TW201318490A - Method for making printed circuit board assembly - Google Patents

Abstract

The present invention provides a method for making a printed circuit board assembly. The method includes steps below. A first printed circuit board assembly is provided. The first panel printed circuit board includes at least one first printed circuit board which is a defected printed circuit board. A second panel printed circuit board is provided. The second panel printed circuit board includes at least one second printed circuit board which is an accepted printed circuit board. The first printed circuit board has a same structure as the second printed circuit board. The first printed circuit board is separated from the first printed circuit board assembly, and the second printed circuit board is separated from the second printed circuit board assembly. Each of the first and second printed circuit board has a step-shaped connection end. The connection end of the first printed circuit board is adhered to that of the second printed circuit board, thereby obtaining a third printed circuit board assembly.

Description

Continuing circuit board manufacturing method

The invention relates to a circuit board manufacturing technology, and in particular to a method for manufacturing a contiguous circuit board.

Generally, the manufacturing process of the circuit board includes: fabricating a contiguous circuit board, which is a circuit board that has formed a circuit, the splicing circuit board includes a plurality of circuit board units, a waste area, and a micro connection area, and the circuit board The unit is the area where the circuit function is separated one by one after the completion of the circuit board, and the waste area is the part that needs to be removed after the board is hit. Wherein each of the circuit board units is connected to the scrap area by a micro-connection area, each of the circuit board units includes at least one driving area for mounting components, and each of the circuit board units The solder paste is printed on the printing area; the parts are mounted in the printing area of the printing solder paste; and the circuit board units after the mounting of the parts are separated from each other by the disconnection of the micro connection area to form a finished circuit board. If there is an electrical defective product in each of the circuit board units, it is not necessary to print solder paste and mounted components on the defective product to save solder paste and parts, but depending on the position of the defective product, it is necessary to The position of the defective product on the contiguous circuit board is shielded by the opening of the different positions of the printed steel plate, and the mounting process is also required to be mounted according to the position of the defective product on each contiguous circuit board. Therefore, the above operation greatly reduces the efficiency of printing solder paste and mounted parts. In order to improve printing and mounting efficiency, solder paste and mounted parts are usually printed on the defective product in actual production. Obviously, the defective product It can't be used after placing parts, so it wastes solder paste and parts, and the more the number of defective products, the more waste.

In view of the above, it is necessary to provide a method for forming a good number of contiguous circuit boards by transplanting, so as to reduce the waste of solder paste and parts caused by defective products during the writing.

A method of fabricating a contiguous circuit board, comprising the steps of: providing a first contiguous circuit board, the first contiguous circuit board comprising a plurality of first circuit board units, and a plurality of first circuit board units surrounding And a first waste area connected to the plurality of first circuit board units, the plurality of first circuit board units including at least one second circuit board unit, the at least one second circuit board unit being electrically defective; a second contiguous circuit board, the second contiguous circuit board comprising a plurality of third circuit board units, and a second waste material surrounding the plurality of third circuit board units and connected to the plurality of third circuit board units At least one of the plurality of third circuit board units is an electrical faulty product, the plurality of third circuit board units includes at least one fourth circuit board unit, and the at least one fourth circuit board unit is an electrical test product. The at least one fourth circuit board unit is identical to the at least two first circuit board units; the portion connecting the at least one second circuit board unit to the first waste area Cutting, forming a stepped first cut surface on the first continuous circuit board, and removing the at least one second circuit board unit; and the at least one fourth circuit board unit and the first Separating portions of the two scrap regions, forming a stepped second cut surface on the at least one fourth circuit board unit, separating the at least fourth circuit board unit, wherein the second cut surface Matching the first cut surface; and bonding the second cut surface to the first cut surface, thereby bonding the separated at least one fourth circuit board unit to remove the A third contiguous circuit board is formed on the first contiguous circuit board behind the at least one second circuit board unit.

The manufacturing method of the contiguous circuit board of the technical solution has the following advantages: transplanting the electrical circuit component of the second contiguous circuit board into a first contiguous circuit board, so that the first connection The number of good circuit board units in the chip board is increased, which can reduce the waste of solder paste and parts caused by defective products when the parts are punched; and the stepped shape cut surface formed by laser cutting can be bonded to increase the circuit of the transplanting The bonding force between the board unit and the first contiguous circuit board prevents the board unit that is transplanted from falling off during the hitting.

The method for fabricating the contiguous circuit board provided by the technical solution will be further described in detail below with reference to the accompanying drawings and embodiments.

The manufacturing method of the contiguous circuit board comprises the following steps:

In the first step, a first contiguous circuit board 10 is provided.

