CN112530921A - Light emitting diode display device and method of manufacturing the same - Google Patents
Light emitting diode display device and method of manufacturing the same Download PDFInfo
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- CN112530921A CN112530921A CN202011232413.4A CN202011232413A CN112530921A CN 112530921 A CN112530921 A CN 112530921A CN 202011232413 A CN202011232413 A CN 202011232413A CN 112530921 A CN112530921 A CN 112530921A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 21
- 230000001154 acute effect Effects 0.000 claims description 9
- 239000000758 substrate Substances 0.000 description 10
- 238000000605 extraction Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 230000017105 transposition Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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Abstract
The light emitting diode display device comprises a back plate, a first light emitting diode element and a second light emitting diode element. The back plate is provided with a first bonding pad group and a second bonding pad group. The plurality of pads of the first pad group are provided with a plurality of first connection areas which are respectively overlapped with the plurality of electrodes of the first light-emitting diode element. The first pseudo-straight line passes through a plurality of geometric centers of the plurality of first connection regions. The second pseudo-straight line passes through a plurality of geometric centers of the plurality of electrodes of the first light emitting diode element. The first quasi-straight line and the second quasi-straight line have a first included angle theta 1. The plurality of pads of the second pad group have a plurality of second connection regions respectively overlapped with the plurality of electrodes of the second light emitting diode element. The third pseudo-straight line passes through a plurality of geometric centers of the plurality of second connecting regions. The fourth pseudo-straight line passes through a plurality of geometric centers of the plurality of electrodes of the second light emitting diode element. The third quasi-straight line and the fourth quasi-straight line have a second included angle theta 2 different from the first included angle theta 1. A method for manufacturing the LED display device is also provided.
Description
Technical Field
The invention relates to a light emitting diode display device and a manufacturing method thereof.
Background
Micro light emitting diode (μ LED) displays have the advantages of power saving, good reliability, capability of frameless design, and the like, and thus are considered as a potential display technology. Mass transfer (mass transfer) is one of the most challenging in the fabrication of micro-led displays. How to transfer the micro-LED chip rapidly, accurately and with high yield in a short time is a common issue facing manufacturers.
The biggest problem of the massive transposition technique is the increase of transposition yield (transfer yield). With the current technology, the transfer yield is not high. Therefore, after the first transposing operation is completed, a repairing operation is required. Generally, in addition to the pads for placing the first-transposed micro leds, additional repair pads are provided on the back plate of the micro led display for electrically connecting the repair micro leds according to the repair requirement. However, the additionally arranged repair pad occupies the layout area of the micro led, which is not favorable for improving the resolution of the micro led.
Disclosure of Invention
The invention provides a light emitting diode display device with good performance.
The invention provides a method for manufacturing a light-emitting diode display device, which can manufacture the light-emitting diode display device with good performance.
The invention relates to a light emitting diode display device which comprises a back plate, a first light emitting diode element and a second light emitting diode element. The back plate is provided with a first bonding pad group and a second bonding pad group. The electrodes of the first light emitting diode element are respectively and electrically connected to the pads of the first pad group. The plurality of pads of the first pad group are respectively provided with a plurality of first connection areas. The first connection regions are respectively overlapped with the electrodes of the first light-emitting diode element. The first pseudo-straight line passes through a plurality of geometric centers of the plurality of first connection regions. The second pseudo-straight line passes through a plurality of geometric centers of the plurality of electrodes of the first light emitting diode element. The first quasi-straight line and the second quasi-straight line have a first included angle theta 1. The electrodes of the second light emitting diode element are respectively and electrically connected to the pads of the second pad group. The plurality of pads of the second pad group are respectively provided with a plurality of second connecting areas. The second connection regions are respectively overlapped with the electrodes of the second light-emitting diode element. The third pseudo-straight line passes through a plurality of geometric centers of the plurality of second connecting regions. The fourth pseudo-straight line passes through a plurality of geometric centers of the plurality of electrodes of the second light emitting diode element. The third quasi-straight line and the fourth quasi-straight line have a second included angle theta 2. The first included angle theta 1 is different from the second included angle theta 2.
