CN109628000A - A kind of anisotropy conductiving glue - Google Patents
A kind of anisotropy conductiving glue Download PDFInfo
- Publication number
- CN109628000A CN109628000A CN201811545448.6A CN201811545448A CN109628000A CN 109628000 A CN109628000 A CN 109628000A CN 201811545448 A CN201811545448 A CN 201811545448A CN 109628000 A CN109628000 A CN 109628000A
- Authority
- CN
- China
- Prior art keywords
- glue
- groove
- line
- anisotropy conductiving
- binding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
Abstract
The present invention relates to a kind of anisotropy conductiving glues, including substrate and the glue-line being set to above the substrate.The surface of the glue-line is to lower recess through the glue-line until the upper surface of the substrate forms groove, wherein one end of the groove extends outward outside the glue-line edge.Anisotropy conductiving glue of the invention extends one channel in port and extraneous formation outside glue-line edge by groove and groove, the attachings bubble that generates it when attaching, the binding bubble that generates can be discharged to outside the glue-line by the channel after this pressure is bound, so as to improve attaching quality or binding quality between the two, and then improve the reliability of product.
Description
Technical field
The present invention relates to a kind of anisotropy conductiving glues, for the connection between semiconductor electronic component, for example, display
Connection between the mould group device being related in panel.
Background technique
With the development of the times, in modern communications industry, the products such as mobile phone, TV, plate, notebook, digital camera city
Field demand is increasing, the also positive high-resolution development of various display equipment.In existing display module manufacture, have component
The technique being bundled in module；Will use in component binding technique a kind of anisotropy conductiving glue (ACF,
Anisotropic Conductive Film) carry out component between connection.
Wherein it is the resistance characteristic in Z axis electrically conducting direction Yu XY insulating planar the characteristics of the anisotropy conductiving glue
With apparent otherness.After the difference of Z axis conduction resistance value and X/Y plane insulating resistance value is more than certain ratio, can both it claim
For good conductive anisotropy.It is to be allowed to using conducting particles connection IC chip with the electrode of substrate between the two that principle, which is connected, in it
As conducting, while it being avoided that conducting short circuit between adjacent two electrode again, and reaches the only purpose in Z-direction conducting.Respectively to different
Property conducting resinl have can be with Continuous maching (Tape-on-Reel), the characteristic of extremely low material loss, therefore become relatively universal at present
The product form used.
But the row of existing anisotropy conductiving glue bubble ability is poor, is easy to produce when anisotropy conductiving glue attaches each
Anisotropy conducting resinl is easy to produce binding bubble after attaching bubble and the binding of this pressure, seriously reduces product reliability.Cause
This, is easy to produce when needing to seek the novel anisotropy conductiving glue of one kind to solve to attach existing for existing anisotropy conductiving glue
The problem of being easy to produce binding bubble after raw attaching bubble, the binding of this pressure.
Summary of the invention
The object of the present invention is to provide a kind of anisotropy conductiving glues, are able to solve existing anisotropy conductiving glue and exist
Attaching when be easy to produce attach bubble, this pressure binding after be easy to produce bind bubble the problem of.
To solve the above-mentioned problems, the present invention provides a kind of anisotropy conductiving glue, comprising: substrate and is arranged on
Glue-line.Wherein the surface of the glue-line to lower recess through the glue-line until to form at least one recessed for the upper surface of the substrate
Slot, wherein one end of the groove extends outward outside the glue-line edge.
Further, wherein the both ends of the groove extend outward outside the glue-line edge.
Further, wherein one end of the groove extends outward outside the glue-line edge along straight line or curve.
Further, wherein the width range of the groove is 0.05-0.15mm.
Further, wherein the groove includes 2 or 2 or more quantity, wherein at least one end of each groove to
Extend outside the glue-line edge outside.
Further, wherein radially distributing between the groove.
Further, wherein being mutually equidistantly arranged in parallel between the groove, grid-like array is formed on the glue-line.
Further, wherein arranged in parallel between the groove, the spacing range between adjacent grooves is 0.3-
0.4mm。
Further, wherein the groove is along the short side direction setting for being parallel to the glue-line.
Further, wherein the groove is angularly disposed relative to the short side direction of the glue-line.
