CN112530921B - Light emitting diode display device and method of manufacturing the same - Google Patents
Light emitting diode display device and method of manufacturing the same Download PDFInfo
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- CN112530921B CN112530921B CN202011232413.4A CN202011232413A CN112530921B CN 112530921 B CN112530921 B CN 112530921B CN 202011232413 A CN202011232413 A CN 202011232413A CN 112530921 B CN112530921 B CN 112530921B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
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- 238000000605 extraction Methods 0.000 description 7
- 230000008439 repair process Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000017105 transposition Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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Abstract
The light emitting diode display device comprises a back plate, a first light emitting diode element and a second light emitting diode element. The backboard is provided with a first connecting pad set and a second connecting pad set. The plurality of connection pads of the first connection pad set are provided with a plurality of first connection areas which are respectively overlapped with a plurality of electrodes of the first light-emitting diode element. The first quasi-straight line passes through a plurality of geometric centers of the first connecting areas. The second quasi-straight line passes through a plurality of geometric centers of a plurality of electrodes of the first light-emitting diode element. The first quasi-straight line and the second quasi-straight line have a first included angle theta 1. The plurality of connection pads of the second connection pad set are provided with a plurality of second connection areas which are respectively overlapped with a plurality of electrodes of the second light-emitting diode element. The third quasi-straight line passes through a plurality of geometric centers of the plurality of second connecting areas. The fourth quasi-straight line passes through a plurality of geometric centers of a plurality of electrodes of the second light emitting diode element. The third and fourth quasi-straight lines have a second included angle theta 2 different from the first included angle theta 1. The manufacturing method of the light emitting diode display device is also provided.
Description
Technical Field
The invention relates to a light-emitting diode display device and a manufacturing method thereof.
Background
Micro light emitting diode (μled) displays have the advantages of power saving, good reliability, and being capable of borderless design, and are therefore considered to be very potential display technologies. Mass transfer (mass transfer) is one of the most challenging process technologies for micro light emitting diode displays. How to quickly, accurately and efficiently transpose the micro light emitting diode chip in a short time is a common problem for manufacturers.
The biggest problem of the massive transposition technique is the improvement of the transposition yield (transfer yield). With the current technology, the transposed yield is not yet high. Therefore, after the first transposition operation is completed, a repair operation is also required. In general, in addition to the connection pad for placing the first transposed micro led, an additional repair connection pad is provided on the back plate of the micro led display for electrical connection with the repair micro led based on the repair requirement. However, the additional repair pad occupies the layout area of the micro led, which is not beneficial to the resolution improvement of the micro led.
Disclosure of Invention
The invention provides a light-emitting diode display device with good performance.
The invention provides a manufacturing method of a light-emitting diode display device, which can manufacture the light-emitting diode display device with good performance.
The invention discloses a light-emitting diode display device, which comprises a back plate, a first light-emitting diode element and a second light-emitting diode element. The backboard is provided with a first connecting pad set and a second connecting pad set. The electrodes of the first LED element are respectively and electrically connected to the plurality of connecting pads of the first connecting pad set. The plurality of connection pads of the first connection pad group are respectively provided with a plurality of first connection areas. The first connection regions are respectively overlapped with the electrodes of the first light-emitting diode element. The first quasi-straight line passes through a plurality of geometric centers of the first connecting areas. The second quasi-straight line passes through a plurality of geometric centers of a plurality of electrodes of the first light-emitting diode element. The first quasi-straight line and the second quasi-straight line have a first included angle theta 1. The electrodes of the second LED element are respectively and electrically connected to the plurality of connecting pads of the second connecting pad set. The plurality of connection pads of the second connection pad group are respectively provided with a plurality of second connection areas. The second connection regions are respectively overlapped with the electrodes of the second light-emitting diode element. The third quasi-straight line passes through a plurality of geometric centers of the plurality of second connecting areas. The fourth quasi-straight line passes through a plurality of geometric centers of a plurality of electrodes of the second light emitting diode element. The third quasi-straight line and the fourth quasi-straight line have a second included angle theta 2. The first angle θ1 is different from the second angle θ2.
