CN106507614A - A kind of manufacture method of Rigid Flex - Google Patents
A kind of manufacture method of Rigid Flex Download PDFInfo
- Publication number
- CN106507614A CN106507614A CN201611018093.6A CN201611018093A CN106507614A CN 106507614 A CN106507614 A CN 106507614A CN 201611018093 A CN201611018093 A CN 201611018093A CN 106507614 A CN106507614 A CN 106507614A
- Authority
- CN
- China
- Prior art keywords
- coverlay
- fpc plates
- pad pasting
- manufacture method
- sticking part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of manufacture method of Rigid Flex, including providing the coverlay with the form fit in the pad pasting face of the FPC plates, the waste material sticking part of the coverlay offers multiple first drillings, the circuit sticking part of the coverlay offers multiple windows for opening the form fit at film with the line unit, make to open at film described in the window alignment, it is affixed on what the coverlay was covered on the pad pasting face, the FPC plates and the PCB hardboards are pressed, the coverlay and PCB hardboards bonding is made.The embodiment of the present invention once fits in the pad pasting face of FPC plates using whole coverlay, and each pad pasting face of script FPC plates needs multiple pad pasting, now only needs and once pasted, greatly improve production efficiency；By drilling windowing at the logicalnot circuit unit of coverlay, the contact area of the copper face of PCB hardboards and FPC plates is increased, makes the adhesion between rigid-flex reach management and control standard.
Description
Technical field
A kind of the present invention relates to PCB production technical fields, more particularly to manufacture method of Rigid Flex.
Background technology
The birth and development of FPC (Flexible Printed Circuit, flexible circuit), expedited the emergence of Rigid Flex this
One new product.Therefore, Rigid Flex, is exactly that FPC plates are hard with PCB (Printed Circuit Board, printed circuit board)
Plate, through operations such as pressings, is combined by related process requirement, there is FPC characteristics with hardboard characteristic while formation
Wiring board.
Fig. 1 is refer to, PCB hardboards typically adopt PP plates, i.e. polypropylene board, because of the line areas surface of soft board (i.e. FPC plates)
Need to paste epiphragma, and PP plates and to cover binding force of membrane poor, therefore existing soft board is when pasting epiphragma, is all using each circuit list
The form of first single card coverlay at single card pad pasting, then hardboard and soft board pressing bonding is made, form Rigid Flex.Due to each
Soft board unit is required to single card coverlay, therefore production efficiency is very low.
Content of the invention
It is an object of the invention to provide a kind of manufacture method of Rigid Flex, solves above technical problem.
It is that the present invention is employed the following technical solutions up to this purpose：
A kind of manufacture method of Rigid Flex, Rigid Flex include that FPC plates and PCB hardboards, the FPC plates are provided with
Multiple line units, the manufacture method include：
Coverlay with the form fit in the pad pasting face of the FPC plates is provided；The waste material sticking part of the coverlay is opened up
There are multiple first drillings；The circuit sticking part of the coverlay offers multiple shapes that opens at film with the line unit
The window that matches somebody with somebody；
Make the coverlay be directed at the pad pasting face, and make to open at film described in the window alignment, the coverlay is covered
Covered is affixed on the pad pasting face；
The FPC plates and the PCB hardboards are pressed, the coverlay and PCB hardboards bonding is made；
Wherein, the pad pasting face is the surface towards the PCB hardboards of the FPC plates；The circuit sticking part is patch
Coverlay part on the line unit；The waste material sticking part is the coverlay being affixed on the garbage area of the FPC plates
Part, the garbage area of the FPC plates are the region beyond the line unit of the FPC plates.
Preferably, the adhesion zone of each circuit sticking part offers multiple second drillings；
Wherein, the adhesion zone of the circuit sticking part is the region beyond the removing window of the circuit sticking part.
Preferably, the symmetrical waste material sticking part being arranged at positioned at coverlay week portion of multiple first drillings
On.
Preferably, multiple second drillings are arranged at positioned at the described viscous of the left and right both ends of the circuit sticking part
Connect in area.
Preferably, first drilling and the described second drilling are circular hole.
Preferably, first drilling and the described second drilling are radius identical circular hole.
Preferably, the FPC plates are square；
The FPC plates include eight line units；The shape of each line unit is identical.
Preferably, the material of the garbage area of the FPC plates is solid copper.