The invention has the advantages that the present invention relates to a kind of anisotropy conductiving glue, by being arranged in its glue-line to lower recess
Through the glue-line until the substrate upper surface groove, wherein one end of the groove extends outward the glue-line side
Outside edge.Anisotropy conductiving glue of the invention extends port and extraneous formation one outside glue-line edge by groove and groove
Channel, the binding bubble generated after the attaching bubble for enabling it to generate when attaching, the binding of this pressure are discharged by the channel
To outside the glue-line, so as to improve attaching quality or binding quality between the two, and then the reliability of product is improved.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those skilled in the art, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is the perspective view of the anisotropy conductiving glue of the embodiment of the present invention 1；
Fig. 2 is the top view of the anisotropy conductiving glue of the embodiment of the present invention 1；
Fig. 3 is the side view of the anisotropy conductiving glue of the embodiment of the present invention 1；
Fig. 4 is the perspective view of the anisotropy conductiving glue of the embodiment of the present invention 2；
Fig. 5 is the top view of the anisotropy conductiving glue of the embodiment of the present invention 2；
Fig. 6 is the side view of the anisotropy conductiving glue of the embodiment of the present invention 2.
Component mark is as follows in figure:
1, substrate
2, glue-line
21, groove
Specific embodiment
Below in conjunction with Figure of description, the preferred embodiments of the present invention are described in detail, with complete to those of skill in the art
It is whole to introduce technology contents of the invention, prove that the present invention can be implemented with citing, so that technology contents disclosed by the invention are more
It is clear, so that will more readily understand how implement the present invention by those skilled in the art.However the present invention can pass through many differences
The embodiment of form emerges from, and protection scope of the present invention is not limited only to the embodiment mentioned in text, Examples below
The range that is not intended to limit the invention of explanation.
The direction term that the present invention is previously mentioned, for example, "upper", "lower", "front", "rear", "left", "right", "inner", "outside", "
Side " etc. is only the direction in attached drawing, and direction term used herein is of the invention for explanation and illustration, rather than is used
To limit the scope of protection of the present invention.
In the accompanying drawings, the identical component of structure is indicated with same numbers label, everywhere the similar component of structure or function with
Like numeral label indicates.In addition, in order to facilitate understanding and description, the size and width of each component shown in the drawings are any
It shows, the present invention does not limit the size and width of each component.
When certain components, when being described as " " another component "upper", the component can be placed directly within described another group
On part；There may also be an intermediate module, the component is placed on the intermediate module, and the intermediate module is placed in another group
On part.When a component is described as " installation is extremely " or " being connected to " another component, the two can be understood as direct " installation "
Or " connection " or a component pass through an intermediate module " installation is extremely " or " being connected to " another component.
Embodiment 1
As shown in Figure 1, the perspective view of the anisotropy conductiving glue of embodiment 1, including substrate 1 and is set to the base
Glue-line 2 above piece 1.Groove 21 is equipped in the glue-line 2, the groove 21 is downward through the glue-line 2 until the substrate 1
Upper surface, specifically can pass through the method for cross cutting be arranged through-hole 21.
As shown in Fig. 2, the top view of the anisotropy conductiving glue of embodiment 1, it is parallel to each other between the groove 21, and recessed
Spacing between slot 21 is identical, forms grid array.Wherein the groove 21 is parallel to the short side direction of the glue-line 2.Thus
The anisotropy conductiving glue of formation can be very good to be easy to produce after the attaching bubble being easy to produce when attaching and the binding of this pressure
Binding bubble be discharged by groove 21, the quality for attaching and binding so as to improve anisotropy conductiving glue, improve product can
By property.And groove 21 is arranged convenient for operation in the mode of grid array, reduces production cost.
Wherein the spacing range between the groove 21 is 0.3-0.4mm, specifically can be according to actual by component
The technique being bundled in module is adjusted.Preferably 0.36mm can be set by the spacing between groove 21.It is possible thereby to
Reach and the binding bubble being easy to produce after the attaching bubble being easy to produce when attaching and the binding of this pressure is passed through what groove 21 was discharged
Optimal effectiveness.