A method of manufacturing a light emitting diode display device, comprising the steps of: the first light-emitting diode elements are respectively arranged on the first connecting pad groups of the backboard, wherein the first connecting pad groups are respectively provided with a plurality of first connecting areas, the first connecting areas are respectively overlapped with the electrodes of the first light-emitting diode elements, a first quasi-straight line passes through the geometric centers of the first connecting areas, a second quasi-straight line passes through the geometric centers of the electrodes of the first light-emitting diode elements, and the first quasi-straight line and the second quasi-straight line have a first included angle theta 1; removing a first light emitting diode element on a first connecting pad set, and removing a part of the first connecting pad set to form a second connecting pad set; after removing the first led element on the first pad set, a second led element is transferred onto the second pad set, wherein the plurality of pads of the second pad set have a plurality of second connection regions respectively, the plurality of second connection regions overlap the plurality of electrodes of the second led element respectively, a third quasi-straight line passes through the geometric centers of the plurality of second connection regions, a fourth quasi-straight line passes through the geometric centers of the plurality of electrodes of the second led element, the third quasi-straight line and the fourth quasi-straight line have a second included angle θ2, and the first included angle θ1 is different from the second included angle θ2.
In one embodiment of the present invention, |θ1- θ2|+.30° or |θ1- θ2|+.gtoreq.57°.
In an embodiment of the invention, the first included angle θ1 is greater than the second included angle θ2, and a spacing of the plurality of pads of the second pad set in a direction is greater than a spacing of the plurality of pads of the first pad set in the direction.
In an embodiment of the invention, the first included angle θ1 is greater than the second included angle θ2, and a distance between the plurality of electrodes of the second light emitting diode element and the fourth pseudo-straight line is greater than a distance between the plurality of electrodes of the first light emitting diode element and the second pseudo-straight line.
In an embodiment of the invention, the pad of the first pad set has a first portion and a second portion, an extending direction of the first portion is staggered with an extending direction of the second portion, and an electrode of the first light emitting diode element is disposed on the second portion.
In an embodiment of the invention, an acute angle is formed between the extending direction of the second portion and the second quasi-straight line.
In an embodiment of the invention, an acute angle is formed between the extending direction of the first portion and the second quasi-straight line.
The invention will now be described in more detail with reference to the drawings and specific examples, which are not intended to limit the invention thereto.
Drawings
Fig. 1 is a flow chart illustrating a method for manufacturing a light emitting diode display device according to an embodiment of the invention.
Fig. 2A to 2D are perspective schematic views illustrating a method for manufacturing the led display device 10 according to an embodiment of the invention.
Fig. 3A to 3D are perspective schematic views illustrating a method for manufacturing a light emitting diode display device 10A according to another embodiment of the invention.
Fig. 4A to 4D are perspective schematic views illustrating a method for manufacturing a light emitting diode display device 10B according to another embodiment of the present invention.
Wherein reference numerals are used to refer to
10. 10A, 10B: light emitting diode display device
100: backboard
110: first pad set
110a, 110b, 112a, 112b: connecting pad
110a-1, 110b-1: a first connection region
112: second pad set
112a-1, 112b-1: second connection region
114: first part
116: second part
A. B, C, D: geometric center
d1, d2: alignment direction
E1, E2: electrode
LED1: first LED element
LED2: second LED element
L1: first pseudo-straight line
L2: second pseudo-straight line
L3: third pseudo-straight line
L4: fourth pseudo-straight line
LS: laser beam
S10, S11, S20, S30, S31, S40, S50, S51, S52: step (a)
s, s': distance of
p, p': spacing of
W: substrate board
x, y: direction of extension
θ1: first included angle
θ2: second included angle
Alpha, beta: acute angle
Gamma: angle of
Detailed Description
Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may mean that there are other elements between the two elements.
As used herein, "about," "approximately," or "substantially" includes both the values and average values within an acceptable deviation of the particular values as determined by one of ordinary skill in the art, taking into account the particular number of measurements and errors associated with the measurements in question (i.e., limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the values, or within ±30%, ±20%, ±10%, ±5%. Further, as used herein, "about," "approximately," or "substantially" may be used to select a more acceptable range of deviations or standard deviations depending on the optical, etching, or other properties, and may not be used with one standard deviation for all properties.
Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present invention and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Fig. 1 is a flow chart illustrating a method for manufacturing a light emitting diode display device according to an embodiment of the invention.
Fig. 2A to 2D are perspective schematic views illustrating a method for manufacturing the led display device 10 according to an embodiment of the invention.
The following illustrates a manufacturing method and a structure of a light emitting diode display device 10 according to an embodiment of the invention with reference to fig. 1 and fig. 2A to 2D.
Referring to fig. 1 and 2A, in the present embodiment, first, step S10 may be performed: a plurality of first light emitting diode elements LED1 on the substrate W are detected. For example, in the present embodiment, the substrate W may be an epitaxial wafer of the first light emitting diode device LED1, but the invention is not limited thereto.
In step S10, if any of the first light emitting diode elements LED1 on the substrate W is found to be failed, step S11 is performed: the failed first light emitting diode element LED1 is removed from the substrate W.
In step S10, if it is determined that the plurality of first light emitting diode elements LED1 on the substrate W are normal, step S20 is performed: the plurality of first light emitting diode elements LED1 are extracted from the substrate W by extraction elements (not shown). For example, in the present embodiment, an elastic head may be selectively utilized to extract the plurality of first light emitting diode elements LED1. However, the present invention is not limited thereto, and in other embodiments, the plurality of first light emitting diode elements LED1 may be extracted using an electrostatic transposing head, a vacuum suction transposing head, or other apparatus.
In this embodiment, after step S10 is completed, step S30 may be performed: a plurality of first light emitting diode elements LED1 on the extraction element are detected.
In step S30, if any of the first light emitting diode elements LED1 on the extraction element is found to be failed, step S31 is performed: the failed first light emitting diode element LED1 is removed from the extraction element.
In step S30, if it is determined that the plurality of first light emitting diode elements LED1 on the extraction element are normal, step S40 is performed: the first light emitting diode elements LED1 are disposed at a specific angle γ with respect to the first pad groups 110 of the back plate 100, so as to transpose the first light emitting diode elements LED1 onto the first pad groups 110 of the back plate 100.
Referring to fig. 2A, for example, in the present embodiment, the arrangement direction d1 of the electrodes E1, E2 of the first light emitting diode devices LED1 on the substrate W and the arrangement direction d2 of the pads 110a, 110b of the first pad set 110 may be disposed at a specific angle γ; then, under the condition of maintaining the specific angle γ, the plurality of first light emitting diode elements LED1 are transposed on the plurality of first bonding pad groups 110 of the back plate 100 respectively by using an extraction element, so that the plurality of first light emitting diode elements LED1 are electrically connected with the plurality of first bonding pad groups 110 respectively.
After the plurality of first light emitting diode elements LED1 are transposed to the plurality of first bonding pad groups 110 of the back plate 100, the plurality of bonding pads 110a and 110B of the first bonding pad groups 110 have a plurality of first connection regions 110a-1 and 110B-1, respectively, the plurality of first connection regions 110a-1 and 110B-1 overlap the plurality of electrodes E1 and E2 of the first light emitting diode elements LED1, respectively, a first quasi-straight line L1 passes through the plurality of geometric centers a of the plurality of first connection regions 110a-1 and 110B-1, a second quasi-straight line L2 passes through the plurality of geometric centers B of the plurality of electrodes E1 and E2 of the first light emitting diode elements LED1, and the first quasi-straight line L1 and the second quasi-straight line L2 have a first included angle θ1 and θ 1>0 °. That is, the first pseudo-straight line L1 is not parallel to the second pseudo-straight line L2.
Referring to fig. 1 and 2A, after step S40 is completed (i.e. after the plurality of first light emitting diode elements LED1 are transposed), step S50 is performed: a plurality of first light emitting diode elements LED1 on the back plate 100 are detected.
In step S50, if the first light emitting diode devices LED1 on the back plate 100 are normal, the light emitting diode display device 10 is completed. In step S50, if any one of the first light emitting diode devices LED1 on the back plate 100 is found to fail, a repairing operation is performed (i.e. steps S51 and S52 are sequentially performed).
