CN103369863A - Production process of softness and hardness combined printed circuit board with soft board at outer layer - Google Patents
Production process of softness and hardness combined printed circuit board with soft board at outer layer Download PDFInfo
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- CN103369863A CN103369863A CN2013103335784A CN201310333578A CN103369863A CN 103369863 A CN103369863 A CN 103369863A CN 2013103335784 A CN2013103335784 A CN 2013103335784A CN 201310333578 A CN201310333578 A CN 201310333578A CN 103369863 A CN103369863 A CN 103369863A
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- Prior art keywords
- soft
- layer
- hard
- conjunction
- sheet material
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 59
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000005530 etching Methods 0.000 claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 claims abstract description 14
- 239000010949 copper Substances 0.000 claims abstract description 14
- 238000003801 milling Methods 0.000 claims abstract description 9
- 239000011889 copper foil Substances 0.000 claims abstract description 8
- 238000005553 drilling Methods 0.000 claims abstract description 6
- 238000009713 electroplating Methods 0.000 claims abstract description 6
- 238000004381 surface treatment Methods 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 28
- 239000012043 crude product Substances 0.000 claims description 20
- 239000000047 product Substances 0.000 claims description 20
- 238000005516 engineering process Methods 0.000 claims description 16
- 238000003825 pressing Methods 0.000 claims description 15
- 238000003466 welding Methods 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a production process of a softness and hardness combined printed circuit board with a soft board at the outer layer. The production process comprises the following steps of: performing groove milling on a hard board layer at the inner layer; performing windowing on a first bonding sheet material layer; performing sequence overlapping on a single-sided copper soft board, the first bonding sheet material layer, the hard board layer at the inner layer, a second bonding sheet material layer and a copper foil material layer; drilling and electroplating; producing a vacuum pressed film; exposing; developing; etching; performing solder mask and surface treatment; cutting the second bonding sheet material layer and removing the hard board layer at the inner layer and the second bonding sheet material layer on the back of the single-sided copper soft board. According to the production process provided by the invention, the requirement of the softness and hardness combined circuit board with the soft board designed on the outer layer is ensured, a production process of blind milling production (blind milling butting) is removed, no blind milling equipment is needed for production, and the production limit of the softness and hardness combined circuit board with the soft board on the outer layer is reduced.
Description
Technical field
The present invention relates to a kind of soft board in the production technology of outer field soft or hard in conjunction with printed substrate, the invention belongs to the production technical field of printed substrate.
Background technology
Reduce electronic product package size, weight, avoid online mistake, increase the assembling flexibility, improve reliability and realize 3 D stereo assembling under the different assembled conditions, be the growing inevitable demand of electronic product.Flexible Printed Circuit FPC (Flexible Printed Circuit) but flexible structure, volume is little, lightweight and the interconnection technique of the characteristic capable of meeting requirements on three-dimensional of deflection assembling demand, be widely used and pay attention in the telecommunications industry.Existing towards flexible and hard combined circuit board R-F PCB (Rigid-Flex Printed Circuit Board) development trend in recent years, its in conjunction with FPC and PCB advantage, deflection, three-dimensional assembling effectively utilizes installing space.Use the volume that dwindles again whole system and strengthen its function.
Bring the huge larger challenge that has also brought simultaneously easily than conventional hardboard technical process in flexible and hard combined circuit board design, the flexible and hard combined circuit board design generally has two kinds:
A kind of is that the soft board design is at internal layer;
Its advantage is: flexible board area is processing on inner plating, and line conductor is made easily;
Its shortcoming is: the material that 1) uses is many, and integral production flow process operation is more, and product cost is high; 2) soft board harmomegathus/deflection is larger, the graph exposure egative film of the many covers of successive process need different multiplying/boring moulding formula;
Another kind is that the soft board design is at skin;
Its advantage is: 1) need not management and control soft board harmomegathus; 2) manufacturing procedure is short, and the material of use is few, and product cost is lower;
Its shortcoming is: 1) need to use the blind moulding/UV Laser cutting machine that drags for, increase the management and control of depth of cut; 2) soft board is in outer processing, and rigid-flex transition region circuit is made difficulty.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, provide a kind of.
