CN112530921B - Light emitting diode display device and method of manufacturing the same - Google Patents

Abstract

The light emitting diode display device includes a back panel, a first light emitting diode element and a second light emitting diode element. The backplane has a first pad set and a second pad set. The plurality of pads of the first pad group have a plurality of first connection areas respectively overlapping with the plurality of electrodes of the first LED element. The first quasi-line passes through the multiple geometric centers of the multiple first connecting regions. The second pseudo-line passes through the plurality of geometric centers of the plurality of electrodes of the first LED element. The first pseudo-line and the second pseudo-line have a first angle θ1. The plurality of pads of the second pad group have a plurality of second connection areas respectively overlapping the plurality of electrodes of the second light emitting diode element. The third pseudo-line passes through the plurality of geometric centers of the plurality of second connecting regions. The fourth pseudo-line passes through the plurality of geometric centers of the plurality of electrodes of the second LED element. The third pseudo-line and the fourth pseudo-line have a second included angle θ2 different from the first included angle θ1. A method for manufacturing the above light-emitting diode display device is also proposed.

Description

Light-emitting diode display device and manufacturing method thereof

technical field

The invention relates to a light emitting diode display device and a manufacturing method thereof.

Background technique

The micro light emitting diode (μLED) display has the advantages of power saving, high reliability and frameless design, so it is regarded as a display technology with great potential. Mass transfer is the most challenging process technology for micro-LED displays. How to perform fast, accurate and high-yield micro-LED chip transposition in a short period of time is a common problem faced by manufacturers.

The biggest problem with massive transposition technology is the improvement of transfer yield. With the current technology, the transposition yield rate is not high. Therefore, after the first transposition operation is completed, a repair operation is required. Generally speaking, in addition to the pads for placing the first transposed micro-LEDs on the backplane of the micro-LED display, additional repair pads are also provided for repairing. The micro light emitting diodes are electrically connected. However, the additional repair pads need to occupy the layout area of the micro-LEDs, which is not conducive to the improvement of the resolution of the micro-LEDs.

Contents of the invention

The invention provides a light emitting diode display device with good performance.

The invention provides a method for manufacturing a light-emitting diode display device, which can manufacture a light-emitting diode display device with good performance.

A light emitting diode display device of the present invention includes a back plate, a first light emitting diode element and a second light emitting diode element. The backplane has a first pad set and a second pad set. The plurality of electrodes of the first LED element are respectively electrically connected to the plurality of pads of the first pad group. The plurality of pads of the first pad group respectively have a plurality of first connection regions. The plurality of first connecting regions are respectively overlapped with the plurality of electrodes of the first LED element. The first quasi-line passes through the multiple geometric centers of the multiple first connecting regions. The second pseudo-line passes through the plurality of geometric centers of the plurality of electrodes of the first LED element. The first pseudo-line and the second pseudo-line have a first angle θ1. The plurality of electrodes of the second LED element are respectively electrically connected to the plurality of pads of the second pad group. The plurality of pads of the second pad group respectively have a plurality of second connection regions. The plurality of second connecting regions overlap the plurality of electrodes of the second LED element respectively. The third pseudo-line passes through the plurality of geometric centers of the plurality of second connecting regions. The fourth pseudo-line passes through the plurality of geometric centers of the plurality of electrodes of the second LED element. The third pseudo-line and the fourth pseudo-line have a second included angle θ2. The first included angle θ1 is different from the second included angle θ2.

A method for manufacturing a light-emitting diode display device, comprising the following steps: allowing a plurality of first light-emitting diode elements to be respectively transferred on a plurality of first pad groups of a backplane, wherein a plurality of contact pads of each first pad group The pads respectively have a plurality of first connection regions, and the plurality of first connection regions respectively overlap with a plurality of electrodes of a first light-emitting diode element, a first quasi-line passes through a plurality of geometric centers of the plurality of first connection regions, and a first Two pseudo-lines pass through multiple geometric centers of multiple electrodes of the first light-emitting diode element, and the first pseudo-line and the second pseudo-line have a first angle θ1; remove a first light emission on a first pad group diode element, and remove a part of the first pad group to form a second pad group; after removing the first light emitting diode element on the first pad group, make a second light emitting diode element transfer to On the second pad group, wherein the plurality of pads of the second pad group respectively have a plurality of second connection areas, and the plurality of second connection areas respectively overlap with the plurality of electrodes of the second light emitting diode element, a third dummy A straight line passes through multiple geometric centers of multiple second connecting regions, a fourth pseudo-line passes through multiple geometric centers of multiple electrodes of the second LED element, and the third pseudo-line and the fourth pseudo-line have a second included angle θ2 , and the first included angle θ1 is different from the second included angle θ2.