Referring to fig. 1, 2B and 2C, specifically, step S51 is performed: the failed first light emitting diode element LED1 is removed from the first pad set 110 of the back plate 100, and a portion of the first pad set 110 is removed to form a second pad set 112. For example, in the present embodiment, the laser LS may be used to remove the failed first light emitting diode element LED1. However, the invention is not so limited, and in other embodiments, other means (e.g., mechanical) of removal may be used.
Referring to fig. 2B and 2C, in the process of removing the failed first light emitting diode element LED1, a portion of the first pad set 110 (i.e., portions of the plurality of pads 110a and 110B) that is originally electrically connected to the failed first light emitting diode element LED1 is also removed along with the failed first light emitting diode element LED1, and a portion of the first pad set 110 (i.e., a plurality of residual portions of the plurality of pads 110a and 110B) remaining on the back plate 100 forms a plurality of pads 112a and 112B of the second pad set 112.
As shown in fig. 2C, a pitch p' of the plurality of pads 112a, 112b of the second pad group 112 in a direction (e.g., the arrangement direction d 2) is greater than a pitch p of the plurality of pads 110a, 110b of the first pad group 110 in the direction (e.g., the arrangement direction d 2).
Referring to fig. 1 and 2D, after step S51 is completed, step S52 is performed: the second light emitting diode device LED2 and the second pad set 112 of the back plate 100 are arranged in the same direction, so as to transpose the second light emitting diode device LED2 on the second pad set 112 of the back plate 100. For example, in the present embodiment, the arrangement direction d2 of the plurality of electrodes E1, E2 of the second light emitting diode element LED2 on the substrate W may be aligned with the arrangement direction d2 of the plurality of pads 112a, 112b of the second pad group 112; then, under the condition that the arrangement direction d2 of the plurality of electrodes E1 and E2 of the second light emitting diode element LED2 is consistent with the arrangement direction d2 of the plurality of pads 112a and 112b of the second pad set 112, the second light emitting diode element LED2 is transposed on the second pad set 112 of the back plate 100 by using an extraction element, so that the second light emitting diode element LED2 is electrically connected with the second pad set 112. In this way, the repairing operation is completed, and the led display device 10 is formed.
It should be noted that, by the above-mentioned manufacturing method of the light emitting diode display device 10, when the failed first light emitting diode element LED1 is removed and a portion of the first pad set 110 is removed, another portion of the first pad set 110 is still retained on the back plate 100 and has a sufficient area. Therefore, the second light emitting diode element LED2 for repair can be provided at the place where the failed first light emitting diode element LED1 is originally provided. In this way, the back plate 100 of the led display device 10 does not need to be provided with an additional repair pad, which is helpful for reducing the pixel size and improving the resolution of the led display device 10.
Referring to fig. 2D, the light emitting diode display device 10 includes a back plate 100, a first light emitting diode element LED1 and a second light emitting diode element LED2.
The back plate 100 has a first pad set 110 and a second pad set 112. The first pad set 110 includes a plurality of pads 110a, 110b. The second pad set 112 includes a plurality of pads 112a, 112b.
In this embodiment, the back plate 100 has a plurality of sub-pixel driving circuits (not shown), wherein each sub-pixel driving circuit includes a data line, a scan line, a power line, a common line, a first transistor, a second transistor and a capacitor, the first end of the first transistor is electrically connected to the data line, the control end of the first transistor is electrically connected to the scan line, the second end of the first transistor is electrically connected to the control end of the second transistor, the first end of the second transistor is electrically connected to the power line, and the capacitor is electrically connected to the second end of the first transistor and the first end of the second transistor.
The plurality of sub-pixel driving circuits of the back panel 100 include a first sub-pixel driving circuit and a second sub-pixel driving circuit; one pad 110a of the first pad set 110 is electrically connected to the second end of the second transistor of the first sub-pixel driving circuit, and the other pad 110b of the first pad set 110 is electrically connected to the common line of the first sub-pixel driving circuit; one pad 112a of the second pad set 112 is electrically connected to the second end of the second transistor of the second sub-pixel driving circuit, and the other pad 112b of the second pad set 112 is electrically connected to the common line of the second sub-pixel driving circuit.
