CN109905965A - Circuit board is in flakes - Google Patents
Circuit board is in flakes Download PDFInfo
- Publication number
- CN109905965A CN109905965A CN201811436542.8A CN201811436542A CN109905965A CN 109905965 A CN109905965 A CN 109905965A CN 201811436542 A CN201811436542 A CN 201811436542A CN 109905965 A CN109905965 A CN 109905965A
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- Prior art keywords
- circuit board
- flakes
- bridge part
- engagement
- geometry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09027—Non-rectangular flat PCB, e.g. circular
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to circuit boards in flakes (1), for method of the manufacture for the method for the circuit board (10) of sensor unit and for manufacturing the pre-assembled component (2) for sensor unit using this circuit board (1) in flakes in the case where using this circuit board (1) in flakes, the circuit board has frame (3) in flakes, at least one keeps bridge part (5) and multiple circuit boards (10), the circuit board is arranged in frame (3) with row and column and keeps bridge part (5) or frame (3) to connect at least one by least one segmentation bridge part (7) respectively, wherein, circuit board (10) has at least one guidance edge (12), the guidance edge has corresponding first engagement geometry (14).Herein, at least one guidance edge (12) with the first engagement geometry (14) forms at least one segmentation bridge part (7), and keeps bridge part (5) or frame (3) to connect at least one.
Description
Technical field
The present invention relates to according to the circuit board of the types of independent claims 1 in flakes.Object of the invention is also to use
This circuit board in flakes in the case where for manufacture for sensor unit circuit board method and for manufacture for passing
The method of the pre-assembled component of sensor cell.
Background technique
In a manufacturing process, single circuit board be unified into it is so-called in flakes.For for example for the small circuit of sensor
Plate can each be combined by 100 single circuit boards in flakes.In general, being assemblied in in flakes for circuit board carries out, and
The circuit board for completing assembly and welding separates before the mounting.It is separately realized by milling technology, tolerance is relatively very big wherein.
In additional technique, for example step rushes in technique the engagement geometry that circuit board is made, and is used for circuit board connecing during installation
More accurate size is closed and be orientated and should have, follows scheduled tolerance in order on engagement geometry.For from plate
In cut out and the manufacturing method of workpieces processing be known as walk punching.This method is characterized in that simple molding tool is continuously fed at the same time
When periodic up and down motion.In order to cut out complicated shape, rotating tool and it can be made to transport in all directions
It is dynamic.Because needing retentivity to separate circuit board using milling technology, corresponding keep bridging so being provided in flakes
Portion.It is known from the state of the art in flakes, there are 144 single circuit boards.
By 10 2,014 216 158 Al of DE become known for the pre-assembled component of pressure sensor, pressure sensor and
For manufacturing such method of pre-assembled component using such circuit board in flakes, the circuit board is in flakes hereinafter
It is illustrated with reference to Fig. 5 and Fig. 6.As Fig. 5 and Fig. 6 further it is visible as, 1A includes frame to such circuit board in flakes
3, multiple holding bridge parts 7 and multiple circuit boards 10, the circuit board are arranged in frame 3 with row and column.Single circuit board 10
It is accordingly arranged between two holding bridge parts 5 or is arranged in frame 3 and keep between bridge part 5 and by segmentation bridge part
7 connect with bridge part 5 or frame 3 is kept.In addition, circuit board 10 is respectively provided with two guidance edge 12, with corresponding
One engagement geometry 14.As Fig. 6 further it is visible as, first engagement geometry include multiple guidance edges
14.1,14.2,14.3, they guide corresponding circuit board 10 during installation or form corresponding backstop.According to being used for for explanation
The method for manufacturing the coupling arrangement as the pre-assembled component 2 for pressure sensor, the base of support unit or osculating element 20
The half-shell of body is assembling 10 period of circuit board at least one electronics and/or electric member and circuit board 10 electrically and mechanically
Connection.And then, single circuit board 10 is split from circuit board in flakes 1A by milling as follows, that is, electricity
The single segmentation bridge part 7 of road plate 10 is cut off by milling process, and segmentation bridge part bridge joint is in single circuit board 10 and protects
Hold the gap 9A between bridge part 5 or frame 3.
