CN102907185B - For method that panels is connected with FPC product and component strip - Google Patents
For method that panels is connected with FPC product and component strip Download PDFInfo
- Publication number
- CN102907185B CN102907185B CN201180025882.1A CN201180025882A CN102907185B CN 102907185 B CN102907185 B CN 102907185B CN 201180025882 A CN201180025882 A CN 201180025882A CN 102907185 B CN102907185 B CN 102907185B
- Authority
- CN
- China
- Prior art keywords
- panels
- band
- fpc product
- workbench
- sheet material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Structure Of Printed Boards (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The present invention relates to the method for panels being connected to FPC product and component strip, described method comprises: correspondingly with the shape of FPC product provide multiple panels by being struck out by panels; By lower band and upper band are connected to the downside of multiple panels and component strip is prepared in upside by the panels of multiple punching press alignment respectively; By remove in process component strip being sent to workbench lower band and on bring multiple panels be supplied to predetermined workbench successively; And the panels being supplied to workbench successively picked up and panels is connected on the corresponding separately position on predetermined FPC product pattern.Therefore, while panels is connected to FPC product, the generation of the exterior materials such as such as particle can be made minimized, and can the surface of preventing pollution FPC product.
Description
Technical field
The present invention relates to and a kind of manufacturing FPC(flexible printed circuit board) connect such as epoxy resin, SUS(stainless steel in the process of product), black mask part, PI(polyimides) etc. the device of panels and the component strip for supply member plate.
Background technology
Although FPC(flexible PCB) thin and have flexibility, need the hard epoxy plate with predetermined thickness to be connected on FPC, FPC is fixed or is connected with other parts.
In addition, for reinforcing and other object, such as the panels such as SUS, PI are connected on FPC.Especially, black mask part is connected on FPC to shield electromagnetic wave.
As the method this existing panels being connected to FPC, prepare pattern 10, it is printed with the FPC product as shown in Fig. 1 (a), and is epoxy resin board in this example for the preparation of the panels 20(of the band shape on the pattern 10 be arranged on as shown in Fig. 1 (b)).
By carrying out Quick-pressing and the hot connecting elements plate 20 that pressurizes successively.
Then, as shown in Fig. 1 (c), the shape according to the FPC product be printed on pattern 10 carries out punching press process, thus as shown in Figure 1 (d) shows, obtains the multiple FPC products 30 being connected to panels 31.
Reference numeral H in Fig. 1 (c) refers to the hole be formed in after punching press on pattern 10.
But, according to this prior art, in the process that FPC product 30 is pressurizeed, produce the exterior materials such as such as particle by panels 20, and this exterior materials sticks on the surface of FPC product 30.Therefore, have following problem: namely, the electronic installation being provided with FPC product is easy to produce fault.
Summary of the invention
[technical problem]
Therefore, the object of this invention is to provide and a kind ofly when panels being connected to FPC product, the generation of the exterior materials such as such as particle is minimized and the method on the surface of preventing pollution FPC product, and component strip used in this method is provided.
[technical scheme]
To achieve these goals, the invention provides a kind of method for panels being connected to FPC product, described method comprises: correspondingly with the shape of FPC product provide multiple panels by being struck out by panels; By lower band and upper band are connected to the downside of multiple panels and component strip is prepared in upside by the panels of multiple punching press alignment respectively; By remove in process component strip being sent to workbench lower band and on bring multiple panels be supplied to predetermined workbench successively; And the panels being supplied to workbench successively picked up and panels is connected on the corresponding separately position on predetermined FPC product pattern.
According to an aspect of the present invention, prepare component strip to be realized by following process: the panels of multiple punching press is connected to successively and is wound around with roll forming and bringing down of extracting to carry out to transmit, and will to be wound around with roll forming and the upper band extracting to carry out transmitting is connected to and is connected on the lower multiple panels brought.
According to an aspect of the present invention, multiple panels is supplied to workbench and comprises the steps:, while component strip is sent to workbench, first to remove band, secondly lower band is removed together with adherent layer.