For example, in the present embodiment, the control terminal of the first transistor of the first sub-pixel driving circuit and the control terminal of the first transistor of the second sub-pixel driving circuit can be selectively and electrically connected to the same scanning line, and the first pad set 110 and the second pad set 112 can be a plurality of pad sets of the same pixel of the light emitting diode display device 10, but the invention is not limited thereto.
The electrodes E1 and E2 of the first light emitting diode device LED1 are electrically connected to the pads 110a and 110b of the first pad set 110, respectively. The plurality of pads 110a, 110b of the first pad set 110 have a plurality of first connection regions 110a-1, 110b-1, respectively. The first connection regions 110a-1 and 110b-1 overlap the electrodes E1 and E2 of the first LED element LED1, respectively. The first quasi-straight line L1 passes through a plurality of geometric centers A of the plurality of first connecting regions 110a-1, 110b-1. The second quasi-straight line L2 passes through a plurality of geometric centers B of the plurality of electrodes E1, E2 of the first light emitting diode element LED1. The first quasi-straight line L1 and the second quasi-straight line L2 have a first included angle theta 1.
The electrodes E1 and E2 of the second light emitting diode device LED2 are electrically connected to the pads 112a and 112b of the second pad set 112, respectively. The plurality of pads 112a, 112b of the second pad set 112 have a plurality of second connection regions 112a-1, 112b-1, respectively. The plurality of second connection regions 112a-1, 112b-1 overlap the plurality of electrodes E1, E2 of the second light emitting diode element LED2, respectively. The third quasi-straight line L3 passes through the geometric centers C of the second connecting regions 112a-1, 112b-1. The fourth quasi-straight line L4 passes through the geometric centers D of the electrodes E1, E2 of the second light emitting diode element LED2. The third quasi-straight line L3 and the fourth quasi-straight line L4 have a second included angle theta 2. In this embodiment, θ2 is substantially 0 °, and θ2 is not indicated.
It is noted that the first included angle θ1 between the first quasi-straight line L1 and the second quasi-straight line L2 and the second included angle θ2 between the third quasi-straight line L3 and the fourth quasi-straight line L4 are different. For example, in the present embodiment, the first included angle θ1 is larger than the second included angle θ2, |θ1- θ2|+.30° or |θ1- θ2|+.gtoreq.57°.
It should be noted that the following embodiments use the element numbers and part of the content of the foregoing embodiments, where the same numbers are used to denote the same or similar elements, and descriptions of the same technical content are omitted. Reference is made to the foregoing embodiments for an explanation of omitted parts, which will not be repeated.
Fig. 3A to 3D are perspective schematic views illustrating a method for manufacturing a light emitting diode display device 10A according to another embodiment of the invention.
The light emitting diode display device 10A of fig. 3A to 3D and the manufacturing method thereof are similar to the light emitting diode display device 10 of fig. 2A to 2D and the manufacturing method thereof, and the main difference between them is that: the shape of the pad 110A of the light emitting diode display device 10A is different from the shape of the pad 110A of the light emitting diode display device 10.
Specifically, in the embodiment of fig. 3A to 3D, a pad 110a of the first pad set 110 has a second portion 116 in addition to the first portion 114, wherein an extending direction x of the first portion 114 is staggered with an extending direction y of the second portion 116. For example, in the present embodiment, the extending direction x of the first portion 114 and the extending direction y of the second portion 116 may be substantially perpendicular, and the first portion 114 and the second portion 116 may be connected to form a T-shaped conductive pattern, but the invention is not limited thereto.
Referring to fig. 3A, in the present embodiment, when the first light emitting diode device LED1 is transposed on the back plate 100, the electrode E1 of the first light emitting diode device LED1 is disposed on the second portion 116 of the pad 110 a. The extending direction y of the second portion 116 of the pad 110a and the second quasi-straight line L2 form an acute angle α. The extending direction x of the first portion 114 of the pad 110a and the second quasi-straight line L2 form an acute angle β.