Summary of the invention
The circuit board of feature with independent claims 1 in flakes and the feature with independent claims 10 for making
Make the method for the circuit board for sensor unit and the feature with independent claims 11 for manufacturing for sensing
The method of the pre-assembled component of device unit this have the advantage that, the packing density of each circuit board in flakes can be improved, and pass through
Space loss and waste material can be reduced by cancelling additional segmentation bridge part.In addition, by using high-precision effortless laser point
Segmentation method guides laser beam along scheduled cut-off rule, can cancel the accurate side for manufacturing the first engagement geometry
The additional process of edge.In addition, can cancel on single circuit board for grabbing and protecting during the milling method used so far
Region needed for holding circuit board, because milling method is not compared to laser separation method in embodiments of the present invention
Effortless dividing method, and need gripping apparatus.It, can be in circuit board size by cancelling the additional holding area on circuit board
The advantageously layout area of increasing circuit plate, or the size of reduction circuit board when keeping identical.This is especially manufacturing small electricity
It is advantageous when the plate of road, very high requirement additionally is proposed to the tolerance of the first engagement geometry.It is bridged by segmentation
The combination that portion engages geometry with first most preferably using advantage and can make to keep bridge part by means of laser separation method
Less.The embodiment of circuit board according to the present invention in flakes may include having more the single circuit board until about 50% as a result,.
In addition, embodiments of the present invention reduce due to the active force when dividing or grabbing circuit board and are applied to dress
The mechanical pressure on circuit board prepared.Further, since small segmentation width so that in laser separation method splitting speed compared with
Low disadvantage is alleviated.Because not needing the additional process at the accurate edge for manufacturing the first engagement geometry, institute
With can be advantageously with cheap preferred circuit plate.Due to there is no milling dust, it may be advantageous to prevent or at least reduce pair
The pollution of the circuit board assembled.
Embodiments of the present invention provide a kind of circuit board in flakes, with frame, at least one keep bridge part with
And multiple circuit boards, circuit board are arranged in frame with row and column and respectively by least one segmentation bridge parts and at least one
A holding bridge part or frame connection.Circuit board has at least one guidance edge, with corresponding first engagement geometry knot
Structure.Here, with first engagement geometry at least one guidance edge formed at least one segmentation bridge part and with extremely
A few holding bridge part or frame connection.
Further it is proposed that a kind of for electricity of the manufacture for sensor unit using this circuit board in flakes
The method of road plate.Circuit board has at least one guidance edge, with corresponding first engagement geometry.By single electricity
Road plate from circuit board in flakes in split.Here, executing the segmentation of single circuit board using laser beam, laser beam is along predetermined
Cut-off rule movement, and at the same time generate at least one guidance edge engagement geometry.
Further it is proposed that a kind of for manufacturing using this circuit board in flakes for the pre- of sensor unit
The method of build-up member.Pre-assembled component includes the circuit board and osculating element with electronic circuit.In addition, circuit board is in flakes
Single circuit board assembles and is welded with the part and osculating element of electronic circuit.After the welding process by single circuit board
It is split in flakes from circuit board.Here, the segmentation of single circuit board is executed using laser beam, laser beam is along scheduled
Cut-off rule movement, and at the same time generating the engagement geometry of at least one guidance edge of corresponding circuit board.
It can be advantageously improved in independent claims 1 by the measure illustrated in the dependent claims and improvement project
The circuit board of explanation is in flakes.
It is particularly advantageous that at least one guidance edge can construct at the first end of corresponding circuit board.In addition, can
The second engagement of construction geometry at the second end that the opposite with first end of circuit board is set.Here, pre- in order to be formed
Build-up member, the first engagement geometry can be engaged with sensor bracket or fixed flange, and the second engagement geometry can
It is engaged with osculating element.
In the advantageous design scheme of circuit board in flakes, frame may include two edge and each other of extension parallel to each other
The two connection bridge parts stretched in parallel, connection bridge part can be respectively perpendicular to two edge and arrange and can connect each other edge
It connects.Here, at least one keeps bridge part that can be parallel to edge or is parallel to connection bridge part extension.If at least one keeps
Bridge part is parallel to two edge extensions, at this point, at least one keeps bridge part that two connection bridge parts is made to be connected to each other.If
At least one keeps bridge part to be parallel to two connection bridge part extensions, at this point, at least one keeps bridge part to make two edge
It is connected to each other.In addition, at least one settable bracketing bridge part, can keep bridge part extension perpendicular at least one.Pass through
This bracketing bridge part can advantageously improve the rigidity of circuit board in flakes.
In another advantageous design scheme of circuit board in flakes, two circuits being connect side by side with same holding bridge part
Plate can be separated from each other by gap.In addition, two circuit boards arranged can be rotated relative to one another 180 ° disposed opposing each otherly.?
This, the second engagement geometry of first circuit board can engage geometry towards the second of second circuit board.In addition, the first electricity
First engagement geometry of road plate can be connect with frame or the first holding bridge part, and the first engagement of second circuit board is several
What structure can be connect with subsequent holding bridge part.In addition, the first engagement geometry of tertiary circuit plate can be towards the second electricity
The first of road plate engages geometry and connect with same holding bridge part.In addition, the second engagement geometry of the 4th circuit board
Structure can engage geometry towards the second of tertiary circuit plate, wherein the first engagement geometry of the 4th circuit board can be with
Subsequent holding bridge part or frame connection.By the arrangement, corresponding two of the circuit board of two facing each other assembly
Osculating element is opposite with small spacing and sets, so that the outer of two osculating elements of pollution can be prevented during subsequent welding process
Portion's contact element at least reduces pollution risk.
Detailed description of the invention
It is further elaborated in embodiment and following discussion the invention is shown in the accompanying drawings.Attached
Identical appended drawing reference shown in figure indicates to implement the part or element of same or similar function.
Fig. 1 shows the top view of the embodiment of circuit board according to the present invention in flakes, circuit board carried out assembly and
Welding.
Fig. 2 shows the detailed diagrams of Fig. 1.
Fig. 3 shows the three-dimensional detailed diagram of Fig. 2.
Fig. 4 show the circuit board from Fig. 1 to Fig. 3 in flakes in split, pre-assembled portion for sensor unit
The top view of part.
Fig. 5 shows the schematical three-dimensional diagram of known circuit board in flakes from the prior art, circuit board section
It is assembled and has been welded in ground.
Fig. 6 shows the detailed diagram of Fig. 5.
Specific embodiment
As visible as Fig. 1 to Fig. 4, circuit board according to the present invention in flakes 1 the embodiment shown include frame
3, at least one keeps bridge part 5 and multiple circuit boards 10, the circuit board to be arranged in frame 3 with row and column and pass through respectively
At least one segmentation bridge part 7 keeps bridge part 5 or frame 3 to connect at least one.Circuit board 10 is at least one guidance
Edge 12, the guidance edge have corresponding first engagement geometry 14.Here, there is the first engagement geometry 14 extremely
A few guidance edge 12 forms at least one segmentation bridge part 7, and keeps bridge part 5 or frame 3 to connect at least one.
As Fig. 1 further it is visible as, in the illustrated embodiment, implement and including each other to 3 rectangle of frame
Two connection bridge parts 3.3,3.4 of two edge 3.1,3.2 and extension parallel to each other that stretch in parallel connect bridging part
It is not arranged perpendicular to two edge 3.1,3.2 and edge is connected to each other.In the diagram according to Fig. 1, two edge 3.1,
3.2 vertically stretch, and the horizontal extension of two connection bridge parts 3.3,3.4.In addition, in the illustrated embodiment, being parallel to
Circuit board 1 is divided into two half-unit in flakes by the bracketing bridge part 4 that edge 3.1,3.2 stretches.In addition, in the illustrated embodiment,
Circuit board 1 includes in flakes five holdings bridge parts 5, is parallel to and connects bridge part 3.3,3.4 and perpendicular to edge 3.1,3.2
It is stretched with bracketing bridge part 4.As a result, in the illustrated embodiment, keep bridge part 5 and bracketing bridge part 4 by circuit board in flakes 1
It is divided into the region of 12 same sizes, is respectively disposed with 18 individual circuit boards 10 or 18 pre-assembled portions wherein
Part 2.
As Fig. 1 to Fig. 4 further it is visible as, at least one guidance edge 12 be formed in corresponding circuit board 10
At first end, wherein be configured with the second engagement geometry at the second end that the opposite with first end of circuit board 10 is set
Structure 15.In the illustrated embodiment, single circuit board 10 respectively includes two guidance edge 12, is respectively provided with first and connects
Geometry 14 is closed, which for example respectively includes three guidance edges 14.1,14.2,14.3.Via
One engagement geometry 14, single circuit board 10 can be when assembling corresponding unshowned sensor unit and sensor bracket
Or fixed flange engagement.As Fig. 1, Fig. 2 and Fig. 4 further it is visible as, single circuit board 10 second engagement geometry
Structure 15 is engaged with osculating element 20 respectively.