A method for manufacturing a light emitting diode display device includes the steps of: respectively transferring a plurality of first light emitting diode elements onto a plurality of first connection pad groups of a back plate, wherein a plurality of connection pads of each first connection pad group are respectively provided with a plurality of first connection areas, the plurality of first connection areas are respectively overlapped with a plurality of electrodes of the first light emitting diode element, a first quasi straight line passes through a plurality of geometric centers of the plurality of first connection areas, a second quasi straight line passes through a plurality of geometric centers of the plurality of electrodes of the first light emitting diode element, and the first quasi straight line and the second quasi straight line have a first included angle theta 1; removing a first LED element on a first bonding pad group and removing a part of the first bonding pad group to form a second bonding pad group; after removing the first light emitting diode element on the first bonding pad group, a second light emitting diode element is transferred on the second bonding pad group, wherein a plurality of bonding pads of the second bonding pad group are respectively provided with a plurality of second bonding areas, the plurality of second bonding areas are respectively overlapped with a plurality of electrodes of the second light emitting diode element, a third quasi-straight line passes through a plurality of geometric centers of the plurality of second bonding areas, a fourth quasi-straight line passes through a plurality of geometric centers of the plurality of electrodes of the second light emitting diode element, the third quasi-straight line and the fourth quasi-straight line have a second included angle theta 2, and the first included angle theta 1 is different from the second included angle theta 2.
In an embodiment of the invention, | θ 1- θ 2| ≦ 30 ° or | θ 1- θ 2| ≦ 57 °.
In an embodiment of the invention, the first included angle θ 1 is greater than the second included angle θ 2, and a distance between the pads of the second pad group in a direction is greater than a distance between the pads of the first pad group in the direction.
In an embodiment of the invention, the first included angle θ 1 is greater than the second included angle θ 2, and a distance between the plurality of electrodes of the second light emitting diode element on the fourth pseudo-straight line is greater than a distance between the plurality of electrodes of the first light emitting diode element on the second pseudo-straight line.
In an embodiment of the invention, the pads of the first pad set have a first portion and a second portion, an extending direction of the first portion is staggered with an extending direction of the second portion, and an electrode of the first light emitting diode element is disposed on the second portion.
In an embodiment of the invention, an acute angle is formed between the extending direction of the second portion and the second quasi-straight line.
In an embodiment of the invention, an acute angle is formed between the extending direction of the first portion and the second quasi-straight line.
The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.
Drawings
Fig. 1 is a schematic flow chart illustrating a method for manufacturing an led display device according to an embodiment of the invention.
Fig. 2A to fig. 2D are perspective schematic views illustrating a manufacturing method of an led display device 10 according to an embodiment of the invention.
Fig. 3A to fig. 3D are perspective schematic views illustrating a manufacturing method of an led display device 10A according to another embodiment of the invention.
Fig. 4A to 4D are schematic perspective views illustrating a method for manufacturing a light emitting diode display device 10B according to another embodiment of the invention.
Wherein the reference numerals
10. 10A, 10B: light emitting diode display device
100: back plate
110: first pad group
110a, 110b, 112a, 112 b: connecting pad
110a-1, 110 b-1: first connection region
112: second pad set
112a-1, 112 b-1: second connecting region
114: the first part
116: the second part
A. B, C, D: geometric center
d1, d 2: direction of arrangement
E1, E2: electrode for electrochemical cell
LED 1: first light emitting diode element
LED 2: second light emitting diode element
L1: first quasi-straight line
L2: second quasi-straight line
L3: third quasi-straight line
L4: fourth pseudo-straight line
LS: laser device
S10, S11, S20, S30, S31, S40, S50, S51, S52: step (ii) of
s, s': distance between two adjacent plates
p, p': distance between each other
W: substrate
x, y: direction of extension
θ 1: first included angle
θ 2: second included angle
α, β: acute angle
γ: angle of rotation
Detailed Description
Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.
It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connections. Further, "electrically connected" or "coupled" may mean that there are additional elements between the elements.
