CN210130004U - Integrated circuit and uncovering type combined board - Google Patents
Integrated circuit and uncovering type combined board Download PDFInfo
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- CN210130004U CN210130004U CN201822231303.0U CN201822231303U CN210130004U CN 210130004 U CN210130004 U CN 210130004U CN 201822231303 U CN201822231303 U CN 201822231303U CN 210130004 U CN210130004 U CN 210130004U
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Abstract
The utility model discloses an integrated circuit reaches takes off lid type combination board, include: and combining the plate body. The dimensions required for deformation of the bonding body are first determined. After the size and shape of the flexible part are determined, the rigid plate and the flexible plate are superposed and matched, namely, a processed part corresponding to the flexible part is formed on the rigid plate. The processing part is divided into a first milling cutter cover uncovering part and a laser cover uncovering part, and the projection of the first milling cutter cover uncovering part on the flexible part and the boundary of the flexible part are arranged at intervals, so that the phenomenon that the milling cutter damages the connection part of the flexible part and the rigid plate when processing the first milling cutter cover uncovering part is avoided. Therefore, when the cover of the combined plate body is uncovered, the combined plate body can be processed by combining two processing modes of milling through by a milling cutter and laser controlled deep cutting, and compared with the traditional rigid-flex combined plate which can only be processed by a single mode of laser controlled deep cutting. The cover-uncovering type combination board can reduce the processing cost of the rigid-flex combination board.
Description
Technical Field
The utility model relates to a technical field of circuit board processing especially relates to an integrated circuit and take off lid type combination board.
Background
Conventionally, a flex-rigid board (a circuit board formed by combining a thin-layer flexible substrate and a rigid substrate, and then laminating them into a single component) requires a cover-removing operation (which means removing a rigid material on the flexible board, wherein the rigid material refers to a rigid substrate and a copper foil) for the flex-rigid board during use. With the continuous reduction of the size or thickness of electronic products, the thickness of the rigid-flex printed circuit board also becomes smaller, and higher precision is required when the rigid-flex printed circuit board is uncovered. In order to ensure the uncovering effect of the rigid-flex printed circuit board, the uncovering operation is usually performed in a laser cutting mode. Therefore, the cover-uncovering mode has higher processing cost.
SUMMERY OF THE UTILITY MODEL
Accordingly, there is a need for an integrated circuit and a flip-top type bonding board that can reduce the cost of processing a rigid-flex board.
The technical scheme is as follows:
a cover-lift type bonding board comprising: the combined plate comprises a rigid plate and a flexible plate, the rigid plate is in superposition fit with the flexible plate, a flexible portion is arranged on the flexible plate, the flexible portion is used for bending deformation of the combined plate, a processing portion corresponding to the flexible portion is arranged on the rigid plate, the processing portion comprises a first milling cutter cover uncovering portion and a laser cover uncovering portion, the first milling cutter cover uncovering portion is used for processing fit with a milling cutter, the laser cover uncovering portion is used for processing fit with a laser cutter, and the projection of the first milling cutter cover uncovering portion on the flexible portion and the boundary of the flexible portion are arranged at intervals.
When the cover-opening type joint plate is processed, the size and the shape of the flexible part are determined according to the actual installation space. I.e. to determine the required dimensions for deformation of the bonding body. After the size and shape of the flexible part are determined, the rigid plate and the flexible plate are superposed and matched, namely, a processed part corresponding to the flexible part is formed on the rigid plate. The processing part is divided into a first milling cutter cover uncovering part and a laser cover uncovering part, and the projection of the first milling cutter cover uncovering part on the flexible part and the boundary of the flexible part are arranged at intervals, so that the phenomenon that the milling cutter damages the connection part of the flexible part and the rigid plate when processing the first milling cutter cover uncovering part is avoided. Therefore, when the cover of the combined plate body is uncovered, the combined plate body can be processed by combining two processing modes of milling through by a milling cutter and laser controlled deep cutting, and compared with the traditional rigid-flex combined plate which can only be processed by a single mode of laser controlled deep cutting. The cover-uncovering type combination board can reduce the processing cost of the rigid-flex combination board.
The present invention is further explained below by combining the above scheme:
the rigid plate comprises a first rigid sub plate and a second rigid sub plate, the processing part comprises a first processing branch and a second processing branch, the first processing branch is arranged on the first rigid sub plate, the second processing branch is arranged on the second rigid sub plate, the first processing branch and the second processing branch correspond to the flexible part, one side of the first rigid sub plate and one side of the flexible plate are mutually attached, and the other side of the second rigid sub plate and the other side of the flexible plate are mutually attached.
The rigid plate is in superposed fit with one side of the flexible plate, and the other side of the flexible plate is exposed in the external space.
The flexible plate is provided with a rigid plate and a flexible plate, and the rigid plate and the flexible plate are bonded through the adhesive piece.
