JP3156120B2 - Semiconductor device mounting structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device mounting structure, and more particularly, to a semiconductor device mounting structure comprising a circuit board and a liquid crystal display (hereinafter, referred to as LCD), and a film carrier device mounted on these. The mounting structure of the semiconductor device.

[0002]

2. Description of the Related Art Conventionally, among semiconductor devices which are used by being incorporated in electronic equipment such as a card-type thin calculator and an electronic organizer, as shown in FIG. 13 and FIG. Comprising an LCD driving circuit board 1 and a display LCD 2, and a film carrier device 3 mounted on the LCD driving circuit board 1 and the display LCD 2.
There is a display, where the film carrier device 3
Is a film substrate 4 formed by attaching the input-side terminal leads 3a and the output-side terminal leads 3b, and an LS mounted on the film substrate 4 after being sealed with an exterior resin.
And an I chip component 5. In this semiconductor device, the input terminal lead 3a is connected to the connection electrode 1a of the circuit board 1 by soldering,
A mounting structure in which the output terminal lead 3b is connected to the connection electrode 2a of the LCD 2 using an anisotropic conductive adhesive 6 has been adopted.

Alternatively, the circuit board 1 and the LCD 2 are arranged at positions vertically separated from each other, as shown in FIG.
The circuit board 1 is bent and deformed on the output side terminal lead 3b provided on the opening 4a formed by punching
Also, the film carrier device 3 is attached so as to straddle between the LCDs 2. FIG.
In FIG. 3, connection electrodes 1a and 2a and output-side terminal leads 3b are not shown, and in FIG. 15, the same components and parts as those in FIG. 14 are denoted by the same reference numerals.

[0004]

By the way, the circuit board 1 and the film carrier device 3 when the above-mentioned conventional structure is adopted are composed of the connection electrode 1a and the input terminal lead 3
It is supposed that the connection is made only via the solder 7 connecting the portions a. Therefore, when an external stress is applied to the semiconductor device, the external stress acts directly on the input-side terminal lead 3a, and the external-side stress acts on the input-side terminal lead 3a. Breakage and damage will occur. In particular,
In the semiconductor device having the configuration shown in FIG. 15, since the film substrate 4 made of a rigid material such as a polyimide resin always generates a repulsive force to return to the flat state, Further external stress was applied to the terminal lead 3a.

In the prior art, the circuit board side portion of the film substrate 4 constituting the film carrier device 3 and the circuit board 1 are adhered and fixed by a double-sided adhesive tape 8 or the like, so that the input terminal A measure for preventing external stress from directly acting on the lead 3 is adopted. However, depending on the arrangement using the double-sided adhesive tape 8, etc., not only the fixing becomes insufficient, but also the material cost and the installation cost are required,
In addition, there is an inconvenience that the installation work takes time and labor.

The present invention has been made in view of such inconvenience, and provides a semiconductor device mounting structure capable of reliably preventing damage to input terminal leads while realizing low cost. Is what you do.

[0007]

A semiconductor device mounting structure according to the present invention comprises a circuit board and a liquid crystal display which are spaced apart from each other, and a film carrier device which is placed over these. The input terminal lead of this film carrier device is soldered to the connection electrode of the circuit board, while the output terminal lead is connected to the connection electrode of the liquid crystal display. The film carrier device has a structure in which a film carrier device side soldering terminal portion is provided at an input terminal lead at a predetermined position in contact with both side surfaces of a circuit board side portion of a film base material constituting the film carrier device. In addition to the above, the circuit board has a solder terminal portion on the film carrier device side. Has established a circuit board side soldering terminal portion in position to respond, and, these film carrier device side and the circuit board side soldering terminal portions connected soldering, device-side soldered terminal portion, the film base
Notch penetrating along the thickness direction of the material side of the circuit board
And is exposed inside this notch.
It is characterized by the following.

[0008]

[0009]

According to the above construction, the device-side and the board-side soldering terminals are connected to each other by soldering. Therefore, the film carrier device provided with the circuit board-side portion of the film base material has the input-side terminal lead. In addition, each of the device-side soldering terminal portions is firmly connected to the circuit board via each of them. Therefore, the external stress applied to the semiconductor device acts not only on the input-side terminal leads but also on the device-side soldering terminals, and the external stress is received by these device-side soldering terminals. As a result, external stress acting on the input-side terminal leads is greatly reduced. Also, if the device-side soldering terminals are exposed in the cutouts of the film base, soldering work should be performed after directly applying a soldering iron to these device-side soldering terminals. Becomes possible.

