CN104168714A - Para-position exposure method applied to PCB circuit in solder resisting technology - Google Patents
Para-position exposure method applied to PCB circuit in solder resisting technology Download PDFInfo
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- CN104168714A CN104168714A CN201410287950.7A CN201410287950A CN104168714A CN 104168714 A CN104168714 A CN 104168714A CN 201410287950 A CN201410287950 A CN 201410287950A CN 104168714 A CN104168714 A CN 104168714A
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Abstract
The invention relates to a para-position exposure method applied to a PCB circuit in solder resisting technology. The method includes: A. pasting a protective film on black wafers painted by light through a film pressing machine; B. punching locating rings of the two black wafers and installing locating pieces; C. fixing one of the black wafers to glass of an exposure machine with adhesive tape; D. inserting the locating pieces on the black wafer from locating holes on a PCB; E. inserting the locating pieces on the other black wafer from locating holes under the PCB; F. putting down an upper frame of the exposure machine, performing air exhausting and air expelling to reach an air pressure required value, and switching on a conveying switch till exposure is completed; G. taking out the other exposed black wafer and PCB; and H. repeating the abovementioned process of D to G to manufacture another PCB. By adoption of the para-position exposure method in the invention, yellow wafer manufacture is omitted, specialized persons are not needed for para-position, and working procedures are also reduced at the same time, compared with an original para-position exposure method, practical inspection effects show that work efficiency can be improved by at least one time, and production cost is greatly saved.
Description
Technical field
The present invention relates to the contraposition exposure method in a kind of PCB of being applied to circuit, welding resistance technique.
Background technology
At present, the contraposition exposure method being applied in PCB circuit, welding resistance technique is: the black-film of 1, light being painted is copied into pornographic movie; 2, through ammoniacal liquor machine, develop and shape; 3, by crossing film laminator, on pornographic movie, stick diaphragm; 4, on the edge outside the figure of pornographic movie, stick adhesive tape; 5, after contraposition personnel amplify by magnifying glass, range estimation is locating ring in pornographic movie and location hole in PCB corresponding going up one by one, guarantees that figure on pornographic movie and the figure on PCB match; 6, keep pornographic movie and PCB contraposition invariant position, with the adhesive tape on the edge outside the figure of pornographic movie, pornographic movie and PCB contraposition position are fixed; 7, upset PCB is also fixing PCB another side and an other pornographic movie position contraposition by above-mentioned 5,6 steps; 8, good pornographic movie and the PCB of contraposition put in exposure machine, put down exposure machine upper ledge, bleed and catch up with gas to air pressure required value, open and carry switch to completing exposure process; 9, from exposure machine, take out the PCB of the light that exposed to the sun and pornographic movie slave plate is torn it down after can complete PCB and make; If 10 need to make another piece PCB, repeat above-mentioned 4 to 9 steps.Said method is both loaded down with trivial details, easily causes again contraposition deviation, affects the product quality of postorder processing.
Summary of the invention
The object of this invention is to provide both simple, quick again, and a kind of contraposition exposure method being applied in PCB circuit, welding resistance technique accurately.
The technical scheme that the present invention takes is: the contraposition exposure method in a kind of PCB of being applied to circuit, welding resistance technique, is characterized in that it comprises the following steps: A, black-film that light is painted sticks diaphragm by crossing film laminator; B, on the locating ring of two black-films, stamp keeper installing hole and load onto keeper; C, a black-film is wherein fixed on to the on glass of exposure machine with adhesive tape; D, the location hole by the keeper on this black-film above PCB embed; E, the location hole by the keeper on another piece black-film below PCB embed; F, put down exposure machine upper ledge, bleed and catch up with gas to air pressure required value, open and carry switch to completing exposure process; G, from exposure machine, take out another piece black-film and PCB of the light that exposed to the sun; If H need to make another piece PCB, repeat the process of above-mentioned D to G.
Adopt the present invention, not only omitted pornographic movie making, and need not professional's contraposition, also reduced operation simultaneously, compare with original contraposition exposure method, border test effect shows factually, work efficiency at least can be enhanced about more than once, and has saved production cost in a large number.
Embodiment
Below in conjunction with specific embodiment, the invention will be further described.It comprises the following steps:
One, embodiment mono-
1, the black-film of light being painted sticks diaphragm by crossing film laminator.
2, on the locating ring of two black-films, stamp four keeper installing holes at two pairs of diagonal angles and load onto keeper
3, a black-film is wherein fixed on to the on glass of exposure machine with adhesive tape.
4, by the keeper on this black-film, four location holes above PCB embed.
5,, by the keeper on another piece black-film, the location hole below PCB embeds.