Preferably, Rigid Flex includes FPC plates and two PCB hardboards；The FPC plates are located at described in two between PCB hardboards；
The FPC plates include that the two pad pasting faces being oppositely arranged, each pad pasting face are posted and each pad pasting face respectively
The coverlay of form fit.
Beneficial effects of the present invention：The embodiment of the present invention once fits in the pad pasting face of FPC plates using whole coverlay, former
Each pad pasting face of this FPC plates needs multiple pad pasting, now only needs and has once pasted, greatly improves production efficiency；By
At the logicalnot circuit unit of coverlay drilling windowing, increased the contact area of the copper face of PCB hardboards and FPC plates, make rigid-flex it
Between adhesion reach management and control standard.
Description of the drawings
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
Accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
To obtain other accompanying drawings according to these accompanying drawings.
Front views of the Fig. 1 for the FPC plates of the Rigid Flex of prior art.
Fig. 2 is the front view of the coverlay of Rigid Flex provided in an embodiment of the present invention.
Fig. 3 is the front view for not pressing the FPC plates before PCB hardboards provided in an embodiment of the present invention.
Fig. 4 is the left view of Rigid Flex provided in an embodiment of the present invention.
In figure：
10th, FPC plates；11st, line unit；111st, open at film；112nd, at single card pad pasting；12nd, garbage area；20th, coverlay；
21st, circuit sticking part；211st, the second drilling；212nd, window；22nd, waste material sticking part；221st, the first drilling；30th, PCB hardboards.
Specific embodiment
For enabling the goal of the invention of the present invention, feature, advantage more obvious and understandable, below in conjunction with the present invention
Accompanying drawing in embodiment, to the embodiment of the present invention in technical scheme be clearly and completely described, it is clear that disclosed below
Embodiment be only a part of embodiment of the invention, and not all embodiment.Embodiment in based on the present invention, this area
All other embodiment that those of ordinary skill is obtained under the premise of creative work is not made, belongs to protection of the present invention
Scope.
Technical scheme is further illustrated below in conjunction with the accompanying drawings and by specific embodiment.
Fig. 2, Fig. 3 and Fig. 4 is refer to, Fig. 2 is facing for the coverlay 20 of Rigid Flex provided in an embodiment of the present invention
Figure, Fig. 3 is the front view for not pressing the FPC plates 10 before PCB hardboards 30 provided in an embodiment of the present invention, and Fig. 4 is present invention enforcement
The left view of the Rigid Flex that example is provided.Rigid Flex includes that FPC plates 10 and PCB hardboards 30, FPC plates 10 are provided with multiple
Line unit 11.
A kind of manufacture method of Rigid Flex is embodiments provided, is imitated for improving the production of Rigid Flex
Rate, the manufacture method are specifically included：
The coverlay 20 of the form fit in the pad pasting face of S1, offer and FPC plates 10.
The embodiment of the present invention needs pre-production or selection and the coverlay 20 of the form fit in the pad pasting face of FPC plates 10, covers
The waste material sticking part 22 of epiphragma 20 offers multiple first drillings 221, increased the copper face of PCB hardboards 30 and FPC plates 10
Contact area, makes the adhesion between rigid-flex reach management and control standard.The circuit sticking part 21 of coverlay 20 offers multiple
The window 212 for opening 111 form fit at film with line unit 11.
Wherein, surface towards PCB hardboard 30 side of the pad pasting face for FPC plates 10, in the present embodiment, FPC plates 10
Including two pad pasting faces being oppositely arranged, each pad pasting face is used to paste epiphragma 20.Waste material sticking part 22 is to be affixed on giving up for FPC plates 10
Coverlay part in material area 12, the garbage area 12 of FPC plates 10 is the region beyond the line unit 11 of FPC plates 10.
S2, make coverlay 20 be directed at the pad pasting face, be affixed on what coverlay 20 was covered on the pad pasting face.
111 positions at film are correspondingly opened on coverlay 20 and offers window 212, when pasting epiphragma 20, coverlay 20 is aligned
The pad pasting face, is aligned window 212 and opens 111 at film, coverlay 20 is affixed on the pad pasting face, and described in two, pad pasting face is pasted
After good coverlay 20, and then press FPC plates 10 and PCB hardboards 30.
S3, FPC plates 10 and PCB hardboards 30 are pressed, bond coverlay 20 and PCB hardboards 30.
After coverlay 20 is posted, the side pressing for posting coverlay 20 respectively with FPC plates 10 of two PCB hardboards 30 makes
Coverlay 20 and PCB hardboards 30 are bonded, and so far, Rigid Flex completes.