Referring to FIG. 1 , which is a plan view of the first splicing circuit board 10 , the first splicing circuit board 10 is rectangular, and includes a square first circuit board unit 101 , a first circuit board unit 101 . a square-shaped second circuit board unit 102, a first waste area 103 surrounding the first circuit board unit 101 and the second circuit board unit 102 and located around the first continuous circuit board 10, and a first The micro-connection area 104, wherein the first circuit board unit 101 is an electrical good test, and the second circuit board unit 102 is an electrical test defective product. The first circuit board unit 101, the second circuit board unit 102, and the first waste area 103 are spaced apart from each other by a gap therebetween, and the first micro connection area 104 is used for the first circuit board unit 101. The interconnection between the second circuit board unit 102 and the first waste area 103 causes the first circuit board unit 101, the second circuit board unit 102, and the first waste area 103 to be integrated. The first micro connection area 104 includes first to seventh connection areas 1041, 1042, 1043, 1044, 1045, 1046, 1047, and the first to seventh connection areas 1041, 1042, 1043, 1044, 1045, 1046 1047 are strips. Wherein the first to third connection regions 1041, 1042, 1043 connect the first circuit board unit 101 with the first waste area 103; the fourth connection area 1044 will be the first circuit board unit 101 is connected to the second circuit board unit 102; the fifth to seventh connection regions 1045, 1046, 1047 connect the second circuit board unit 102 with the first waste area 103. In the embodiment, the first continuous circuit board 10 serves as a circuit board that accepts the transplanted circuit board unit.

Referring to FIG. 2, which is a cross-sectional view of the first splicing circuit board 10, in the embodiment, the first splicing circuit board 10 is a double-sided flexible circuit board that has formed a conductive line, and includes a first conductive The layer 11, the second conductive layer 12, the first insulating layer 13 between the first conductive layer 11 and the second conductive layer 12, and the first covering layer outside the first conductive layer 11 and the second conductive layer 12, respectively 14 and a second cover film layer 15. The material of the first insulating layer 13 is polyester (PET) or polyimine (PI), and the first cover film layer 14 and the second cover film layer 15 each comprise a layer of glue and a layer of protection. a layer, a glue layer of the first cover film layer 14 and a glue layer of the second cover film layer 15 are respectively bonded to the first conductive layer 11 and the second conductive layer 12, and the glue layer is made of epoxy resin or acrylic Resin or the like, the material of the protective layer is polyester (PET) or polyimine (PI).

The first contiguous circuit board 10 can also be a single-layer or multi-layer flexible circuit board, and can also be a single-layer, double-layer or multi-layer rigid circuit board. It should be noted that the number of circuit board units on the first contiguous circuit board 10 is not limited. In this embodiment, only two circuit board units are included, and in fact, the number of contiguous circuit boards is generally two or more. As the circuit board that accepts the transplanted circuit board unit, the number of electrical defects detected on the first continuous circuit board 10 is not less than one, and the number of electrical products is not less than one. It is recommended that the number of electrical products be more than the number of defective products to reduce the number of transplants and improve the efficiency of transplantation. The first circuit board unit 101 and the second circuit board unit 102 may also have other shapes. The number of the connection areas included in the first micro connection area 104 may be other as long as the circuit board unit and the waste area can be connected.

In the second step, referring to Figures 3 and 4, a second contiguous circuit board 20 is provided. The second contiguous circuit board 20 and the first contiguous circuit board 10 are substantially identical except for the electrical connection measured by the electrical measurement.

The second slab circuit board 20 includes a third circuit board unit 201, a fourth circuit board unit 202 symmetrical with the third circuit board unit 201, and a fourth circuit board unit 201 and a fourth circuit board. a second scrap area 203 and a second micro-connection area 204 of the unit 202 located around the second slab circuit board 20, wherein the third circuit board unit 201 is an electrical faulty product, and the fourth circuit board The unit 202 is electrically measured, and the second micro connection area 204 includes eighth to fourteenth connection areas 2041, 2042, 2043, 2044, 2045, 2046, 2047, wherein the eighth to tenth connection areas 2041 The second circuit board unit 201 is connected to the second waste area 203, and the eleventh connection area 2044 connects the third circuit board unit 201 and the fourth circuit board unit 202. The twelfth to fourteenth connection regions 2045, 2046, 2047 connect the fourth circuit board unit 202 with the second waste region 203. In the embodiment, the second contiguous circuit board 20 serves as a circuit board for providing a good circuit board unit.