According to an aspect of the present invention, while component strip is sent to workbench, upper band and lower band extract respectively by being turned up by wedge shape part and remove, and described wedge shape part is arranged to tilt along the direction of transfer of component strip respectively.
According to an aspect of the present invention, multiple panels is supplied to workbench to comprise the steps:, after removing band and lower band, to remove exterior materials from the side of panels.
According to an aspect of the present invention, utilize brush component to carry out the exterior materials of the side of removing components plate, described brush component is arranged in and is sent in the path of workbench by panels.
In addition, to achieve these goals, the invention provides the component strip for panels being connected to FPC product, described component strip is formed by following process: by the multiple panels alignment provided by punching press process, and lower band and upper band are connected to respectively downside and the upside of multiple panels.
According to an aspect of the present invention, component strip is formed by following process: be connected to successively by the panels of multiple punching press and extract and bringing down of transmitting from roller, and will extract from roller and the upper band transmitted is connected to and is connected on the lower multiple panels brought.
In addition, to achieve these goals, the invention provides a kind of method for panels being connected to FPC product, described method comprises: correspondingly with the shape of FPC product provide multiple panels by being struck out by panels; Panels sheet material is prepared by the panels of multiple punching press is alignd and is connected in rectangular sheet by multiple panels; Panels sheet material is connected to bringing of transmitting towards predetermined work platform, and by multiple panels being supplied to successively workbench band is sent to taping and sheet material in the process of workbench; And the panels being supplied to workbench successively picked up and panels is connected on the corresponding separately position on predetermined FPC product pattern.
According to an aspect of the present invention, prepare panels sheet material to be realized by following process: the panels of multiple punching press is connected to successively and is wound around with roll forming and bringing of extracting to carry out to transmit, and when connected panels reaches predetermined quantity cutting belt.
According to an aspect of the present invention, multiple panels is supplied to workbench and comprises the steps: while the band being connected with panels sheet material is sent to workbench, sheet material is removed together with band.
According to an aspect of the present invention, while band is sent to workbench, band and sheet material extract by being turned up by wedge shape part and remove, and wedge shape part is set to tilt along the direction of transfer of band respectively.
According to an aspect of the present invention, multiple panels is supplied to workbench to comprise the steps:, before taping and sheet material, to remove exterior materials from the upper surface of panels.
According to an aspect of the present invention, utilize clearer to carry out the exterior materials of the upper surface of removing components plate, clearer is arranged in and is sent in the path of workbench by band.
[beneficial effect]
According to the method for panels being connected to FPC product and component strip used in the method according to the invention, upper band and lower band are connected respectively to the upper surface and lower surface that are stamped into the multiple panels corresponding with the shape of FPC product, and by removing upper band and lower band and panels being connected on FPC product pattern, thus can to prevent panels together punching press when carrying out punching press to FPC product and the generation of particle can be made to minimize.
In addition, when removing upper band and lower band, the particle remained on the surface of panels is removed together, thus can significantly reduce to pollute FPC product.
In addition, if panels has large size and is therefore difficult to panels to be connected to when bringing and be difficult to roll panels, multiple panels to be placed on sheet material and to be connected on conveyer belt to be supplied.Therefore, it is possible to realize effect same as described above.
Accompanying drawing explanation
Fig. 1 is the schematic diagram for illustration of existing methodical step panels being connected to FPC product;
Fig. 2 is for illustration of flow chart panels being connected to the method for FPC product according to the first exemplary embodiment of the present invention;
Fig. 3 and Fig. 4 is the schematic diagram of the device of the method realized in Fig. 2;
Fig. 5 is for illustration of flow chart panels being connected to the method for FPC product according to the second exemplary embodiment of the present invention; And
Fig. 6 to Fig. 8 is the schematic diagram of the device for realizing the method in Fig. 5.
Embodiment
Flow chart according to Fig. 2 realizes method panels being connected to FPC product according to the first exemplary embodiment of the present invention.