[0010]

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

[0012] a plan view showing a mounting structure of a semiconductor device according to a first embodiment of the first embodiment Figure 1 the present invention, FIG 2 is a side view showing a mounting structure of a semiconductor device according to a first embodiment, FIG. 3 4 and FIG. 4 are plan views showing first and second modifications, and FIG. 5 is a side view showing a third modification. Since the mounting structure of the semiconductor device according to this embodiment is not basically different from that of the conventional example, FIGS.
The same reference numerals are given to parts and portions that are identical to each other.

As shown in FIGS. 1 and 2, the semiconductor device according to the present embodiment has a circuit board 1 and an LCD 2 which are arranged in parallel and are separated from each other in a plane, and are mounted over these. And an input terminal lead 3a formed on the film substrate 4 of the film carrier device 3. The outer lead side of the input terminal lead 3a is formed on the circuit board 1. Of the output terminal lead 3b is connected to the LCD 2
The connection electrodes 2a are connected using an anisotropic conductive adhesive 6. An LSI chip component 5 sealed with an exterior resin is mounted on the film substrate 4, and the electrodes of the LSI chip component 5 have inner leads of input and output terminal leads 3 a and 3 b, respectively. Connected to the side. In FIG. 1, the connection electrodes 1a and 2a and the output-side terminal lead 3b are not shown, and the reference numeral 7 in FIG. 2 indicates a solder connecting the connection electrode 1a and the input-side terminal lead 3a. . Further, the connection of the output-side terminal lead 3b to the connection electrode 2a is not limited to the bonding by the anisotropic conductive adhesive 6, but may be soldering or the like.

Further, at this time, the device-side soldering terminals 10 are provided separately from the input-side terminal leads 3a at predetermined positions on both sides of the circuit board-side portion of the film substrate 4 constituting the film carrier device 3. These newly provided device-side soldering terminals 10 have a predetermined area and are formed simultaneously with the input-side and output-side terminal leads 3a, 3b. That is, the film substrate 4 is made of a rigid material such as an epoxy resin containing glass fiber or a polyimide resin, while the input and output terminal leads 3a and 3b are connected to the device side. Each of the soldering terminal portions 10 is formed by performing an etching process on a copper foil applied so as to entirely cover one surface of the film substrate 4, and these device-side soldering terminal portions are formed. No new process for providing 10 is required at all.

Further, board-side soldering terminal portions 11 are provided separately from the connection electrodes 1a at predetermined positions of the circuit board 1 corresponding to the device-side soldering terminal portions 10, respectively. Each of the device-side soldering terminal portions 10 is connected to each of the terminal portions 11 by soldering. Note that these board-side soldering terminal portions 11 are also formed simultaneously by etching of the copper foil at the time of forming the conductor pattern of the circuit board 1. Reference numerals 12 in FIGS. The solder connecting the soldering terminal portions 10 and 11 is shown. At this time, the work of soldering the device-side and board-side solder terminal portions 10 and 11 is performed simultaneously with the work of soldering the input terminal lead 3a to the connection electrode 1a.

That is, in this embodiment, the input-side terminal leads 3a of the film carrier device 3 are connected by soldering to the connection electrodes 1a of the circuit board 1, and the device-side soldering terminals 10 are connected to the board-side soldering terminals. Part 11
The mounting structure soldered to is adopted,
The circuit board side portion of the film substrate 4 in the film carrier device 3 is firmly connected to the circuit board 1 via the input side terminal leads 3a and the device side soldering terminals 10. Therefore, external stress applied to the semiconductor device employing this mounting structure acts not only on the input-side terminal lead 3a but also on the device-side soldering terminal portion 10. As a result of receiving external stress by the side soldering terminal section 10, the input side terminal lead 3a
The external stress acting on is greatly reduced.

