KR20000038523A - Tape carrier package and manufacture thereof - Google Patents

Abstract

PURPOSE: A tape carrier package is provided to prevent a disconnection of leads at bending points thereof. CONSTITUTION: A tape carrier package(TCP)(100) is used, for example, to connect a liquid crystal display(LCD) panel(300) with a printed circuit board(PCB)(360) driving the LCD panel(300). The TCP(100) includes a flexible base film(110) on which output leads(130) and input leads(135) are formed. A driving IC(150) is inserted into an opening of the flexible base film(110) and then bonded to the output and input leads(130,135). The output leads(130) connect the driving IC(150) and the LCD panel(300), and the input leads(135) connect the driving IC(150) and the PCB(360). A solder resist layer(140) is partially formed on the flexible base film(110), defining two bending points(120). The output leads(130) exposed through the bending points(120) are coated with polyimide solder resist layer(125) having lower hardness than the solder resist layer(140). Since the base film(110) has no conventional slit at the bending points(120) and supports the output leads(130), a disconnection of the leads(130) is effectively prevented.

Description

Tape carrier package and its manufacturing method

The present invention relates to a tape carrier package, and more particularly, to a tape carrier package in which the strength of the leads is increased by modifying the bending portion of the tape carrier package connecting the LCD panel and the printed circuit board. Moreover, it is related with the manufacturing method of a tape carrier package.

In a typical LCD panel, a gate printed circuit board for driving gate lines and a source printed circuit board for driving data lines are installed at predetermined intervals from short and long sides of neighboring LCD panels, and are provided in a tape carrier package (hereinafter referred to as a tape carrier package). Is electrically connected to the gate and data lines of the LCD panel.

As such, the gate and source printed circuit board electrically connected to the LCD panel by TCP is located on the same plane as the LCD panel, and when the LCD module is manufactured in this state, the size of the LCD module is unnecessarily large compared to the screen display area. Therefore, the flexible TCP is bent twice so that the printed circuit board is located at the rear of the LCD module, thereby reducing the area of the LCD module.

Here, when bending the TCP to place the printed circuit board on the back of the LCD module, a lot of stress is concentrated on the bent portion, causing cracks in the leads. In order to prevent this, US Patent No. 5,153,705 forms a bend by forming a slit (slit) in the portion where the TCP is bent.

In order to form the TCP 1 having the slit, between the portion of the flexible base film 10 bonded to the LCD panel (not shown) and the portion on which the drive drive IC 50 is mounted, as shown in FIG. 1. Punch two slots using a punch.

Then, the leads, that is, the input and output leads 30 and 35 and the solder resist film 45 are sequentially formed on one surface of the base film 10 in which the slot is formed, and then the base film 10 is formed in the slot-formed portion. The bending portion 20 is formed by applying a polyimide solder resist 25 having more flexibility. As described above, when the bending part 20 is formed, since the TCP 1 is easily bent by a force applied from the outside, the stress concentrated on the bent portion is reduced.

When the bending part 20 is formed, the driving drive IC 50 is mounted in a predetermined region of the base film 10 so that the input / output leads 30 and 35 and the input / output pins (not shown) are connected.

However, if the base film is removed and the slit is formed in the TCP to easily bend the TCP, the mechanical strength of the bending portion against bending becomes weak. Therefore, the output leads passing through the bending portion are easily disconnected due to external mechanical stress and the environment. Defect occurs.

This is because the polyimide solder resist resin surrounding the bending part is more vulnerable to mechanical stress than the base film, so that the function of reinforcing the lead is weak.

In addition, if the position of the slot is formed in the base film according to the specification of the product is different from each other by the size and type of TCP, there is a problem in that the hassle and manufacturing cost to manufacture a punching mold for each size and type is increased.

Accordingly, an object of the present invention is to provide a bending part without forming a slot in the base film in order to prevent the lead open occurs in the bent portion of the TCP by devising in view of the above problems.