According to technical scheme provided by the invention, described soft board may further comprise the steps in the production technology of outer field soft or hard in conjunction with printed substrate:
A, internal layer hardboard layer is carried out etching, use milling cutter to pull the groove of left and right sides twice 0.6 ~ 1.2mm width out on the internal layer hardboard layer after the etching, this groove runs through the upper and lower surface of internal layer hardboard layer;
B, the first bonding sheet material layer is windowed, the distance between the right hand edge of the right road groove of the left hand edge of the left road groove on the width of window and the internal layer hardboard layer to the internal layer hardboard layer equates;
C, with single face copper soft board, the first bonding sheet material layer, internal layer hardboard layer, the second bonding sheet material layer and copper foil material layer sequentially are superimposed together and put into hydraulic press, the left hand edge of the left road groove on the first bonding sheet material layer on the width sideline of window and the internal layer hardboard layer and the right hand edge of the right road groove on the internal layer hardboard layer align, the pressing pressure control of hydraulic press: one section pressure 100 ~ 120psi, two sections pressure 200 ~ 240psi, three sections pressure 380 ~ 400psi, the temperature of hydraulic press control: 80 ℃ ~ 100 ℃ of one section temperature, 120 ℃ ~ 140 ℃ of two sections temperature, 170 ℃ ~ 190 ℃ of three sections temperature, pressing time is controlled at 180min ~ 220min, must obtain soft or hard in conjunction with the printed wire base board;
D, soft or hard is sequentially carried out conventional drilling operating and electroplating work procedure in conjunction with the printed wire base board, obtain soft or hard in conjunction with the printed substrate crude product;
E, soft or hard is carried out vacuum film pressing production in conjunction with the printed substrate crude product, the press mold temperature is controlled at 60 ~ 90 ℃, and the press mold time is controlled at 20 ~ 60sec, and vacuum pressure is controlled at 2 ~ 4kg/cm
2, obtain soft or hard and partly become crude product in conjunction with printed substrate;
F, partly become crude product sequentially to carry out conventional exposure process, developing procedure, etching work procedure, anti-welding operation and surface treatment procedure in conjunction with printed substrate soft or hard, obtain soft or hard in conjunction with the printed wire boards half-finished product;
G, soft or hard is cut off the second bonding sheet material layer in conjunction with the printed wire boards half-finished product in rigid-flex junction, soft board back, after dragging for into required form, remove internal layer hardboard layer and the second bonding sheet material layer at single face copper soft board back, obtain soft or hard in conjunction with the printed wire board finished product.
As preferably, described internal layer hardboard layer is copper-clad base plate FR4 material, and the thickness of internal layer hardboard layer is 0.1 ~ 2.0mm.
As preferably, the thickness of described single face copper soft board is 0.0125 ~ 0.15mm.
As preferably, described the first bonding sheet material layer is low gummosis Prepreg semi-curing glue sheet material, and the thickness of the first bonding sheet material layer is 0.04 ~ 0.1mm.
As preferably, described the second bonding sheet material layer is Prepreg semi-curing glue sheet material, and the thickness of the second bonding sheet material layer is 0.04 ~ 0.1mm.
As preferably, the thickness of described copper foil material layer is 0.012 ~ 0.035mm.
Production technology of the present invention has guaranteed the requirement of soft board design at outer flexible and hard combined circuit board product, cancelled blind production (or blind the drag for docking) production technology of dragging for, need not to use the blind device fabrication of dragging for, reduce the soft board design and produce threshold at outer field flexible and hard combined circuit board.
Embodiment
The invention will be further described below in conjunction with specific embodiment.
