CN101594745B - Improved structure of registration of upper and lower films and electronic circuit board - Google Patents

Improved structure of registration of upper and lower films and electronic circuit board Download PDF

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Publication number
CN101594745B
CN101594745B CN2008101224451A CN200810122445A CN101594745B CN 101594745 B CN101594745 B CN 101594745B CN 2008101224451 A CN2008101224451 A CN 2008101224451A CN 200810122445 A CN200810122445 A CN 200810122445A CN 101594745 B CN101594745 B CN 101594745B
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Prior art keywords
contraposition
circuit board
electronic circuit
registration holes
holes
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CN2008101224451A
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CN101594745A (en
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杨雪林
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JIANGSU SUHANG ELECTRONIC CO Ltd
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JIANGSU SUHANG ELECTRONIC CO Ltd
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Abstract

The invention discloses an improved contraposition structure of upper and lower filins and an electronic circuit board; wherein, the upper and lower filins are respectively fixed onto the upper and lower surfaces of the electronic circuit board in a contraposition manner, at least the four corners of the upper filin are respectively provided with a first contraposition hole, at least the four corners of the lower filins are respectively provided with a second contraposition hole; the electronic circuit board is provided with third and fourth contraposition holes which are corresponding to the first and second contraposition holes, the first and third contraposition holes are correspondingly superposed and communicated with each other, the second and fourth contraposition holes are correspondingly superposed and communicated with each other; pin ends of eight contraposition pins are correspondingly fixed across the corresponding communicated first, third contraposition holes and the second, fourth contraposition holes; bottom plates of the contraposition holes cover the surface of the upper and lower filin. The invention can easily and directly finish the contraposition technology by directly correspondingly sheathing the upper and lower filin on the contraposition fins in the third and fourth contraposition holes on the circuit board; and the upper and lower filins are respectively fixed on the electric circuit board, which can ensure that the upper and lower filins do not break off the electric circuit board during the subsequent exposal process, further facilitate the subsequent operation in the manufacture process of the electric circuit board.

