CN101938884A - Explosion positioning method of manually made PCB (Printed Circuit Board) - Google Patents
Explosion positioning method of manually made PCB (Printed Circuit Board) Download PDFInfo
- Publication number
- CN101938884A CN101938884A CN 201010204960 CN201010204960A CN101938884A CN 101938884 A CN101938884 A CN 101938884A CN 201010204960 CN201010204960 CN 201010204960 CN 201010204960 A CN201010204960 A CN 201010204960A CN 101938884 A CN101938884 A CN 101938884A
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- CN
- China
- Prior art keywords
- cellophane paper
- transparent paper
- glass plate
- pcb board
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000004880 explosion Methods 0.000 title abstract 3
- 239000011521 glass Substances 0.000 claims abstract description 33
- 239000011229 interlayer Substances 0.000 claims abstract description 9
- 230000005540 biological transmission Effects 0.000 claims abstract description 5
- 229920000298 Cellophane Polymers 0.000 claims description 48
- 239000003292 glue Substances 0.000 claims description 5
- 230000004807 localization Effects 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000007630 basic procedure Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201010204960 CN101938884B (en) | 2010-06-21 | 2010-06-21 | Explosion positioning method of manually made PCB (Printed Circuit Board) |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201010204960 CN101938884B (en) | 2010-06-21 | 2010-06-21 | Explosion positioning method of manually made PCB (Printed Circuit Board) |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101938884A true CN101938884A (en) | 2011-01-05 |
CN101938884B CN101938884B (en) | 2012-12-19 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201010204960 Expired - Fee Related CN101938884B (en) | 2010-06-21 | 2010-06-21 | Explosion positioning method of manually made PCB (Printed Circuit Board) |
Country Status (1)
Country | Link |
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CN (1) | CN101938884B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2842853B2 (en) * | 1996-08-29 | 1999-01-06 | 富山日本電気株式会社 | Exposure equipment for printed wiring boards |
WO2009033215A1 (en) * | 2007-09-10 | 2009-03-19 | Dyesol Industries Pty Ltd | An array of solar cells |
CN201400401Y (en) * | 2009-04-14 | 2010-02-10 | 常州海弘电子有限公司 | Vacuum packaging bag for PCB board |
-
2010
- 2010-06-21 CN CN 201010204960 patent/CN101938884B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2842853B2 (en) * | 1996-08-29 | 1999-01-06 | 富山日本電気株式会社 | Exposure equipment for printed wiring boards |
WO2009033215A1 (en) * | 2007-09-10 | 2009-03-19 | Dyesol Industries Pty Ltd | An array of solar cells |
CN201400401Y (en) * | 2009-04-14 | 2010-02-10 | 常州海弘电子有限公司 | Vacuum packaging bag for PCB board |
Also Published As
Publication number | Publication date |
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CN101938884B (en) | 2012-12-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: NANTONG TONGZHOU YIJUN LABOUR SERVICE CO., LTD. Free format text: FORMER OWNER: DING BANGJUN Effective date: 20131023 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 214153 WUXI, JIANGSU PROVINCE TO: 226368 NANTONG, JIANGSU PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20131023 Address after: 226368 Jiangsu city of Nantong province Tongzhou District five Jie Zhen Yuan San Wei village two groups Patentee after: Nantong City Tongzhou District Yijun Labour Service Co., Ltd. Address before: 214153 Jiangsu province Binhu District of Wuxi City Qian Rong Lu No. 108 Patentee before: Ding Bangjun |
|
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20110105 Assignee: Shenzhen Sen Sen precision circuit Co., Ltd. Assignor: Nantong City Tongzhou District Yijun Labour Service Co., Ltd. Contract record no.: 2015440020157 Denomination of invention: Explosion positioning method of manually made PCB (Printed Circuit Board) Granted publication date: 20121219 License type: Exclusive License Record date: 20150507 |
|
LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
EM01 | Change of recordation of patent licensing contract |
Change date: 20150821 Contract record no.: 2015440020157 Assignee after: Shenzhen Dongxu Circuit Technology Co., Ltd. Assignee before: Shenzhen Sen Sen precision circuit Co., Ltd. |
|
LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121219 Termination date: 20190621 |