Referring to fig. 3B, 3C and 3D, when the failed first light emitting diode element LED1 is removed, a large portion of the second portion 116 of the pad 110a is removed along with the failed first light emitting diode element LED1, but a large portion of the area of the first portion 114 of the pad 110a is reserved. That is, the area of the bonding pad 112a of the second bonding pad group 112 formed by the partial bonding pad 110a of the first bonding pad group 110 remaining on the back plate 100 is larger, so as to facilitate the electrical connection between the repairing second light emitting diode device LED2 and the second bonding pad group 112.
Fig. 4A to 4D are perspective schematic views illustrating a method for manufacturing a light emitting diode display device 10B according to another embodiment of the present invention.
The light emitting diode display device 10B of fig. 4A to 4D and the manufacturing method thereof are similar to the light emitting diode display device 10 of fig. 2A to 2D and the manufacturing method thereof, and the main difference is that: in the embodiment of fig. 4A to 4D, the size of the second light emitting diode element LED2 for repairing is larger than the size of the first light emitting diode element LED1 originally disposed on the back plate 100.
Referring to fig. 4D, the electrodes E1 and E2 of the first light emitting diode device LED1 are electrically connected to the pads 110a and 110b of the first pad set 110, respectively. The plurality of pads 110a, 110b of the first pad set 110 have a plurality of first connection regions 110a-1, 110b-1, respectively. The first connection regions 110a-1 and 110b-1 overlap the electrodes E1 and E2 of the first LED element LED1, respectively. The first quasi-straight line L1 passes through a plurality of geometric centers A of the plurality of first connecting regions 110a-1, 110b-1. The second quasi-straight line L2 passes through a plurality of geometric centers B of the plurality of electrodes E1, E2 of the first light emitting diode element LED1. The first quasi-straight line L1 and the second quasi-straight line L2 have a first included angle theta 1.
The electrodes E1 and E2 of the second light emitting diode device LED2 are electrically connected to the pads 112a and 112b of the second pad set 112, respectively. The plurality of pads 112a, 112b of the second pad set 112 have a plurality of second connection regions 112a-1, 112b-1, respectively. The plurality of second connection regions 112a-1, 112b-1 overlap the plurality of electrodes E1, E2 of the second light emitting diode element LED2, respectively. The third quasi-straight line L3 passes through the geometric centers C of the second connecting regions 112a-1, 112b-1. The fourth quasi-straight line L4 passes through the geometric centers D of the electrodes E1, E2 of the second light emitting diode element LED2. The third quasi-straight line L3 and the fourth quasi-straight line L4 have a second included angle theta 2. In this embodiment, θ2 is substantially 0 °, and θ2 is not indicated. The first angle θ1 is different from the second angle θ2. In this embodiment, the first angle θ1 is larger than the second angle θ2.
Unlike the embodiment of fig. 2A to 2D, the size of the second light emitting diode element LED2 for repairing is larger than the size of the first light emitting diode element LED1 originally disposed on the back plate 100, and the distance s' between the plurality of electrodes E1, E2 of the second light emitting diode element LED2 and the fourth quasi-straight line L4 is larger than the distance s between the plurality of electrodes E1, E1 of the first light emitting diode element LED1 and the second quasi-straight line L2. The distance s' refers to the distance of the geometrical centers D of the electrodes E1, E2 of the second light emitting diode element LED2. The distance s refers to the distance of the geometric centers B of the electrodes E1, E2 of the first light emitting diode element LED1.
The pitch p ' of the plurality of bonding pads 112a, 112b of the second bonding pad set 112 is larger than the pitch p ' of the plurality of bonding pads 110a, 110b of the first bonding pad set 110, and the second light emitting diode element LED2 with the larger distance s ' of the plurality of electrodes E1, E2 is used for repairing, which is helpful for improving the bonding yield of the second light emitting diode element LED2 and the second bonding pad set 112.
