CN103582305B - The preparation method of finished printed circuit board product - Google Patents
The preparation method of finished printed circuit board product Download PDFInfo
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- CN103582305B CN103582305B CN201210285228.0A CN201210285228A CN103582305B CN 103582305 B CN103582305 B CN 103582305B CN 201210285228 A CN201210285228 A CN 201210285228A CN 103582305 B CN103582305 B CN 103582305B
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- printed circuit
- circuit board
- pcb
- preparation
- finished
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Abstract
The present invention discloses a kind of preparation method of finished printed circuit board product, and it comprises the following steps. First, provide printed circuit panel, described printed circuit panel has the multiple printed circuit board (PCB)s that are connected in series. Then, detect described printed circuit panel, to distinguish non-non-defective unit printed circuit board (PCB) and non-defective unit printed circuit board (PCB) from described printed circuit panel. Afterwards, the adjacent described non-defective unit printed circuit board (PCB) of choosing predetermined quantity is using as becoming article unit. ,, capture described one-tenth article unit thereafter.
Description
Technical field
The present invention relates to the making side of a kind of printed circuit board (PCB) (printedcircuitboard, PCB) finished productMethod, and particularly relate to one and can improve shipment yield, the system of the finished printed circuit board product reducing costsMake method.
Background technology
In recent years, along with making rapid progress of electronic technology, high-tech electronic product is come out one after another, more human natureChange, electronic product with better function are constantly weeded out the old and bring forth the new, and towards light, thin, short, little trend design.In response to the design of this microminiaturization, old-fashioned circuit connection method (for example bread board) has not been applied demand,Therefore the printed circuit board (PCB) that, forms conducting wire with photoetching method on insulating substrate becomes now and providesThe main flow of the circuit connection in electronic component.
In the prior art, after print circuit plates making completes, conventionally can be first by the printing electricity of predetermined quantityRoad plate is arranged in column and is disposed at working plate (workingpanel) above, on working plate, has multiple sealsPrinted circuit board row. Then,, in the time of shipment, capture these printed circuit panels and become as printed circuit board (PCB)Product, and be transported to client and carry out follow-up processing.
Fig. 1 illustrates the schematic diagram of existing printed circuit board (PCB) in the time of shipment. Please refer to Fig. 1, working plate 10On dispose multiple printed circuit panels 20, each printed circuit panel 20 has housing 20a, andBy housing 20a around three continuously arranged printed circuit board (PCB)s 30. The housing 20a process illustrating at thisSimplify, in fact, housing 20a has certain width certainly, and also can be provided with light on housing 20aLearn loci, so that the function of aligning to be provided in follow-up manufacture craft. Can between each printed circuit board (PCB) 30Be connected to each other by connecting elements (not illustrating), between each printed circuit board (PCB) 30 and housing 20a, also canBe connected to each other by connecting elements (not illustrating). In addition the printed circuit panel 20 except specifically drawing,In addition, on working plate 10, also may be configured with other printed circuit panels 20.
As this configuration mode of Fig. 1 has some shortcomings. For example, while making printed circuit board (PCB), unavoidableHave the existence of the non-non-defective unit of minority. For instance, in Fig. 1 with the printed circuit board (PCB) 30 of " X " markBe non-non-defective unit. During due to shipment, in printed circuit panel 20, there are multiple (in Fig. 1, being three)Printed circuit board (PCB) 30, is non-non-defective units as long as therefore there is a printed circuit board (PCB) 30, this printed circuit board (PCB)Row 20 just must be scrapped and cannot serve as finished printed circuit board product. If taking situation as shown in Figure 1 as example,Although having two printed circuit board (PCB)s 30 in a printed circuit panel 20 is non-defective units, this printed circuit board (PCB)Row 20 still must be scrapped, and this has caused the waste of material, also make overall shipment yield decline a lot.
Summary of the invention
The object of the present invention is to provide a kind of preparation method of finished printed circuit board product, can improve shipment goodRate and reducing production costs.