Another object of the present invention is to reduce the hassle of manufacturing a punching mold according to the size and type of TCP and reducing the manufacturing cost of TCP by easily adjusting the position of the bending part corresponding to the type and size of the TCP without using a punching mold. have.

Other objects of the present invention will become more apparent from the following detailed description and the accompanying drawings.

1 is a cross-sectional view showing the structure of a conventional tape carrier package.

2 is a plan view showing the structure of a tape carrier package according to the present invention;

3 is a cross-sectional view taken along line II of FIG. 2,

4A to 4E are views for explaining a manufacturing process of the tape carrier package according to the present invention.

5 is a cross-sectional view of the LCD panel and the printed circuit board by using the tape carrier package of the present invention.

In order to achieve the above object, the present invention forms a plurality of leads electrically connected to the drive drive IC on a second surface of the base film opposite to the first surface, and one end and the other end of the base film of the second surface. A first insulating film is applied between the predetermined region and one end portion of the base film and the driving drive IC except for a portion where the base film is bent, and a second insulating layer having a lower hardness than the first insulating film in the portion where the base film is bent. Is applied to form a bending part.

Hereinafter, the structure of the TCP according to the present invention will be described with reference to FIGS. 2 to 4.

As shown in FIG. 5, the TCP 100 according to the present invention is provided with an LCD panel 300 displaying information as an example and a predetermined interval from short and long sides of neighboring LCD panels 300. It is used to electrically connect the printed circuit board 360 that drives 300.

Referring to FIGS. 2 and 3, the structure of the TCP 100 will be described in detail. In the widthwise side edges of the flexible base film 110, the base film 110 is placed on a work table in order to manufacture the TCP 100. A plurality of fixing holes 112 are formed, and a driving drive IC 150 having a plurality of input / output pins (not shown) is mounted on a predetermined portion of the base film 110.

In addition, a plurality of leads 130 and 135 are formed in a line along the width direction of the base film 110 on the other surface of the base film 110. In FIG. The leads 130 are arranged, and the input leads 135 are arranged on the right side based on the driving drive IC 150.

Here, one end of the output leads 130 is electrically connected to the output pins of the drive drive IC 150 and the other end is bonded to the gate and data input pads (not shown) formed in the LCD panel 300, One end of the input leads 135 is electrically connected to the input pins of the driving drive IC 150, and the other end thereof is bonded to the output pads formed on the printed circuit board 360.

Meanwhile, two bending parts 120 for easily bending the TCP 100 between the one end portion of the base film 110 bonded to the LCD panel 300 and the driving drive IC 150 are provided in the base film 110. It is formed along the width direction, and each of the bending parts 120 is formed spaced apart from each other by a predetermined interval.

In addition, the entire area of the base film 110 except for a predetermined region at one end connected to the LCD panel 300, a predetermined region at the other end bonded to the printed circuit board 360, and a predetermined portion at which the bending parts 120 are formed. The solder resist film 140 is apply | coated to this.

Here, one side end and the other end of the base film 110 is a part electrically connected to the LCD panel 300 and the printed circuit board 360, and does not apply the solder resist film 140 of an insulating material, and the bending parts ( The reason why the solder resist film 140 is not applied to the portion where the 120 is formed is to prevent stress from being concentrated and the output leads 130 are disconnected.

Meanwhile, in order to protect the output leads 130 exposed to the outside of the solder resist film 140 and easily bend the TCP 110 at the portion where the bending portions 120 are formed, the insulating portion is formed on the portion where the bending portions 120 are formed. A polyimide solder resist film 125 is applied.

As described above, the bending parts 120 may be formed of a poly-polyurethane having a lower hardness than the solder resist film 140 in a portion where the solder resist film 140 is not applied to the portion where the TCP 100 is to be bent and the solder resist film 140 is not applied. It is formed by applying the mid solder resist film 125.

The manufacturing method of TCP by this invention is demonstrated with reference to FIG.