Embodiment 1
A kind of soft board may further comprise the steps in the production technology of outer field soft or hard in conjunction with printed substrate:
A, internal layer hardboard layer is carried out etching, use milling cutter to pull the groove of left and right sides twice 0.6mm width out on the internal layer hardboard layer after the etching, this groove runs through the upper and lower surface of internal layer hardboard layer;
B, the first bonding sheet material layer is windowed, the distance between the right hand edge of the right road groove of the left hand edge of the left road groove on the width of window and the internal layer hardboard layer to the internal layer hardboard layer equates;
C, with single face copper soft board, the first bonding sheet material layer, internal layer hardboard layer, the second bonding sheet material layer and copper foil material layer sequentially are superimposed together and put into hydraulic press, the left hand edge of the left road groove on the first bonding sheet material layer on the width sideline of window and the internal layer hardboard layer and the right hand edge of the right road groove on the internal layer hardboard layer align, the pressing pressure of hydraulic press is controlled at one section pressure 100psi, two sections pressure 200psi, three sections pressure 380psi, the temperature of hydraulic press is controlled at 80 ℃ of one section temperature, 120 ℃ of two sections temperature, 170 ℃ of three sections temperature, pressing time is controlled at 180min, obtains soft or hard in conjunction with the printed wire base board;
D, soft or hard is sequentially carried out conventional drilling operating and electroplating work procedure in conjunction with the printed wire base board, obtain soft or hard in conjunction with the printed substrate crude product;
E, soft or hard is carried out vacuum film pressing production in conjunction with the printed substrate crude product, the press mold temperature is controlled at 60 ℃, and the press mold time is controlled at 60sec, and vacuum pressure is controlled at 4kg/cm
2, obtain soft or hard and partly become crude product in conjunction with printed substrate;
F, partly become crude product sequentially to carry out conventional exposure process, developing procedure, etching work procedure, anti-welding operation and surface treatment procedure in conjunction with printed substrate soft or hard, obtain soft or hard in conjunction with the printed wire boards half-finished product;
G, soft or hard is cut off the second bonding sheet material layer in conjunction with the printed wire boards half-finished product in rigid-flex junction, soft board back, after dragging for into required form, remove internal layer hardboard layer and the second bonding sheet material layer at single face copper soft board back, obtain soft or hard in conjunction with the printed wire board finished product.
Embodiment 2
A kind of soft board may further comprise the steps in the production technology of outer field soft or hard in conjunction with printed substrate:
A, internal layer hardboard layer is carried out etching, use milling cutter to pull the groove of left and right sides twice 1.0mm width out on the internal layer hardboard layer after the etching, this groove runs through the upper and lower surface of internal layer hardboard layer;
B, the first bonding sheet material layer is windowed, the distance between the right hand edge of the right road groove of the left hand edge of the left road groove on the width of window and the internal layer hardboard layer to the internal layer hardboard layer equates;
C, with single face copper soft board, the first bonding sheet material layer, internal layer hardboard layer, the second bonding sheet material layer and copper foil material layer sequentially are superimposed together and put into hydraulic press, the left hand edge of the left road groove on the first bonding sheet material layer on the width sideline of window and the internal layer hardboard layer and the right hand edge of the right road groove on the internal layer hardboard layer align, the pressing pressure of hydraulic press is controlled at one section pressure 110psi, two sections pressure 220psi, three sections pressure 390psi, the temperature of hydraulic press is controlled at 90 ℃ of one section temperature, 130 ℃ of two sections temperature, 180 ℃ of three sections temperature, pressing time is controlled at 2000min; Obtain soft or hard in conjunction with the printed wire base board;
D, soft or hard is sequentially carried out conventional drilling operating and electroplating work procedure in conjunction with the printed wire base board, obtain soft or hard in conjunction with the printed substrate crude product;
E, soft or hard is carried out vacuum film pressing production in conjunction with the printed substrate crude product, the press mold temperature is controlled at 75 ℃, and the press mold time is controlled at 40sec, and vacuum pressure is controlled at 3kg/cm
2, obtain soft or hard and partly become crude product in conjunction with printed substrate;
F, partly become crude product sequentially to carry out conventional exposure process, developing procedure, etching work procedure, anti-welding operation and surface treatment procedure in conjunction with printed substrate soft or hard, obtain soft or hard in conjunction with the printed wire boards half-finished product;
G, soft or hard is cut off the second bonding sheet material layer in conjunction with the printed wire boards half-finished product in rigid-flex junction, soft board back, after dragging for into required form, remove internal layer hardboard layer and the second bonding sheet material layer at single face copper soft board back, obtain soft or hard in conjunction with the printed wire board finished product.