In an embodiment of the present invention, |θ1-θ2|≤30° or |θ1-θ2|≥57°.

In an embodiment of the present invention, the above-mentioned first included angle θ1 is greater than the second included angle θ2, and the distance between the plurality of pads in the second pad group in one direction is greater than that of the plurality of pads in the first pad group Spacing in that direction.

In an embodiment of the present invention, the first included angle θ1 is greater than the second included angle θ2, and the distance between the plurality of electrodes of the second light-emitting diode element on the fourth pseudo-line is greater than that of the plurality of electrodes of the first light-emitting diode element The distance on the second quasi-line.

In an embodiment of the present invention, the above-mentioned pads of the first pad group have a first portion and a second portion, the extension direction of the first portion is intersected with the extension direction of the second portion, and the first light emitting diode element An electrode is arranged on the second part.

In an embodiment of the present invention, the extension direction of the above-mentioned second portion forms an acute angle with the second pseudo-line.

In an embodiment of the present invention, the extension direction of the above-mentioned first portion forms an acute angle with the second pseudo-line.

The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

Description of drawings

FIG. 1 is a schematic flowchart of a method for manufacturing a light emitting diode display device according to an embodiment of the present invention.

2A to 2D are schematic perspective views of a method of manufacturing the LED display device 10 according to an embodiment of the present invention.

3A to 3D are schematic perspective views of a method of manufacturing an LED display device 10A according to another embodiment of the present invention.

4A to 4D are schematic perspective views of a method of manufacturing an LED display device 10B according to yet another embodiment of the present invention.

Among them, reference signs

10, 10A, 10B: LED display device

100: Backplane

110: The first pad group

110a, 110b, 112a, 112b: Pads

110a-1, 110b-1: first connection area

112: Second pad group

112a-1, 112b-1: second connection area

114: Part 1

116: Part Two

A, B, C, D: geometric center

d1, d2: arrangement direction

E1, E2: electrodes

LED1: the first light-emitting diode element

LED2: Second light-emitting diode element

L1: first quasi-line

L2: second quasi-line

L3: third quasi-line

L4: Fourth quasi-line

LS: laser

S10, S11, S20, S30, S31, S40, S50, S51, S52: steps

s, s': distance

p, p': spacing

W: Substrate

x, y: extension direction

θ1: the first included angle

θ2: second included angle

α, β: acute angle

γ: angle

Detailed ways

Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and descriptions to refer to the same or like parts.

It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may mean that other elements exist between two elements.

As used herein, "about," "approximately," or "substantially" includes stated values and averages within acceptable deviations from a particular value as determined by one of ordinary skill in the art, taking into account the measurements in question and the relative A specific amount of measurement-related error (ie, a limitation of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Moreover, "about", "approximately" or "substantially" used herein may select a more acceptable deviation range or standard deviation according to optical properties, etching properties or other properties, and may not use one standard deviation to apply to all properties .

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant art and the present invention, and will not be interpreted as idealized or excessive formal meaning, unless expressly so defined herein.

FIG. 1 is a schematic flowchart of a method for manufacturing a light emitting diode display device according to an embodiment of the present invention.

2A to 2D are schematic perspective views of a method of manufacturing the LED display device 10 according to an embodiment of the present invention.

The manufacturing method and structure of the light emitting diode display device 10 according to an embodiment of the present invention will be illustrated below with reference to FIG. 1 and FIG. 2A to FIG. 2D .