Preferably, in the present embodiment, coverlay 20 includes multiple circuit sticking parts 21；The adhesion zone of each circuit sticking part 21
Multiple second drillings 211 are offered.
Wherein, circuit sticking part 21 is the coverlay part being affixed on line unit 11；The adhesion zone of circuit sticking part 21
For circuit sticking part 21 be not covered in out at film 111 region, i.e. region on circuit sticking part 21 beyond window 212.
In the present embodiment, FPC plates 10 are square, and which is provided with eight line units 11；The shape phase of each line unit 11
Same, it is square.
The top (upper length is existed) of the line unit 11 of top side apart from the top (during upper length) of FPC plates 10 away from
From for H1, following (the downside length sides) of the line unit 11 of lower side apart from following (the downside length sides) of FPC plates 10 away from
From for H2, the left side (left side width is existed) of the line unit 11 of the leftmost side apart from the left side (during left side width) of FPC plates 10 away from
From for L1, the right (right side width is existed) of the line unit 11 of the rightmost side apart from the right (during right side width) of FPC plates 10 away from
From for L2；Preferably, H1 is equal to H2, and L1 is equal to L2.Thus, during pad pasting, it is only necessary to by the length sides alignment FPC plates 10 of coverlay 20
Length sides, by the width edge of the width edge of coverlay 20 alignment FPC plates 10, do not take into account that and just paste the problem that instead pastes, more
Plus it is convenient.
Preferably, 221 symmetrical being arranged at of multiple first drillings are positioned on the waste material sticking part 22 in 20 weeks portions of film.
Preferably, multiple second drillings 211 are arranged at the bonding positioned at the left and right both ends of each circuit sticking part 11
Qu Shang.
Preferably, the first drilling 221 and the second drilling 211 are circular hole.More excellent, the first drilling 221 and second drills
211 is radius identical circular hole.Using the circular hole of same size, identical punch device can be conveniently used, reduce die cost, carry
High perforating efficiency.
Preferably, the material of the garbage area 12 of FPC plates 10 is solid copper.
The embodiment of the present invention once fits in the pad pasting face of FPC plates 10 using whole coverlay 20, and FPC plates 10 are needed originally
Multiple pad pasting is wanted, is now only needed and has once been pasted, greatly improve production efficiency；By the waste material sticking part 22 in coverlay 20
Add brill windowing with the adhesion zone, increased the contact area of the copper face of PCB hardboards 30 and FPC plates 10, make between rigid-flex
Adhesion reach management and control standard.
In description of the invention, it is to be understood that the orientation of instruction or the position such as term " on ", " on ", "left", "right"
Relation is based on orientation shown in the drawings or position relationship, is for only for ease of the description present invention and simplifies description, rather than refers to
Show or imply that therefore the device or element of indication must can not be managed with specific orientation, with specific azimuth configuration and operation
Solve as limitation of the present invention.It should be noted that the present embodiment is mainly on the basis of Fig. 3 to the explanation or description in orientation.
The above, above example only in order to technical scheme to be described, rather than a limitation；Although with reference to front
State embodiment to be described in detail the present invention, it will be understood by those within the art that：Which still can be to front
State the technical scheme described in each embodiment to modify, or equivalent is carried out to which part technical characteristic；And these
Modification is replaced, and does not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (9)
1. a kind of manufacture method of Rigid Flex, Rigid Flex include that FPC plates and PCB hardboards, the FPC plates are provided with many
Individual line unit, it is characterised in that the manufacture method includes：
Coverlay with the form fit in the pad pasting face of the FPC plates is provided；The waste material sticking part of the coverlay offers many
Individual first drilling；The circuit sticking part of the coverlay offers multiple form fits that opens at film with the line unit
Window；
Make the coverlay be directed at the pad pasting face, and make to open at film described in the window alignment, the coverlay is covered
It is affixed on the pad pasting face；
The FPC plates and the PCB hardboards are pressed, the coverlay and PCB hardboards bonding is made；
Wherein, the pad pasting face is the surface towards the PCB hardboards of the FPC plates；The circuit sticking part is for being affixed on
State the coverlay part on line unit；The waste material sticking part is the coverlay part being affixed on the garbage area of the FPC plates,
The garbage area of the FPC plates is the region beyond the line unit of the FPC plates.
2. manufacture method according to claim 1, it is characterised in that the adhesion zone of each circuit sticking part offers
Multiple second drillings；
Wherein, the adhesion zone of the circuit sticking part is the region beyond the removing window of the circuit sticking part.