A plurality of resin holes are arranged on the combined plate body at intervals.
The distance between the projection of the first milling cutter uncovering part on the flexible part and the boundary of the flexible part is 0.3-0.5 mm.
The processing part further comprises a second milling cutter cover uncovering part, the first milling cutter cover uncovering part and the second milling cutter cover uncovering part are arranged at intervals, and the first milling cutter cover uncovering part and the second milling cutter cover uncovering part are bridged.
The bridging distance between the first milling cutter cover uncovering part and the second milling cutter cover uncovering part is 1 mm-2 mm.
The flexible portion includes a first flexible subsection and a second flexible subsection spaced apart from each other, the processing portion includes a third processing subsection corresponding to the first flexible subsection and a fourth processing subsection corresponding to the second flexible subsection.
An integrated circuit comprises the uncovering type combination board and an integrated circuit board, wherein the integrated circuit board is electrically connected with the uncovering type combination board.
When the integrated circuit is used, the uncovering type combination board is connected with the integrated circuit board, so that the space requirement of the integrated circuit can be met on one hand, and the processing cost of the integrated circuit is saved on the other hand.
Drawings
Fig. 1 is a schematic structural view of a cover-uncovering type combination board according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a cover-uncovering type combination board according to another embodiment of the present invention;
fig. 3 is a schematic structural view of a cover-uncovering type combination board according to another embodiment of the present invention;
fig. 4 is a schematic structural view of a cover-uncovering type combination board according to another embodiment of the present invention.
Description of reference numerals:
100. a bonding plate body, 110, a rigid plate, 111, a processing portion, 1111, a first milling cutter cap-removing portion, 1112, a laser cap-removing portion, 1113, a second milling cutter cap-removing portion, 1114, a first processing portion, 1115, a second processing portion, 1116, a third processing portion, 1117, a fourth processing portion, 112, a first rigid subpart, 113, a second rigid subpart, 120, a flexible plate, 121, a flexible portion, 1211, a first flexible portion, 1212, and a second flexible portion.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and the following detailed description. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the present invention, the terms "first" and "second" do not denote any particular quantity or order, but are merely used to distinguish names.
In one embodiment, as shown in fig. 1, a combination board of a flip-top type includes: the board body 100 is combined, the board body 100 includes a rigid board 110 and a flexible board 120, the rigid board 110 is overlapped and matched with the flexible board 120, a flexible portion 121 is disposed on the flexible board 120, the flexible portion 121 is used for bending and deforming the board body 100, a processing portion 111 corresponding to the flexible portion 121 is disposed on the rigid board 110, the processing portion 111 includes a first milling cutter cover portion 1111 and a laser cover portion 1112, the first milling cutter cover portion 1111 is used for processing and matching with a milling cutter, the laser cover portion 1112 is used for processing and matching with a laser cutter, and a projection of the first milling cutter cover portion 1111 on the flexible portion 121 and a boundary of the flexible portion 121 are arranged at intervals.
When the cover-release type coupling plate is manufactured, the size and shape of the flexible portion 121 are determined according to an actual installation space. I.e. to determine the required dimensions for deformation of the bonding body. After the size and shape of the flexible portion 121 are determined, the rigid plate 110 is then overlapped and fitted with the flexible plate 120, i.e., the rigid plate 110 is formed with a processed portion 111 corresponding to the flexible portion 121. The machining part 111 is divided into a first milling cutter uncovering part 1111 and a laser uncovering part 1112, and the projection of the first milling cutter uncovering part 1111 on the flexible part 121 and the boundary of the flexible part 121 are arranged at intervals, so that the connection part of the flexible part 121 and the rigid plate 110 is prevented from being damaged when the milling cutter machines the first milling cutter uncovering part 1111. Therefore, when the cover of the combination board 100 is removed, the combination processing can be performed by milling with a milling cutter and laser controlled deep cutting, compared with the conventional rigid-flex combination board which can only be processed by laser controlled deep cutting in a single mode. The cover-uncovering type combination board can reduce the processing cost of the rigid-flex combination board.
As shown in fig. 1 and 2, in one embodiment, the rigid plate 110 includes a first rigid sub-plate 112 and a second rigid sub-plate 113. The processing section 111 includes a first processing sub 1114 and a second processing sub 1115. The first processing branch 1114 is disposed on the first rigid sub-plate 112, the second processing branch 1115 is disposed on the second rigid sub-plate 113, and the first processing branch 1114 and the second processing branch 1115 both correspond to the flexible portion 121, one side of the first rigid sub-plate 112 and one side of the flexible plate 120 are bonded to each other, and the other side of the second rigid sub-plate 113 and the other side of the flexible plate 120 are bonded to each other. Specifically, the flexible board 120 needs to be installed inside the rigid board 110 according to actual use. Therefore, in this embodiment, the first processed portion 111 is integrally formed with the first rigid sub-plate 112, and the second processed portion 111 is integrally formed with the second rigid sub-plate 113. The two sides of the flexible plate 120 are respectively attached to the first rigid sub-plate 112 and the second rigid sub-plate 113, i.e. the flexible plate 120 is located inside the rigid plate 110. The opening area of the flexible portion 121 is first determined. In this case, the areas of the first processed portion 111 and the second processed portion 111 are determined according to the opening area of the flexible portion 121, that is, both the first processed portion 111 and the second processed portion 111 can be processed by milling and laser controlled depth cutting. The embodiment can effectively reduce the processing cost of the rigid-flex printed circuit board.