Referring to FIG. 1 and FIG. 2A , in this embodiment, firstly, step S10 may be performed: detecting a plurality of first light emitting diode elements LED1 on the substrate W. Referring to FIG. For example, in this embodiment, the substrate W may be an epitaxial wafer of the first light emitting diode element LED1, but the invention is not limited thereto.

In step S10 , if any of the first light emitting diode elements LED1 on the substrate W is found to be invalid, proceed to step S11 : remove the failed first light emitting diode elements LED1 from the substrate W.

In step S10 , if it is determined that the plurality of first light emitting diode elements LED1 on the substrate W are normal, proceed to step S20 : extracting the plurality of first light emitting diode elements LED1 from the substrate W by using an extraction device (not shown). For example, in this embodiment, a plurality of first light emitting diode elements LED1 can be selectively extracted by using an elastic transposition head. However, the present invention is not limited thereto, and in other embodiments, an electrostatic transposition head, a vacuum suction transposition head or other devices may also be used to extract a plurality of first light emitting diode elements LED1.

In this embodiment, after step S10 is completed, step S30 may be performed: detecting a plurality of first light emitting diode elements LED1 on the extraction element.

In step S30, if it is found that any first LED1 on the extractor is invalid, proceed to step S31: remove the failed first LED1 from the extractor.

In step S30, if it is judged that the plurality of first light-emitting diode elements LED1 on the extraction element is normal, proceed to step S40: make the plurality of first light-emitting diode elements LED1 and the plurality of first pad groups 110 of the backplane 100 form a specific angle γ, so as to transfer the plurality of first light emitting diode elements LED1 on the plurality of first pad groups 110 of the backplane 100 .

Please refer to FIG. 2A , for example, in this embodiment, the arrangement direction d1 of the plurality of electrodes E1 and E2 of the plurality of first light emitting diode elements LED1 on the substrate W can be aligned with the plurality of contacts of the first pad group 110 . The arrangement direction d2 of the pads 110a, 110b has a specific angle γ; then, under the condition of maintaining the specific angle γ, a plurality of first light-emitting diode elements LED1 are respectively transferred to the plurality of backplane 100 by using an extraction element. On the first pad set 110 , the plurality of first light emitting diode elements LED1 are respectively electrically connected to the plurality of first pad sets 110 .

After the plurality of first light emitting diode elements LED1 are respectively transferred to the plurality of first pad groups 110 of the backplane 100, the plurality of pads 110a, 110b of the first pad group 110 respectively have a plurality of first connection regions 110a -1, 110b-1, a plurality of first connection areas 110a-1, 110b-1 are respectively overlapped with a plurality of electrodes E1, E2 of the first light emitting diode element LED1, a first quasi-line L1 passes through the plurality of first connection areas Multiple geometric centers A of 110a-1 and 110b-1, a second pseudo-line L2 passing through multiple geometric centers B of multiple electrodes E1, E2 of the first light-emitting diode element LED1, the first pseudo-line L1 and the second pseudo-linear The straight line L2 has a first included angle θ1, and θ1>0°. That is to say, the first pseudo-line L1 and the second pseudo-line L2 are not parallel.

Referring to FIG. 1 and FIG. 2A , after step S40 is completed (that is, after transposing a plurality of first light emitting diode elements LED1 ), then step S50 is performed: detecting a plurality of first light emitting diode elements LED1 on the backplane 100 .

In step S50 , if the plurality of first LED elements LED1 on the backplane 100 are normal, the LED display device 10 is completed. In step S50 , if any of the first light-emitting diode elements LED1 on the backplane 100 is found to be invalid, a repair operation is performed (that is, steps S51 and S52 are performed sequentially).

Please refer to FIG. 1 , FIG. 2B and FIG. 2C , specifically, step S51 is performed first: remove the failed first light-emitting diode element LED1 from the first pad group 110 of the backplane 100 , and remove the first pad A part of the group 110 is formed to form the second pad group 112 . For example, in this embodiment, the failed first LED element LED1 can be removed by using the laser LS. However, the present invention is not limited thereto, and in other embodiments, other methods (such as mechanical methods) can also be used to remove them.

2B and FIG. 2C, in the process of removing the failed first light emitting diode element LED1, a part of the first pad group 110 (that is, a plurality of contacts) that was originally electrically connected to the failed first light emitting diode element LED1 A plurality of parts of the pads 110a, 110b) will also be removed along with the failed first light-emitting diode element LED1, and a part of the first pad group 110 remaining on the backplane 100 (ie, a plurality of pads 110a , 110b a plurality of remaining parts) then form a plurality of pads 112a, 112b of the second pad group 112 .

As shown in FIG. 2C , the pitch p' of the plurality of pads 112a, 112b in the second pad group 112 in one direction (for example, the arrangement direction d2) is greater than that of the plurality of pads 110a, 110b in the first pad group 110. Pitch p in said direction (for example: arrangement direction d2).

Please refer to FIG. 1 and FIG. 2D, after step S51 is completed, then proceed to step S52: arrange the second light emitting diode element LED2 and the second pad group 112 of the backplane 100 in the same direction, so that the second light emitting diode element The LED2 is placed on the second pad set 112 of the backplane 100 . For example, in this embodiment, the arrangement direction d2 of the plurality of electrodes E1, E2 of the second light emitting diode element LED2 on the substrate W can be aligned with the arrangement of the plurality of pads 112a, 112b of the second pad group 112 The direction d2 is consistent; then, under the condition that the arrangement direction d2 of the plurality of electrodes E1, E2 of the second light emitting diode element LED2 is consistent with the arrangement direction d2 of the plurality of pads 112a, 112b of the second pad group 112, use An extraction component transfers the second light emitting diode element LED2 on the second pad set 112 of the backplane 100 , so that the second light emitting diode element LED2 is electrically connected to the second pad set 112 . Here, the repairing operation is completed, and the LED display device 10 is formed.

It is worth mentioning that, through the above-mentioned manufacturing method of the light emitting diode display device 10, when the failed first light emitting diode element LED1 is removed and part of the first pad group 110 is removed, the first pad group Another part of 110 is still retained on the backplane 100 with sufficient area. Therefore, where the failed first light emitting diode element LED1 is originally set, the repairing second light emitting diode element LED2 can still be set. In this way, the backplane 100 of the LED display device 10 does not need to provide additional repair pads thereon, which helps to reduce the pixel size of the LED display device 10 and improve the resolution.

Referring to FIG. 2D , the light emitting diode display device 10 includes a backplane 100 , a first light emitting diode element LED1 and a second light emitting diode element LED2 .

The backplane 100 has a first pad set 110 and a second pad set 112 . The first pad set 110 includes a plurality of pads 110a, 110b. The second pad set 112 includes a plurality of pads 112a, 112b.

In this embodiment, the backplane 100 has multiple sub-pixel driving circuits (not shown), wherein each sub-pixel driving circuit includes a data line, a scanning line, a power line, a common line, and a first transistor , a second transistor and a capacitor, the first end of the first transistor is electrically connected to the data line, the control end of the first transistor is electrically connected to the scan line, and the second end of the first transistor is electrically connected To the control terminal of the second transistor, the first terminal of the second transistor is electrically connected to the power line, and the capacitor is electrically connected to the second terminal of the first transistor and the first terminal of the second transistor.

The multiple sub-pixel driving circuits of the backplane 100 include a first sub-pixel driving circuit and a second sub-pixel driving circuit; a pad 110a of the first pad group 110 is electrically connected to the second sub-pixel driving circuit of the first pad group 110. The second end of the transistor, and the other pad 110b of the first pad group 110 is electrically connected to the common line of the first sub-pixel driving circuit; a pad 112a of the second pad group 112 is electrically connected to the first sub-pixel driving circuit The second terminal of the second transistor of the second sub-pixel driving circuit, and the other pad 112b of the second pad group 112 are electrically connected to the common line of the second sub-pixel driving circuit.

For example, in this embodiment, the control terminal of the first transistor of the first sub-pixel driving circuit and the control terminal of the first transistor of the second sub-pixel driving circuit can be selectively electrically connected to the same scanning line. lines, and the first pad group 110 and the second pad group 112 may be multiple pad groups of the same pixel of the LED display device 10 , but the present invention is not limited thereto.

The plurality of electrodes E1 , E2 of the first light emitting diode element LED1 are electrically connected to the plurality of pads 110 a , 110 b of the first pad set 110 , respectively. The plurality of pads 110 a , 110 b of the first pad set 110 respectively have a plurality of first connection regions 110 a - 1 , 110 b - 1 . The plurality of first connection regions 110a-1, 110b-1 are respectively overlapped with the plurality of electrodes E1, E2 of the first light emitting diode element LED1. The first pseudo-line L1 passes through the multiple geometric centers A of the multiple first connecting regions 110a-1, 110b-1. The second pseudo-line L2 passes through the plurality of geometric centers B of the plurality of electrodes E1 , E2 of the first light-emitting diode element LED1 . The first pseudo-line L1 and the second pseudo-line L2 have a first angle θ1.

The plurality of electrodes E1 , E2 of the second light emitting diode element LED2 are electrically connected to the plurality of pads 112 a , 112 b of the second pad set 112 , respectively. The plurality of pads 112 a , 112 b of the second pad set 112 respectively have a plurality of second connection regions 112 a - 1 , 112 b - 1 . The plurality of second connection regions 112a-1, 112b-1 are respectively overlapped with the plurality of electrodes E1, E2 of the second light emitting diode element LED2. The third pseudo-line L3 passes through the plurality of geometric centers C of the plurality of second connecting regions 112a-1, 112b-1. The fourth pseudo-line L4 passes through the plurality of geometric centers D of the plurality of electrodes E1 , E2 of the second light emitting diode element LED2 . The third pseudo-line L3 and the fourth pseudo-line L4 have a second included angle θ2. In this embodiment, θ2 is substantially 0°, and θ2 is not marked.

It should be noted that the first angle θ1 between the first pseudo-line L1 and the second pseudo-line L2 is different from the second angle θ2 between the third pseudo-line L3 and the fourth pseudo-line L4. For example, in this embodiment, the first included angle θ1 is greater than the second included angle θ2, |θ1-θ2|≤30° or |θ1-θ2|≥57°.

It must be noted here that the following embodiments use the component numbers and part of the content of the previous embodiments, wherein the same numbers are used to denote the same or similar components, and descriptions of the same technical content are omitted. For the description of omitted parts, reference may be made to the aforementioned embodiments, and the following embodiments will not be repeated.

3A to 3D are schematic perspective views of a method of manufacturing an LED display device 10A according to another embodiment of the present invention.

The LED display device 10A of FIG. 3A to FIG. 3D and its manufacturing method are similar to the LED display device 10 of FIG. 2A to FIG. 2D and its manufacturing method. The shape is different from that of the pad 110 a of the LED display device 10 .

Specifically, in the embodiment shown in FIG. 3A to FIG. 3D , a pad 110 a of the first pad group 110 has a second portion 116 in addition to the first portion 114 , wherein an extension direction x of the first portion 114 It intersects with an extending direction y of the second portion 116 . For example, in this embodiment, the extending direction x of the first portion 114 and the extending direction y of the second portion 116 may be substantially perpendicular, and the first portion 114 and the second portion 116 may be connected to form a T-shaped conductive pattern. , but the present invention is not limited thereto.

Referring to FIG. 3A , in this embodiment, when the first light emitting diode element LED1 is placed on the backplane 100 , the electrode E1 of the first light emitting diode element LED1 is disposed on the second portion 116 of the pad 110 a. The extending direction y of the second portion 116 of the pad 110 a forms an acute angle α with the second pseudo-line L2 . The extension direction x of the first portion 114 of the pad 110 a forms an acute angle β with the second pseudo-line L2 .

Referring to FIG. 3B, FIG. 3C and FIG. 3D, when removing the failed first LED element LED1, a large part of the second portion 116 of the pad 110a will be removed along with the failed first LED element LED1, But most of the area of the first portion 114 of the pad 110a is reserved. That is, the area of the pads 112a of the second pad group 112 formed by the partial pads 110a of the first pad group 110 remaining on the backplane 100 is relatively large, which contributes to the second light emission for repairing. The diode element LED2 is electrically connected to the second pad set 112 .

4A to 4D are schematic perspective views of a method of manufacturing an LED display device 10B according to yet another embodiment of the present invention.

The light-emitting diode display device 10B of FIG. 4A to FIG. 4D and its manufacturing method are similar to the light-emitting diode display device 10 of FIG. 2A to FIG. 2D and its manufacturing method. , the size of the second light emitting diode element LED2 used for repairing is larger than the size of the first light emitting diode element LED1 originally disposed on the backplane 100 .

Referring to FIG. 4D , the plurality of electrodes E1 , E2 of the first light emitting diode element LED1 are electrically connected to the plurality of pads 110 a , 110 b of the first pad set 110 , respectively. The plurality of pads 110 a , 110 b of the first pad set 110 respectively have a plurality of first connection regions 110 a - 1 , 110 b - 1 . The plurality of first connection regions 110a-1, 110b-1 are respectively overlapped with the plurality of electrodes E1, E2 of the first light emitting diode element LED1. The first pseudo-line L1 passes through the multiple geometric centers A of the multiple first connecting regions 110a-1, 110b-1. The second pseudo-line L2 passes through the plurality of geometric centers B of the plurality of electrodes E1 , E2 of the first light-emitting diode element LED1 . The first pseudo-line L1 and the second pseudo-line L2 have a first angle θ1.

The plurality of electrodes E1 , E2 of the second light emitting diode element LED2 are electrically connected to the plurality of pads 112 a , 112 b of the second pad set 112 , respectively. The plurality of pads 112 a , 112 b of the second pad set 112 respectively have a plurality of second connection regions 112 a - 1 , 112 b - 1 . The plurality of second connection regions 112a-1, 112b-1 are respectively overlapped with the plurality of electrodes E1, E2 of the second light emitting diode element LED2. The third pseudo-line L3 passes through the plurality of geometric centers C of the plurality of second connecting regions 112a-1, 112b-1. The fourth pseudo-line L4 passes through the plurality of geometric centers D of the plurality of electrodes E1 , E2 of the second light emitting diode element LED2 . The third pseudo-line L3 and the fourth pseudo-line L4 have a second included angle θ2. In this embodiment, θ2 is substantially 0°, and θ2 is not marked. The first included angle θ1 is different from the second included angle θ2. In this embodiment, the first included angle θ1 is greater than the second included angle θ2.

2A to 2D, the size of the repaired second light emitting diode element LED2 is larger than the size of the first light emitting diode element LED1 originally arranged on the backplane 100, and the size of the second light emitting diode element LED2 The distance s′ between the plurality of electrodes E1 and E2 on the fourth pseudo-line L4 is greater than the distance s between the plurality of electrodes E1 and E1 of the first light emitting diode element LED1 on the second pseudo-line L2. The distance s' refers to the distance of the plurality of geometric centers D of the plurality of electrodes E1, E2 of the second light emitting diode element LED2. The distance s refers to the distance of the plurality of geometric centers B of the plurality of electrodes E1 , E2 of the first light-emitting diode element LED1 .

The pitch p' of the plurality of pads 112a, 112b in the second pad group 112 is larger than the pitch p' of the plurality of pads 110a, 110b in the first pad group 110, and the distance s between the plurality of electrodes E1, E2 is utilized. 'Repairing the larger second light-emitting diode element LED2 is helpful to improve the bonding yield between the second light-emitting diode element LED2 and the second pad group 112 .

Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the scope of protection of the appended claims of the present invention.

Claims (14)

1. A light emitting diode display device, comprising:

a back plate having a first pad set and a second pad set;

the first light-emitting diode element comprises a plurality of electrodes, a first quasi-straight line, a second quasi-straight line and a first inclined angle theta 1, wherein the plurality of electrodes of the first light-emitting diode element are respectively and electrically connected to the plurality of connecting pads of the first connecting pad group; and

the second light-emitting diode element is characterized in that a plurality of electrodes of the second light-emitting diode element are respectively and electrically connected to a plurality of connecting pads of the second connecting pad group, the connecting pads of the second connecting pad group are respectively provided with a plurality of second connecting areas, the second connecting areas are respectively overlapped with the electrodes of the second light-emitting diode element, a third quasi-straight line passes through a plurality of geometric centers of the second connecting areas, a fourth quasi-straight line passes through a plurality of geometric centers of the electrodes of the second light-emitting diode element, the third quasi-straight line and the fourth quasi-straight line have a second included angle theta 2, and the first included angle theta 1 is different from the second included angle theta 2.

2. The light-emitting diode display device according to claim 1, wherein |θ1- θ2|is equal to or less than 30 ° or |θ1- θ2|is equal to or greater than 57 °.

3. The LED display device of claim 1, wherein the first angle θ1 is greater than the second angle θ2, and a pitch of the bonding pads of the second bonding pad set in a direction is greater than a pitch of the bonding pads of the first bonding pad set in the direction.

4. The light emitting diode display device of claim 1, wherein the first angle θ1 is greater than the second angle θ2, and a distance between the electrodes of the second light emitting diode element on the fourth pseudo-straight line is greater than a distance between the electrodes of the first light emitting diode element on the second pseudo-straight line.

5. The LED display device of claim 1, wherein one of the pads of the first pad set has a first portion and a second portion, an extending direction of the first portion is staggered with an extending direction of the second portion, and one of the electrodes of the first LED element is disposed on the second portion.

6. The led display device of claim 5, wherein the direction of extension of the second portion includes an acute angle with the second quasi-straight line.

7. The led display device of claim 6, wherein the direction of extension of the first portion and the second quasi-straight line form an acute angle.

8. A method of manufacturing a light emitting diode display device, comprising:

the method comprises the steps of enabling a plurality of first light-emitting diode elements to be respectively arranged on a plurality of first connecting pad groups of a backboard, wherein a plurality of connecting pads of each first connecting pad group are respectively provided with a plurality of first connecting areas, the first connecting areas are respectively overlapped with a plurality of electrodes of the first light-emitting diode element, a first quasi-straight line passes through a plurality of geometric centers of the first connecting areas, a second quasi-straight line passes through a plurality of geometric centers of the electrodes of the first light-emitting diode element, and a first included angle theta 1 is formed between the first quasi-straight line and the second quasi-straight line;

removing a first light emitting diode element on the first pad set, and removing a part of the first pad set to form a second pad set; and

after the first light emitting diode element on the first bonding pad set is removed, a second light emitting diode element is transferred onto the second bonding pad set, wherein a plurality of bonding pads of the second bonding pad set are respectively provided with a plurality of second connecting areas, the second connecting areas are respectively overlapped with a plurality of electrodes of the second light emitting diode element, a third quasi-straight line passes through a plurality of geometric centers of the second connecting areas, a fourth quasi-straight line passes through a plurality of geometric centers of the electrodes of the second light emitting diode element, the third quasi-straight line and the fourth quasi-straight line have a second included angle theta 2, and the first included angle theta 1 is different from the second included angle theta 2.

9. The method of manufacturing a light-emitting diode display device according to claim 8, wherein |θ1- θ2|is not more than 30 ° or |θ1- θ2|is not less than 57 °.

10. The method of claim 8, wherein the first angle θ1 is greater than the second angle θ2, and a pitch of the bonding pads of the second bonding pad set in a direction is greater than a pitch of the bonding pads of the first bonding pad set in the direction.

11. The method of claim 8, wherein the first angle θ1 is larger than the second angle θ2, and a pitch of the electrodes of the second light emitting diode element on the fourth pseudo-straight line is larger than a pitch of the electrodes of the first light emitting diode element on the second pseudo-straight line.

12. The method of claim 8, wherein a pad of the first pad set has a first portion and a second portion, an extending direction of the first portion is staggered with an extending direction of the second portion, and the electrode of the first led element is disposed on the second portion.

13. The method of claim 12, wherein the extending direction of the second portion and the second quasi-straight line form an acute angle.

14. The method of claim 13, wherein the extending direction of the first portion and the second quasi-straight line form an acute angle.

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