Description

The contraposition structure-improved of the upper and lower film and electronic circuit board
Technical field
The present invention relates to the aligning structure of a kind of electronic circuit board and the upper and lower film.
Background technology
The contraposition of the conditional electronic wiring board and the upper and lower film has following two kinds:
1. rely on the CCD camera lens of fully automatic exposure machine will deceive the position of designing on marker graphic on the film (pattern mark) and the pcb board same position, hole and carry out automatic contraposition of while;
2. the figure that will deceive on the film copies on the brown diazo sheet (diazo film), utilize the translucent character of brown diazo sheet the position of designing on marker graphic (pattern mark) and the pcb board same position, hole to be aligned by artificial naked eyes, finish eight artificial contrapositions of the film on two sides, four angles successively, the use of a common exposure machine, needs three to four-player is finished, the one man operation exposure machine, two to three people's contrapositions.
The tradition contraposition need drop into a large amount of equipment funds if use the fully automatic exposure machine to carry out automatic contraposition, and the such technique of counterpoint production efficiency of artificial contraposition is low, Aligning degree is low, cost of idleness if the use manual exposure machine carries out.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides the contraposition structure-improved of a kind of upper and lower film and electronic circuit board, the contraposition structure-improved of this upper and lower film and electronic circuit board can make the upper and lower film and the electronic circuit board contraposition is easy, precision is high and cost is lower.
The present invention for the technical scheme that solves its technical problem and adopt is:
On, the contraposition structure-improved of the following film and electronic circuit board, comprise electronic circuit board, the last film and the following film, the last film, the following film respectively contraposition be fixed in electronic circuit board on, below, be respectively equipped with first registration holes on four angles of the last film, be respectively equipped with second registration holes on four angles of the following film, electronic circuit board is provided with and described first, the 3rd of two registration holes correspondences, four registration holes, first of described correspondence position, three registration holes overlap and communicate, second of described correspondence position, four registration holes overlap and communicate, being provided with eight alignment pin correspondences again fastens in first, three registration holes and second, in four registration holes, alignment pin is made up of chassis and pin end, the pin end is fixed on the chassis, the pin end of alignment pin fasten respectively in correspondence communicate first, three registration holes and second, in four registration holes, the chassis of alignment pin is covered on the correspondence, the surface of the following film.
The invention has the beneficial effects as follows: during use, the direct correspondence of the upper and lower film that only needs to load onto alignment pin is inserted in third and fourth registration holes on the wiring board can finish contraposition, can easily directly finish technique of counterpoint, therefrom find out, the manually contraposition with the naked eye of this example, but effectively utilizing cooperating of alignment pin and registration holes, the efficiency and precision and the cost that improve contraposition widely are lower; And after the upper and lower film is individually fixed in circuit board, can guarantee that the upper and lower film can not come off with circuit board in the post-exposure process, more help the subsequent operation in the process for manufacturing circuit board.
Description of drawings
Fig. 1 is a schematic diagram of the present invention.
Embodiment
Embodiment: on a kind of, the contraposition structure-improved of the following film and electronic circuit board, comprise electronic circuit board 2, the last film 1 and the following film 3, the last film 1, the following film 3 respectively contraposition be fixed in electronic circuit board 2 on, below, be respectively equipped with first registration holes 5 on four angles of the last film 1, be respectively equipped with second registration holes 8 on four angles of the following film 3, electronic circuit board is provided with and described first, two registration holes 5, the 3rd of 8 correspondences, four registration holes 6,7, first of described correspondence position, three registration holes 5,6 coincidences communicate, second of described correspondence position, four registration holes 8,7 coincidences communicate, be provided with eight alignment pin 4 again, alignment pin 4 is made up of chassis 11 and pin end 10, pin end 10 is fixed on the chassis 11, the pin end 10 of alignment pin 4 fasten respectively in correspondence communicate first, three registration holes 5,6 and second, four registration holes 8, in 7, the chassis 11 of alignment pin 4 is covered on the correspondence, the following film 1,3 surface.
This routine manufacturing process is:
Draw the film with light commonly used, the position, hole of its figure and electronic circuit board (PCB) (this Kong Feiben example the described the 3rd, four registration holes, but the position, hole on the wiring board) figure is corresponding one by one, drawing at the last film four jiaos can be by the circular pattern of special-purpose film perforating press identification, go out corresponding first registration holes by special-purpose film perforating press then, the first registration holes diameter is got 2.0mm in this example, then alignment pin is loaded onto, the pin end diameter of alignment pin is got 1.95mm in this example, the height of pin end is generally 1.0mm, sticking transparent adhesive tape on the chassis of alignment pin is bonded into one itself and the last film, finish the bookbinding of the alignment pin of four first registration holes successively, just finished the making of last film band alignment pin, the making of following film band alignment pin is identical with the last film, no longer describes in detail.
Third and fourth registration holes on the electronic circuit board in this example (PCB) gets out in the position of alignment pin correspondence, the diameter 2.05mm of third and fourth registration holes, and third and fourth registration holes its aperture after finishing hole metallization through heavy copper plating is 2.0mm.
The concrete grammar of this example alignment pin contraposition in realizing exposure is:
During exposure, the following film of stapled alignment pin is placed on the exposure glass plate, paste fixingly with adhesive tape, then the 4th registration holes correspondence on the electronic circuit board (PCB) of need exposure is pressed on the alignment pin, finish down film contraposition.The 3rd registration holes correspondence that the last film of stapled alignment pin is aimed on the electronic circuit board is pressed into, and finishes the contraposition of the film.Can shut shutter then and push and expose, finish the location.
Below be to adopt some data of alignment pin technique of counterpoint and common artificial technique of counterpoint to compare:
Figure GSB00000327108700041

Claims (1)

1. on one kind, the contraposition structure-improved of the following film and electronic circuit board, comprise electronic circuit board, the last film and the following film, the last film, the following film respectively contraposition be fixed in electronic circuit board on, below, it is characterized in that: upward be respectively equipped with first registration holes on four angles of the film, be respectively equipped with second registration holes on four angles of the following film, electronic circuit board is provided with and described first, the 3rd of two registration holes correspondences, four registration holes, first of described correspondence position, three registration holes overlap and communicate, second of described correspondence position, four registration holes overlap and communicate, being provided with eight alignment pin correspondences again fastens in first, three registration holes and second, in four registration holes, alignment pin is made up of chassis and pin end, the pin end is fixed on the chassis, the pin end of alignment pin fasten respectively in correspondence communicate first, three registration holes and second, in four registration holes, the chassis of alignment pin is covered on the correspondence, the surface of the following film.
CN2008101224451A 2008-05-28 2008-05-28 Improved structure of registration of upper and lower films and electronic circuit board Expired - Fee Related CN101594745B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008101224451A CN101594745B (en) 2008-05-28 2008-05-28 Improved structure of registration of upper and lower films and electronic circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2008101224451A CN101594745B (en) 2008-05-28 2008-05-28 Improved structure of registration of upper and lower films and electronic circuit board