Specifically, in S110, correspondingly with the shape of FPC product provide multiple panels (in this embodiment for epoxy resin board) by being struck out by panels.
That is, FPC pattern 10 is connected to and then panels to be carried out together with FPC product the prior art of punching press (with reference to Fig. 1 (c) and (d)) contrary with by the panels of band shape (with reference to 20 in Fig. 1), in the present invention, in advance punching press process is carried out to the panels (with reference in Fig. 1 31) corresponding with the shape of FPC product.
Then, in S120, picked up the panels of multiple punching press by such as pick-up head, and bring under the panels of multiple punching press is connected to and on bring, to provide component strip.
In this embodiment, in order to realize this process, use device as shown in Figure 3.
That is, lower band 201 is extracted from the first roller 202 and lower band 201 is sent to the second roller 203.In the transport process of lower band 201, such as pick-up head is utilized to be put down by the panels 31 of pre-punching, the panels 31 of pre-punching to be connected to the A place, fixed position on lower band 201.
In this embodiment, as in Fig. 3 left side exploded view shown in, panels 31(namely, epoxy resin board) epoxy resin layer 31a, adhesive phase 31b and adherent layer 31c can be previously provided with.
According to this structure of epoxy resin board 31, when epoxy resin board 31 is connected on lower band 201, adherent layer 31c is connected integratedly with lower band 201, thus anti-adhesive tape 31c can remove from epoxy resin board 31 together with the lower band 201 illustrated after a while.
The multiple panels 31 be connected in turn on lower band 201 are connected to the upper band 205 that extracts from the 3rd roller 204 again.
The panels 31 and the lower band 201 that are connected with band 205 in addition form component strip 206 with upper band 205.Then, component strip 206 is wound on the second roller 203.
In figure 3, Reference numeral 207 is feed roller, and Reference numeral 208 is idler roller.
As next step, described above provided component strip 206 is sent to predetermined work platform.In the process, upper band 205 and lower band 201 is removed from component strip 206.Finally, in S130, only panels 31 is supplied to workbench successively.
For this purpose, device is as described in Figure 4 used in this embodiment.
That is, the component strip 206 extracted from the first roller 301 is transmitted towards workbench B.
In the process, first, the upper band 205 forming a part for component strip 206 utilizes wedge shape part 302 to be removed by turning up, and is then extracted by removed upper band 205 and is wrapped on the second roller 303.
Next, form component strip 206(now, component strip 206, removed upper band 205) the lower band 201 of a part before just arriving workbench B, utilize wedge shape part 304 to be removed by turning up, then removed lower band 201 extracted and be wrapped on the 3rd roller 305.
Therefore, only the panels 31 of component strip 206 is supplied on the workbench B on wedge shape part 304 side.
Removing in the process of lower band 201 from component strip 206, the adherent layer (31c with reference to the enlarged drawing in Fig. 3) of panels 31 is also removed together with lower band 201.
Therefore, the panels 31 only with epoxy resin layer 31a and adhesive phase 31b is fed on workbench B.
In addition, in their respective position, the direction of transfer be formed as to component strip 206 tilts wedge shape part 302,304, thus easily can remove upper band 205 and lower band 201 from component strip 206.
In the diagram, Reference numeral 306 is feed roller, and Reference numeral 307 is idler roller, and Reference numeral 308 is the brush components removing exterior materials from the side of panels 31.
As next step, in S140, by by above-mentioned steps and the panels 31 be supplied to successively on workbench B pick up, and picked up panels 31 to be connected on each correspondence position on predetermined FPC product pattern.
For this purpose, as shown in Figure 4, panels 31 is picked and transmitted by pick-up head 401, and in order to panels 31 be accurately sent to coordinate position and accurately be rotated, is provided with image camera 402.
The multiple panels 31 picked up by pick-up head 401 are connected to each position C on FPC product pattern 10 as shown in Figure 1.
As next step, in S150, the adhesion process that first time and secondary vertical pressurization and heating have carried out panels 31 is carried out to the FPC product pattern 10 being connected with multiple panels 31.
