WO2011149195A2 - Method for attaching member plates to fpc product, and member plate tapes - Google Patents
Method for attaching member plates to fpc product, and member plate tapes Download PDFInfo
- Publication number
- WO2011149195A2 WO2011149195A2 PCT/KR2011/003194 KR2011003194W WO2011149195A2 WO 2011149195 A2 WO2011149195 A2 WO 2011149195A2 KR 2011003194 W KR2011003194 W KR 2011003194W WO 2011149195 A2 WO2011149195 A2 WO 2011149195A2
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- WIPO (PCT)
- Prior art keywords
- adhesive tape
- member plate
- plates
- tape
- attaching
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Definitions
- the present invention provides a method for attaching member plates, such as epoxy, sus, black shield, and polyimide, in the manufacturing process of FPC products and to the member plate tape for providing the member plates. It is about.
- Flexible circuit boards are used by attaching a hard epoxy plate having a predetermined thickness to a specific portion necessary for fixing or connecting to other parts due to its thin thickness and high flexibility.
- a member plate such as sus (SUS), PI, or the like is attached to the FPC as a reinforcement and other uses, and in particular, a black shield is used for electromagnetic shielding.
- a pattern (pattern 10) on which an FPC product as shown in FIG. 1 (a) is printed is prepared, and a pattern prepared as shown in (b) ( 10)
- a strip-shaped member plate 20 is attached.
- the attachment of the member plate 20 is performed by performing a quick press and a hot press sequentially.
- press punching is performed in the shape of the FPC product printed on the pattern 10 as in (c) to obtain a plurality of FPC products 30 to which the member plate 31 is attached as in (d).
- reference numeral 'H' means a hole formed in the pattern 10 after the punching.
- An object of the present invention is to provide a method capable of minimizing foreign substances such as dust in the process of attaching a member plate to an FPC product, thereby preventing surface contamination of the FPC product and a member plate tape used in such a method. .
- the present invention provides a method for attaching a member plate to an FPC product, comprising: preparing a plurality of member plates by press-punching to correspond to the shape of the FPC product; Arranging the plurality of punched member plates and attaching a lower adhesive tape and an upper adhesive tape to each of the upper and lower surfaces to prepare a member plate tape; Removing the upper adhesive tape and the lower adhesive tape in the process of transferring the member plate tape to a predetermined work table and sequentially supplying the plurality of member plates to the work table; And picking up the member plates sequentially supplied to the workbench and attaching the member plates to respective corresponding positions on a predetermined FPC product pattern.
- the plurality of punched member plates are sequentially attached on the lower adhesive tape which is wound and transported in a roll shape, and on the plurality of member plates attached to the lower adhesive tape. It may also be achieved by attaching and integrating the upper adhesive tape, which is again wound and transported in roll form.
- the supplying of the plurality of member plates to the work table may include removing the upper adhesive tape primarily and secondly the lower adhesive tape together with the release paper layer in the process of transferring the member plate tape to the work table. It may include the step of removing.
- the upper adhesive tape and the lower adhesive tape may be removed through a process in which the member plate tape is drawn out of a wedge which is inclined in a corresponding conveying direction in the process of being transferred to the work table and rolled up.
- the supplying of the plurality of member plates to the work table may include removing foreign material from the side of the member plate after removing the upper adhesive tape and the lower adhesive tape.
- the foreign material on the side of the member plate may be removed by a brush disposed in the path in which the member plate is transferred to the work bench.
- the present invention is a member plate tape used to attach the member plate to the FPC product, a plurality of member plates prepared by press-punching to correspond to the shape of the FPC product is arranged on each top and bottom
- a member plate tape which is formed by attaching a lower adhesive tape and an upper adhesive tape in common.
- the member plate tape is sequentially attached to the lower adhesive tape to which the plurality of member plates prepared by punching are wound and transported in a roll form, and rolls again on the plurality of member plates attached to the lower adhesive tape. It may be formed by attaching and incorporating an upper adhesive tape wound and conveyed into the unit.
- the present invention provides a method for attaching the member plate to the FPC product, comprising the steps of preparing a plurality of member plates by pressing the punch to match the shape of the FPC product; Preparing a member plate sheet by aligning and attaching the plurality of punched member plates onto a rectangular sheet; Attaching the member plate sheet on the adhesive tape transferred to a predetermined work table, and removing the adhesive tape and the sheet in a transfer process to sequentially supply the plurality of member plates to the work table; And picking up the member plates sequentially supplied to the workbench and attaching the member plates to respective corresponding positions on a predetermined FPC product pattern.
- the preparing of the member plate sheet may include sequentially attaching the punched member plates on a tape that is wound and transported in a roll, and each time the attached member plates reach a predetermined number. It may also be achieved by cutting.
- the supplying of the plurality of member plates to the work table may include removing the sheet together with the adhesive tape in the process of transferring the adhesive tape to which the member plate sheet is attached to the work table. have.
- the adhesive tape and the sheet may be removed by the process of being folded in the wedge is drawn to be inclined in the transfer direction in the process of the adhesive tape is transported to the workbench and rolled up.
- the supplying of the plurality of member plates to the work table may include removing foreign substances on the upper surface of the member plate before removing the adhesive tape and the sheet.
- the foreign material on the upper surface of the member plate may be removed by a clean roll disposed on the path through which the adhesive tape is transferred.
- FIG. 1 is a step-by-step schematic diagram illustrating a conventional member plate attachment method for an FPC product
- FIG. 2 is a flow chart illustrating a method of attaching a member plate to an FPC product according to a first embodiment of the present invention
- FIG. 3 and 4 are schematic views of an apparatus in which the method of FIG. 2 is implemented, respectively;
- FIG. 5 is a flowchart illustrating a method of attaching a member plate to an FPC product according to a second embodiment of the present invention
- FIG. 6-8 are schematic diagrams of means in which the method of FIG. 5 is implemented, respectively.
- the member plate in this embodiment, the epoxy plate
- the epoxy plate is prepared by press-punching to correspond to the shape of the FPC product (S110).
- the plurality of punched member plates are picked up through a pick-up head or the like, and then attached to the lower adhesive tape, and then the upper adhesive tape is attached thereto to prepare the member plate tape (S120).
- the device configuration as shown in FIG. 3 is used.
- the lower adhesive tape 201 is drawn out of the first winding roll 202 and drawn into the second winding roll 203 to be wound up.
- the lower adhesive tape 201 by the lower position on the position (A) attached to attach.
- the member plate 31, that is, the epoxy plate may be prepared by consisting of the epoxy layer 31a, the adhesive layer 31b, and the release paper layer 31c in advance, as shown in the left enlarged view of FIG. 3. .
- the epoxy plate 31 when the release paper layer 31c is integrally bonded with the lower adhesive tape 201 when attached to the lower adhesive tape 201, the epoxy together with the removal of the tape 201 as described later It may be detached from the plate 31.
- the upper adhesive tape 205 which is pulled out from the third winding roll 204 is attached onto the plurality of member plates 31 which are sequentially attached on the lower adhesive tape 201 to be transferred.
- the member plate 31 and the lower adhesive tape 201, to which the upper adhesive tape 205 is additionally attached, are integral with the upper adhesive tape 205 to form the member plate tape 206, and then the member plate tape. 206 is wound around the second winding roll 203.
- reference numeral 207 denotes a feed roller
- 208 denotes an idle roller
- the member plate tape 206 prepared as described above is transferred to a predetermined work table, and in the process, the upper and lower adhesive tapes 205 and 201 are removed from the member plate tape 206 and finally, Only the member plate 31 is sequentially supplied to the work table (S130).
- the device configuration as shown in FIG. 4 is used.
- the member plate tape 206 taken out from the first winding roll 301 is conveyed toward the work table B. As shown in FIG.
- the upper adhesive tape 205 forming a part of the member plate tape 206 is removed by being folded in the wedge 302 and wound on the second winding roll 303.
- the lower adhesive tape 201 constituting a part thereof immediately before the work table B is folded and pulled out of the wedge 304 so that the third winding roll 305 is removed. It is removed by winding in).
- the wedges 302 and 304 are formed to be inclined in the conveying direction of the member plate tape 206 at the corresponding positions, thereby allowing the upper and lower adhesive tapes 205 and 201 to smoothly move from the member plate tape 206. To be removed.
- reference numeral 306 denotes a feed roller
- 307 denotes an idle roller
- 308 denotes a brush for removing foreign matter on the side of the member plate 31.
- the member plate 31 which is sequentially supplied to the work table B by the above-described configuration is picked up and attached to each corresponding position on the predetermined FPC product pattern (S140).
- the pickup plate 401 through the pickup plate 31 is picked up and transported, the vision camera 402 is provided for the transfer of the correct coordinate value and rotation angle do.
- a number of member plates 31 picked up by the pick-up head 401 are attached to respective corresponding positions C on the FPC product pattern 10 as shown in FIG. 1.
- bonding of the member plate 31 is completed by pressing and heating the FPC product pattern 10 having the plurality of member plates 31 attached up and down over the first and second steps (S150).
- the member plate is prepared by pressing the punch to correspond to the shape of the FPC product (S210).
- a plurality of punched member plates are picked up through a pick-up head, etc., and then seated on a sheet of synthetic resin (S220).
- the device configuration as shown in FIG. 6 is used.
- the member plate sheet 604 is prepared in the form of a plurality of laminated sheet papers, unlike the tape form of the first embodiment described above, especially in the case where the size of the member plate 31 is large and difficult to adhere to the tape and roll. It may be usefully applied (see FIG. 7).
- the member plate sheet 604 prepared as described above is attached to and transported together on the adhesive tape to be transported to a predetermined work table, and only the member plate is removed after removing the adhesive tape and sheet just before reaching the work table. Sequentially supply to the working table (S230).
- the device configuration as shown in FIG. 8 is used.
- the adhesive tape 701 taken out from the winding roll (not shown) is conveyed toward the work table B. As shown in FIG.
- the member plate sheet 604 described above is attached onto the conveyed adhesive tape 701 and conveyed together.
- the sheet of the member plate sheet 604 and the adhesive tape 701 are removed by being pulled out of the wedge 702 just before the work table B and wound up on the take-up roll 703.
- a clean roll 704 is disposed on the transfer path of the adhesive tape 701 on the upper portion of the wedge 702.
- the clean roll 704 is pressed onto the member plate sheet 604 to be conveyed and rolled in close contact with each other, thereby compressing the member roll 31 and removing foreign substances present on the surface thereof.
- the member plates 31 which are sequentially supplied to the work table B are picked up and attached to respective corresponding positions on a predetermined FPC product pattern (S240 in FIG. 5).
- the FPC product pattern to which the member plate 31 is attached is pressed and heated up and down to complete bonding of the member plate 31 (S250).
- S260 by press-breaking the FPC product pattern on which the bonding of the plurality of member plates 31 is completed, an FPC product to which the member plate 31 is attached is formed (S260).
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (14)
- FPC 제품에 부재 플레이트를 부착하는 방법에 있어서,In the method of attaching the member plate to the FPC product,부재 플레이트를 상기 FPC 제품의 모양에 대응하도록 프레스 타발하여 다수 준비하는 단계와;Press-preparing a plurality of member plates to correspond to the shape of the FPC product;상기 타발된 다수의 부재 플레이트를 정렬하여 각 상하면에 공통으로 하부 접착테이프와 상부 접착테이프를 부착함으로써 부재 플레이트 테이프를 준비하는 단계와;Arranging the plurality of punched member plates and attaching a lower adhesive tape and an upper adhesive tape to each of the upper and lower surfaces to prepare a member plate tape;상기 부재 플레이트 테이프를 소정의 작업대로 이송하는 과정에서 상기 상부 접착테이프와 하부 접착테이프를 제거하여 상기 다수의 부재 플레이트를 상기 작업대에 순차로 공급하는 단계; 및Removing the upper adhesive tape and the lower adhesive tape in the process of transferring the member plate tape to a predetermined work table and sequentially supplying the plurality of member plates to the work table; And상기 작업대에 순차로 공급되는 부재 플레이트를 픽업하여 소정의 FPC 제품 패턴 상의 각 해당 위치에 부착하는 단계를 포함하는 것을 특징으로 하는 FPC 제품에 부재 플레이트를 부착하는 방법.Picking member plates sequentially supplied to the workbench and attaching the member plates to respective corresponding positions on a predetermined FPC product pattern.
- 제1항에 있어서,The method of claim 1,상기 부재 플레이트 테이프를 준비하는 단계는,Preparing the member plate tape,상기 타발된 다수의 부재 플레이트를 롤 형태로 권취되어 이송되는 하부 접착테이프 상에 순차로 부착하고, 상기 하부 접착테이프에 부착된 다수의 부재 플레이트 상에 다시 롤 형태로 권취되어 이송되는 상부 접착테이프를 부착하여 일체화함으로써 달성되는 것을 특징으로 하는 FPC 제품에 부재 플레이트를 부착하는 방법.The plurality of punched member plates are sequentially attached to the lower adhesive tape wound and transported in rolls, and the upper adhesive tapes are wound and transported again in rolls on the plurality of member plates attached to the lower adhesive tape. A method of attaching a member plate to an FPC article, which is achieved by attaching and integrating.
- 제1항에 있어서,The method of claim 1,상기 다수의 부재 플레이트를 상기 작업대에 공급하는 단계는,Supplying the plurality of member plates to the workbench,상기 부재 플레이트 테이프를 상기 작업대로 이송하는 과정에서 1차적으로 상기 상부 접착테이프를 제거하고 2차적으로 상기 이형지층과 함께 상기 하부 접착테이프를 제거하는 단계를 포함하는 것을 특징으로 하는 FPC 제품에 부재 플레이트를 부착하는 방법.And removing the upper adhesive tape primarily and the lower adhesive tape together with the release paper layer in the process of transferring the member plate tape to the workbench. How to attach it.
- 제3항에 있어서,The method of claim 3,상기 상부 접착테이프와 상기 하부 접착테이프는, 상기 부재 플레이트 테이프가 상기 작업대로 이송되는 과정에서 각각 해당 이송방향으로 경사지게 마련되는 쐐기에 접혀 인출되어 롤 권취되는 과정을 통해 제거되는 것을 특징으로 하는 FPC 제품에 부재 플레이트를 부착하는 방법.The upper adhesive tape and the lower adhesive tape are FPC products, characterized in that the member plate tape is removed by the process of being rolled up and rolled up to the wedge is inclined in the corresponding transport direction in the process of conveying to the workbench How to attach a member plate to the.
- 제1항에 있어서,The method of claim 1,상기 다수의 부재 플레이트를 상기 작업대에 공급하는 단계는,Supplying the plurality of member plates to the workbench,상기 상부 접착테이프와 하부 접착테이프를 제거한 후 상기 부재 플레이트의 측면 이물을 제거하는 단계를 포함하는 것을 특징으로 하는 FPC 제품에 부재 플레이트를 부착하는 방법.And removing side foreign substances on the member plate after removing the upper adhesive tape and the lower adhesive tape.
- 제5항에 있어서,The method of claim 5,상기 부재 플레이트의 측면 이물은, 상기 부재 플레이트가 상기 작업대로 이송되는 경로에 배치되는 브러쉬에 의해 제거되는 것을 특징으로 하는 FPC 제품에 부재 플레이트를 부착하는 방법.The side foreign matter of the member plate is removed by a brush disposed in a path in which the member plate is transferred to the workbench.
- FPC 제품에 부재 플레이트를 부착하는데 사용되는 부재 플레이트 테이프로서,A member plate tape used to attach a member plate to an FPC product,상기 FPC 제품의 모양에 대응하도록 프레스 타발하여 준비되는 다수의 부재 플레이트를 정렬하여 각 상하면에 공통으로 하부 접착테이프와 상부 접착테이프를 부착함으로써 형성되는 것을 특징으로 하는 부재 플레이트 테이프.The member plate tape is formed by aligning a plurality of member plates prepared by press punching to correspond to the shape of the FPC product and attaching the lower adhesive tape and the upper adhesive tape to each upper and lower surfaces in common.
- 제7항에 있어서,The method of claim 7, wherein상기 부재 플레이트 테이프는,The member plate tape,상기 타발하여 준비된 다수의 부재 플레이트가 롤 형태로 권취되어 이송되는 하부 접착테이프 상에 순차로 부착되고, 상기 하부 접착테이프에 부착된 다수의 부재 플레이트 상에 다시 롤 형태로 권취되어 이송되는 상부 접착테이프가 부착되어 일체화함으로써 형성되는 것을 특징으로 하는 부재 플레이트 테이프.The plurality of member plates prepared by punching are sequentially attached to the lower adhesive tape which is wound and transported in a roll form, and the upper adhesive tape which is wound and transported again in a roll form on the plurality of member plates attached to the lower adhesive tape. The member plate tape, characterized in that formed by attaching and integral.
- FPC 제품에 부재 플레이트를 부착하는 방법에 있어서,In the method of attaching the member plate to the FPC product,부재 플레이트를 상기 FPC 제품의 모양에 대응하도록 프레스 타발하여 다수 준비하는 단계와;Press-preparing a plurality of member plates to correspond to the shape of the FPC product;상기 타발된 다수의 부재 플레이트를 정렬하여 장방형의 시트 상에 부착함으로써 부재 플레이트 시트를 준비하는 단계와;Preparing a member plate sheet by aligning and attaching the plurality of punched member plates onto a rectangular sheet;소정의 작업대로 이송되는 접착성 테이프 상에 상기 부재 플레이트 시트를 부착하고, 이송 과정에서 상기 접착성 테이프와 상기 시트를 제거하여 상기 다수의 부재 플레이트를 상기 작업대에 순차로 공급하는 단계; 및Attaching the member plate sheet on the adhesive tape transferred to a predetermined work table, and removing the adhesive tape and the sheet in a transfer process to sequentially supply the plurality of member plates to the work table; And상기 작업대에 순차로 공급되는 부재 플레이트를 픽업하여 소정의 FPC 제품 패턴 상의 각 해당 위치에 부착하는 단계를 포함하는 것을 특징으로 하는 FPC 제품에 부재 플레이트를 부착하는 방법.Picking member plates sequentially supplied to the workbench and attaching the member plates to respective corresponding positions on a predetermined FPC product pattern.
- 제9항에 있어서,The method of claim 9,상기 부재 플레이트 시트를 준비하는 단계는,Preparing the member plate sheet,상기 타발된 다수의 부재 플레이트를 롤 형태로 권취되어 이송되는 테이프 상에 순차로 부착하고, 상기 부착된 부재 플레이트가 일정한 개수에 도달할 때마다 상기 테이프를 절단함으로써 달성되는 것을 특징으로 하는 FPC 제품에 부재 플레이트를 부착하는 방법.And a plurality of punched member plates sequentially attached on a rolled and conveyed tape in roll form, and cutting the tape whenever the attached member plates reach a certain number. How to attach the member plate.
- 제9항에 있어서,The method of claim 9,상기 다수의 부재 플레이트를 상기 작업대에 공급하는 단계는,Supplying the plurality of member plates to the workbench,상기 부재 플레이트 시트가 부착된 접착성 테이프를 상기 작업대로 이송하는 과정에서 상기 접착성 테이프와 함께 상기 시트를 제거하는 단계를 포함하는 것을 특징으로 하는 FPC 제품에 부재 플레이트를 부착하는 방법.Removing the sheet together with the adhesive tape in the process of transferring the adhesive tape to which the member plate sheet is attached to the workbench.
- 제11항에 있어서,The method of claim 11,상기 접착성 테이프와 상기 시트는, 상기 접착성 테이프가 상기 작업대로 이송되는 과정에서 해당 이송방향으로 경사지게 마련되는 쐐기에 접혀 인출되어 롤 권취되는 과정을 통해 제거되는 것을 특징으로 하는 FPC 제품에 부재 플레이트를 부착하는 방법.The adhesive tape and the sheet, the member plate in the FPC product, characterized in that the adhesive tape is removed through the process of being folded in the wedge is drawn to be inclined in the transfer direction in the process of conveying the workbench and rolled up How to attach it.
- 제9항에 있어서,The method of claim 9,상기 다수의 부재 플레이트를 상기 작업대에 공급하는 단계는,Supplying the plurality of member plates to the workbench,상기 접착성 테이프와 상기 시트를 제거하기 전에 상기 부재 플레이트의 상면 이물을 제거하는 단계를 포함하는 것을 특징으로 하는 FPC 제품에 부재 플레이트를 부착하는 방법.Removing foreign material from the upper surface of the member plate before removing the adhesive tape and the sheet.
- 제13항에 있어서,The method of claim 13,상기 부재 플레이트의 상면 이물은, 상기 접착성 테이프가 이송되는 경로 상에 배치되는 클린 롤에 의해 제거되는 것을 특징으로 하는 FPC 제품에 부재 플레이트를 부착하는 방법.The foreign material on the upper surface of the member plate is removed by a clean roll disposed on a path through which the adhesive tape is conveyed.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CN201180025882.1A CN102907185B (en) | 2010-05-27 | 2011-04-29 | For method that panels is connected with FPC product and component strip |
JP2013512520A JP2013528322A (en) | 2010-05-27 | 2011-04-29 | Method of attaching member plate to FPC product and member plate tape |
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KR20100049567 | 2010-05-27 | ||
KR10-2010-0049567 | 2010-05-27 | ||
KR1020110002234A KR101051857B1 (en) | 2010-05-27 | 2011-01-10 | Method of adhering additional plate to fpc product |
KR10-2011-0002234 | 2011-01-10 |
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WO2011149195A2 true WO2011149195A2 (en) | 2011-12-01 |
WO2011149195A3 WO2011149195A3 (en) | 2012-05-10 |
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PCT/KR2011/003194 WO2011149195A2 (en) | 2010-05-27 | 2011-04-29 | Method for attaching member plates to fpc product, and member plate tapes |
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JP (1) | JP2013528322A (en) |
KR (1) | KR101051857B1 (en) |
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KR101257612B1 (en) | 2011-09-19 | 2013-04-29 | 우영관 | Apparatus for adhering additional plate to fpc and press unit used in the apparatus |
KR101444069B1 (en) | 2012-08-13 | 2014-09-26 | 우영관 | Method of providing additional plate for adhering onto printed circuit board |
KR101496780B1 (en) | 2013-05-23 | 2015-02-27 | 우영관 | Method of adhering additional plate onto printed circuit board |
CN103923574B (en) * | 2014-03-27 | 2016-05-18 | 厦门爱谱生电子科技有限公司 | Double faced adhesive tape and manufacture method thereof, FPC product are pasted the method for double faced adhesive tape |
KR101724573B1 (en) * | 2016-03-03 | 2017-04-19 | 최상문 | Method for manufacturing a chip supporting plate array film |
KR101747806B1 (en) | 2016-03-12 | 2017-06-14 | 우영관 | Supplying apparatus of additional plate for printed circuit board |
KR101915981B1 (en) * | 2017-02-02 | 2019-01-30 | 정성수 | Back up plate auto taping device for flexible printed circuit board |
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KR20030094445A (en) * | 2002-06-04 | 2003-12-12 | 주식회사 신기원 | FPCB manufacturing apparatus and the same method |
JP2007005805A (en) * | 2005-06-22 | 2007-01-11 | Dk Uil Co Ltd | Method for manufacturing flexible circuit board |
KR100668132B1 (en) * | 2006-05-04 | 2007-01-11 | 세호로보트산업 주식회사 | System and method for attaching stiffening plate on flexible printed circuit board |
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JPS5938278B2 (en) * | 1976-09-24 | 1984-09-14 | 株式会社日立製作所 | How to attach items |
JPH03126623U (en) * | 1990-04-03 | 1991-12-20 | ||
JPH05160542A (en) * | 1991-12-06 | 1993-06-25 | Fujikura Ltd | Manufacture of flexible printed board |
JP2000138497A (en) * | 1998-10-29 | 2000-05-16 | Sony Corp | Parts feeder |
JP4407471B2 (en) * | 2004-10-29 | 2010-02-03 | パナソニック株式会社 | Flexible wiring board, electronic device using the same, and manufacturing method thereof |
WO2007129844A1 (en) * | 2006-05-04 | 2007-11-15 | Seho Robot Industries Co., Ltd | System and method for attaching stiffening plate on flexible printed circuit board |
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2011
- 2011-01-10 KR KR1020110002234A patent/KR101051857B1/en active IP Right Grant
- 2011-04-29 WO PCT/KR2011/003194 patent/WO2011149195A2/en active Application Filing
- 2011-04-29 JP JP2013512520A patent/JP2013528322A/en active Pending
- 2011-04-29 CN CN201180025882.1A patent/CN102907185B/en not_active Expired - Fee Related
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KR20030094445A (en) * | 2002-06-04 | 2003-12-12 | 주식회사 신기원 | FPCB manufacturing apparatus and the same method |
JP2007005805A (en) * | 2005-06-22 | 2007-01-11 | Dk Uil Co Ltd | Method for manufacturing flexible circuit board |
KR100668132B1 (en) * | 2006-05-04 | 2007-01-11 | 세호로보트산업 주식회사 | System and method for attaching stiffening plate on flexible printed circuit board |
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CN102907185B (en) | 2015-08-19 |
WO2011149195A3 (en) | 2012-05-10 |
JP2013528322A (en) | 2013-07-08 |
CN102907185A (en) | 2013-01-30 |
KR101051857B1 (en) | 2011-07-25 |
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