First, a plurality of transfer holes 112 are formed at both edges of the base film 110 by using a punching facility (not shown), and a through hole 152 is formed in a portion where the drive drive IC 150 is to be mounted. .

Thereafter, as illustrated in FIG. 4A, the adhesive 115 is applied to the other surface of the base film 110, that is, the surface facing the LCD panel 300 and the printed circuit board 360.

Subsequently, as shown in FIG. 4B, a metal film, for example, a copper film 130a is attached to the upper surface of the adhesive 115, and then the copper film 130a is photo-etched to enter the other surface of the base film 110. Form output leads 130 and 135.

Subsequently, as shown in FIG. 4C, predetermined regions of one end portion and the other end portion of the base film 110, portions where the base film 110 is bent and portions where the through holes 152 are formed are closed. In the remaining area, the opened first mask 200 is placed on the upper surfaces of the input / output leads 130 and 135.

When the first mask 200 is removed from the base film 110 after applying the solder resist 140a, which is an insulating resin, on the upper surface of the first mask 200, the opening of the first mask 200 corresponds to the opening portion. The solder resist film 140 is formed in the region to be formed, and the solder resist film 140 is not coated in the region corresponding to the closed portion. The output leads 130 are exposed to the outside in the portion where the solder resist film 140 is not applied. Here, the first mask 200 is formed of a nonwoven fabric.

When the solder resist film 140 is applied to the upper surfaces of the input and output leads 130 and 135 as described above, as shown in FIG. 4D, a portion corresponding to the portion where the base film 110 is bent is opened and the remaining portion is opened. The region places the closed second mask 250 on the upper surface of the solder resist film 140.

Thereafter, when the polyimide solder resist 125a, which is an insulating resin, is applied on the upper surface of the second mask 250, and then the second mask 250 is removed, the polyimide solder resist film 125 is formed only at a portion corresponding to the opening portion. It is applied to form a bending portion 120 of the TCP.

Here, when the polyimide solder resist resin 125a is cured, one having a hardness lower than the hardness of the solder resist film 140 should be selected and used. This is to bend the TCP 100 by using the difference between the hardness of the polyimide solder resist film 125 and the hardness of the solder resist film 140. When a force is applied to the TCP 100, the polyimide solder having a low hardness is used. This is to allow the resist film 125, that is, the bending part 120 to bend first.

If the hardness of the solder resist film 140 and the polyimide solder resist 125 are the same as each other, the TCP 100 is not bent or an unwanted portion is bent, and the polyimide is greater than the hardness of the solder resist film 140. When the hardness of the solder resist film 125 is high, the boundary portion of the bending portion 120 having a lower hardness than the bending portions 120 is bent.

Meanwhile, when the bending parts 120 are formed by applying the polyimide solder resist film 125, the input / output leads 130 and 135 exposed to the outside of the solder resist film 140 are plated with tin.

Subsequently, as shown in FIG. 4E, the driving drive IC 150 is accommodated in the through hole 152 formed in the predetermined region of the base film 110, and the output pins of the driving drive IC 150 are output leads ( 130, and input pins of the driving drive IC 150 are connected to one end of the input leads 135.

Thereafter, the periphery of the driving drive IC 150 is filled with the molding compound 155.

Here, reference numeral 105 is a cutting line for removing the outer edges of the transfer hole 112 and the base film 110 after manufacturing the TCP (110), 132 is a gate and data input formed on the LCD panel 300 It is an alignment mark for aligning the pads and the output leads 130.

Referring to the process of connecting the LCD panel and the printed circuit board using the TCP configured as described above are as follows.

An anisotropic conductive film (ACF) (not shown) is attached to the input pads formed on the adjacent short and long sides of the LCD panel 300. Thereafter, the alignment marks 132 formed on the output leads 130 are used to align the output leads 130 of the TCP 1 and the gate and data input pads of the LCD panel 300 to each other, and to generate heat and pressure. In addition, one end of the TCP 100 having the output leads 130 is bonded to the LCD panel 300.