For reaching above-mentioned purpose, the present invention proposes a kind of preparation method of finished printed circuit board product, comprises followingStep. First, provide printed circuit panel, described printed circuit panel has the multiple seals that are connected in seriesPrinted circuit board. Then, detect described printed circuit panel, non-to distinguish from described printed circuit panelNon-defective unit printed circuit board (PCB) and non-defective unit printed circuit board (PCB). Afterwards, choose the adjacent described good of predetermined quantityProduct printed circuit board (PCB) using as become article unit. ,, capture described one-tenth article unit thereafter.
In one embodiment of this invention, above-mentioned printed circuit panel is for example disposed on working plate.
In one embodiment of this invention, above-mentioned printed circuit panel comprises multiple connecting elements, and printingCircuit board is for example connected to each other by described connecting elements.
In one embodiment of this invention, the method that captures into article unit comprise remove be positioned at into article unit withIn abutting connection with the connecting elements between the printed circuit board (PCB) of one-tenth article unit.
In one embodiment of this invention, the edge of above-mentioned printed circuit board (PCB) for example has optical registrationPoint.
In one embodiment of this invention, the quantity of the printed circuit board (PCB) in above-mentioned printed circuit panel for exampleFor the integral multiple of described predetermined quantity.
Based on above-mentioned, the present invention proposes a kind of preparation method of finished printed circuit board product, by quantity is largeThe printed circuit board (PCB) of the printed circuit board (PCB) quantity in finished printed circuit board product is arranged in printed circuit panel,Then in printed circuit panel, capture the adjacent printed circuit board (PCB) of predetermined quantity as becoming article unit,Therefore the elasticity that is chosen to article unit can be provided, and can promote thus shipment yield, and reduce materialThe waste of material.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinateAppended accompanying drawing is described in detail below.
Brief description of the drawings
Schematic diagram when Fig. 1 is existing printed circuit board (PCB) shipment;
Fig. 2 A is the schematic diagram of the preparation method of the finished printed circuit board product of one embodiment of the invention;
Fig. 2 B is the partial enlarged drawing of Fig. 2 A.
Main element symbol description
10,110: working plate
20,100: printed circuit panel
20a: housing
30,102: printed circuit board (PCB)
104: connecting elements
105: become article unit
106: optical registration point
X, 1,2,3,4: indicate
Detailed description of the invention
Fig. 2 A is the schematic diagram of the preparation method of finished printed circuit board product according to an embodiment of the invention.Fig. 2 B is the partial enlarged drawing of Fig. 2 A.
Referring to Fig. 2 A and Fig. 2 B, the invention provides a kind of preparation method of finished printed circuit board product.First, provide printed circuit panel 100, as the dotted line frame in Fig. 2 A indicates. Printed circuit panel100 for example can be configured on working plate 110, with convenient operation. In Fig. 2 A, only specifically illustrate listOne printed circuit panel 100, but the invention is not restricted to this, in practical operation, certainly can be in workOn plate 110, configure multiple printed circuit panels 100.
Printed circuit panel 100 has the multiple printed circuit board (PCB)s 102 that are connected in series. In the present embodiment,Printed circuit panel 100 can comprise multiple connecting elements 104, and each printed circuit board (PCB) 102 is by connectingConnection member 104 is connected in series mutually. Connecting elements 104 is for example break edge or stamp hole (perforatededge）。
Then, detect printed circuit panel 100, print to distinguish non-non-defective unit from printed circuit panel 100Printed circuit board and non-defective unit printed circuit board (PCB). Detecting the method for printed circuit panel 100 for example establishes with opticsStandby detection by gold-plated the formed bar code of laser, green paint or copper face or binary bar code.