As used herein, "about", "approximately", or "substantially" includes the stated value and the average value within an acceptable range of deviation of the specified value as determined by one of ordinary skill in the art, taking into account the measurement in question and the specified amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the stated value, or within ± 30%, ± 20%, ± 10%, ± 5%. Further, as used herein, "about", "approximately" or "substantially" may be selected based on optical properties, etch properties, or other properties, with a more acceptable range of deviation or standard deviation, and not all properties may be applied with one standard deviation.
Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present invention and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Fig. 1 is a schematic flow chart illustrating a method for manufacturing an led display device according to an embodiment of the invention.
Fig. 2A to fig. 2D are perspective schematic views illustrating a manufacturing method of an led display device 10 according to an embodiment of the invention.
The following describes a method for manufacturing an led display device 10 and a structure thereof according to an embodiment of the invention with reference to fig. 1 and fig. 2A to 2D.
Referring to fig. 1 and fig. 2A, in the present embodiment, first, step S10 may be performed: the plurality of first light emitting diode elements LED1 on the substrate W are detected. For example, in the embodiment, the substrate W may be an epitaxial wafer of the first light emitting diode element LED1, but the invention is not limited thereto.
In step S10, if it is found that any one of the first light emitting diode elements LED1 on the substrate W is failed, the process proceeds to step S11: the failed first light emitting diode element LED1 is removed from the substrate W.
In step S10, if it is determined that the plurality of first light emitting diode elements LEDs 1 on the substrate W are normal, the process proceeds to step S20: a plurality of first light emitting diode elements LEDs 1 are extracted from the substrate W by extraction elements (not shown). For example, in the present embodiment, a flexible transposing head can be selectively used to extract a plurality of first LED elements 1. However, the present invention is not limited thereto, and in other embodiments, the plurality of first light emitting diode element LEDs 1 may be extracted using an electrostatic transposing head, a vacuum attraction transposing head, or other device.
In this embodiment, after completing step S10, step S30 may be performed: a plurality of first light emitting diode elements LEDs 1 on the extraction element are detected.
In step S30, if it is found that any one of the first LED devices 1 of the extraction device is failed, the process proceeds to step S31: the failed first light emitting diode element LED1 is removed from the extraction element.
In step S30, if it is determined that the first LED elements LED1 on the extraction element are normal, the process proceeds to step S40: the plurality of first LED elements 1 and the plurality of first pad sets 110 of the back panel 100 form a specific angle γ, so that the plurality of first LED elements 1 are transposed onto the plurality of first pad sets 110 of the back panel 100.
Referring to fig. 2A, for example, in the present embodiment, a specific angle γ may be formed between the arrangement direction d1 of the electrodes E1 and E2 of the first light emitting diode elements LED1 on the substrate W and the arrangement direction d2 of the pads 110a and 110b of the first pad group 110; then, under the condition of maintaining the specific angle γ, the plurality of first LED elements 1 are respectively transferred onto the plurality of first pad sets 110 of the back plate 100 by using an extraction element, so that the plurality of first LED elements LEDs 1 are respectively electrically connected to the plurality of first pad sets 110.
After the first LED devices 1 are respectively transposed to the first pad sets 110 of the backplate 100, the pads 110a and 110B of the first pad sets 110 respectively have a plurality of first connection regions 110a-1 and 110B-1, the first connection regions 110a-1 and 110B-1 are respectively overlapped with the electrodes E1 and E2 of the first LED device LED1, a first pseudo-straight line L1 passes through the geometric centers a of the first connection regions 110a-1 and 110B-1, a second pseudo-straight line L2 passes through the geometric centers B of the electrodes E1 and E2 of the first LED device LED1, and the first pseudo-straight line L1 and the second pseudo-straight line L2 have a first θ 1, and θ 1 is greater than 0 °. That is, the first pseudo-straight line L1 is not parallel to the second pseudo-straight line L2.
Referring to fig. 1 and 2A, after step S40 is completed (i.e., after the plurality of first light emitting diode element LEDs 1 are transposed), step S50 is performed: a plurality of first light emitting diode element LEDs 1 on the backplane 100 are detected.