6, put down exposure machine upper ledge, bleed and catch up with gas to air pressure required value, open and carry switch to completing exposure process.
7, from exposure machine, take out another piece black-film and PCB of the light that exposed to the sun;
If 8 need to make another piece PCB, repeat above-mentioned 4 to 7 process.
Two, embodiment bis-
1, the black-film of light being painted sticks diaphragm by crossing film laminator.
2, on the locating ring of two black-films, stamp two keeper installing holes at a pair of diagonal angle and load onto keeper
3, a black-film is wherein fixed on to the on glass of exposure machine with adhesive tape.
4, by the keeper on this black-film, two location holes above PCB embed.
5, by the keeper on another piece black-film, the location hole below PCB embeds.
6, put down exposure machine upper ledge, bleed and catch up with gas to air pressure required value, open and carry switch to completing exposure process.
7, from exposure machine, take out another piece black-film and PCB of the light that exposed to the sun.
If 8 need to make another piece PCB, repeat above-mentioned 4 to 7 process.
Claims (1)
1. be applied to the contraposition exposure method in PCB circuit, welding resistance technique, it is characterized in that it comprises the following steps: A, black-film that light is painted sticks diaphragm by crossing film laminator; B, on the locating ring of two black-films, stamp keeper installing hole and load onto keeper; C, a black-film is wherein fixed on to the on glass of exposure machine with adhesive tape; D, the location hole by the keeper on this black-film above PCB embed; E, the location hole by the keeper on another piece black-film below PCB embed; F, put down exposure machine upper ledge, bleed and catch up with gas to air pressure required value, open and carry switch to completing exposure process; G, from exposure machine, take out another piece black-film and PCB of the light that exposed to the sun; If H need to make another piece PCB, repeat the process of above-mentioned D to G.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410287950.7A CN104168714A (en) | 2014-06-25 | 2014-06-25 | Para-position exposure method applied to PCB circuit in solder resisting technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410287950.7A CN104168714A (en) | 2014-06-25 | 2014-06-25 | Para-position exposure method applied to PCB circuit in solder resisting technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104168714A true CN104168714A (en) | 2014-11-26 |
Family
ID=51912286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410287950.7A Pending CN104168714A (en) | 2014-06-25 | 2014-06-25 | Para-position exposure method applied to PCB circuit in solder resisting technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104168714A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105376950A (en) * | 2015-12-14 | 2016-03-02 | 谢兴龙 | Improved manual alignment method for solder-mask exposure of circuit board |
| CN106231805A (en) * | 2016-08-15 | 2016-12-14 | 建业科技电子（惠州）有限公司 | A kind of semi-automatic exposure machine does the processing technology of inner plating |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000068632A (en) * | 1998-08-24 | 2000-03-03 | Ibiden Co Ltd | Manufacture of printed wiring board |
| CN101594745A (en) * | 2008-05-28 | 2009-12-02 | 江苏苏杭电子有限公司 | The contraposition structure-improved of the upper and lower film and electronic circuit board |
| CN101782725A (en) * | 2010-02-04 | 2010-07-21 | 深圳市迈瑞特电路科技有限公司 | Printed circuit board positioning exposure device and positioning exposure method |
| CN203204300U (en) * | 2013-03-19 | 2013-09-18 | 深圳市仁创艺电子有限公司 | Circuit graph positioning exposure system of circuit board |
-
2014
- 2014-06-25 CN CN201410287950.7A patent/CN104168714A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000068632A (en) * | 1998-08-24 | 2000-03-03 | Ibiden Co Ltd | Manufacture of printed wiring board |
| CN101594745A (en) * | 2008-05-28 | 2009-12-02 | 江苏苏杭电子有限公司 | The contraposition structure-improved of the upper and lower film and electronic circuit board |
| CN101782725A (en) * | 2010-02-04 | 2010-07-21 | 深圳市迈瑞特电路科技有限公司 | Printed circuit board positioning exposure device and positioning exposure method |
| CN203204300U (en) * | 2013-03-19 | 2013-09-18 | 深圳市仁创艺电子有限公司 | Circuit graph positioning exposure system of circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105376950A (en) * | 2015-12-14 | 2016-03-02 | 谢兴龙 | Improved manual alignment method for solder-mask exposure of circuit board |
| CN106231805A (en) * | 2016-08-15 | 2016-12-14 | 建业科技电子（惠州）有限公司 | A kind of semi-automatic exposure machine does the processing technology of inner plating |
| CN106231805B (en) * | 2016-08-15 | 2019-01-22 | 建业科技电子（惠州）有限公司 | A kind of semi-automatic exposure machine does the manufacture craft of inner plating |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141126 |