In the following description, exemplarily, represent non-good to indicate the printed circuit board (PCB) 102 of " X "Product printed circuit board (PCB), represents non-defective unit printed circuit board (PCB) without 102 of the printed circuit board (PCB)s indicating. At Fig. 2 AIn, the position of non-non-defective unit printed circuit board (PCB) is identical with that shown in Figure 1, and this is in order to clearly demonstrate the present inventionEffect and the specially arrangement done below will be described it in detail. In practical situation, in affiliated technical fieldHave and conventionally know known to the knowledgeable, non-non-defective unit printed circuit board (PCB) is to come across at random owning on working plate 110In printed circuit board (PCB).
After determining non-non-defective unit after testing, (be generally and meet client demand according to predetermined quantityQuantity), choose non-defective unit printed circuit board (PCB) adjacent in printed circuit panel 100, using as become article unit105. In the embodiment illustrating at Fig. 2 A, a finished printed circuit board product is scheduled to contain three printing electricityRoad plate 102, therefore, can choose adjacent three printed circuit board (PCB)s that are denoted as " 1 ", " 2 ", " 3 "102, as becoming article unit 105, as shown in the solid box in Fig. 2 A. Certainly, also can choose signFor adjacent three printed circuit board (PCB)s 102 of " 2 ", " 3 ", " 4 " are used as into article unit 105. In addition,Predetermined quantity is not particularly limited, according to circumstances required adjustment, but selected in same manufacture craftThe quantity of getting is all consistent. Should point out the printed circuit of printed circuit panel 100 in Fig. 2 A at thisPlate total quantity is only for illustrating. In fact, as long as the printed circuit board (PCB) number of printed circuit panel 100Amount is greater than the situation of the printed circuit board (PCB) predetermined quantity of finished printed circuit board product, is all summarized in model of the present inventionWithin farmland.
Afterwards, capture selected one-tenth article unit 105 using as finished printed circuit board product. In the present embodiment,The method that captures selected one-tenth article unit 105 for example remove be positioned at into article unit with in abutting connection with becoming article unitConnecting elements 104 between printed circuit board (PCB) 102.
The prior art comparison that the embodiment then Fig. 2 A and Fig. 2 B being illustrated and Fig. 1 illustrate, withEffect of the present invention is described. In Fig. 1, (top herein refers to figure to be disposed at working plate 10 the topsThe top of face, the not top in real space) a line printed circuit board (PCB) comprise three printed circuit board (PCB)sRow 20, each printed circuit panel 20 has three printed circuit board (PCB)s 30. In Fig. 2, be disposed at workA line printed circuit panel 100 of doing plate 110 the tops has nine printed circuit board (PCB)s 102. At Fig. 1In Fig. 2 A, the quantity of printed circuit board (PCB) is identical, also phase of the quantity of non-non-defective unit printed circuit board (PCB) and positionWith. In the prior art, due to the existence of the non-non-defective unit printed circuit board (PCB) of minority, remaining non-defective unit is printedPrinted circuit board also must be scrapped together; And in the present embodiment, as previously mentioned, can be from printed circuit board (PCB)In row 100, choose adjacent non-defective unit printed circuit board (PCB), then make finished printed circuit board product. This practice canTo reduce the waste of material, significantly promote yield. With the situation shown in Fig. 1 and Fig. 2 A, existingTechnology has been scrapped six non-defective unit printed circuit board (PCB)s, and the present embodiment is only scrapped three non-defective unit printed circuit board (PCB)s,The ratio of waste of material has reduced 50%.
In addition, if the quantity of printed circuit board (PCB) 102 is the more, selectable in printed circuit panel 100Become the combination of article unit also the more, the effect of Yield lmproved, minimizing waste of material also just better. Due toIn the present embodiment, be on working plate 110, to configure adjacent multiple printed circuit board (PCB)s 102, be compared to existingHave taking several printed circuit board (PCB)s as one group, respectively organize isolated configuration mode, can more effectively utilize workDo the space of plate 110; That is to say, on the working plate 110 of same size, described in the present embodimentMethod can configure more printed circuit board (PCB) 102, and then can promote further the yield of shipment.