In step S50, if the plurality of first LED elements LEDs 1 on the back panel 100 are normal, the LED display device 10 is completed. In step S50, if it is found that any one of the first LED elements 1 on the back plate 100 is failed, a repairing operation is performed (i.e., steps S51 and S52 are performed in sequence).
Referring to fig. 1, fig. 2B and fig. 2C, in detail, step S51 is first performed: the failed first LED element LEDs 1 are removed from the first pad set 110 of the backplane 100 and a portion of the first pad set 110 is removed to form a second pad set 112. For example, in the present embodiment, the failed first light emitting diode element LED1 may be removed using a laser LS. However, the invention is not limited thereto, and in other embodiments, other means (e.g., mechanical means) for removing the metal layer may be used.
Referring to fig. 2B and 2C, in the process of removing the failed first LED device 1, a portion of the first pad set 110 (i.e., portions of the pads 110a and 110B) originally electrically connected to the failed first LED device LED1 is also removed along with the failed first LED device LED1, and a portion of the first pad set 110 (i.e., remaining portions of the pads 110a and 110B) remaining on the backplane 100 forms the pads 112a and 112B of the second pad set 112.
As shown in fig. 2C, a pitch p' of the pads 112a, 112b of the second pad group 112 in a direction (e.g., the arrangement direction d2) is greater than a pitch p of the pads 110a, 110b of the first pad group 110 in the direction (e.g., the arrangement direction d 2).
Referring to fig. 1 and fig. 2D, after step S51 is completed, step S52 is performed: the second LED element LEDs 2 are arranged in the same direction as the second pad group 112 of the back panel 100, so that the second LED element LEDs 2 are transposed on the second pad group 112 of the back panel 100. For example, in the present embodiment, the arrangement direction d2 of the electrodes E1 and E2 of the second LED element LED2 on the substrate W may be consistent with the arrangement direction d2 of the pads 112a and 112b of the second pad group 112; then, while maintaining the alignment direction d2 of the electrodes E1 and E2 of the second LED element LED2 consistent with the alignment direction d2 of the pads 112a and 112b of the second pad set 112, an extraction element is used to transpose the second LED element LED2 onto the second pad set 112 of the back plate 100, so that the second LED element LED2 is electrically connected to the second pad set 112. In this way, the repairing operation is completed and the led display device 10 is formed.
It should be noted that, by the above-mentioned method for manufacturing the LED display device 10, when the failed first LED element LED1 is removed and a portion of the first pad set 110 is removed, another portion of the first pad set 110 is still remained on the rear panel 100 and has a sufficient area. Therefore, the second light emitting diode element LED2 for repair can be provided even where the failed first light emitting diode element LED1 is originally provided. Therefore, the back plate 100 of the led display device 10 does not need to have an additional repairing pad thereon, which is helpful to reduce the pixel size of the led display device 10 and improve the resolution.
Referring to fig. 2D, the LED display device 10 includes a back plate 100, a first LED element 1 and a second LED element LED 2.
The back plate 100 has a first pad set 110 and a second pad set 112. The first pad set 110 includes a plurality of pads 110a and 110 b. The second pad set 112 includes a plurality of pads 112a and 112 b.
In the present embodiment, the backplane 100 has a plurality of sub-pixel driving circuits (not shown), wherein each sub-pixel driving circuit includes a data line, a scan line, a power line, a common line, a first transistor, a second transistor and a capacitor, a first terminal of the first transistor is electrically connected to the data line, a control terminal of the first transistor is electrically connected to the scan line, a second terminal of the first transistor is electrically connected to a control terminal of the second transistor, a first terminal of the second transistor is electrically connected to the power line, and the capacitor is electrically connected to the second terminal of the first transistor and the first terminal of the second transistor.
The plurality of sub-pixel driving circuits of the backplane 100 includes a first sub-pixel driving circuit and a second sub-pixel driving circuit; one pad 110a of the first pad set 110 is electrically connected to the second terminal of the second transistor of the first sub-pixel driving circuit, and the other pad 110b of the first pad set 110 is electrically connected to the common line of the first sub-pixel driving circuit; one pad 112a of the second pad set 112 is electrically connected to the second terminal of the second transistor of the second sub-pixel driving circuit, and the other pad 112b of the second pad set 112 is electrically connected to the common line of the second sub-pixel driving circuit.