The number of circuit board units on the second contiguous circuit board 20 may also be two or more. As a circuit board for providing a good circuit board unit, the number of electrical products measured on the second splicing circuit board 20 is not Less than one, it is recommended that the number of defective products to be measured exceeds the number of electrical products, so that it is necessary as a circuit board for providing a good circuit board unit. Of course, the second splicing circuit board 20 may be different from the first slab circuit board 10, and at least one circuit board unit identical to the second circuit board unit 102 may be used.

In the third step, referring to FIG. 5, the second circuit board unit 102 is removed by laser cutting. It is also said that the fourth to seventh connection regions are cut by laser cutting to separate the second circuit board unit 102 from the first waste area 103 and the first circuit board unit 101. To remove the second circuit board unit 102.

The cutting manners of the fourth to seventh connecting regions 1044, 1045, 1046, and 1047 are the same, and the cutting of the seventh connecting portion 1047 in the drawing will be described as an example. The two faces defining the seventh connection region 1047 and the surface of the first cover film layer 14 and the surface of the second cover film layer 15 are side faces. First, one face of the first cover film layer 14 of the first slab circuit board 10 is laser-cut toward a lightning ray, wherein the laser light is cut from the surface of the first cover film layer 14 and the direction of the laser light is irradiated. Vertically perpendicular to the surface of the first cover film layer 14, the cutting depth is one half of the thickness of the first continuous circuit board 10, and the seventh connection region 1047 on the first continuous circuit board 10 forms the first The face 105 is cut.

Then, the first slab circuit board 10 is flipped so that the second cover film layer 15 of the first slab circuit board 10 is laser-cut toward the lightning ray, wherein the laser is irradiated from the surface of the second cover film layer 15. The cutting is performed, and the irradiation direction of the laser is perpendicular to the surface of the second cover film layer 15, and the cutting depth is also one half of the thickness of the first continuous circuit board 10, and the first continuous circuit board 10 is The upper seventh connection region 1047 forms a second cut surface 106. The first cut surface 105 and the second cut surface 106 are offset from each other in the extending direction of the seventh connection region 1047 , wherein the first cut surface 105 is closer to the second circuit board unit 102 .

Further, the first slab circuit board 10 is turned over such that the side surface of the seventh connection region 1047 faces the lightning ray, and laser cutting is performed along the middle portion of the first insulating layer 13, in the first contig The seventh connection region 1047 on the circuit board 10 forms a third cut surface 107, wherein the cutting direction extends from the first cut surface 105 to one end of the first insulating layer 13 to the second cut The face 106 is at one end of the first insulating layer 13, thereby breaking the seventh connection region 1047. That is, the cut surface of the seventh connection region 1047 on the first continuous wiring board 10 has a stepped shape, and is formed by sequentially connecting the first cut surface 105, the third cut surface 107, and the second cut surface 106. Then, the fourth to sixth connection regions 1044, 4045, 1046 are cut according to the cutting method of the seventh connection region 1047, so that the second circuit board unit 102 and the first waste region 103 and the first circuit The board units 101 are separated from each other. Finally, the second circuit board unit 102 is removed.

It can be understood that since the above cutting does not need to be very precise, other cutting means can also be used for the above cutting, such as milling cutting.

In the fourth step, referring to FIG. 6, in the same manner as the third step, the fourth circuit board unit 202 is separated from the second continuous circuit board 20 by laser cutting.

Separating the fourth circuit board unit 202 from the second slab circuit board 20 by laser cutting, wherein the eleventh to fourteenth connection regions 2044, 2045, 2046, 2047 are cut off positions The depth is the same as the cutting position and the depth of the fourth to seventh connection regions 1044, 1045, 1046, and 1047, and the fourteenth connection region 2047 on the fourth circuit board unit 202 is taken as an example. The cut surface of the fourteenth connection region 2047 has a stepped shape, and is formed by sequentially connecting the fourth cut surface 205, the fifth cut surface 206, and the sixth cut surface 207, because the eleventh to fourteenth joints are formed. The cutting positions and depths of the regions 2044, 2045, 2046, and 2047 are the same as the cutting positions and depths of the fourth to seventh connecting regions 1044, 1045, 1046, and 1047, so the fourth cutting surface 205, The fifth cut surface 206 and the sixth cut surface 207 are matched with the first cut surface 105, the third cut surface 107, and the second cut surface 106, respectively.

It can be understood that if the second splicing circuit board 20 is not identical to the first slab circuit board 10, as long as the second splicing circuit board 20 has at least one same circuit board as the second circuit board unit 102. For the unit, the same circuit board unit of the second contiguous circuit board 20 as the second circuit board unit 102 can be separated according to the method of step 3.