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CN101594745A CN101594745A (en) 2009-12-02
CN101594745B true CN101594745B (en) 2011-11-02

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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101872131A (en) * 2010-03-23 2010-10-27 广州依利安达微通科技有限公司 Positioning device and alignment method for exposure alignment of PCB (Polychlorinated Biphenyl) board green oil
CN101846878B (en) * 2010-06-21 2012-07-04 四川虹欧显示器件有限公司 Large-size film master mask design and combination method thereof
CN102253612A (en) * 2011-06-24 2011-11-23 胜华电子(惠阳)有限公司 Aligning method for dry films
CN102497738B (en) * 2011-12-19 2016-03-30 深圳市景旺电子股份有限公司 A kind of method applying outer semi-automatic exposure machine making core material
CN102540768A (en) * 2012-03-13 2012-07-04 四川深北电路科技有限公司 Alignment device and alignment method for exposure of PCB (Printed Circuit Board)
CN104168714A (en) * 2014-06-25 2014-11-26 浙江开化建科电子科技有限公司 Para-position exposure method applied to PCB circuit in solder resisting technology
CN105376950A (en) * 2015-12-14 2016-03-02 谢兴龙 Improved manual alignment method for solder-mask exposure of circuit board
CN105430928A (en) * 2015-12-29 2016-03-23 广东欧珀移动通信有限公司 Electroplating method of flexible circuit board, flexible circuit board and mobile terminal
CN107205317A (en) * 2016-03-17 2017-09-26 上海嘉捷通电路科技股份有限公司 A kind of PCB films aligned for printed board leaf type PIN
CN106676469B (en) * 2017-01-09 2019-03-26 昆山国显光电有限公司 Mask plate and its manufacturing method is deposited
CN107682477B (en) * 2017-09-25 2021-02-26 捷开通讯(深圳)有限公司 Camera assembly and terminal
CN109757038B (en) * 2019-01-21 2022-04-01 珠海市协宇电子有限公司 Film contraposition process method and structure thereof
CN111474829B (en) * 2020-05-18 2023-01-10 深圳市绿基电子科技有限公司 Circuit board exposure method
CN113504702A (en) * 2021-07-12 2021-10-15 天水华洋电子科技股份有限公司 Method for manufacturing film glass mold

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2201769Y (en) * 1994-07-05 1995-06-21 胡祝欣 Pricking-through pin of PC board for locating negative
JP2677227B2 (en) * 1995-02-21 1997-11-17 日本電気株式会社 Manufacturing method of printed wiring board
CN1784122A (en) * 2004-10-25 2006-06-07 日本梅克特隆株式会社 Flexible printed circuit board apposition method and guide pin
US7304860B2 (en) * 2006-01-17 2007-12-04 Huo-Lu Tsai Printed circuit board with thin film switches for a keyboard
CN201204758Y (en) * 2008-05-28 2009-03-04 江苏苏杭电子有限公司 Contraposition improved structure for upper/lower films and electronic line board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2201769Y (en) * 1994-07-05 1995-06-21 胡祝欣 Pricking-through pin of PC board for locating negative
JP2677227B2 (en) * 1995-02-21 1997-11-17 日本電気株式会社 Manufacturing method of printed wiring board
CN1784122A (en) * 2004-10-25 2006-06-07 日本梅克特隆株式会社 Flexible printed circuit board apposition method and guide pin
US7304860B2 (en) * 2006-01-17 2007-12-04 Huo-Lu Tsai Printed circuit board with thin film switches for a keyboard
CN201204758Y (en) * 2008-05-28 2009-03-04 江苏苏杭电子有限公司 Contraposition improved structure for upper/lower films and electronic line board

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Application publication date: 20091202

Assignee: Kunshan Suhang Circuit Board Co., Ltd.

Assignor: Jiangsu Suhang Electronic Co., Ltd.

Contract record no.: 2013320010032

Denomination of invention: Improved structure of registration of upper and lower films and electronic circuit board

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Contract record no.: 2014320010025

Denomination of invention: Improved structure of registration of upper and lower films and electronic circuit board

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