In one embodiment, as shown in FIG. 3, the rigid plate 110 is in overlapping engagement with one side of the flexible plate 120, and the other side of the flexible plate 120 is exposed to the outside. Specifically, one side of the rigid plate 110 and one side of the flexible plate 120 are attached to each other according to actual use. At this time, the opening area of the flexible portion 121 is determined, then the starting area of the processing portion 111 is determined according to the opening area of the flexible portion 121, and the processing is performed by two modes of milling and cutting through by a milling cutter and laser depth control cutting, so that the processing only by adopting a single laser depth control cutting mode is avoided, and the processing cost of the rigid-flex printed circuit board is effectively reduced.
In one embodiment, the flip-top bonding sheet further comprises an adhesive (not labeled). The adhesive member is located between the rigid plate 110 and the flexible plate 120, and the rigid plate 110 and the flexible plate 120 are bonded to each other by the adhesive member. Specifically, in this embodiment, the adhesive member is a glue or a solder. The rigid plate 110 and the flexible plate 120 are attached to each other by an adhesive. Meanwhile, since a plurality of processing holes are formed in the coupling plate 100 for actual installation and processing, a part of the adhesive member can penetrate into the processing holes by additionally providing the adhesive member between the rigid plate 110 and the flexible plate 120, thereby blocking the processing holes. When the cover opening operation is performed on the rigid-flex printed circuit board, laser depth control cutting is adopted at the joint of the flexible portion 121 and the rigid board 110, and at the moment, the glue overflow phenomenon at the joint of the flexible portion 121 and the rigid board 110 can be avoided depending on the stability of the laser depth control cutting. The bonding plate 100 is provided with a plurality of resin holes at intervals. More specifically, resin is used for plugging holes in the processing holes of the combined plate body 100, so that the flatness of the rigid-flex printed circuit board is ensured, and subsequent processing operation on the rigid-flex printed circuit board is facilitated.
In one embodiment, the projection of the first milling cutter uncovering portion 1111 on the flexible portion 121 is spaced 0.3mm to 0.5mm from the boundary of the flexible portion 121. Specifically, in the present embodiment, when milling by a milling cutter, the distance between the projection of the first milling cutter uncovering part 1111 on the flexible part 121 and the boundary of the flexible part 121 is 0.3mm to 0.5 mm. The above embodiment can avoid the milling cutter from being close to the boundary of the flexible part 121, that is, the flexible plate 120 and the rigid plate 110 from being displaced.
As shown in fig. 1, in one embodiment, the processing portion 111 further includes a second mill uncovering portion 1113. The first milling cutter uncovering portion 1111 and the second milling cutter uncovering portion 1113 are arranged at intervals, and the first milling cutter uncovering portion 1111 and the second milling cutter uncovering portion 1113 are bridged. The bridging distance between the first milling cutter uncovering part 1111 and the second milling cutter uncovering part 1113 is 1 mm-2 mm. Specifically, in this embodiment, the milling cutter passes through the first milling cutter uncovering portion 1111 and the second milling cutter uncovering portion 1113 under the condition that the milling cutter processing does not cause the rigid plate 110 and the flexible plate 120 to be staggered, so that the processing area of the milling cutter passing through is enlarged, and the processing cost of the rigid-flex printed circuit board is further reduced. More specifically, the distance between the first milling cutter uncovering portion 1111 and the second milling cutter uncovering portion 1113 is 1mm to 2mm, and bridging is performed in the distance, so that partial regions on the flexible portion 121 can be prevented from falling off to influence the manufacturing process.