Of course, the present invention is capable of other various embodiments and its several details are capable of modification and variation in light of the present invention, as will be apparent to those skilled in the art, without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (14)
1. A light emitting diode display device, comprising:
a back plate having a first pad set and a second pad set;
the first light-emitting diode element comprises a plurality of electrodes, a first quasi-straight line, a second quasi-straight line and a first inclined angle theta 1, wherein the plurality of electrodes of the first light-emitting diode element are respectively and electrically connected to the plurality of connecting pads of the first connecting pad group; and
the second light-emitting diode element is characterized in that a plurality of electrodes of the second light-emitting diode element are respectively and electrically connected to a plurality of connecting pads of the second connecting pad group, the connecting pads of the second connecting pad group are respectively provided with a plurality of second connecting areas, the second connecting areas are respectively overlapped with the electrodes of the second light-emitting diode element, a third quasi-straight line passes through a plurality of geometric centers of the second connecting areas, a fourth quasi-straight line passes through a plurality of geometric centers of the electrodes of the second light-emitting diode element, the third quasi-straight line and the fourth quasi-straight line have a second included angle theta 2, and the first included angle theta 1 is different from the second included angle theta 2.
2. The light-emitting diode display device according to claim 1, wherein |θ1- θ2|is equal to or less than 30 ° or |θ1- θ2|is equal to or greater than 57 °.
3. The LED display device of claim 1, wherein the first angle θ1 is greater than the second angle θ2, and a pitch of the bonding pads of the second bonding pad set in a direction is greater than a pitch of the bonding pads of the first bonding pad set in the direction.
4. The light emitting diode display device of claim 1, wherein the first angle θ1 is greater than the second angle θ2, and a distance between the electrodes of the second light emitting diode element on the fourth pseudo-straight line is greater than a distance between the electrodes of the first light emitting diode element on the second pseudo-straight line.
5. The LED display device of claim 1, wherein one of the pads of the first pad set has a first portion and a second portion, an extending direction of the first portion is staggered with an extending direction of the second portion, and one of the electrodes of the first LED element is disposed on the second portion.
6. The led display device of claim 5, wherein the direction of extension of the second portion includes an acute angle with the second quasi-straight line.
7. The led display device of claim 6, wherein the direction of extension of the first portion and the second quasi-straight line form an acute angle.
8. A method of manufacturing a light emitting diode display device, comprising:
the method comprises the steps of enabling a plurality of first light-emitting diode elements to be respectively arranged on a plurality of first connecting pad groups of a backboard, wherein a plurality of connecting pads of each first connecting pad group are respectively provided with a plurality of first connecting areas, the first connecting areas are respectively overlapped with a plurality of electrodes of the first light-emitting diode element, a first quasi-straight line passes through a plurality of geometric centers of the first connecting areas, a second quasi-straight line passes through a plurality of geometric centers of the electrodes of the first light-emitting diode element, and a first included angle theta 1 is formed between the first quasi-straight line and the second quasi-straight line;
removing a first light emitting diode element on the first pad set, and removing a part of the first pad set to form a second pad set; and
after the first light emitting diode element on the first bonding pad set is removed, a second light emitting diode element is transferred onto the second bonding pad set, wherein a plurality of bonding pads of the second bonding pad set are respectively provided with a plurality of second connecting areas, the second connecting areas are respectively overlapped with a plurality of electrodes of the second light emitting diode element, a third quasi-straight line passes through a plurality of geometric centers of the second connecting areas, a fourth quasi-straight line passes through a plurality of geometric centers of the electrodes of the second light emitting diode element, the third quasi-straight line and the fourth quasi-straight line have a second included angle theta 2, and the first included angle theta 1 is different from the second included angle theta 2.
9. The method of manufacturing a light-emitting diode display device according to claim 8, wherein |θ1- θ2|is not more than 30 ° or |θ1- θ2|is not less than 57 °.
10. The method of claim 8, wherein the first angle θ1 is greater than the second angle θ2, and a pitch of the bonding pads of the second bonding pad set in a direction is greater than a pitch of the bonding pads of the first bonding pad set in the direction.
11. The method of claim 8, wherein the first angle θ1 is larger than the second angle θ2, and a pitch of the electrodes of the second light emitting diode element on the fourth pseudo-straight line is larger than a pitch of the electrodes of the first light emitting diode element on the second pseudo-straight line.