Wherein the width range of the groove 21 is 0.05-0.15mm, can specifically be tied up component according to actual
The technique being scheduled in module is adjusted.Preferably 0.1mm can be set by the width of the groove 21, it is possible thereby to improve
The binding bubble being easy to produce after the attaching bubble being easy to produce when attaching and the binding of this pressure is passed through into the effect that groove 21 is discharged.
As shown in Figure 2 and Figure 3, wherein the length of the groove 21 is equal to the bond length of the glue-line 2.It is possible thereby to mention
The binding bubble that the attaching bubble and this pressure that height is easy to produce when attaching entire glue-line 1 are easy to produce after binding passes through groove 21
The effect of discharge, and convenient for operation, save production cost.
Embodiment 2
As shown in figure 4, the perspective view of the anisotropy conductiving glue of embodiment 2, including substrate 1 and is set to the base
Glue-line 2 above piece 1.Groove 21 is equipped in the glue-line 2, the groove 21 is downward through the glue-line 2 until the substrate 1
Upper surface, specifically can pass through the method for cross cutting be arranged through-hole 21.
As shown in figure 5, the top view of the anisotropy conductiving glue of embodiment 2, it is parallel to each other between the groove 21, and recessed
Spacing between slot 21 is identical, forms grid array.Wherein the groove 21 oblique is set relative to the short side direction of the glue-line 2
It sets, preferably the angle of the groove 21 and the short side direction of the glue-line 2 can be set as 45 degree.What is be consequently formed is each to different
Property the conducting resinl binding bubble that can be very good to be easy to produce after binding the attachings bubble that is easy to produce when attaching and this pressure lead to
The discharge of groove 21 is crossed, so as to improve the quality of attaching and the binding of anisotropy conductiving glue, improves the reliability of product.And grid
Groove 21 is arranged convenient for operation in the mode of array, reduces production cost.
Wherein the spacing range between the groove 21 is 0.3-0.4mm, specifically can be according to actual by component
The technique being bundled in module is adjusted.Preferably 0.36mm can be set by the spacing between groove 21.It is possible thereby to
Reach and the binding bubble being easy to produce after the attaching bubble being easy to produce when attaching and the binding of this pressure is passed through what groove 21 was discharged
Optimal effectiveness.
Wherein the width range of the groove 21 is 0.05-0.15mm, can specifically be tied up component according to actual
The technique being scheduled in module is adjusted.Preferably 0.1mm can be set by the width of the groove 21, it is possible thereby to improve
The binding bubble being easy to produce after the attaching bubble being easy to produce when attaching and the binding of this pressure is passed through into the effect that groove 21 is discharged.
As shown in Figure 5, Figure 6, wherein the length of the groove 21 is greater than the bond length of the glue-line 2.It is possible thereby to mention
The binding bubble that the attaching bubble and this pressure that height is easy to produce when attaching entire glue-line 1 are easy to produce after binding passes through groove 21
The effect of discharge, and convenient for operation, save production cost.
Anisotropy conductiving glue provided by the present invention is described in detail above.It should be understood that as described herein show
Example property embodiment should be to be considered only as descriptive, be used to help understand method and its core concept of the invention, and not
For limiting the present invention.The description of features or aspect should be usually considered suitable for other in each illustrative embodiments
Similar features or aspects in exemplary embodiment.Although reference example embodiment describes the present invention, can suggest affiliated
The technical staff in field carries out various change and change, any modification done within the spirit and principles of the present invention, etc.
With replacement and improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of anisotropy conductiving glue characterized by comprising
Substrate；
Glue-line, the glue-line are set on the substrate；
The surface of the glue-line to lower recess through the glue-line until the upper surface of the substrate forms at least one groove,
Described in one end of groove extend outward outside the glue-line edge.
2. anisotropy conductiving glue according to claim 1, which is characterized in that the both ends of the groove extend outward
Outside the glue-line edge.
3. anisotropy conductiving glue according to claim 1, which is characterized in that one end of the groove is along straight line or song
Line extends outward outside the glue-line edge.
4. anisotropy conductiving glue according to claim 1, which is characterized in that the width range of the groove is 0.05-
0.15mm。
5. anisotropy conductiving glue described in -4 according to claim 1, which is characterized in that the groove includes 2 or 2 or more
Quantity, wherein at least one end of each groove extends outward outside the glue-line edge.
