CN206042500U - Circuit board with contract in microconnection printing ink - Google Patents
Circuit board with contract in microconnection printing ink Download PDFInfo
- Publication number
- CN206042500U CN206042500U CN201620906781.5U CN201620906781U CN206042500U CN 206042500 U CN206042500 U CN 206042500U CN 201620906781 U CN201620906781 U CN 201620906781U CN 206042500 U CN206042500 U CN 206042500U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- micro
- force sensing
- laser
- board unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Laser Beam Processing (AREA)
Abstract
The utility model discloses a circuit board with contract in microconnection printing ink, package rubbing board frame, be located a plurality of circuit board unit of sheet frame, between the circuit board unit and continuous through the microconnection between circuit board unit and the sheet frame, the department is cut apart with continuous of circuit board unit for laser to the microconnection, and circuit board unit all last laser departments of cutting apart contract in having microconnection printing ink. The utility model discloses contract in having set up microconnection printing ink, laser cutting position department does not have printing ink, and cutting panel can not cause the printing ink burn to remain when laser divides the board to simultaneously can improve laser cutting efficiency.
Description
Technical field
The utility model is related to a kind of circuit board inside contracted with micro-force sensing ink, be applied to camera module (mobile phone module,
Vehicle-mounted module, fingerprint set module, intelligent module), belong to the circuit board production techniques such as PCB, COF, FPC, R-F field.
Background technology
In the preparation technology of the circuit boards such as PCB/COF/FPC/R-F, need to carry out a point plate by laser cutting machine, at present,
PCB/COF/FPC/R-F PCB micro-force sensings ink without inside contracting, laser high temperature burn cut point ink, assembling chip during laser point plate
After can cause secondary pollution.And there is ink at laser separation can affect laser point plate efficiency.
Utility model content
Goal of the invention：For problems of the prior art, the utility model is provided and is inside contracted with micro-force sensing ink
Circuit board, cutting position do not have ink such that it is able to improves cutting efficiency and does not result in ink burn residual.
Technical scheme：For achieving the above object, the utility model is adopted the following technical scheme that：
With the circuit board that micro-force sensing ink is inside contracted, including sheet frame, several circuit board units in sheet frame, circuit
It is connected by micro-force sensing between Slab element and between circuit board unit and sheet frame, the micro-force sensing and circuit board unit connecting place
At laser separation, there is micro-force sensing ink to inside contract at all laser separations on circuit board unit.
Preferably, the sheet frame is rectangular shape, the circuit board unit rectangular permutation arrangement in sheet frame.
Preferably, the circuit board unit passes sequentially through micro-force sensing by row in rectangular plate-and-frame being connected or by leu
It is connected by micro-force sensing.
Preferably, the length that the micro-force sensing ink is inside contracted is more than the length at laser separation, width is 0.1-
0.2mm。
Beneficial effect：The utility model is provided with micro-force sensing ink and inside contracts, and does not have ink, in laser at laser cutting position
When dividing plate, cutting sheet material does not result in ink burn residual, and while can improve laser cutting efficiency.With prior art phase
Than, the utility model has the advantages that：Equipment substandard products are reduced first；Secondly, can quickly when product stream go to subsequent processing, raising
Efficiency；3rd, reduce the fraction defective because of product gap caused by sheet material deficient purchase.
Description of the drawings
Structural representations of the Fig. 1 for the utility model embodiment.
Fig. 2 is the partial enlarged drawing at position B in Fig. 1.
Specific embodiment
Below in conjunction with the accompanying drawings and specific embodiment, further illustrate the utility model.
The present embodiment is illustrated by taking pcb board as an example, skilled person will appreciate that scheme of the present utility model not only may be used
With application and pcb board, the circuit boards such as COF, FPC, R-F are equally applicable to.As described in Fig. 1,2, a kind of tool disclosed in the present embodiment
The circuit board for having micro-force sensing ink to inside contract, including pcb board frame 1, pcb board micro-force sensing 2, several single PCS Slab elements 3, micro-force sensing
Ink is inside contracted 5 at 4 and list PCS laser separations.Wherein pcb board frame 1 is rectangular plate-and-frame, is fixed by SMT tools, and specific size can root
Depending on according to production design scale, module circuit is printed on single PCS Slab elements 3, is arranged in pcb board frame 1 in rectangle permutation mode
Portion, single PCS Slab elements 3 using only row wise or column wise by the way of be connected in series by micro-force sensing 2 and be fixed on inframe, can be according to list
The concrete shape of PCS Slab elements 3 selects the number of micro-force sensing 2 and connected position, and connecting place is list 5 at list PCS laser separations
At all laser separations on PCS Slab elements 3,5 all there is micro-force sensing ink to inside contract.Plate factory is oily at micro-force sensing in printing-ink
Ink inside contracts 0.15 ± 0.05mm, and laser point plate cutting need not cut ink, ink of will not burning.