As Fig. 1 to Fig. 4 further it is visible as, each pre-assembled component 2 respectively includes 10 He of circuit board assembled
Osculating element 20.Circuit board 10, which is implemented as, in two sides can carry out assembly and including electronic circuit 16, which has extremely
A few electronics and/or electric member 16.1,16.2, for example, execute the original signal of sensor element signal gain and/
Or processing.In the illustrated embodiment, electronic circuit 16 include specific integrated circuit (ASIC) 16.1 and have it is multiple electrical and/
Or the corresponding protection circuit of electronic structure element 16.2.Between ASIC16.1 and electrical and/or electronic structure element 16.2
Electrical connection established by conductor circuit not shown further and welding position.The pre-assembled component shown can be used for not
The pressure sensor unit shown.It is surveyed here, unshowned pressure can be received via the contact surface 18 of arrangement on the circuit board 10
It measures the electrical output of element and passes it to electric circuit.Obviously, this pre-assembled component can also be used in other biographies
Sensor cell detects other physical parameters, such as acceleration, speed, power etc. via corresponding measuring cell.In addition,
Measuring cell also can be integrated into ASIC16.1.
In the illustrated embodiment, osculating element 20 forms external electrical interface, has at least one external contacts
Position 24.At least one electrical output of electronic circuit 16 can be obtained via at least one external contact position 24.Such as by scheming
1, as Fig. 2 and Fig. 4 is further visible, the matrix 22 of osculating element 20 has columnar shape and in the illustrated embodiment
Including two half-shell 22A, they are respectively provided at least one external contact position 24 of external electrical interface.In addition, contact is single
There is member 20 third not shown further to engage geometry, be at least partially accommodated circuit board 10.In the implementation shown
In example, the matrix 22 of osculating element 20 has the third engagement geometry for being embodied as accommodating opening, outer with circuit board 10
Outline, and it is at least partially accommodated into the second engagement geometry 15 at the second end of circuit board 10.In outside
Between at least one external contact position 24 of electric interfaces and at least one corresponding interior contact position 19 of circuit board 10
At least one electrical connection via at least one construction being established through contact portion in the matrix 22, should through contact portion with
The relevant cooperation contact site 26 of at least one of matrix 22 is electrically connected, and the cooperation contact site is again via at least one weldering
Therefore and electronic circuit it connects electrical and is mechanically connect at least one interior contact position 19 of circuit board 10 in succession, and
16 electrical connections.In the illustrated embodiment, there are four external contact positions 24 for the tool of osculating element 20, wherein in each half-shell
There are two external contact positions 24 for arrangement on 22A.In addition, in the embodiment of osculating element 20 shown, in the every of matrix 22
The contact element 28 of spring is disposed at a half-shell 22A so that in combined state at the outer profile of matrix 22 cloth
The contact element 28 there are two spring disposed opposing each other is set, osculating element 20 is made to be centered in unshowned protection
It is become easy in set.In addition, in the illustrated embodiment, the matrix 22 of support unit 20 has edge 23 outstanding, connecing
Unshowned protective case is sealed in the state of conjunction.Thus it can advantageously prevent dirt particle, chip etc. from entering the interior of protective case
In portion.
As further visible as Fig. 1 to Fig. 3, two side by side with the same circuit boards 10 that connect of holding bridge part 5
It is separated from each other by gap 9.Bridge part 5 is not kept to stretch between two circuit boards 10 because being different from the prior art, institute
Gap 9 is obviously reduced in the prior art with comparable.
As Fig. 1 to Fig. 3 further it is visible as, two circuit boards 10 arranged disposed opposing each otherly are relative to each other
180 ° of rotation.It means that second engagement of the second engagement geometry 15 of first circuit board 10 towards second circuit board 10
Geometry 15, wherein the first engagement geometry 14 of first circuit board 10 is connect with frame 3 or the first holding bridge part 5,
And the first engagement geometry 14 of second circuit board 10 is connect with subsequent holding bridge part 5.In addition, tertiary circuit plate 10
First engagement geometry 14 towards second circuit board 10 first engage geometry 14 and with same holding bridge part 5
Connection.In addition, the second engagement geometry 15 of the 4th circuit board 10 engages geometry towards the second of tertiary circuit plate 10
15, wherein the first engagement geometry 14 of the 4th circuit board 10 is connect with subsequent holding bridge part 5 or frame 3.
As Fig. 1 and Fig. 2 further it is visible as, pass through this arrangement, the electricity of the assembly of two facing each other
Corresponding two osculating elements 20 of road plate 10 are opposite with the spacing of very little and set, so that can prevent during subsequent welding process
The external contact element 24 of two osculating elements 20 is polluted, or can at least reduce pollution risk.