For example, in the present embodiment, the control terminal of the first transistor of the first sub-pixel driving circuit and the control terminal of the first transistor of the second sub-pixel driving circuit can be selectively and electrically connected to the same scan line, and the first pad set 110 and the second pad set 112 can be a plurality of pad sets of the same pixel of the led display device 10, but the invention is not limited thereto.
The electrodes E1 and E2 of the first LED element LED1 are electrically connected to the pads 110a and 110b of the first pad set 110, respectively. The pads 110a and 110b of the first pad set 110 have a plurality of first connection regions 110a-1 and 110b-1, respectively. The plurality of first connection regions 110a-1, 110b-1 overlap the plurality of electrodes E1, E2 of the first light emitting diode element LED1, respectively. The first pseudo-straight line L1 passes through the plurality of geometric centers A of the plurality of first attachment regions 110a-1, 110 b-1. The second pseudo straight line L2 passes through a plurality of geometric centers B of the plurality of electrodes E1, E2 of the first light emitting diode element LED 1. The first quasi-straight line L1 and the second quasi-straight line L2 form a first included angle theta 1.
The electrodes E1 and E2 of the second LED device LED2 are electrically connected to the pads 112a and 112b of the second pad set 112, respectively. The pads 112a and 112b of the second pad set 112 have a plurality of second connection regions 112a-1 and 112b-1, respectively. The second connection regions 112a-1 and 112b-1 overlap the electrodes E1 and E2 of the second light emitting diode element LED2, respectively. The third pseudo-straight line L3 passes through a plurality of geometric centers C of the plurality of second attachment zones 112a-1, 112 b-1. The fourth pseudo-straight line L4 passes through a plurality of geometric centers D of the plurality of electrodes E1, E2 of the second light emitting diode element LED 2. The third quasi-straight line L3 and the fourth quasi-straight line L4 form a second included angle theta 2. In the present embodiment, θ 2 is substantially 0 °, and θ 2 is not indicated.
It should be noted that the first angle θ 1 between the first quasi-straight line L1 and the second quasi-straight line L2 is different from the second angle θ 2 between the third quasi-straight line L3 and the fourth quasi-straight line L4. For example, in the embodiment, the first included angle θ 1 is greater than the second included angle θ 2, | θ 1- θ 2| ≦ 30 ° or | θ 1- θ 2| ≧ 57 °.
It should be noted that the following embodiments follow the reference numerals and parts of the contents of the foregoing embodiments, wherein the same reference numerals are used to indicate the same or similar elements, and the description of the same technical contents is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, which will not be repeated below.
Fig. 3A to fig. 3D are perspective schematic views illustrating a manufacturing method of an led display device 10A according to another embodiment of the invention.
The led display device 10A and the manufacturing method thereof shown in fig. 3A to 3D are similar to the led display device 10 and the manufacturing method thereof shown in fig. 2A to 2D, and the main difference therebetween is: the shape of the pad 110A of the led display device 10A is different from the shape of the pad 110A of the led display device 10.
Specifically, in the embodiment of fig. 3A to 3D, one pad 110a of the first pad set 110 has a second portion 116 in addition to the first portion 114, wherein an extending direction x of the first portion 114 is staggered with an extending direction y of the second portion 116. For example, in the present embodiment, the extending direction x of the first portion 114 and the extending direction y of the second portion 116 may be substantially perpendicular, and the first portion 114 and the second portion 116 may be connected to form a T-shaped conductive pattern, but the invention is not limited thereto.
Referring to fig. 3A, in the embodiment, when the first LED element LED1 is transposed on the back plate 100, the electrode E1 of the first LED element LED1 is disposed on the second portion 116 of the pad 110 a. The extending direction y of the second portion 116 of the pad 110a forms an acute angle α with the second quasi-straight line L2. The extending direction x of the first portion 114 of the pad 110a forms an acute angle β with the second quasi-straight line L2.