3. manufacture method according to claim 2, it is characterised in that symmetrical being arranged at of multiple first drillings is located at
The coverlay week portion the waste material sticking part on.
4. manufacture method according to claim 3, it is characterised in that multiple second drillings are arranged at positioned at the line
On the adhesion zone at the left and right both ends of road sticking part.
5. manufacture method according to claim 4, it is characterised in that first drilling and the described second drilling are circle
Hole.
6. manufacture method according to claim 5, it is characterised in that first drilling and the described second drilling are radius
Identical circular hole.
7. manufacture method according to claim 1, it is characterised in that the FPC plates are square；
The FPC plates include eight line units；The shape of each line unit is identical.
8. manufacture method according to claim 1, it is characterised in that the material of the garbage area of the FPC plates is solid copper.
9. manufacture method according to claim 1, it is characterised in that Rigid Flex includes FPC plates and two PCB hardboards；
The FPC plates are located at described in two between PCB hardboards；
The FPC plates include that the shape with each pad pasting face is posted in the two pad pasting faces being oppositely arranged, each pad pasting face respectively
The coverlay of coupling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611018093.6A CN106507614B (en) | 2016-11-18 | 2016-11-18 | A kind of production method of Rigid Flex |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611018093.6A CN106507614B (en) | 2016-11-18 | 2016-11-18 | A kind of production method of Rigid Flex |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106507614A true CN106507614A (en) | 2017-03-15 |
| CN106507614B CN106507614B (en) | 2019-03-19 |
Family
ID=58325025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611018093.6A Active CN106507614B (en) | 2016-11-18 | 2016-11-18 | A kind of production method of Rigid Flex |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106507614B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108391376A (en) * | 2018-03-06 | 2018-08-10 | 东莞森玛仕格里菲电路有限公司 | A kind of high-accuracy or very small region cover film applying method |
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|---|---|---|---|---|
| JP3695799B2 (en) * | 1995-09-14 | 2005-09-14 | 株式会社東芝 | Flexible printed wiring board and manufacturing method thereof |
| CN101695217A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for producing printed board combining rigidness and flexibleness |
| CN102083270A (en) * | 2009-11-28 | 2011-06-01 | 比亚迪股份有限公司 | Circuit board and manufacturing method thereof |
| CN103118505A (en) * | 2013-01-25 | 2013-05-22 | 景旺电子（深圳）有限公司 | Rigid-flexible board and method for manufacturing same |
| CN103384444A (en) * | 2013-07-30 | 2013-11-06 | 博敏电子股份有限公司 | Rigid-flex printed circuit board capable of protecting inner layer windowing area and production method thereof |
| CN104869756A (en) * | 2015-06-10 | 2015-08-26 | 金达(珠海)电路版有限公司 | Manufacturing method for hollowed-out board |
| CN105555061A (en) * | 2015-12-25 | 2016-05-04 | 深圳崇达多层线路板有限公司 | PCB design method and device capable of improving laminated white edges of board during inner-layer hole plating |
-
2016
- 2016-11-18 CN CN201611018093.6A patent/CN106507614B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3695799B2 (en) * | 1995-09-14 | 2005-09-14 | 株式会社東芝 | Flexible printed wiring board and manufacturing method thereof |
| CN101695217A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for producing printed board combining rigidness and flexibleness |
| CN102083270A (en) * | 2009-11-28 | 2011-06-01 | 比亚迪股份有限公司 | Circuit board and manufacturing method thereof |
| CN103118505A (en) * | 2013-01-25 | 2013-05-22 | 景旺电子（深圳）有限公司 | Rigid-flexible board and method for manufacturing same |
| CN103384444A (en) * | 2013-07-30 | 2013-11-06 | 博敏电子股份有限公司 | Rigid-flex printed circuit board capable of protecting inner layer windowing area and production method thereof |
| CN104869756A (en) * | 2015-06-10 | 2015-08-26 | 金达(珠海)电路版有限公司 | Manufacturing method for hollowed-out board |
| CN105555061A (en) * | 2015-12-25 | 2016-05-04 | 深圳崇达多层线路板有限公司 | PCB design method and device capable of improving laminated white edges of board during inner-layer hole plating |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108391376A (en) * | 2018-03-06 | 2018-08-10 | 东莞森玛仕格里菲电路有限公司 | A kind of high-accuracy or very small region cover film applying method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106507614B (en) | 2019-03-19 |
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