By the way, as in a first modification shown in FIG. 3, a device side is provided for each side edge of the circuit board side portion of the film substrate 4 which is closer to the output side than the mounting position of the LSI chip component 5. Even if the soldering terminal portion 10 is provided, or as in the second modified example shown in FIG. 4, the outer lead side of the input side terminal lead 3a to be soldered to the connection electrode 1a and the LSI chip Device-side soldering terminal portions 10 may be provided at both end portions of the film substrate 4 located between the component 5. If the arrangement position of the device-side soldering terminal section 10 in these cases is separated from the mounting area A (the area indicated by the phantom line in FIGS. 3 and 4) of the LSI chip component 5, external stress may occur. The advantage is obtained that the influence can be prevented from affecting the LSI chip component 5 and the inner lead sides of the input and output terminal leads 3a and 3b.

Further, from the viewpoint of the configuration of the electronic equipment, as shown in a third modification shown in FIG. 5, the circuit board 1 and the LCD 2 are arranged at positions vertically separated from each other, and It is necessary to mount the film carrier device 3 so as to straddle between the circuit board 1 and the LCD 2 in a state where the output terminal lead 3b provided on the opening 4a formed by punching the punch 4 is bent and deformed. In some cases, if the device-side soldering terminal 10 is provided at a position closer to the output side than the LSI chip component 5 and corresponding to the end of the circuit board 1, the film base 4 attempts to return to the flat state. The generated repulsive force can be received by the device-side soldering terminal section 10 connected to the circuit board 1 by soldering. As a result, external stress due to the repulsive force is reduced by the input-side terminal lead. It would be prevented from reaching against a. The various terminals and electrodes described above are all plated with tin. If the output side terminal leads 3b are not sufficiently reliable in a bare state, they may be replaced with a polyimide resin or the like. From both sides with a thin plate made of

Second Embodiment FIG. 6 is a plan view showing a semiconductor device mounting structure according to a second embodiment of the present invention, and FIG. 7 is a side view showing a semiconductor device mounting structure according to the second embodiment. FIG. 8 is a plan view showing a fourth modification. FIG. 6 relating to this embodiment.
FIGS. 1 and 2 related to the first embodiment in FIGS.
The same reference numerals are given to the same parts and portions as those described above, and the detailed description is omitted here.

As shown in FIGS. 6 and 7, the semiconductor device according to the present embodiment includes a circuit board 1 and an LCD 2 which are spaced apart from each other, and a film carrier device 3 mounted thereon. The input terminal lead 3a of the film carrier device 3 is connected to the connection electrode 1a of the circuit board 1 by soldering, while the output terminal lead 3b is connected to the connection electrode 2a of the LCD 2. . The device-side soldering terminal portion 10 having the same predetermined area as the first embodiment is provided at each of the predetermined positions of both side ends of the film substrate 4 constituting the film carrier device 3 on the circuit board side. Lead 3a
These device-side soldering terminal portions 10 are provided so as to cover the side surface of the circuit board of the notch portion 13 penetrating along the thickness direction of the film substrate 4. It is exposed inside.

On the other hand, board-side soldering terminals 11 are provided separately from the connection electrodes 1a at predetermined positions of the circuit board 1 corresponding to the device-side soldering terminals 10, respectively. The device-side soldering terminals 10 are connected to the respective terminals 11 by soldering. In this case, since each of the device-side soldering terminals 10 is exposed in the notch 13 of the film base 4, a soldering iron is directly applied to these device-side soldering terminals 10. As a result, it is possible to realize a soldering operation that requires only a short time after setting the soldering temperature low. In addition, since the solder 12 connecting the device-side and board-side soldering terminal portions 10 and 11 wraps around and adheres to the device-side soldering terminal portion 10, there is an advantage that the soldering strength is improved. can get.

In the first and second embodiments described above, the device-side soldering terminal 10 is provided at the side end of the film base 4 constituting the film carrier device 3. The disposition positions of these device-side soldering terminal portions 10 are not limited to the side end portions of the film substrate 4, for example, as in a fourth modification shown in FIG. May be provided at a predetermined inner position in the portion of the film substrate 4 on the circuit board side. In FIG. 8, the device-side soldering terminal 10 is exposed by providing the notch 13 in the film base 4. However, the device-side soldering terminal 10 is not provided without the notch 13. Of course, it can be left unexposed.