12. The method of claim 8, wherein a pad of the first pad set has a first portion and a second portion, an extending direction of the first portion is staggered with an extending direction of the second portion, and the electrode of the first led element is disposed on the second portion.
13. The method of claim 12, wherein the extending direction of the second portion and the second quasi-straight line form an acute angle.
14. The method of claim 13, wherein the extending direction of the first portion and the second quasi-straight line form an acute angle.
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| TW109114115A TWI723855B (en) | 2020-04-28 | 2020-04-28 | Light emitting diode display and manufacturing method thereof |
| TW109114115 | 2020-04-28 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101093295A (en) * | 2006-06-22 | 2007-12-26 | 中华映管股份有限公司 | Basal plate of active cell array, and repairing method |
| CN108615741A (en) * | 2018-04-19 | 2018-10-02 | 友达光电股份有限公司 | Light emitting device and method for manufacturing the same |
| CN109065598A (en) * | 2018-05-31 | 2018-12-21 | 友达光电股份有限公司 | Display device |
| CN109801936A (en) * | 2017-11-17 | 2019-05-24 | 英属开曼群岛商镎创科技股份有限公司 | Display panel and its restorative procedure |
| CN111048033A (en) * | 2019-06-04 | 2020-04-21 | 友达光电股份有限公司 | Display device and method for manufacturing the same |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI378574B (en) * | 2008-09-25 | 2012-12-01 | Delta Electronics Inc | Light emitting diode chip |
| TW201434179A (en) * | 2013-02-26 | 2014-09-01 | Lextar Electronics Corp | Light-emitting device and method for bonding light-emitting diode thereof |
| KR101427593B1 (en) * | 2013-04-26 | 2014-08-07 | 삼성디스플레이 주식회사 | Organic light emitting diode display |
| TWI548124B (en) * | 2013-05-27 | 2016-09-01 | 崴發控股有限公司 | Flip chip light emitting device and package structure thereof |
| CN105023987B (en) * | 2014-04-23 | 2018-01-09 | 光宝光电(常州)有限公司 | LED load bearing seats and its manufacture method |
| CN104269431B (en) * | 2014-09-29 | 2017-03-01 | 京东方科技集团股份有限公司 | A kind of organic elctroluminescent device, its driving method and display device |
| TWI657597B (en) * | 2015-03-18 | 2019-04-21 | 新世紀光電股份有限公司 | Edge lighting light emitting diode structure and method of manufacturing the same |
| US9837473B2 (en) * | 2015-04-29 | 2017-12-05 | Lg Display Co., Ltd. | Organic light emitting diode display |
| TWI661574B (en) * | 2018-06-06 | 2019-06-01 | 友達光電股份有限公司 | Micro light emitting diode display micro light emitting diode and manufacturing methods thereof |
| EP3637472A1 (en) * | 2018-10-08 | 2020-04-15 | Samsung Electronics Co., Ltd. | Organic light emitting diode display panels and display devices including the same |
| TWI668856B (en) * | 2018-12-12 | 2019-08-11 | 友達光電股份有限公司 | Light emitting diode panel |
-
2020
- 2020-04-28 TW TW109114115A patent/TWI723855B/en active
- 2020-11-06 CN CN202011232413.4A patent/CN112530921B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101093295A (en) * | 2006-06-22 | 2007-12-26 | 中华映管股份有限公司 | Basal plate of active cell array, and repairing method |
| CN109801936A (en) * | 2017-11-17 | 2019-05-24 | 英属开曼群岛商镎创科技股份有限公司 | Display panel and its restorative procedure |
| CN108615741A (en) * | 2018-04-19 | 2018-10-02 | 友达光电股份有限公司 | Light emitting device and method for manufacturing the same |
| CN109065598A (en) * | 2018-05-31 | 2018-12-21 | 友达光电股份有限公司 | Display device |
| CN111048033A (en) * | 2019-06-04 | 2020-04-21 | 友达光电股份有限公司 | Display device and method for manufacturing the same |
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| Publication number | Publication date |
|---|---|
| TW202141763A (en) | 2021-11-01 |
| CN112530921A (en) | 2021-03-19 |
| TWI723855B (en) | 2021-04-01 |
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