JP2000031636A - Method for mounting electronic component and electronic component package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount an LSI package on further smaller area of, generally called a TCP, when it is mounted on equipment. SOLUTION: An input/output terminal section 3 of a TCP is bent at one side toward a die 4 for an LSI. The bent part of the input/output terminal 3 is positioned and pasted on a terminal section 14 of a printed board 13 with an anisotropic conductive adhesive 15. Since the TCP is bent mounted on the printed board 13 with a least one side part of the input/output terminal section 3 which is expanded two-dimensionally, the mounting area can be reduced by the bent part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a pattern on an insulating film using a conductive thin film,
The present invention relates to an electronic component mounting method and an electronic component mounted body applied to a mounting mode in which electronic components such as the above are mounted, that is, a mounting mode called a TCP.

[0002]

2. Description of the Related Art In recent years, in electronic equipment required to be miniaturized, an LSI mounting form called TCP, in which a conductive pattern is formed by a conductive thin film on an insulating film and the LSI is mounted on the conductive pattern portion, has been widely adopted. I have.

FIG. 3 is a perspective view for explaining a conventional TCP. In this TCP, a conductive pattern portion 21 is formed on an insulating film 20, and input / output terminal portions 22, 22 are provided on both sides of the conductive pattern portion 21. 22 is formed, and an LSI die 23 is mounted at a substantially central portion of the conductive pattern portion 21.

[0004]

In order to mount the above-described conventional TCP on a device, the input / output terminal portions 22 and 22 installed so as to spread two-dimensionally are directly mounted on a printed circuit board or the like of the device. Dimensionally, because it was electrically connected using soldering or anisotropic conductive adhesive, etc.,
A mounting area much larger than the size of the die 23 of the LSI is required.

[0005] The present invention solves the above-mentioned conventional problems and provides a TC
It is an object of the present invention to provide an electronic component mounting method and an electronic component mounted body that can reduce the mounting area of P.

[0006]

In order to achieve the above object, the present invention provides a method for forming a conductive pattern at a central portion of an insulating film, and forming an input / output terminal at an end of the insulating film. In the TCP in which the electronic component is mounted on the conductive pattern portion, the input / output terminal portion on at least one end of the insulating film is bent toward the electronic component, and the input / output terminal is electrically connected to the circuit of the mounting device in the bent state. Since the input / output terminal portions that spread two-dimensionally are mounted by bending, the mounting area is inevitably reduced.

[0007]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a cross-sectional view showing a main part of a TCP for explaining an embodiment of the present invention. An electrode pattern including input / output terminals 3 is formed on an insulating film 1 by a conductive thin film 2. The LSI die 4 is mounted on the substrate by thermocompression bonding, the LSI functional surface and the mounting portion are protected by a chip coat resin 5, and an LSI generally called TCP is used.
Is implemented.

Further, in the present embodiment, the insulating film 1
Is bent to the die 4 side, and the inside of the bent portion of the insulating film 1 on the die 4 side is fixed using an adhesive 6, so that the planar area of the TCP is reduced. .

As described above, since at least one end of the two-dimensionally extending input / output terminal portion of the TCP is mounted so as to be bent, the mounting area is reduced by the bent size.

Next, a mounting method for mounting the TCP shown in FIG. 1 on a liquid crystal display panel will be described with reference to FIG.

First, the input / output terminals 7 on the unbent side of the TCP are thermocompression-bonded to the terminal portions 11 of the liquid crystal display panel 10 using an anisotropic conductive adhesive 12, and the liquid crystal display panel 10 and the TCP are electrically connected. Connection. Next, using the anisotropic conductive adhesive 15 for the terminal portion 14 of the printed circuit board 13 that exchanges signals with the TCP, the TCP on the bent side is used.
The input / output terminals 3 are aligned and pasted. Furthermore, the anisotropic conductive adhesive 15 is fixed by placing the TCP and the printed circuit board 13 in a temperature bath while keeping the pressurized state.

[0013]

As described above, according to the present invention,
At least one input / output terminal portion of the TCP is bent to the electronic component side, and the input / output terminal can be electrically connected to the mounting-side circuit in the bent state. Can be implemented.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a main part of a TCP for explaining an embodiment of the present invention.

FIG. 2 is a front view showing a part of a mounted product for explaining a mounting method of the TCP shown in FIG. 1;

FIG. 3 is a perspective view for explaining a conventional TCP.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating film 2 Conductive thin film 3, 7 I / O terminal 4 LSI die 5 Chip coat resin 6 Adhesive 10 Liquid crystal display panel 11 Terminal part of liquid crystal display panel 12, 15 Anisotropic conductive adhesive 13 Printed circuit board 14 Printed circuit board Terminal part

Claims (2)

[Claims] 1. An electronic component mounting method comprising: forming a conductive pattern portion at a central portion of an insulating film; forming an input / output terminal portion at an end portion of the insulating film; and mounting an electronic component on the conductive pattern portion. When mounting the body on another circuit member, the input / output terminal portion on at least one end of the insulating film is bent toward the electronic component, and the input / output terminal is electrically connected to the other circuit member in the bent state. Electronic component mounting method. 2. An electronic component mounting wherein a conductive pattern portion is formed at a center portion of an insulating film, an input / output terminal portion is formed at an end portion of the insulating film, and an electronic component is mounted on the conductive pattern portion. An electronic component package, wherein at least one input / output terminal portion of the insulating film is bent toward an electronic component and held by the electronic component.