Referring to fig. 3B, fig. 3C and fig. 3D, when the failed first LED device LED1 is removed, most of the second portion 116 of the pad 110a is removed along with the failed first LED device LED1, but most of the area of the first portion 114 of the pad 110a is remained. That is, the area of the pads 112a of the second pad set 112 formed by the partial pads 110a of the first pad set 110 remaining on the rear panel 100 is larger, which facilitates the electrical connection between the second LED device for repairing LED2 and the second pad set 112.
Fig. 4A to 4D are schematic perspective views illustrating a method for manufacturing a light emitting diode display device 10B according to another embodiment of the invention.
The led display device 10B of fig. 4A to 4D and the manufacturing method thereof are similar to the led display device 10 of fig. 2A to 2D and the manufacturing method thereof, and the main difference therebetween is: in the embodiment of fig. 4A to 4D, the size of the second light emitting diode element LED2 for repairing is larger than the size of the first light emitting diode element LED1 originally disposed on the backboard 100.
Referring to fig. 4D, a plurality of electrodes E1 and E2 of the first LED device LED1 are electrically connected to the pads 110a and 110b of the first pad set 110, respectively. The pads 110a and 110b of the first pad set 110 have a plurality of first connection regions 110a-1 and 110b-1, respectively. The plurality of first connection regions 110a-1, 110b-1 overlap the plurality of electrodes E1, E2 of the first light emitting diode element LED1, respectively. The first pseudo-straight line L1 passes through the plurality of geometric centers A of the plurality of first attachment regions 110a-1, 110 b-1. The second pseudo straight line L2 passes through a plurality of geometric centers B of the plurality of electrodes E1, E2 of the first light emitting diode element LED 1. The first quasi-straight line L1 and the second quasi-straight line L2 form a first included angle theta 1.
The electrodes E1 and E2 of the second LED device LED2 are electrically connected to the pads 112a and 112b of the second pad set 112, respectively. The pads 112a and 112b of the second pad set 112 have a plurality of second connection regions 112a-1 and 112b-1, respectively. The second connection regions 112a-1 and 112b-1 overlap the electrodes E1 and E2 of the second light emitting diode element LED2, respectively. The third pseudo-straight line L3 passes through a plurality of geometric centers C of the plurality of second attachment zones 112a-1, 112 b-1. The fourth pseudo-straight line L4 passes through a plurality of geometric centers D of the plurality of electrodes E1, E2 of the second light emitting diode element LED 2. The third quasi-straight line L3 and the fourth quasi-straight line L4 form a second included angle theta 2. In the present embodiment, θ 2 is substantially 0 °, and θ 2 is not indicated. The first included angle theta 1 is different from the second included angle theta 2. In the present embodiment, the first included angle θ 1 is greater than the second included angle θ 2.
Unlike the embodiment of fig. 2A to 2D, the size of the second light emitting diode element LED2 for repairing is larger than the size of the first light emitting diode element LED1 originally disposed on the back plate 100, and the distance s' of the plurality of electrodes E1, E2 of the second light emitting diode element LED2 on the fourth pseudo-straight line L4 is larger than the distance s of the plurality of electrodes E1, E1 of the first light emitting diode element LED1 on the second pseudo-straight line L2. The distance s' is a distance of geometric centers D of the electrodes E1 and E2 of the second light emitting diode element LED 2. The distance s is a distance of the geometric centers B of the electrodes E1 and E2 of the first light emitting diode element LED 1.
The pitch p ' of the pads 112a, 112b of the second pad set 112 is larger than the pitch p ' of the pads 110a, 110b of the first pad set 110, and the second LED device LED2 having the larger distance s ' between the electrodes E1, E2 is used for repairing, which is helpful to improve the bonding yield between the second LED device LED2 and the second pad set 112.