Embodiment 3
Soft board may further comprise the steps in the production technology of outer field soft or hard in conjunction with printed substrate:
A, internal layer hardboard layer is carried out etching, use milling cutter to pull the groove of left and right sides twice 1.2mm width out on the internal layer hardboard layer after the etching, this groove runs through the upper and lower surface of internal layer hardboard layer;
B, the first bonding sheet material layer is windowed, the distance between the right hand edge of the right road groove of the left hand edge of the left road groove on the width of window and the internal layer hardboard layer to the internal layer hardboard layer equates;
C, with single face copper soft board, the first bonding sheet material layer, internal layer hardboard layer, the second bonding sheet material layer and copper foil material layer sequentially are superimposed together and put into hydraulic press, the left hand edge of the left road groove on the first bonding sheet material layer on the width sideline of window and the internal layer hardboard layer and the right hand edge of the right road groove on the internal layer hardboard layer align, the pressing pressure of hydraulic press is controlled at one section pressure 120psi, two sections pressure 240psi, three sections pressure 400psi, the temperature of hydraulic press is controlled at 100 ℃ of one section temperature, 140 ℃ of two sections temperature, 190 ℃ of three sections temperature, pressing time is controlled at 220min; Obtain soft or hard in conjunction with the printed wire base board;
D, soft or hard is sequentially carried out conventional drilling operating and electroplating work procedure in conjunction with the printed wire base board, obtain soft or hard in conjunction with the printed substrate crude product;
E, soft or hard is carried out vacuum film pressing production in conjunction with the printed substrate crude product, the press mold temperature is controlled at 90 ℃, and the press mold time is controlled at 20sec, and vacuum pressure is controlled at 2kg/cm
2, obtain soft or hard and partly become crude product in conjunction with printed substrate;
F, partly become crude product sequentially to carry out conventional exposure process, developing procedure, etching work procedure, anti-welding operation and surface treatment procedure in conjunction with printed substrate soft or hard, obtain soft or hard in conjunction with the printed wire boards half-finished product;
G, soft or hard is cut off the second bonding sheet material layer in conjunction with the printed wire boards half-finished product in rigid-flex junction, soft board back, after dragging for into required form, remove internal layer hardboard layer and the second bonding sheet material layer at single face copper soft board back, obtain soft or hard in conjunction with the printed wire board finished product.
Claims (6)
1. a soft board is characterized in that in the production technology of outer field soft or hard in conjunction with printed substrate this production technology may further comprise the steps:
A, internal layer hardboard layer is carried out etching, use milling cutter to pull the groove of left and right sides twice 0.6 ~ 1.2mm width out on the internal layer hardboard layer after the etching, this groove runs through the upper and lower surface of internal layer hardboard layer;
B, the first bonding sheet material layer is windowed, the distance between the right hand edge of the right road groove of the left hand edge of the left road groove on the width of window and the internal layer hardboard layer to the internal layer hardboard layer equates;
C, with single face copper soft board, the first bonding sheet material layer, internal layer hardboard layer, the second bonding sheet material layer and copper foil material layer sequentially are superimposed together and put into hydraulic press, the left hand edge of the left road groove on the first bonding sheet material layer on the width sideline of window and the internal layer hardboard layer and the right hand edge of the right road groove on the internal layer hardboard layer align, the pressing pressure control of hydraulic press: one section pressure 100 ~ 120psi, two sections pressure 200 ~ 240psi, three sections pressure 380 ~ 400psi, the temperature of hydraulic press control: 80 ℃ ~ 100 ℃ of one section temperature, 120 ℃ ~ 140 ℃ of two sections temperature, 170 ℃ ~ 190 ℃ of three sections temperature, pressing time is controlled at 180min ~ 220min, must obtain soft or hard in conjunction with the printed wire base board;
D, soft or hard is sequentially carried out conventional drilling operating and electroplating work procedure in conjunction with the printed wire base board, obtain soft or hard in conjunction with the printed substrate crude product;
E, soft or hard is carried out vacuum film pressing production in conjunction with the printed substrate crude product, the press mold temperature is controlled at 60 ~ 90 ℃, and the press mold time is controlled at 20 ~ 60sec, and vacuum pressure is controlled at 2 ~ 4kg/cm
2, obtain soft or hard and partly become crude product in conjunction with printed substrate;
F, partly become crude product sequentially to carry out conventional exposure process, developing procedure, etching work procedure, anti-welding operation and surface treatment procedure in conjunction with printed substrate soft or hard, obtain soft or hard in conjunction with the printed wire boards half-finished product;
G, soft or hard is cut off the second bonding sheet material layer in conjunction with the printed wire boards half-finished product in rigid-flex junction, soft board back, after dragging for into required form, remove internal layer hardboard layer and the second bonding sheet material layer at single face copper soft board back, obtain soft or hard in conjunction with the printed wire board finished product.