Moreover in one embodiment, the quantity of the printed circuit board (PCB) 102 in printed circuit panel 100 canFor becoming the integral multiple of predetermined quantity of article unit 105, with at whole printed circuit panel 100 containing non-When non-defective unit printed circuit board (PCB), do not cause extra waste.
In addition, as shown in Figure 2 B, in the present embodiment, the edge of each printed circuit board (PCB) 102 hasOptical registration point 106, to provide the function of aligning in follow-up manufacture craft.
In sum, the present invention proposes a kind of preparation method of finished printed circuit board product, by quantity is largeThe printed circuit board (PCB) of the printed circuit board (PCB) quantity in finished printed circuit board product is arranged in printed circuit panel,Then in printed circuit panel, capture the adjacent printed circuit board (PCB) of predetermined quantity as becoming article unit,Therefore the elasticity that is chosen to article unit can be provided, and can promote thus shipment yield, and reduce materialThe waste of material.
Although disclosed the present invention in conjunction with above embodiment, but it is not in order to limit the present invention, anyIn affiliated technical field, be familiar with this operator, without departing from the spirit and scope of the present invention, can do a littleChange and retouching, therefore protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (6)
1. a preparation method for finished printed circuit board product, comprising:
Printed circuit panel is provided, and described printed circuit panel has the multiple printed circuits that are connected in seriesPlate;
Detect described printed circuit panel, to distinguish non-non-defective unit printed circuit from described printed circuit panelPlate and non-defective unit printed circuit board (PCB);
The adjacent described non-defective unit printed circuit board (PCB) of choosing predetermined quantity is using as becoming article unit; And
Capture described one-tenth article unit.
2. the preparation method of finished printed circuit board product as claimed in claim 1, wherein said printed circuitPanel is to be disposed on working plate.
3. the preparation method of finished printed circuit board product as claimed in claim 1, wherein said printed circuitPanel comprises multiple connecting elements, and described printed circuit board (PCB) is connected in series by described connecting elements.
4. the preparation method of finished printed circuit board product as claimed in claim 3, wherein captures described finished productThe method of unit comprise remove be positioned at described one-tenth article unit with in abutting connection with described become the described printing of article unit electricDescribed connecting elements between the plate of road.
5. the preparation method of finished printed circuit board product as claimed in claim 1, wherein prints described in eachThe edge of circuit board has optical registration point.
6. the preparation method of finished printed circuit board product as claimed in claim 1, wherein said printed circuitThe quantity of the described printed circuit board (PCB) in panel is the integral multiple of described predetermined quantity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210285228.0A CN103582305B (en) | 2012-08-10 | 2012-08-10 | The preparation method of finished printed circuit board product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210285228.0A CN103582305B (en) | 2012-08-10 | 2012-08-10 | The preparation method of finished printed circuit board product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103582305A CN103582305A (en) | 2014-02-12 |
| CN103582305B true CN103582305B (en) | 2016-05-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210285228.0A Expired - Fee Related CN103582305B (en) | 2012-08-10 | 2012-08-10 | The preparation method of finished printed circuit board product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103582305B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101610640A (en) * | 2008-06-18 | 2009-12-23 | 诺亚电子股份有限公司 | Method for transplanting and maintaining with finished printed circuit board product of multi-plate typesetting |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030029034A1 (en) * | 2001-08-08 | 2003-02-13 | Unitech Printed Circuit Board Corp. | Method of removing and replacing defective piece of printed circuit board formed on a panel |
| TW200717208A (en) * | 2005-10-18 | 2007-05-01 | Sheng-San Gu | Defective connected piece of PCB reset method and system thereof |
-
2012
- 2012-08-10 CN CN201210285228.0A patent/CN103582305B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101610640A (en) * | 2008-06-18 | 2009-12-23 | 诺亚电子股份有限公司 | Method for transplanting and maintaining with finished printed circuit board product of multi-plate typesetting |
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| Publication number | Publication date |
|---|---|
| CN103582305A (en) | 2014-02-12 |
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Granted publication date: 20160525 Termination date: 20170810 |