The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (14)
1. A light emitting diode display device, comprising:
a back plate having a first pad set and a second pad set;
a first light emitting diode element, wherein a plurality of electrodes of the first light emitting diode element are electrically connected to a plurality of pads of the first pad group, the pads of the first pad group are respectively provided with a plurality of first connection regions, the first connection regions are respectively overlapped with the electrodes of the first light emitting diode element, a first pseudo-straight line passes through a plurality of geometric centers of the first connection regions, a second pseudo-straight line passes through a plurality of geometric centers of the electrodes of the first light emitting diode element, and the first pseudo-straight line and the second pseudo-straight line have a first included angle theta 1; and
a second light emitting diode element, wherein a plurality of electrodes of the second light emitting diode element are electrically connected to a plurality of pads of the second pad set, the pads of the second pad set are respectively provided with a plurality of second connection areas, the second connection areas are respectively overlapped with the electrodes of the second light emitting diode element, a third quasi-straight line passes through a plurality of geometric centers of the second connection areas, a fourth quasi-straight line passes through a plurality of geometric centers of the electrodes of the second light emitting diode element, the third quasi-straight line and the fourth quasi-straight line have a second included angle theta 2, and the first included angle theta 1 is different from the second included angle theta 2.
2. The light emitting diode display device of claim 1, wherein | θ 1- θ 2| ≦ 30 ° or | θ 1- θ 2| ≧ 57 °.
3. The light emitting diode display device of claim 1, wherein the first included angle θ 1 is greater than the second included angle θ 2, and a distance between the pads of the second pad set in a direction is greater than a distance between the pads of the first pad set in the direction.
4. The light emitting diode display device of claim 1, wherein the first included angle θ 1 is greater than the second included angle θ 2, and a distance of the electrodes of the second light emitting diode element on the fourth pseudo-straight line is greater than a distance of the electrodes of the first light emitting diode element on the second pseudo-straight line.
5. The light emitting diode display device of claim 1, wherein one of the pads of the first set of pads has a first portion and a second portion, an extending direction of the first portion is staggered with an extending direction of the second portion, and one of the electrodes of the first light emitting diode element is disposed on the second portion.
6. The light emitting diode display device of claim 5, wherein the extending direction of the second portion forms an acute angle with the second quasi-straight line.
7. The light emitting diode display device of claim 6, wherein the extending direction of the first portion forms an acute angle with the second quasi-straight line.
8. A method of manufacturing a light emitting diode display device, comprising:
respectively transferring a plurality of first light emitting diode elements onto a plurality of first connection pad groups of a back plate, wherein a plurality of connection pads of each first connection pad group are respectively provided with a plurality of first connection areas, the first connection areas are respectively overlapped with a plurality of electrodes of the first light emitting diode element, a first quasi-straight line passes through a plurality of geometric centers of the first connection areas, a second quasi-straight line passes through a plurality of geometric centers of the electrodes of the first light emitting diode element, and the first quasi-straight line and the second quasi-straight line have a first included angle theta 1;
removing a first LED element on the first pad set and removing a part of the first pad set to form a second pad set; and
after removing the first led element on the first pad set, a second led element is transferred onto the second pad set, wherein the pads of the second pad set have a plurality of second connection areas respectively, the second connection areas overlap with the electrodes of the second led element respectively, a third pseudo-straight line passes through a plurality of geometric centers of the second connection areas, a fourth pseudo-straight line passes through a plurality of geometric centers of the electrodes of the second led element, the third pseudo-straight line and the fourth pseudo-straight line have a second included angle θ 2, and the first included angle θ 1 is different from the second included angle θ 2.
9. The method of claim 8, wherein | θ 1- θ 2| ≦ 30 ° or | θ 1- θ 2| ≦ 57 °.
10. The method of claim 8, wherein the first angle θ 1 is greater than the second angle θ 2, and a distance between the pads of the second set of pads in a direction is greater than a distance between the pads of the first set of pads in the direction.
11. The method of claim 8, wherein the first included angle θ 1 is greater than the second included angle θ 2, and a distance between the electrodes of the second LED element on the fourth pseudo-straight line is greater than a distance between the electrodes of the first LED element on the second pseudo-straight line.
12. The method as claimed in claim 8, wherein the pad of the first pad set has a first portion and a second portion, an extending direction of the first portion is staggered with an extending direction of the second portion, and the electrode of the first LED device is disposed on the second portion.