6. anisotropy conductiving glue according to claim 5, which is characterized in that radially distribute between the groove.
7. anisotropy conductiving glue according to claim 5, which is characterized in that mutually equidistantly set in parallel between the groove
It sets, forms grid-like array on the glue-line.
8. anisotropy conductiving glue according to claim 5, which is characterized in that it is arranged in parallel between the groove,
Spacing range between adjacent grooves is 0.3-0.4mm.
9. anisotropy conductiving glue according to claim 1, which is characterized in that the groove edge is parallel to the glue-line
Short side direction setting.
10. anisotropy conductiving glue according to claim 1, which is characterized in that the groove is relative to the glue-line
Short side direction is angularly disposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811545448.6A CN109628000A (en) | 2018-12-17 | 2018-12-17 | A kind of anisotropy conductiving glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811545448.6A CN109628000A (en) | 2018-12-17 | 2018-12-17 | A kind of anisotropy conductiving glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109628000A true CN109628000A (en) | 2019-04-16 |
Family
ID=66074798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811545448.6A Pending CN109628000A (en) | 2018-12-17 | 2018-12-17 | A kind of anisotropy conductiving glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109628000A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114242304A (en) * | 2021-12-28 | 2022-03-25 | 天马微电子股份有限公司 | Conductive adhesive, manufacturing method thereof and display device |
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|---|---|---|---|---|
| US20100032088A1 (en) * | 2002-12-27 | 2010-02-11 | c/o LINTEC CORPORATION | Method for production of a pressure-sensitive adhesive sheet |
| CN103930503A (en) * | 2011-11-14 | 2014-07-16 | Lg化学株式会社 | Adhesive film |
| CN104662113A (en) * | 2012-08-29 | 2015-05-27 | 德莎欧洲公司 | Grooved adhesive tape |
| CN206986088U (en) * | 2017-07-14 | 2018-02-09 | 东莞市古川胶带有限公司 | Novel super-high discharge type point-like glue band |
| CN206986086U (en) * | 2017-07-28 | 2018-02-09 | 东莞中世拓实业有限公司 | A kind of two-sided tape with point-like structural adhesive layer |
| CN207727021U (en) * | 2017-12-14 | 2018-08-14 | 上海自图新材料科技有限公司 | A kind of gluing protecting film structure with exhaust passage |
| CN108531094A (en) * | 2018-05-30 | 2018-09-14 | 奇鋐科技股份有限公司 | Bonding structure |
| CN207918747U (en) * | 2018-01-30 | 2018-09-28 | 苍南县周左胶粘制品有限公司 | A kind of water suction viscose glue |
-
2018
- 2018-12-17 CN CN201811545448.6A patent/CN109628000A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100032088A1 (en) * | 2002-12-27 | 2010-02-11 | c/o LINTEC CORPORATION | Method for production of a pressure-sensitive adhesive sheet |
| CN103930503A (en) * | 2011-11-14 | 2014-07-16 | Lg化学株式会社 | Adhesive film |
| CN104662113A (en) * | 2012-08-29 | 2015-05-27 | 德莎欧洲公司 | Grooved adhesive tape |
| CN206986088U (en) * | 2017-07-14 | 2018-02-09 | 东莞市古川胶带有限公司 | Novel super-high discharge type point-like glue band |
| CN206986086U (en) * | 2017-07-28 | 2018-02-09 | 东莞中世拓实业有限公司 | A kind of two-sided tape with point-like structural adhesive layer |
| CN207727021U (en) * | 2017-12-14 | 2018-08-14 | 上海自图新材料科技有限公司 | A kind of gluing protecting film structure with exhaust passage |
| CN207918747U (en) * | 2018-01-30 | 2018-09-28 | 苍南县周左胶粘制品有限公司 | A kind of water suction viscose glue |
| CN108531094A (en) * | 2018-05-30 | 2018-09-14 | 奇鋐科技股份有限公司 | Bonding structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114242304A (en) * | 2021-12-28 | 2022-03-25 | 天马微电子股份有限公司 | Conductive adhesive, manufacturing method thereof and display device |
| CN114242304B (en) * | 2021-12-28 | 2024-03-15 | 天马微电子股份有限公司 | Conductive adhesive, manufacturing method thereof and display device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190416 |