CN101938884A - Explosion positioning method of manually made PCB (Printed Circuit Board) - Google Patents
Explosion positioning method of manually made PCB (Printed Circuit Board) Download PDFInfo
- Publication number
- CN101938884A CN101938884A CN 201010204960 CN201010204960A CN101938884A CN 101938884 A CN101938884 A CN 101938884A CN 201010204960 CN201010204960 CN 201010204960 CN 201010204960 A CN201010204960 A CN 201010204960A CN 101938884 A CN101938884 A CN 101938884A
- Authority
- CN
- China
- Prior art keywords
- cellophane paper
- transparent paper
- glass plate
- pcb board
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000004880 explosion Methods 0.000 title abstract 3
- 239000011521 glass Substances 0.000 claims abstract description 33
- 239000011229 interlayer Substances 0.000 claims abstract description 9
- 230000005540 biological transmission Effects 0.000 claims abstract description 5
- 229920000298 Cellophane Polymers 0.000 claims description 48
- 239000003292 glue Substances 0.000 claims description 5
- 230000004807 localization Effects 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000007630 basic procedure Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Images
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses an explosion positioning method of a manually made PCB (Printed Circuit Board). The method comprises the following steps of: (1) aligning the hole patterns of transparent paper: aligning the print hole patterns on the transparent paper under the transmission of light or sunlight and then clamping the transparent paper with a clip; (2) fixing the transparent paper and glass boards: firstly, arranging the clamped transparent paper in an interlayer of the two glass boards, then, positioning the glass boards with a protractor and finally and respectively positioning the upper transparent paper and the lower transparent paper on the upper glass board and the lower glass board by filling an adhesive in small holes on the glass boards; and (3) placing the PCB, removing the clip on the transparent paper, arranging the PCB in the interlayer of the transparent paper, positioning the glass boards with the protractor, vacuumizing in an explosion box and exploding. The invention can not cause pattern dislocation.
Description
Technical field
The present invention relates to a kind of pcb board exposure localization method of making by hand.
Background technology
It is as follows to have the basic procedure of making pcb board by hand now:
The first step: print the development figure.With drawing good pcb board figure (see figure 1), respectively top layer (front) and bottom (bottom surface) graphic printing of figure (are seen Fig. 2, Fig. 3) on cellophane paper.
Second step: cellophane paper figure contraposition.Under light or sunlight transmission, with the porose position alignment of the institute of two figures on the cellophane paper, the edge of paper locates with adhesive sticker is sticking.And the pcb board that will have photosensitive material places among the interlayer of cellophane paper.(as Fig. 4)
The 3rd step: exposure imaging.Second works made of step are placed exposure box, vacuumize and make up and down cellophane paper be close to pcb board, open exposure box light and expose.The exposure schematic diagram as shown in Figure 5.
The 4th step: the manual pcb board that the pcb board that exposure is good develops, finished product is made in the burn into punching.
Above method easily causes the dislocation of hole pattern up and down.Be difficult in the process of inhaling vacuum guarantee that the bonding place of adhesive sticker is positioned at the centre position of pcb board thickness direction, so cause the dislocation of hole pattern up and down easily.Upwards skew of right side adhesive sticker bonding place among Fig. 6, adhesive sticker bonding place, left side offsets downward, and makes that going up figure moves to left, and following figure moves to right, and causes the location inaccurate.
Summary of the invention
The present invention seeks to provides a kind of pcb board exposure localization method of making by hand at the defective that prior art exists.
The present invention adopts following technical scheme for achieving the above object:
A kind of pcb board exposure localization method of making by hand of the present invention comprises the steps:
The first step: the contraposition of cellophane paper hole pattern, under the transmission of light or sunlight with cellophane paper on the print hole figure carry out contraposition, with clip cellophane paper is clamped then;
Second step: cellophane paper and glass plate fixing, at first the cellophane paper that clips is placed the interlayer of two glass plates, utilize angle square that glass plate is located then, utilize at last on the glass plate the aperture injecting glue will about cellophane paper be positioned on the lower glass plate respectively;
The 3rd step: place pcb board, remove the clip on the cellophane paper, pcb board is placed among the interlayer of cellophane paper, glass plate is located, in exposure box, inhale vacuum, and expose with angle square.
The present invention and prior art have following advantage:
1. overcome the first method shortcoming of figure dislocation up and down.First method adhesive sticker bonding place must have to compile and move slightly in PCB thickness direction centre position, promptly can cause the dislocation of figure up and down.The cellophane paper that this method at first will be printed on figure is fixed on the glass plate, by angle square glass plate is located, and can not cause the figure dislocation.
2. overcome first method in the process of inhaling vacuum, cellophane paper unbalance stress up and down, interactive problem.The cellophane paper unbalance stress also causes the dislocation of figure easily up and down.In this method up and down cellophane paper in the process of inhaling vacuum mutually between not influence, so there is not this phenomenon.