13. The method of claim 12, wherein the extending direction of the second portion forms an acute angle with the second virtual line.
14. The method of claim 13, wherein the extending direction of the first portion forms an acute angle with the second quasi-straight line.
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| TW109114115A TWI723855B (en) | 2020-04-28 | 2020-04-28 | Light emitting diode display and manufacturing method thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101093295A (en) * | 2006-06-22 | 2007-12-26 | 中华映管股份有限公司 | Basal plate of active cell array, and repairing method |
| US20160276293A1 (en) * | 2015-03-18 | 2016-09-22 | Genesis Photonics Inc. | Light-emitting device and backlight module using the same |
| CN108615741A (en) * | 2018-04-19 | 2018-10-02 | 友达光电股份有限公司 | Light emitting device and method for manufacturing the same |
| CN109065598A (en) * | 2018-05-31 | 2018-12-21 | 友达光电股份有限公司 | Display device |
| CN109801936A (en) * | 2017-11-17 | 2019-05-24 | 英属开曼群岛商镎创科技股份有限公司 | Display panel and its restorative procedure |
| CN111048033A (en) * | 2019-06-04 | 2020-04-21 | 友达光电股份有限公司 | Display device and method for manufacturing the same |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI378574B (en) * | 2008-09-25 | 2012-12-01 | Delta Electronics Inc | Light emitting diode chip |
| TW201434179A (en) * | 2013-02-26 | 2014-09-01 | Lextar Electronics Corp | Light-emitting device and method for bonding light-emitting diode thereof |
| KR101427593B1 (en) * | 2013-04-26 | 2014-08-07 | 삼성디스플레이 주식회사 | Organic light emitting diode display |
| TWI548124B (en) * | 2013-05-27 | 2016-09-01 | 崴發控股有限公司 | Flip chip light emitting device and package structure thereof |
| CN105023987B (en) * | 2014-04-23 | 2018-01-09 | 光宝光电(常州)有限公司 | LED load bearing seats and its manufacture method |
| CN104269431B (en) * | 2014-09-29 | 2017-03-01 | 京东方科技集团股份有限公司 | A kind of organic elctroluminescent device, its driving method and display device |
| US9837473B2 (en) * | 2015-04-29 | 2017-12-05 | Lg Display Co., Ltd. | Organic light emitting diode display |
| TWI661574B (en) * | 2018-06-06 | 2019-06-01 | 友達光電股份有限公司 | Micro light emitting diode display micro light emitting diode and manufacturing methods thereof |
| EP3637472A1 (en) * | 2018-10-08 | 2020-04-15 | Samsung Electronics Co., Ltd. | Organic light emitting diode display panels and display devices including the same |
| TWI668856B (en) * | 2018-12-12 | 2019-08-11 | 友達光電股份有限公司 | Light emitting diode panel |
-
2020
- 2020-04-28 TW TW109114115A patent/TWI723855B/en active
- 2020-11-06 CN CN202011232413.4A patent/CN112530921B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101093295A (en) * | 2006-06-22 | 2007-12-26 | 中华映管股份有限公司 | Basal plate of active cell array, and repairing method |
| US20160276293A1 (en) * | 2015-03-18 | 2016-09-22 | Genesis Photonics Inc. | Light-emitting device and backlight module using the same |
| CN109801936A (en) * | 2017-11-17 | 2019-05-24 | 英属开曼群岛商镎创科技股份有限公司 | Display panel and its restorative procedure |
| CN108615741A (en) * | 2018-04-19 | 2018-10-02 | 友达光电股份有限公司 | Light emitting device and method for manufacturing the same |
| CN109065598A (en) * | 2018-05-31 | 2018-12-21 | 友达光电股份有限公司 | Display device |
| CN111048033A (en) * | 2019-06-04 | 2020-04-21 | 友达光电股份有限公司 | Display device and method for manufacturing the same |
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| Publication number | Publication date |
|---|---|
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| TW202141763A (en) | 2021-11-01 |
| CN112530921B (en) | 2023-05-02 |
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