For this purpose, pressuring machine 501 as shown in Figure 4 can be used in this embodiment.
As last step, in S160, punching press process is carried out to the FPC product pattern 10 being bonded with multiple panels 31, to form the FPC product 30 it being connected with panels 31.
Realize according to the flow chart shown in Fig. 5 according to method panels being connected to FPC product of the second exemplary embodiment of the present invention.
First, in S210, provide the panels corresponding with the shape of FPC product by punching press process.
In S220, the panels of multiple punching press is picked up by pick-up head and is connected on the sheet material of synthetic resin material.
For this purpose, device is as shown in Figure 6 used in this embodiment.
That is, the band 601 of synthetic resin material is extracted from roller 602.In the process that band 601 is transmitted by feed roller 607, the panels 31 of punching press is in advance put down the fixed position A be connected on band 601 by pick-up head.
Then, at band 601 by the process that transmits, if the panels 31 connected as mentioned above reaches predetermined quantity, then by operation cutter 603, band 601 is cut, with generate it is connected with multiple panels 31 panels sheet material 604(with reference to Fig. 7).
In this way, different from the shape of the band in above-mentioned first exemplary embodiment, panels sheet material 604 is set to multi-layer sheet with laminated.Especially, when panels 31 there is large-size and be therefore difficult to panels 31 to be connected to bring and be difficult to be reeled time (with reference to Fig. 7), effectively can adopt the form of above-mentioned multi-layer sheet.
As next step, in S230, the panels sheet material 604 prepared as mentioned above is connected to bringing towards the transmission of predetermined work platform.Just, before panels sheet material 604 arrives workbench, panels sheet material 604 is removed together with band, thus only panels is supplied to workbench successively.
For this purpose, device is as shown in Figure 8 used in this embodiment.
That is, the band 701 extracted from roller (not shown) is transmitted towards workbench B.
In the process, panels sheet material 604 to be connected on transmitted band 701 and to be transmitted together with band 701.
Sheet material with 701 and panels sheet material 604 was just turned up by wedge shape part 702 and utilizes roller 703 to extract before arrival workbench B.
As a result, only panels 31 is supplied in the workbench B on wedge shape part 702 side.
Before band 701 and sheet material 604 are removed, clearer 704 is arranged in the top of wedge shape part 702 along the transfer path of band 701.
Clearer 704 pressurizes and rolls with closely contact member plate 31 on transmitted panels sheet material 604, thus for removing exterior materials from the surface of panels 31.
As next step, in mode identical as in the first embodiment, picked and its correspondence position (S240 with reference in Fig. 5) be connected on predetermined FPC product pattern of the panels 31 being supplied to workbench B successively.In S250, the FPC product pattern being connected with multiple panels 31 is pressurizeed vertically and has been heated the adhesion process of panels 31.Finally, in S260, punching press is carried out to the FPC product pattern being bonded with multiple panels 31, thus form the FPC product it being connected with panels 31.
Although having disclosed method and the component strip for panels being connected to FPC product according to the first exemplary embodiment of the present invention and the second exemplary embodiment, various improvement, interpolation can be carried out when not departing from the scope and spirit of the present invention and substituted.
Therefore, above-described embodiment must regard as the example provided for illustration of the present invention, instead of for limiting the present invention.
Claims (6)
1., for panels being connected to a method for FPC product, comprising:
Correspondingly with the shape of described FPC product multiple panels is provided by being struck out by described panels;
Panels sheet material is prepared by the panels of multiple punching press is alignd and is connected in rectangular sheet by described multiple panels;
Described panels sheet material is connected to bringing of transmitting towards predetermined work platform, and described multiple panels is supplied to successively described workbench by removing described band and described sheet material in the process described band being sent to described workbench; And
The described panels being supplied to described workbench is successively picked up and described panels is connected on the corresponding separately position on predetermined FPC product pattern.
2. the method for panels being connected to FPC product according to claim 1, wherein,
Prepare panels sheet material to be realized by following process: the panels of multiple punching press is connected to successively and is wound around with roll forming and describedly bringing of extracting to carry out to transmit, and cut described band when connected panels reaches predetermined quantity.