In one embodiment, as shown in fig. 4, the flexure 121 includes a first flexure 1211 and a second flexure 1212. The first flexible subsection 1211 is spaced apart from the second flexible subsection 1212, the processing portion 111 includes a third processing subsection 1116 and a fourth processing subsection 1117, the third processing subsection 1116 corresponds to the first flexible subsection 1211, and the fourth processing subsection 1117 corresponds to the second flexible subsection 1212. Specifically, in this embodiment, the rigid-flex printed circuit board is bent more than once according to the actual installation condition. Therefore, the flexible plate 120 is provided with a first flexible subsection 1211 and a second flexible subsection 1212 at a distance, and the rigid plate 110 is provided with a third processed portion 111 corresponding to the first flexible subsection 1211 and a fourth processed portion 111 corresponding to the second flexible subsection 1212. Finally, the first milling cutter uncovering portions 1111 of the third processing portion 111 and the fourth processing portion 111 are milled through by milling, and the laser uncovering portions 1112 of the third processing portion 111 and the fourth processing portion 111 are processed by laser controlled deep cutting. Therefore, in the above embodiment, the rigid-flex printed circuit board is processed by milling and cutting with laser depth control, so that on one hand, the rigid-flex printed circuit board is bent (at least one time of bending), and on the other hand, the processing cost of the rigid-flex printed circuit board is saved.
In one embodiment, an integrated circuit includes the combination board of the cover-lifting type as described in any one of the above embodiments, and further includes an integrated circuit board. The integrated circuit board is electrically connected with the uncovering type combination board. When the integrated circuit is used, the uncovering type combination board is connected with the integrated circuit board, so that the space requirement of the integrated circuit can be met on one hand, and the processing cost of the integrated circuit is saved on the other hand.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A cover-uncovering type combination board, comprising:
the combined plate comprises a rigid plate and a flexible plate, the rigid plate is in superposition fit with the flexible plate, a flexible portion is arranged on the flexible plate, a processing portion corresponding to the flexible portion is arranged on the rigid plate, the processing portion comprises a first milling cutter cover uncovering portion and a laser cover uncovering portion, the first milling cutter cover uncovering portion is used for being matched with a milling cutter in a processing mode, the laser cover uncovering portion is used for being matched with a laser cutter in a processing mode, and the projection of the first milling cutter cover uncovering portion on the flexible portion and the boundary of the flexible portion are arranged at intervals.
2. The lift-off type bonding plate of claim 1, wherein the rigid plate comprises a first rigid subpanel and a second rigid subpanel, the processing portion comprises a first processing subsection and a second processing subsection, the first processing subsection is disposed on the first rigid subpanel, the second processing subsection is disposed on the second rigid subpanel, and the first processing subsection and the second processing subsection both correspond to the flexible portion, wherein one side of the first rigid subpanel and one side of the flexible plate are attached to each other, and the other side of the second rigid subpanel and the other side of the flexible plate are attached to each other.
3. The lift-off type bonding plate of claim 1, wherein the rigid plate is in overlapping engagement with one side of the flexible plate, and the other side of the flexible plate is exposed to an external space.
4. The cover-lift type bonding sheet according to claim 3, further comprising an adhesive member between the rigid sheet and the flexible sheet, the rigid sheet and the flexible sheet being bonded to each other by the adhesive member.
5. The cover-lifting type bonding board according to any one of claims 1 to 4, wherein a plurality of resin holes are provided at intervals on the bonding board body.
6. The cover-lifting type bonding plate according to claim 1, wherein the first milling cutter cover-lifting portion has a projection on the flexible portion at a distance of 0.3mm to 0.5mm from the boundary of the flexible portion.
7. The lift-off type bonding plate of claim 6, wherein the processing portion further comprises a second mill lift-off portion, the first mill lift-off portion and the second mill lift-off portion being spaced apart, and the first mill lift-off portion and the second mill lift-off portion being bridged therebetween.
8. The lift-off type bonding plate of claim 7, wherein the bridging distance between the first and second mill cover portions is 1mm to 2 mm.
9. The lift-off type bonding pad of claim 1, wherein the flexible portion comprises a first flexible subsection and a second flexible subsection spaced apart from the first flexible subsection, and the processing portion comprises a third processing subsection corresponding to the first flexible subsection and a fourth processing subsection corresponding to the second flexible subsection.
10. An integrated circuit comprising the cover-lifting type bonding board of any one of claims 1 to 9, and further comprising an integrated circuit board electrically connected to the cover-lifting type bonding board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822231303.0U CN210130004U (en) | 2018-12-28 | 2018-12-28 | Integrated circuit and uncovering type combined board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822231303.0U CN210130004U (en) | 2018-12-28 | 2018-12-28 | Integrated circuit and uncovering type combined board |
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| CN210130004U true CN210130004U (en) | 2020-03-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114799553A (en) * | 2022-04-22 | 2022-07-29 | 东莞领益精密制造科技有限公司 | Composite material processing technology and composite material production line |
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2018
- 2018-12-28 CN CN201822231303.0U patent/CN210130004U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114799553A (en) * | 2022-04-22 | 2022-07-29 | 东莞领益精密制造科技有限公司 | Composite material processing technology and composite material production line |
| CN114799553B (en) * | 2022-04-22 | 2023-10-20 | 东莞领益精密制造科技有限公司 | Composite material processing technology and composite material production line |
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