In the fifth step, referring to FIG. 5-7, the fourth circuit board unit 202 is adhered to the first continuous circuit board 10 by means of adhesive bonding to form a whole good product after transplantation. Three-piece circuit board 30.

First, the sixth cut surface 207 of the fourth circuit board unit 202 is coated with glue; then, the fourth circuit board unit 202 is placed on the first continuous circuit board 10, and the The eleventh to fourteenth connection regions 2044, 2045, 2046, and 2047 connected to the four circuit board units 202 are connected to the first to fourth circuit boards 10, respectively. The stepped cut surfaces of the joining regions 1044, 1045, 1046, 1047 are mated and bonded together. Taking the fourteenth connection region 2047 as an example, the fourth cut surface 205, the fifth cut surface 206, and the sixth cut surface 207 are respectively separated from the first cut surface of the first continuous wiring board 10 105. The second cut surface 106 and the third cut surface 107 are attached, and the sixth cut surface 207 and the third cut surface 107 are bonded by glue, thereby sticking the fourth circuit board unit 202. Connected to the first continuous circuit board 10; finally, the glue is cured to obtain a third continuous circuit board 30 including a first circuit board unit 101 and a fourth circuit board unit 202, the first circuit board Both the unit 101 and the fourth circuit board unit 202 are electrically good. That is, the fourth circuit board unit 202 is transplanted to the position of the second circuit board unit 102 in the first contiguous circuit board 10 to form the third contiguous circuit board 30.

It can be understood that if the third circuit board unit 201 is good and the fourth circuit board unit 202 is defective, the third circuit board unit 201 can be transplanted to the second circuit board unit 102 as long as each The cut surface and the cut position of the connection region may correspond to the cut surface and the cut position of each of the connection regions in the first continuous wiring board 10 after the second circuit board unit 102 is removed.

The cutting depth of the first cut surface 105 may be other depths, and is not limited to the middle portion of the first insulating layer, so as to facilitate cutting, and only the cutting depth and the third cutting of the first cutting surface 105 are required. The sum of the cutting depths of the faces 107 may be equal to the thickness of the first slab circuit board 10, that is, the first cut surface 105, the second cut surface 106, and the third cut surface 107 may need to be the seventh The connection area 1047 is cut.

Alternatively, the glue may be applied to the third cut surface 107. The glue can also be replaced by a solid pressure sensitive adhesive or the like. In addition, if the first contiguous circuit board 10 includes more than two circuit board units with poor electrical measurement, and the second splicing circuit board 20 has only one circuit board unit that is electrically measured, the method may be as follows. Several good circuit board units are then transferred from the other contiguous circuit boards to the first contiguous circuit board 10.

Compared with the prior art, the method for fabricating a contiguous circuit board of the present technical solution has the following advantages: transplanting a circuit board unit that is electrically measured in a second contiguous circuit board into a first contiguous circuit board, Increasing the number of good circuit board units in the first continuous circuit board can reduce the waste of solder paste and parts caused by defective products when the parts are punched; and the stepped cut surface formed by laser cutting is bonded The bonding force between the transplanted circuit board unit and the first contiguous circuit board can be increased to prevent the board unit that is transplanted from falling off during the hitting.

However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10. . . First contiguous circuit board

101. . . First circuit board unit

102. . . Second circuit board unit

103. . . First waste area

104. . . First micro-joining area

1041. . . First connection area

1042. . . Second connection zone

1043. . . Third connection zone

1044. . . Fourth connection zone

1045. . . Fifth connection zone

1046. . . Sixth connection zone

1047. . . Seventh connection zone

11. . . First conductive layer

12. . . Second conductive layer

13. . . First insulating layer

14. . . First cover layer

15. . . Second cover layer

20. . . Second contiguous circuit board

201. . . Third circuit board unit

202. . . Fourth circuit board unit

203. . . Second waste area

204. . . Second micro-joining area

2041. . . Eighth connection zone

2042. . . Ninth connection zone

2043. . . Tenth connection zone

2044. . . Eleventh connection zone

2045. . . Twelfth connection zone

2046. . . Thirteenth connection zone

2047. . . Fourteenth connection zone

105. . . First cut surface

106. . . Second cut surface

107. . . Third cut surface

205. . . Fourth cut surface

206. . . Fifth cut surface

207. . . Sixth cut surface

30. . . Third contiguous circuit board

1 is a schematic plan view of a first contiguous circuit board provided by an embodiment of the present technical solution.

2 is a cross-sectional view of a first contiguous circuit board provided by an embodiment of the present technical solution.

FIG. 3 is a schematic plan view of a second contiguous circuit board provided by an embodiment of the present technical solution.