3. the method for panels being connected to FPC product according to claim 1, wherein,
Described multiple panels is supplied to described workbench to comprise the steps:, while the described band being connected with described panels sheet material is sent to described workbench, described sheet material to be removed together with described band.
4. the method for panels being connected to FPC product according to claim 3, wherein,
While described band is sent to described workbench, described band and described sheet material extract by being turned up by wedge shape part and remove, and described wedge shape part is set to tilt along the direction of transfer of described band respectively.
5. the method for panels being connected to FPC product according to claim 1, wherein,
Multiple described panels is supplied to described workbench to comprise the steps:, before removing described band and described sheet material, to remove exterior materials from the upper surface of described panels.
6. the method for panels being connected to FPC product according to claim 5, wherein,
Utilize clearer to remove the exterior materials of the upper surface of described panels, described clearer is arranged in and is sent in the path of described workbench by described band.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20100049567 | 2010-05-27 | ||
KR10-2010-0049567 | 2010-05-27 | ||
KR1020110002234A KR101051857B1 (en) | 2010-05-27 | 2011-01-10 | Method of adhering additional plate to fpc product |
KR10-2011-0002234 | 2011-01-10 | ||
PCT/KR2011/003194 WO2011149195A2 (en) | 2010-05-27 | 2011-04-29 | Method for attaching member plates to fpc product, and member plate tapes |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102907185A CN102907185A (en) | 2013-01-30 |
CN102907185B true CN102907185B (en) | 2015-08-19 |
Family
ID=44924063
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201180025882.1A Expired - Fee Related CN102907185B (en) | 2010-05-27 | 2011-04-29 | For method that panels is connected with FPC product and component strip |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2013528322A (en) |
KR (1) | KR101051857B1 (en) |
CN (1) | CN102907185B (en) |
WO (1) | WO2011149195A2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101257612B1 (en) | 2011-09-19 | 2013-04-29 | 우영관 | Apparatus for adhering additional plate to fpc and press unit used in the apparatus |
KR101444069B1 (en) | 2012-08-13 | 2014-09-26 | 우영관 | Method of providing additional plate for adhering onto printed circuit board |
KR101496780B1 (en) | 2013-05-23 | 2015-02-27 | 우영관 | Method of adhering additional plate onto printed circuit board |
CN103923574B (en) * | 2014-03-27 | 2016-05-18 | 厦门爱谱生电子科技有限公司 | Double faced adhesive tape and manufacture method thereof, FPC product are pasted the method for double faced adhesive tape |
KR101724573B1 (en) * | 2016-03-03 | 2017-04-19 | 최상문 | Method for manufacturing a chip supporting plate array film |
KR101747806B1 (en) | 2016-03-12 | 2017-06-14 | 우영관 | Supplying apparatus of additional plate for printed circuit board |
KR101915981B1 (en) * | 2017-02-02 | 2019-01-30 | 정성수 | Back up plate auto taping device for flexible printed circuit board |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5339330A (en) * | 1976-09-24 | 1978-04-11 | Hitachi Ltd | Application of adherends to articles |
JPH03126623U (en) * | 1990-04-03 | 1991-12-20 | ||
JP2000138497A (en) * | 1998-10-29 | 2000-05-16 | Sony Corp | Parts feeder |
KR20030094445A (en) * | 2002-06-04 | 2003-12-12 | 주식회사 신기원 | FPCB manufacturing apparatus and the same method |
JP2006128435A (en) * | 2004-10-29 | 2006-05-18 | Matsushita Electric Ind Co Ltd | Flexible wiring board and electronic apparatus using the same and its manufacturing method |
WO2007129844A1 (en) * | 2006-05-04 | 2007-11-15 | Seho Robot Industries Co., Ltd | System and method for attaching stiffening plate on flexible printed circuit board |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05160542A (en) * | 1991-12-06 | 1993-06-25 | Fujikura Ltd | Manufacture of flexible printed board |