2. soft board as claimed in claim 1 is characterized in that in the production technology of outer field soft or hard in conjunction with printed substrate: described internal layer hardboard layer is copper-clad base plate FR4 material, and the thickness of internal layer hardboard layer is 0.1 ~ 2.0mm.
3. soft board as claimed in claim 1 is characterized in that in the production technology of outer field soft or hard in conjunction with printed substrate: the thickness of described single face copper soft board is 0.0125 ~ 0.15mm.
4. soft board as claimed in claim 1 is characterized in that in the production technology of outer field soft or hard in conjunction with printed substrate: described the first bonding sheet material layer is low gummosis Prepreg semi-curing glue sheet material, and the thickness of the first bonding sheet material layer is 0.04 ~ 0.1mm.
5. soft board as claimed in claim 1 is characterized in that in the production technology of outer field soft or hard in conjunction with printed substrate: described the second bonding sheet material layer is Prepreg semi-curing glue sheet material, and the thickness of the second bonding sheet material layer is 0.04 ~ 0.1mm.
6. soft board as claimed in claim 1 is characterized in that in the production technology of outer field soft or hard in conjunction with printed substrate: the thickness of described copper foil material layer is 0.012 ~ 0.035mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310333578.4A CN103369863B (en) | 2013-08-02 | 2013-08-02 | A kind of soft board is in the production technology of outer field soft or hard in conjunction with printed substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310333578.4A CN103369863B (en) | 2013-08-02 | 2013-08-02 | A kind of soft board is in the production technology of outer field soft or hard in conjunction with printed substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103369863A true CN103369863A (en) | 2013-10-23 |
| CN103369863B CN103369863B (en) | 2016-04-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310333578.4A Expired - Fee Related CN103369863B (en) | 2013-08-02 | 2013-08-02 | A kind of soft board is in the production technology of outer field soft or hard in conjunction with printed substrate |
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| Country | Link |
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| CN (1) | CN103369863B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112533368A (en) * | 2019-09-18 | 2021-03-19 | 庆鼎精密电子（淮安）有限公司 | Rigid-flexible circuit board and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2007288023A (en) * | 2006-04-19 | 2007-11-01 | Cmk Corp | Method for manufacturing rigid flex multilayer printed wiring board |
| CN101175379A (en) * | 2006-10-31 | 2008-05-07 | 比亚迪股份有限公司 | Production method for soft and hard combined printing circuit board |
| CN101695217A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for producing printed board combining rigidness and flexibleness |
| CN101820718A (en) * | 2009-01-30 | 2010-09-01 | 欧陆汽车有限责任公司 | The welding resistance enamelled coating that is used for hard and soft combined circuit plate |
| CN101998766A (en) * | 2009-08-25 | 2011-03-30 | 欣兴电子股份有限公司 | Method for manufacturing soft and hard composite board |
| CN102497746A (en) * | 2011-12-05 | 2012-06-13 | 深圳市五株电路板有限公司 | Circuit board manufacturing method |
-
2013
- 2013-08-02 CN CN201310333578.4A patent/CN103369863B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007288023A (en) * | 2006-04-19 | 2007-11-01 | Cmk Corp | Method for manufacturing rigid flex multilayer printed wiring board |
| CN101175379A (en) * | 2006-10-31 | 2008-05-07 | 比亚迪股份有限公司 | Production method for soft and hard combined printing circuit board |
| CN101820718A (en) * | 2009-01-30 | 2010-09-01 | 欧陆汽车有限责任公司 | The welding resistance enamelled coating that is used for hard and soft combined circuit plate |
| CN101998766A (en) * | 2009-08-25 | 2011-03-30 | 欣兴电子股份有限公司 | Method for manufacturing soft and hard composite board |
| CN101695217A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for producing printed board combining rigidness and flexibleness |
| CN102497746A (en) * | 2011-12-05 | 2012-06-13 | 深圳市五株电路板有限公司 | Circuit board manufacturing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112533368A (en) * | 2019-09-18 | 2021-03-19 | 庆鼎精密电子（淮安）有限公司 | Rigid-flexible circuit board and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN103369863B (en) | 2016-04-27 |
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