For for using circuit board in flakes 1 in the case where manufacture for sensor unit circuit board 10 according to this
The embodiment of the method for invention 1 is partitioned into single circuit board 10 in flakes from circuit board, which is respectively provided at least one
A guidance edge 12, with corresponding first engagement geometry 14.Here, executing single circuit board 10 using laser beam
Segmentation, laser beam are moved along scheduled cut-off rule 8, and at the same time generating the engagement geometry of at least one guidance edge 12
14.Then, from circuit board, 1 circuit board 10 split can be assembled individually in flakes.
Manufacture is used for the pre-assembled of sensor unit in the case where for the circuit board for text explanation in use in flakes 1
The embodiment according to the method for the present invention of component 2, first for circuit board in flakes 1 the single assembly of circuit board 10 and welding
The part 16.1,16.2 and osculating element 20 of corresponding electronic circuit 16.After the welding process, from 1 point in flakes of circuit board
Single circuit board 10 or pre-assembled component 2 are cut out, circuit board 10 is respectively included, which has electronic circuit 16 and connect
Touch unit 20.Here, executing the segmentation of single circuit board 10 using laser beam, laser beam is moved along scheduled cut-off rule 8, and
And the engagement geometry 14 of at least one guidance edge 12 of corresponding circuit board 10 is generated simultaneously.In circuit board in flakes 1
In the embodiment shown, circuit board 10 respectively includes two guidance edge 12, has corresponding guidance profile 14.Such as by Fig. 2
To Fig. 4 further it is visible as, corresponding cut-off rule 8 trend corresponding to relevant circuit board 10 it is corresponding first engagement
The trend at the guidance edge 14.1,14.2,14.3 of geometry 14.
Claims (11)
1. a kind of circuit board is in flakes (1), with frame (3), at least one keep bridge part (5) and multiple circuit boards (10),
The circuit board is arranged in the frame (3) with row and column and respectively by least one segmentation bridge part (7) and at least one
A holding bridge part (5) or the frame (3) connection, wherein the circuit board (10) has at least one guidance edge (12),
The guidance edge has corresponding first engagement geometry (14), which is characterized in that has the first engagement geometry
(14) at least one guidance edge (12) formed at least one described segmentation bridge part (7) and at least one described holding
Bridge part (5) or the frame (3) connection.
2. circuit board according to claim 1 is in flakes (1), which is characterized in that at least one described guidance edge (12) structure
Make at the first end of corresponding circuit board (10), wherein in the opposite with the first end of the circuit board (10) and
The second engagement geometry (15) is configured at the second end set.
3. circuit board according to claim 2 is in flakes (1), which is characterized in that described first engagement geometry (14) energy
It is engaged with sensor bracket or fixed flange, and second engagement geometry (15) can be engaged with osculating element (20).
4. circuit board according to any one of claim 1 to 3 is in flakes (1), which is characterized in that the frame (3) includes
Two edge (3.1,3.2) of extension parallel to each other and two connection bridge parts (3.3,3.4) of extension parallel to each other, the company
It connects bridge part to be respectively perpendicular to described two edge (3.1,3.2) arrangement and the two edge is made to be connected to each other, wherein described
At least one holding bridge part (5), which is parallel to the edge (3.1,3.2) or is parallel to the connection bridge part (3.3,3.4), stretches
Prolong.
5. circuit board according to claim 5 is in flakes (1), which is characterized in that at least one bracketing bridge part (4) perpendicular to
At least one described holding bridge part (5) extension.
6. circuit board according to any one of claim 1 to 5 is in flakes (1), which is characterized in that two side by side with same guarantor
The circuit board (10) for holding bridge part (5) connection is separated from each other by gap (9).
7. circuit board according to any one of claim 1 to 6 is in flakes (1), which is characterized in that two disposed opposing each other
The circuit board (10) of ground arrangement is rotated relative to one another 180 °.
8. circuit board according to claim 7 is in flakes (1), which is characterized in that the second engagement of first circuit board (10) is several
Second engagement geometry (15) of what structure (15) towards second circuit board (10), wherein the first circuit board (10)
First engagement geometry (14) keeps bridge part (5) to connect with the frame (3) or first, and the second circuit board
(10) the first engagement geometry (14) is connect with subsequent holding bridge part (5).