KR100666282B1 (en) | 2005-06-22 | 2007-01-09 | 디케이 유아이엘 주식회사 | Method for manufacturing multi layer flexible printed circuit board |
KR100668132B1 (en) * | 2006-05-04 | 2007-01-11 | 세호로보트산업 주식회사 | System and method for attaching stiffening plate on flexible printed circuit board |
-
2011
- 2011-01-10 KR KR1020110002234A patent/KR101051857B1/en active IP Right Grant
- 2011-04-29 JP JP2013512520A patent/JP2013528322A/en active Pending
- 2011-04-29 CN CN201180025882.1A patent/CN102907185B/en not_active Expired - Fee Related
- 2011-04-29 WO PCT/KR2011/003194 patent/WO2011149195A2/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5339330A (en) * | 1976-09-24 | 1978-04-11 | Hitachi Ltd | Application of adherends to articles |
JPH03126623U (en) * | 1990-04-03 | 1991-12-20 | ||
JP2000138497A (en) * | 1998-10-29 | 2000-05-16 | Sony Corp | Parts feeder |
KR20030094445A (en) * | 2002-06-04 | 2003-12-12 | 주식회사 신기원 | FPCB manufacturing apparatus and the same method |
JP2006128435A (en) * | 2004-10-29 | 2006-05-18 | Matsushita Electric Ind Co Ltd | Flexible wiring board and electronic apparatus using the same and its manufacturing method |
WO2007129844A1 (en) * | 2006-05-04 | 2007-11-15 | Seho Robot Industries Co., Ltd | System and method for attaching stiffening plate on flexible printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
CN102907185A (en) | 2013-01-30 |
KR101051857B1 (en) | 2011-07-25 |
WO2011149195A3 (en) | 2012-05-10 |
WO2011149195A2 (en) | 2011-12-01 |
JP2013528322A (en) | 2013-07-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102907185B (en) | For method that panels is connected with FPC product and component strip | |
CN101346046B (en) | Plastering apparatus and method for printed circuit board | |
WO2017202103A1 (en) | Adhesion device and adhesion method for conductive adhesive | |
KR100996070B1 (en) | Black shield, method of manufacturing the same and method of manufacturing pcb or fpc using the same | |
CN104125763B (en) | The production and processing method of use for electronic products an insulating shroud | |
KR20130029778A (en) | Tape adhesion device and tape adhesion method | |
CN106576427A (en) | Method and apparatus for producing an electronic device | |
CN114340156A (en) | Manufacturing method of PET material die cutting process flexible single panel | |
CN102449642A (en) | Method for producing portable data carriers | |
CN110027744A (en) | A kind of flexible printed circuit board packaging detection equipment | |
CN105050325A (en) | Rigid-flex printed circuit board milling method | |
JP5107273B2 (en) | Film sticking device | |
JP5088544B2 (en) | Manufacturing method of wireless IC device | |
CN104735923B (en) | A kind of preparation method of rigid-flex combined board | |
KR20160143971A (en) | Module for laminating dry-flim and method for manufacturing PCB using the same | |
CN210308194U (en) | FPC cross cutting production facility | |
JP4525180B2 (en) | Vacuum lamination apparatus and method for forming insulating layer using the same | |
JP6838688B1 (en) | RFIC modules, RFID tags and their manufacturing methods | |
CN201863237U (en) | Edge material cutting device of prepreg | |
CN207340286U (en) | Polyimides foamed substrate multi-layer board | |
KR101444069B1 (en) | Method of providing additional plate for adhering onto printed circuit board | |
CN107031168A (en) | A kind of sheet cover layer automatic stripper | |
KR101412361B1 (en) | laminating method of partially insulating layer on the metal sheet for shield can and device thereof | |
CN201400401Y (en) | Vacuum packaging bag for PCB board | |
KR101412240B1 (en) | laminating method of partially insulating layer on the metal sheet for shield can and device thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150819 Termination date: 20170429 |
|
CF01 | Termination of patent right due to non-payment of annual fee |