and considering the design factor of the driving film that is commonly used, the thickness of the thin film 300 May be set to 30 μm or less.

In the case of lamination of the thin film 300, a process of curing the adhesive layer 200 after adhering the thin film 300 to the adhesive layer 200 is performed. Thus, a portion of the adhesive layer 200 may penetrate into the spaced space between the cut surfaces and may be solidified. Since the size of the editing space E generated by the penetration of the adhesive layer 200 can be minimized by adjusting the coating amount of the adhesive material 200, the size of the editing space E is a circuit section A between the a2 circuit and the a3 circuit. It is formed smaller than the size of the connecting section (S) for connecting. Therefore, the defective section of the driving film due to the editing space (E) can be minimized.

7 is a flowchart illustrating a method of editing a driving film according to an embodiment, which illustrates a case of laminating a thin film to form an adhesive film layer.

In order to edit the driving film P, the section e in which a defect occurs in the driving film P is determined (S100). This can be determined visually by the operator, or the defective section e can be determined using the defective discrimination apparatus using the vision camera.

Defective section (e) is determined, by cutting both ends of the defective section (e) (S110).

Both side sections (P-1, P-2) from which the defective section (e) is removed are aligned to the adhesive position (S120). Both side sections (P-1, P-2) have the edited driving film (P ') in accordance with the design factor in consideration of the size of the circuit section (A) and the connection section (S) set as the design factor. So that it is aligned.

An adhesive layer is formed on the lower surfaces of the cut surfaces in contact with each other to form an adhesive layer 200 (S130). The adhesive material constituting the adhesive layer 200 may be an adhesive material such as epoxy-based or acrylic-based according to the type of the thin film 300 to be bonded later.

When the adhesive layer 200 is formed, the thin film 300 is attached (lamination) to the adhesive layer 200 (S140).

Thus, when the cut surfaces of both side sections (P-1, P-2) are bonded to each other and edited, it is determined whether the edited film P 'is defective (S150). The operator can determine whether the edited film P 'is defective by checking the adhesive strength, the bonding position, the adhesion state, the thickness and the width of the editing space E, etc. of the edited film P'.

When the inspection is completed, the edited drive film P 'can be shipped to the orderer (S160). Here, if it is confirmed that a bad section has occurred in the edited driving film (P ') can go back to step S110 to perform the editing operation.

Although described above with reference to the embodiment is only an example and is not intended to limit the invention, those of ordinary skill in the art to which the present invention does not exemplify the above within the scope not departing from the essential characteristics of this embodiment It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

1 is an edited state diagram of a driving film according to the prior art.

Figure 2 is an adhesive state of the drive film edited according to the prior art.

Figure 3 is an edited state of the drive film according to the embodiment.

Figure 4 is an adhesive state of the driving film according to an embodiment.

5 and 6 is a bonding process of the driving film according to another embodiment.

7 is a flowchart of a method of editing a driving film according to an embodiment.

Claims (12)

Cutting both ends of the defective section existing in the driving film; Arranging the driving film of the non-defective section in which the defective section is cut to be bonded to each other; Driving film editing method comprising the step of forming an adhesive film layer on both side lower surface of the drive film of the non-defective section. The method of claim 1, The adhesive film layer, A driving film editing method comprising at least one of a polyimide adhesive film, a film made of glass fiber filled with epoxy and an inorganic filler, and a general cellophane adhesive film. The method of claim 1, Forming an adhesive film layer on both lower surfaces of the driving film of the non-conforming section, Forming adhesive layers on both lower surfaces of the driving film of the non-conforming section; Driving film editing method comprising the step of attaching a thin film on the adhesive layer. The method of claim 3, The adhesive layer, A drive film editing method comprising at least any one of an acrylic adhesive, an epoxy adhesive, an instant adhesive, a thermosetting adhesive, a laser curing adhesive, and an ultrasonic curing adhesive. The method of claim 3, The thickness of the thin film is a driving film editing method is set larger than 0㎛ greater than or equal to 30㎛. The method of claim 1, Arranging the drive film of the non-defective section in which the defective section is cut to be bonded to each other, And a step of bonding the cut surfaces of the drive film to be bonded to each other within a connection section connecting the circuits formed on the drive film. A circuit section of a predetermined size having a circuit formed on the base film; A connection section having a predetermined size formed on the base film and connecting the circuit sections; And a editing section attached to both bottom surfaces of the base film to interconnect the cut surface of the base film within the connection section. The method of claim 7, wherein The editing section is a driving film comprising an adhesive film layer attached to both side lower surfaces of the base film. The method of claim 8, The adhesive film layer, A driving film comprising at least one of a polyimide adhesive film, a film of a glass fiber filled with epoxy and an inorganic filler, and a general cellophane adhesive film. The method of claim 7, wherein The editing section includes an adhesive layer formed on both lower surfaces of the base film; Driving film comprising a thin film layer attached to the adhesive layer. The method of claim 10, The adhesive layer, A drive film comprising at least one of an acrylic adhesive, an epoxy adhesive, an instant adhesive, a thermosetting adhesive, a laser curing adhesive, and an ultrasonic curing adhesive. The method of claim 10, The thickness of the thin film is a driving film is set larger than 0㎛ greater than or equal to 30㎛.

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