Above-described embodiment is only intended to clearly illustrate the utility model example, and is not to of the present utility model
The restriction of embodiment.For those of ordinary skill in the field, which can also be made on the basis of the above description
The change or variation of its multi-form.There is no need to be exhaustive to all of embodiment.And these belong to this reality
With new spirit it is extended obvious change or variation still in protection domain of the present utility model among.
Claims (4)
1. the circuit board that there is micro-force sensing ink to inside contract, including sheet frame, several circuit board units in sheet frame, circuit board
It is connected by micro-force sensing between unit and between circuit board unit and sheet frame, it is characterised in that the micro-force sensing and circuit board
Unit connecting place is, at laser separation, there is micro-force sensing ink to inside contract at all laser separations on circuit board unit.
2. the circuit board inside contracted with micro-force sensing ink according to claim 1, it is characterised in that the sheet frame is rectangle
Shape, the circuit board unit rectangular permutation arrangement in sheet frame.
3. the circuit board inside contracted with micro-force sensing ink according to claim 2, it is characterised in that the circuit board unit
Micro-force sensing is passed sequentially through by row in the rectangular plate-and-frame be connected or micro-force sensing passed sequentially through by row be connected.
4. the circuit board inside contracted with micro-force sensing ink according to claim 1 or 2 or 3, it is characterised in that micro- company
Length that ink inside contracts is connect more than the length at laser separation, width is 0.1-0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620906781.5U CN206042500U (en) | 2016-08-19 | 2016-08-19 | Circuit board with contract in microconnection printing ink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620906781.5U CN206042500U (en) | 2016-08-19 | 2016-08-19 | Circuit board with contract in microconnection printing ink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206042500U true CN206042500U (en) | 2017-03-22 |
Family
ID=58307269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620906781.5U Expired - Fee Related CN206042500U (en) | 2016-08-19 | 2016-08-19 | Circuit board with contract in microconnection printing ink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206042500U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109905965A (en) * | 2017-11-30 | 2019-06-18 | 罗伯特·博世有限公司 | Circuit board is in flakes |
| CN111975220A (en) * | 2020-08-14 | 2020-11-24 | 乐健科技（珠海）有限公司 | Heat-conducting metal block splicing plate and processing method of heat-conducting metal block |
-
2016
- 2016-08-19 CN CN201620906781.5U patent/CN206042500U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109905965A (en) * | 2017-11-30 | 2019-06-18 | 罗伯特·博世有限公司 | Circuit board is in flakes |
| CN109905965B (en) * | 2017-11-30 | 2022-06-28 | 罗伯特·博世有限公司 | Circuit board connecting piece |
| CN111975220A (en) * | 2020-08-14 | 2020-11-24 | 乐健科技（珠海）有限公司 | Heat-conducting metal block splicing plate and processing method of heat-conducting metal block |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206042500U (en) | Circuit board with contract in microconnection printing ink | |
| CN105555110B (en) | A kind of shielding case structure | |
| CN103052276A (en) | PCB (Printed Circuit Board) welding fixture | |
| CN208128627U (en) | A kind of multiple-unit wiring board convenient for cutting | |
| CN103481652A (en) | Advertisement board clamping device for advertisement printing and working method thereof | |
| CN201805631U (en) | Inverted-fastening assembling structure for printed circuit boards (PCB) | |
| CN102582253A (en) | Ink-jet printing and laser processing system and textile processing method | |
| CN204506143U (en) | A kind of novel smooth core decoration customization machine | |
| CN104249578A (en) | Raster plate seamless splicing type printing method for 3D (three dimensional) stereographs | |
| CN203368930U (en) | Splicing type PCB plate | |
| CN108177391B (en) | A kind of production method of folding tag | |
| CN203932032U (en) | Integrated circuit metal-packaged shell location built-up jig | |
| CN203557853U (en) | Clamping device for advertisement printing | |
| CN203748118U (en) | Modularization furnace carrier for printed circuit board | |
| CN203901805U (en) | Folding device for die-cutting paper boards | |
| CN105828526A (en) | Printed circuit board panel and manufacturing method thereof | |
| CN103917041A (en) | Flexible circuit board and manufacturing method thereof | |
| CN102548198A (en) | Flexible circuit board suitable for packing | |
| CN204955675U (en) | Silk screen printing platform that contains wing board | |
| CN205467838U (en) | Mobile tool of light guide plate | |
| CN204425771U (en) | The net of FPC and double faced adhesive tape is arranged formula fixed structure | |
| CN104168718A (en) | Laser typesetting equipment for overlapping printed circuit boards | |
| CN103582305B (en) | The preparation method of finished printed circuit board product | |
| CN203157340U (en) | Combined printing device | |
| CN203172144U (en) | Circuit board printing auxiliary tool |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170322 Termination date: 20190819 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |