CN201400401Y - Vacuum packaging bag for PCB board - Google Patents
Vacuum packaging bag for PCB board Download PDFInfo
- Publication number
- CN201400401Y CN201400401Y CN2009203021714U CN200920302171U CN201400401Y CN 201400401 Y CN201400401 Y CN 201400401Y CN 2009203021714 U CN2009203021714 U CN 2009203021714U CN 200920302171 U CN200920302171 U CN 200920302171U CN 201400401 Y CN201400401 Y CN 201400401Y
- Authority
- CN
- China
- Prior art keywords
- pcb board
- packaging bag
- plastic film
- vacuum packaging
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Packages (AREA)
- Vacuum Packaging (AREA)
Abstract
The utility model relates to a package for a PCB board, in particular to a vacuum packaging bag thereof, aiming at providing a PCB board outside packaging method capable of lowering scrapping and improving the product quality. The vacuum packaging bag for the PCB board comprises a bottom surface, side surfaces and a top surface, wherein the side surfaces and the top surface of the packaging bag are transparent plastic films, and the bottom surface is a foaming plastic film. The top surface and the side surfaces of the packaging bag are formed by directly pressing a whole plastic film onto thePCB board to be packaged. For being a vacuum package, the utility model prevents that the PCB board is influenced by the temperature and the humidity of environment to influence the weldability of thePCB board, thereby improving the product quality; and as the bottom surface of the packaging bag is the foaming plastic film, scrapping caused by mutual collision and extrusion of the PCB boards in atransportation process or a transfer process is prevented, thereby lowering the damage incidence.
Description
Technical field
The utility model relates to the packing of pcb board, relates to its vacuum packaging bag especially.
Background technology
Pcb board is exactly a printed circuit board (PCB), almost can appear in the middle of each electronic machine.And electronic component just is set on the pcb board of different sizes.Along with electronic machine becomes increasingly complex, the part that needs is more and more, and circuit and part on the pcb board are also more and more intensive.This plate is heat insulation by insulation, also unbending material constitutes substrate, the tiny line material that can see on the surface is a Copper Foil, originally Copper Foil is to cover on the whole plank, and part is etched in manufacturing process disposes, and the part that stays has just become netted tiny circuit.These circuits are known as lead or claim wiring, and are used to provide the circuit connection of part on the pcb board.
The external packing of existing pcb board is generally the craft paper packing.Be subjected to the influence of temperature, humidity in the environment and influence the weldability of pcb board, be easy to cause pcb board weldability difference and rosin joint; Thereby be easy to cause scrapping that mutual collision and extruding cause in transportation or in transfer process.
The utility model content
The purpose of this utility model provides the pcb board external packing method that a kind of reduction is scrapped, improved the quality of products.
The technical scheme that realizes the utility model purpose is as follows:
A kind of vacuum packaging bag of pcb board has bottom surface, side and end face, and above-mentioned packaging bag side and end face are overlay, and the bottom surface is the foamed plastic film.The end face of above-mentioned packaging bag and side directly are pressed on the pcb board to be packaged by whole plastic film and form.
Owing to be vacuum packaging, prevented the influence of the temperature of pcb board in being subjected to environment, humidity and influenced the weldability of pcb board, thereby improved the quality of product; Because the packaging bag bottom surface is the foamed plastic film, prevented pcb board transportation or in transfer process because collision and push scrapping of causing mutually, thereby reduced the damage incidence.
Description of drawings
Fig. 1 is the utility model scheme drawing.
The specific embodiment
See Fig. 1, the vacuum foam bag of the utility model pcb board has end face 2, side and bottom surface 1, and end face and side are overlay, and the bottom surface is the foamed plastic film.During packing, stacked being placed on the foamed plastic film of pcb board finished product with the needs packing, by the special hot pressing machine whole overlay pushed downwards from stacked pcb board top then, coat pcb board fully until overlay, and the plastic film of both sides is bonded into one with bottom surface foamed plastic film under hot pressing function, and pcb board just is vacuum-packed in the plastic film like this.When above-mentioned vacuum-packed whole bag pcb board is cased,, can make packing chest have the good shockproof function of resistance to wearing foamed plastic film side being arranged as at interval.
Claims (2)
1. the vacuum packaging bag of a pcb board has bottom surface, side and end face, it is characterized in that: above-mentioned packaging bag side and end face (2) are overlay, and bottom surface (1) is the foamed plastic film.
2. the vacuum packaging bag of pcb board according to claim 1 is characterized in that: the end face of above-mentioned packaging bag and side directly are pressed into pcb board to be packaged (3) by whole plastic film and go up and form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009203021714U CN201400401Y (en) | 2009-04-14 | 2009-04-14 | Vacuum packaging bag for PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009203021714U CN201400401Y (en) | 2009-04-14 | 2009-04-14 | Vacuum packaging bag for PCB board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201400401Y true CN201400401Y (en) | 2010-02-10 |
Family
ID=41660198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009203021714U Expired - Lifetime CN201400401Y (en) | 2009-04-14 | 2009-04-14 | Vacuum packaging bag for PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201400401Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101938884A (en) * | 2010-06-21 | 2011-01-05 | 丁帮俊 | Explosion positioning method of manually made PCB (Printed Circuit Board) |
| CN103754397A (en) * | 2014-01-24 | 2014-04-30 | 万世泰金属工业（昆山）有限公司 | Metal sheet packaging machine |
-
2009
- 2009-04-14 CN CN2009203021714U patent/CN201400401Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101938884A (en) * | 2010-06-21 | 2011-01-05 | 丁帮俊 | Explosion positioning method of manually made PCB (Printed Circuit Board) |
| CN101938884B (en) * | 2010-06-21 | 2012-12-19 | 丁帮俊 | Explosion positioning method of manually made PCB (Printed Circuit Board) |
| CN103754397A (en) * | 2014-01-24 | 2014-04-30 | 万世泰金属工业（昆山）有限公司 | Metal sheet packaging machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100210 |
|
| CX01 | Expiry of patent term |