Third Embodiment FIG. 9 is a plan view showing a mounting structure of a semiconductor device according to a third embodiment of the present invention, and FIG. 10 is a side view showing a mounting procedure of the semiconductor device. 9 and FIG. 10, the same parts as those in FIG. 1 and FIG.
The same reference numerals are given to the portions, and the detailed description is omitted here.

In the portion of the film substrate 4 constituting the film carrier device 3 of the semiconductor device according to this embodiment on the circuit board side, a cutout portion of the film substrate 4 is formed as in the case shown in FIGS. A device-side soldering terminal portion 10 formed so as to cover 13 is provided separately from the input-side terminal lead 3a, and the device-side soldering terminal portion 10 exposed in each cutout portion 13 has a thickness direction. A through hole 14 is provided along the hole. These through-holes 14 are connected to the input and output terminal leads 3a, 3b.
And the device-side soldering terminal portion 10 are simultaneously formed by copper foil etching. Although the shape of the through hole 14 in FIG. 9 in plan view is circular, the shape is not limited to a circle, and a through hole having a rectangular shape or the like in plan view is formed by selecting a resist mask at the time of etching. It is also possible.

A board-side soldering terminal section 11 is provided separately from the connection electrode 1a at each predetermined position of the circuit board 1 corresponding to the device-side soldering terminal section 10. Each of the device-side soldering terminal portions 10 is connected to each of the devices 11 by soldering. In the soldering operation at this time, since the through-holes 14 are formed in the device-side soldering terminal sections 10, the positioning with respect to the board-side soldering terminal sections 11 using the through-holes 14 is performed. Not only can be performed with high accuracy, but also it is easy to confirm the state of adhesion of the solder 12 after soldering by using the through hole 14. It is needless to say that in performing the alignment, it is necessary to provide an alignment mark on the board-side soldering terminal portion 11 in advance.

Furthermore, according to such a mounting structure, the solder 12 connected between the device-side and board-side soldering terminal portions 10 and 11 passes through the through-hole 14 and then on the device-side soldering terminal portion 10. As a result, the soldering strength can be improved. And
At this time, as shown in FIG.
1, a pin terminal 15 having a predetermined length may be protruded on the circuit board 1. In this case, the positioning of the film carrier device 3 mounted from the upper side of the circuit board 1 can be performed by the device-side soldering terminal portion 10. This is also achieved by the through hole 14 and the pin terminal 15. Reference numeral 20 in FIG. 10 is a work base plate.

Fourth Embodiment FIG. 11 is a plan view showing a mounting structure of a semiconductor device according to a fourth embodiment of the present invention, and FIG. 12 is an enlarged sectional view showing a main part thereof. Note that the overall configuration of the semiconductor device according to the fourth embodiment is not fundamentally different from those of the first to third embodiments. Therefore, in FIGS. 11 and 12, parts and portions which are the same as those in FIGS. Are denoted by the same reference numerals, and a detailed description thereof will be omitted.

As shown in FIG. 10, a pin terminal 15 having a predetermined length faces upward on the board-side soldering terminal 11 provided on the circuit board 1 constituting the semiconductor device according to the present embodiment. It is protruded as a state. And
Film substrate 4 constituting film carrier device 3
The notch 13 of the film substrate 4
Are provided separately from the input terminal leads 3a. The device-side solder terminals 10 exposed in the cutouts 13 are provided separately from the input-side terminal leads 3a. A cut piece 16 that expands and deforms as the pin terminal 15 is inserted, that is, a cut piece 16 composed of a plurality of cut pieces separated from each other via a radial slit is formed. The slits forming the cutouts 16 can be formed by copper foil etching, or can be formed by using a press machine or the like.

Then, as shown in FIG. 10, when the film carrier device 3 is placed from the upper side of the circuit board 1, the pin terminals 15 provided on the board-side soldering terminal portion 11 become As a result, the pin terminal 15 that has come into contact with the soldering terminal portion 10 penetrates into the cutout portion 16 of the device-side soldering terminal portion 10. As a result, each of the cut pieces expands and deforms so as to open upward in accordance with the insertion of the pin terminal 15, and holds the pin terminal 15 that has been inserted while pressing it in the diametric direction. That is, when the mounting structure according to the present embodiment is employed, the film carrier device 3 can be positioned with respect to the circuit board 1 by inserting the pin terminals 15 through the cutout portions 16.