Description of drawings
The pcb board figure that Fig. 1 draws;
Fig. 2 has printed the cellophane paper of PCB top layer figure;
Fig. 3 has printed the cellophane paper of PCB bottom figure;
Fig. 4 cellophane paper figure contraposition schematic diagram, the a front view, the b explosive view, 11. cellophane paper 1 (exposure of PCB upper surface is used) 21. pcb board 31. double faced adhesive tapes 41. that have photosensitive material that are printed on exposure figure are printed on the cellophane paper 2 (exposure of PCB lower surface is used) of exposure figure;
Fig. 5 schematic diagram that exposes, A. upper surface irradiation ultraviolet radiation B. lower surface irradiation ultraviolet radiation;
Fig. 6 cellophane paper hole pattern dislocation schematic diagram, the following cellophane paper of adhesive sticker bonding place 71. dislocation that move on the last cellophane paper 61. off center positions of 51. dislocation;
Fig. 7 cellophane paper figure 1. is printed on cellophane paper 2. clips of exposure figure to bitmap;
The fixing structural representation of Fig. 8 cellophane paper and glass plate, 1. cellophane paper 2. clips 3. lower glass plate 4. upper glass plates 5 angle squares 6 hole for injecting glue;
Fig. 9 pcb board is placed schematic diagram, and cellophane paper 1-2 goes up the pcb board that cellophane paper 3 lower glass plate 4 upper glass plates 5 angle squares 6 hole for injecting glue 7 have photosensitive material under the 1-1.
Embodiment
Be elaborated below in conjunction with the technical scheme of accompanying drawing to invention:
The first step: the contraposition of cellophane paper hole pattern.Under the transmission of light or sunlight with cellophane paper on the print hole figure carry out contraposition, with clip cellophane paper is tightly clamped then.As shown in Figure 7.
Second step: the fixing of cellophane paper and glass plate.At first the cellophane paper that clips is placed the interlayer of two glass plates, utilizes angle square that glass plate is located then, utilize at last on the glass plate the aperture injecting glue up and down cellophane paper be positioned on the lower glass plate respectively.Structural representation as shown in Figure 8.
The 3rd step: place pcb board.Remove the clip on the cellophane paper, pcb board is placed (cellophane paper and last lower glass plate are fixed together up and down) among the interlayer of cellophane paper, glass plate is located, in exposure box, inhale vacuum, and expose with angle square.As shown in Figure 9.
Claims (1)
1. make pcb board exposure localization method by hand for one kind, it is characterized in that comprising the steps:
The first step: the contraposition of cellophane paper hole pattern, under the transmission of light or sunlight with cellophane paper on the print hole figure carry out contraposition, with clip cellophane paper is clamped then;
Second step: cellophane paper and glass plate fixing, at first the cellophane paper that clips is placed the interlayer of two glass plates, utilize angle square that glass plate is located then, utilize at last on the glass plate the aperture injecting glue will about cellophane paper be positioned on the lower glass plate respectively;
The 3rd step: place pcb board, remove the clip on the cellophane paper, pcb board is placed among the interlayer of cellophane paper, glass plate is located, in exposure box, inhale vacuum, and expose with angle square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010204960 CN101938884B (en) | 2010-06-21 | 2010-06-21 | Explosion positioning method of manually made PCB (Printed Circuit Board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010204960 CN101938884B (en) | 2010-06-21 | 2010-06-21 | Explosion positioning method of manually made PCB (Printed Circuit Board) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101938884A true CN101938884A (en) | 2011-01-05 |
| CN101938884B CN101938884B (en) | 2012-12-19 |
Family
ID=43391939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010204960 Expired - Fee Related CN101938884B (en) | 2010-06-21 | 2010-06-21 | Explosion positioning method of manually made PCB (Printed Circuit Board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101938884B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2842853B2 (en) * | 1996-08-29 | 1999-01-06 | 富山日本電気株式会社 | Exposure equipment for printed wiring boards |
| WO2009033215A1 (en) * | 2007-09-10 | 2009-03-19 | Dyesol Industries Pty Ltd | An array of solar cells |
| CN201400401Y (en) * | 2009-04-14 | 2010-02-10 | 常州海弘电子有限公司 | Vacuum packaging bag for PCB board |
-
2010
- 2010-06-21 CN CN 201010204960 patent/CN101938884B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2842853B2 (en) * | 1996-08-29 | 1999-01-06 | 富山日本電気株式会社 | Exposure equipment for printed wiring boards |
| WO2009033215A1 (en) * | 2007-09-10 | 2009-03-19 | Dyesol Industries Pty Ltd | An array of solar cells |
| CN201400401Y (en) * | 2009-04-14 | 2010-02-10 | 常州海弘电子有限公司 | Vacuum packaging bag for PCB board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101938884B (en) | 2012-12-19 |
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: NANTONG TONGZHOU YIJUN LABOUR SERVICE CO., LTD. Free format text: FORMER OWNER: DING BANGJUN Effective date: 20131023 |
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| C41 | Transfer of patent application or patent right or utility model | ||
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Free format text: CORRECT: ADDRESS; FROM: 214153 WUXI, JIANGSU PROVINCE TO: 226368 NANTONG, JIANGSU PROVINCE |
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| TR01 | Transfer of patent right |
Effective date of registration: 20131023 Address after: 226368 Jiangsu city of Nantong province Tongzhou District five Jie Zhen Yuan San Wei village two groups Patentee after: Nantong City Tongzhou District Yijun Labour Service Co., Ltd. Address before: 214153 Jiangsu province Binhu District of Wuxi City Qian Rong Lu No. 108 Patentee before: Ding Bangjun |
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| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20110105 Assignee: Shenzhen Sen Sen precision circuit Co., Ltd. Assignor: Nantong City Tongzhou District Yijun Labour Service Co., Ltd. Contract record no.: 2015440020157 Denomination of invention: Explosion positioning method of manually made PCB (Printed Circuit Board) Granted publication date: 20121219 License type: Exclusive License Record date: 20150507 |
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| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| EM01 | Change of recordation of patent licensing contract |
Change date: 20150821 Contract record no.: 2015440020157 Assignee after: Shenzhen Dongxu Circuit Technology Co., Ltd. Assignee before: Shenzhen Sen Sen precision circuit Co., Ltd. |
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| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121219 Termination date: 20190621 |