4 is a cross-sectional view of a first contiguous circuit board provided by an embodiment of the present technical solution.

FIG. 5 is a schematic cross-sectional view showing the first circuit board unit in FIG.

6 is a schematic cross-sectional view showing the third circuit board unit of FIG. 4 separated.

FIG. 7 is a cross-sectional view of the third contiguous circuit board after transplantation according to the embodiment of the present technical solution.

101. . . First circuit board unit

1041. . . First connection area

1042. . . Second connection zone

1044. . . Fourth connection zone

1045. . . Fifth connection zone

1047. . . Seventh connection zone

202. . . Fourth circuit board unit

2044. . . Eleventh connection zone

2045. . . Twelfth connection zone

2047. . . Fourteenth connection zone

30. . . Third contiguous circuit board

Claims (8)

A method for manufacturing a contiguous circuit board, comprising the steps of:
Providing a first contiguous circuit board, the first contiguous circuit board comprising a plurality of first circuit board units, and a first one surrounding the plurality of first circuit board units and connected to the plurality of first circuit board units a waste area, the plurality of first circuit board units including at least one second circuit board unit, wherein the at least one second circuit board unit is an electrical faulty product;
Providing a second contiguous circuit board, the second contiguous circuit board including a plurality of third circuit board units, and a second surrounding the plurality of third circuit board units and connected to the plurality of third circuit board units In the scrap area, at least one of the plurality of third circuit board units is an electrical faulty product, the plurality of third circuit board units includes at least one fourth circuit board unit, and the at least one fourth circuit board unit is an electrical good product The at least one fourth circuit board unit is identical to the at least two first circuit board units;
Cutting a portion of the at least one second circuit board unit connected to the first scrap area, forming a stepped first cut surface on the first continuous circuit board, and removing the at least one Second circuit board unit;
Cutting a portion of the at least one fourth circuit board unit connected to the second scrap area, forming a stepped second cut surface on the at least one fourth circuit board unit, separating the at least fourth a circuit board unit, wherein the second cut surface matches the first cut surface; and the second cut surface is cooperatively bonded to the first cut surface, thereby separating the The at least one fourth circuit board unit is adhered to the first contiguous circuit board after removing the at least one second circuit board unit to form a third contiguous circuit board. The method of fabricating a contiguous circuit board according to claim 1, wherein the at least one second circuit board unit on the first contiguous circuit board is multiplexed with the first micro connection area and the first a waste area connected to an adjacent circuit board unit, wherein the at least one fourth circuit board unit on the second contiguous circuit board is adjacent to the second waste area by a plurality of second micro connection areas The board units are connected. The method for fabricating a contiguous circuit board according to the second aspect of the invention, wherein the plurality of first micro-joining regions and the plurality of second micro-joining regions are strip-shaped. The method of fabricating a contiguous circuit board according to claim 2, wherein the step of cutting off the portion of the at least one second circuit board unit connected to the first scrap area comprises: the first micro connection The region has two surfaces, the distance between the two surfaces is H1, and the first micro-joining region is cut out from a surface of the first micro-joining region to form a first slit, the first slit depth Is H2; cutting a position of the first micro-joining region from the opposite surface of the first micro-joining region to a position where the first micro-joining region is offset from the first slit, the second slit having a depth of H3, wherein H2+H3=H1; a third slit is horizontally cut between the bottom of the first slit and the bottom of the second slit, and the first slit, the second slit and the third slit are connected, thereby The at least one second circuit board unit is separated from the first contiguous circuit board. The method of fabricating a contiguous circuit board according to claim 2, wherein the step of cutting off the portion of the at least one fourth circuit board unit connected to the second waste area comprises: the second micro connection The region has two surfaces, the distance between the two surfaces is H4, and the second micro-joining region is cut out from a surface of the second micro-joining region to form a fourth slit, the fourth slit depth is H5 Cutting a second slit from a position at which the second micro-joining region and the fourth slit are offset from another surface of the second micro-joining region, the fifth slit depth being H6, wherein H5+H6=H4 Cutting a sixth slit between the bottom of the fourth slit and the bottom of the fifth slit, the fourth slit, the fifth slit and the sixth slit connecting the at least one fourth circuit board unit Separated from the second contiguous circuit board. The method for fabricating a contiguous circuit board according to claim 4, wherein the cutting method is laser cutting. The circuit board sub-board method according to claim 1, wherein the second cutting surface and the first cutting surface are adhered by glue. The method for manufacturing a contiguous circuit board according to the first aspect of the invention, wherein the bonding manner between the second cut surface and the first cut surface is by pressure sensitive adhesive bonding.