Subsequently, the output pads (not shown) formed on the printed circuit board 360 and the input leads 135 of the TCP 100 are aligned with each other, and then the other end of the TCP on which the input leads 135 are formed by soldering is printed. Bonding to the circuit board 360. Here, when the pitch of the output pads formed on the printed circuit board 360 is fine, an anisotropic conductive film may be used.

As such, when the LCD panel 300 and the printed circuit board 360 are electrically connected by the TCP 100, the LCD assembly 300 assembles a backlight assembly 330 that irradiates and guides light to the rear of the LCD panel 300.

Then, as shown in FIG. 5, the printed circuit board 360 is positioned on the bottom surface of the backlight assembly 330 by bending the TCP 100 twice to reduce the area of the LCD module.

Here, when the force to bend the bending portion 120 to the TCP (100), the bending portion 120 adjacent to the LCD panel 300 is bent at the boundary between the upper surface and the side of the backlight assembly 330 The bending part 120 adjacent to the driving drive IC 150 is bent at the boundary between the side and the bottom surface of the backlight assembly 330 so that the printed circuit board 360 is connected to the bottom surface of the backlight assembly 330. Will be located.

The reason why the bending parts 120 are bent even when the slits are not formed in the base film 110 as in the related art is that the poly formed in the bending parts 120 is greater than the hardness of the solder resist film 140 formed around the bending parts 120. Since the hardness of the mid solder resist film 125 is low, when a force is applied from the outside, the polyimide solder resist film 125, that is, the bending part 120, which is relatively lower than the solder resist film 140 is bent first. Lose.

As described above, in the present invention, when the bending part is formed by using the difference in hardness between the solder resist film and the polyimide solder resist film without forming a slot in the base film, the base film covering one surface of the bending part is located at the bending part. It acts as a reinforcement to support the leads.

Therefore, the mechanical stress applied to the output leads can be reduced to prevent the output leads from being disconnected, thereby improving the reliability of the product.

In addition, since the bending part can be formed using a mask only, a punching mold for forming the bending part is not required, and thus the trouble of manufacturing the punching mold according to the size and type of TCP is eliminated, and the manufacturing cost of TCP is reduced. There is a deterioration effect.

In addition, in the present invention, TCP is not used to connect the LCD panel and the printed circuit board described above, but may be used anywhere in the electrical appliance connecting one member and the other member.

Claims (5)

A flexible base film having a first surface and a second surface opposite the first surface; A drive drive IC mounted at a predetermined position on the first surface and having a plurality of input / output pins; A plurality of leads formed on the second surface and having one end electrically connected to the input / output pins of the driving drive IC; A first insulating film applied to the remaining portion of the second surface except for a portion in which the base film is bent between one end and the other predetermined region of the base film and one end of the base film and the driving drive IC; And a bending part formed by applying a second insulating film having a lower hardness than the first insulating film to a portion where the base film is bent. The tape carrier package according to claim 1, wherein the first insulating film is a solder resist film and the second insulating film is a polyimide solder resist film. Coating a conductive film on the second surface of the base film and then photographing the conductive film to form leads; Applying a first insulating film on a second surface of the base film on which the leads are formed to expose a predetermined region of one end portion and the other end portion of the base film, a portion to which the base film is to be bent, and a portion to which the drive drive IC is to be mounted; Steps; Forming a bending part by applying a second insulating film having a lower hardness than the first insulating film to a portion where the base film is to be bent; And mounting the drive drive IC to be connected to one end of the leads in a predetermined area of the first surface of the base film. The method of claim 3, wherein in the forming of the solder resist film, a portion corresponding to a predetermined region of one end portion and the other end portion of the base film, the portion to which the bending portion and the driving drive IC are to be mounted is closed and the remaining portion is opened. A method of manufacturing a tape carrier package, comprising using a first mask. The method of claim 3, wherein the forming of the bending part comprises using a second mask in which a portion corresponding to a portion where the second insulating film is to be formed is opened and the remaining portion is closed.