Further, in this case, since the cut pieces are expanded upward and deformed as the pin terminals 15 are inserted, as shown in FIG. 12, the device in which the cut piece portions 16 are formed is formed. As a result of the increased range of the solder 12 between the side soldering terminal portion 10 and the board side soldering terminal portion 11, there is also obtained an advantage that the soldering strength is improved.

[0031]

As described above, in the mounting structure of the semiconductor device according to the present invention, the device-side soldering terminal portion is connected to the input-side terminal lead on the circuit board-side portion of the film substrate constituting the film carrier device. Separately, and a board-side soldering terminal portion is provided at each predetermined position of the circuit board corresponding to the device-side soldering terminal portion, and these device-side and board-side soldering terminal portions are connected by soldering. Therefore, the film carrier device is firmly connected to the circuit board via each of the input-side terminal lead and the device-side soldering terminal. Therefore, the external stress applied to the semiconductor device is also received by the device-side soldering terminal portion, and as a result, the external stress acting on the input-side terminal lead is greatly reduced.
These input terminal leads do not break or be damaged by the action of the external stress, and the input terminal leads can be reliably prevented from being damaged.

According to the present invention, since it is not necessary to perform the fixing using a double-sided adhesive tape or the like as in the conventional example, it is not necessary to attach the double-sided adhesive tape which requires labor and time, thereby reducing the cost. It becomes easy to achieve the conversion. Further, in the present invention, the soldering operation is facilitated by exposing the device-side soldering terminal portion in the cutout portion of the film substrate, and a through hole is formed in the device-side soldering terminal portion. By doing so, it is possible to obtain an effect that the alignment and positioning can be facilitated and the soldering connection can be reliably performed.

[Brief description of the drawings]

FIG. 1 is a plan view showing a mounting structure of a semiconductor device according to a first embodiment.

FIG. 2 is a side view showing a mounting structure of the semiconductor device according to the first embodiment.

FIG. 3 is a plan view showing a mounting structure of a semiconductor device according to a first modification.

FIG. 4 is a plan view showing a mounting structure of a semiconductor device according to a second modification.

FIG. 5 is a side view showing a mounting structure of a semiconductor device according to a third modification.

FIG. 6 is a plan view showing a mounting structure of a semiconductor device according to a second embodiment.

FIG. 7 is a side view showing a mounting structure of a semiconductor device according to a second embodiment.

FIG. 8 is a plan view showing a mounting structure of a semiconductor device according to a fourth modification.

FIG. 9 is a plan view showing a mounting structure of a semiconductor device according to a third embodiment.

FIG. 10 is a side view showing a procedure for mounting a semiconductor device according to a third embodiment.

FIG. 11 is a plan view showing a mounting structure of a semiconductor device according to a fourth embodiment.

FIG. 12 is an enlarged sectional view showing a main part of a mounting structure of a semiconductor device according to a fourth embodiment.

FIG. 13 is a plan view showing a mounting structure of a semiconductor device according to a conventional example.

FIG. 14 is a side view showing a mounting structure of a semiconductor device according to a conventional example.

FIG. 15 is a side view showing a mounting structure of a semiconductor device according to a modification.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circuit board 1a Connection electrode 2 LCD 3 Film carrier device 3a Input side terminal lead 4 Film base material 10 Device side soldering terminal part 11 Board side soldering terminal part 12 Solder

Claims (1)

(57) [Claims] 1. A liquid crystal display comprising: a circuit board and a liquid crystal display which are spaced apart from each other; and a film carrier device mounted on the circuit board and the liquid crystal display. A mounting structure of a semiconductor device in which an output terminal lead is connected to a connection electrode of a liquid crystal display while being soldered to the connection electrode. A film carrier device-side soldering terminal portion is provided separately from an input terminal lead at a predetermined position in contact with both side surfaces of a circuit board side portion of a film base constituting a device. A circuit board-side soldering terminal is provided at a predetermined position corresponding to the device-side soldering terminal. And, these film carrier device side and the circuit board side soldering terminal portions connected soldering, device-side soldered terminal portion, the thickness direction of the film substrate
Provided to cover the side of the circuit board of the notch that penetrates along
And a semiconductor device mounting structure which is exposed in the notch .