9. circuit board according to claim 8 is in flakes (1), which is characterized in that the first engagement of tertiary circuit plate (10) is several
What structure (14) towards the second circuit board (10) first engage geometry (14) and with same holding bridge part (5)
Connection, and second engagement of the second engagement geometry (15) of the 4th circuit board (10) towards the tertiary circuit plate (10)
Geometry (15), wherein the first engagement geometry (14) of the 4th circuit board (10) and subsequent holding bridge part
(5) or the frame (3) connects.
10. one kind using circuit board according to any one of claim 1 to 9 (1) in flakes for manufacturing
The method of circuit board (10) for sensor unit, wherein the circuit board (10) has at least one guidance edge (12),
The guidance edge has corresponding first engagement geometry (14), wherein by single circuit board (10) from the circuit board
(1) is split in flakes, which is characterized in that the segmentation of single circuit board (10) is executed using laser beam, the laser beam along
Scheduled cut-off rule (8) movement is and at the same time generate the engagement geometry (14) of at least one guidance edge (12).
11. one kind using circuit board according to any one of claim 1 to 9 (1) in flakes for manufacturing
The method of pre-assembled component (2) for sensor unit, wherein the pre-assembled component (2) includes having electronic circuit
(16) circuit board (10) and osculating element (20), wherein the circuit board in flakes single circuit board (10) assembly of (1) and
It is welded with the part (16.1,16.2) and osculating element (20) of corresponding electronic circuit (16), wherein the single circuit board
(10) it is split in flakes (1) from the circuit board after the welding process, which is characterized in that execute the list using laser beam
The segmentation of a circuit board (10), the laser beam are moved along scheduled cut-off rule (8) and at the same time generating corresponding circuit board
(10) the engagement geometry (14) of at least one guidance edge (12).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017221543.7 | 2017-11-30 | ||
| DE102017221543.7A DE102017221543A1 (en) | 2017-11-30 | 2017-11-30 | PCB panels |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109905965A true CN109905965A (en) | 2019-06-18 |
| CN109905965B CN109905965B (en) | 2022-06-28 |
Family
ID=66547735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811436542.8A Active CN109905965B (en) | 2017-11-30 | 2018-11-28 | Circuit board connecting piece |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20190064497A (en) |
| CN (1) | CN109905965B (en) |
| DE (1) | DE102017221543A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112203406A (en) * | 2019-07-08 | 2021-01-08 | 相互股份有限公司 | Soft and hard composite circuit board framework manufactured in whole piece mode |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103096641A (en) * | 2011-10-28 | 2013-05-08 | 富葵精密组件(深圳)有限公司 | Manufacture method of contiguous circuit board |
| CN103635023A (en) * | 2012-08-27 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit boards |
| CN104113993A (en) * | 2013-04-17 | 2014-10-22 | 富葵精密组件(深圳)有限公司 | Continuous circuit board and method for manufacturing same |
| CN106030270A (en) * | 2014-02-17 | 2016-10-12 | 罗伯特·博世有限公司 | Connection device for a pressure sensor, pressure sensor, and method for producing a connection device |
| CN206042500U (en) * | 2016-08-19 | 2017-03-22 | 江苏正桥影像科技股份有限公司 | Circuit board with contract in microconnection printing ink |
-
2017
- 2017-11-30 DE DE102017221543.7A patent/DE102017221543A1/en active Pending
-
2018
- 2018-11-28 CN CN201811436542.8A patent/CN109905965B/en active Active
- 2018-11-29 KR KR1020180150475A patent/KR20190064497A/en not_active Application Discontinuation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103096641A (en) * | 2011-10-28 | 2013-05-08 | 富葵精密组件(深圳)有限公司 | Manufacture method of contiguous circuit board |
| CN103635023A (en) * | 2012-08-27 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit boards |
| CN104113993A (en) * | 2013-04-17 | 2014-10-22 | 富葵精密组件(深圳)有限公司 | Continuous circuit board and method for manufacturing same |
| CN106030270A (en) * | 2014-02-17 | 2016-10-12 | 罗伯特·博世有限公司 | Connection device for a pressure sensor, pressure sensor, and method for producing a connection device |
| CN206042500U (en) * | 2016-08-19 | 2017-03-22 | 江苏正桥影像科技股份有限公司 | Circuit board with contract in microconnection printing ink |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112203406A (en) * | 2019-07-08 | 2021-01-08 | 相互股份有限公司 | Soft and hard composite circuit board framework manufactured in whole piece mode |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190064497A (en) | 2019-06-10 |
| CN109905965B (en) | 2022-06-28 |
| DE102017221543A1 (en) | 2019-06-06 |
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