JP6110628B2 - Lighting apparatus and method of manufacturing the lighting apparatus - Google Patents

Description

  The present invention relates to a lighting apparatus using a light emitting diode (hereinafter referred to as LED).

  2. Description of the Related Art Conventionally, lighting fixtures that use LEDs that can easily save power as a light source are known instead of fluorescent lamps (see, for example, Patent Document 1). A lighting fixture using LEDs includes a plurality of LEDs and a substrate on which the plurality of LEDs are mounted. In a straight tube type lighting fixture, the substrate tends to be long, and the cost of manufacturing a long substrate may be a problem. For this reason, a configuration in which a plurality of relatively short substrates are arranged may be employed. In this case, it is necessary to electrically connect adjacent substrates. For example, when two long rectangular substrates are conductively connected, a land is provided at an end in the longitudinal direction of each substrate, and the lands of each substrate are connected by a lead wire. The step of connecting the lead wire to the land is performed by, for example, manual soldering.

  A specific process of the soldering operation is performed, for example, by connecting one end of the lead wire to the land of one substrate and then connecting the other end of the lead wire to the land of the other substrate. The lead wire may change direction or move even with a small force. In order to prevent this, it is desirable to hold the lead wire by hand so that the lead wire does not move when the end of the lead wire is first connected to the land. However, if the soldering operation is continued, heat from the soldering iron is transmitted and the lead wire is heated. For this reason, there is a problem that it is difficult to hold the lead wire by hand until the soldering operation is completed. Further, when the lead wire is pressed using a tool such as tweezers, it is necessary to change the substrate when moving the substrate, which may cause a reduction in work efficiency.

  One method for avoiding such a problem is to temporarily fix one end of the lead wire to one substrate and then solder the other end of the lead wire to the other substrate. For the part that has been temporarily fixed, the final fixing is performed later. Specifically, the temporary fixing is a soldering operation performed in a relatively short time such that the lead wire does not become so hot. This fastening is a soldering operation performed over time so that the electrical connection between the lead wire and the land is sufficient. By temporarily fixing, one end of the lead wire is fixed to one side of the substrate. In this state, it is not necessary to support the lead wire in particular, and the other end of the lead wire can be applied to the land using a soldering iron. However, since the soldering operation is insufficient in the temporarily fixed state, the electrical connection state between the conductor and the land is insufficient.

  According to the above method, it is necessary to perform re-soldering and permanent fixing to the temporarily fixed land. This is because if the electrical connection between the lead wire and the land is left unsatisfactory, the lead wire and the land may be separated from each other with time and the product may malfunction. However, it is difficult to visually determine whether the lead wire and the land are only temporarily fixed or whether they are permanently fixed, and the lead wire and the land may be left in a state where they are temporarily fixed. obtain. Furthermore, even if it is only temporarily fixed, it is difficult to detect a defect even if it is inspected by energization before shipment because it is electrically connected.

  Further, even when temporary fixing as described above is not performed, it is possible that the connection state between the lead wire and the land becomes insufficient. If the lighting fixture is used in a state where the connection between the lead wire and the land is insufficient, the vicinity of the connection portion may generate heat or spark may occur. There is a need for measures to prevent this situation.

JP 2004-335426 A

  The present invention has been conceived under the circumstances described above, and it is a main object of the present invention to provide a luminaire and a method of manufacturing the luminaire that are less likely to cause poor connection.

  The lighting fixture provided by the first aspect of the present invention includes a first light emitting element, a second light emitting element aligned with the first light emitting element along a first direction, and the first light emitting element. A first substrate comprising: a first wiring pattern electrically connected to the first wiring pattern; a first main land electrically connected to the first wiring pattern; and a first sub-land electrically separated from the first wiring pattern. A second substrate comprising a second wiring pattern electrically connected to the second light emitting element, a second main land electrically connected to the second wiring pattern, the first main land, And a connection wiring for connecting to the second main land.

  According to such a configuration, when the first substrate and the second substrate are connected, temporary fixing can be performed using the first sub-brand. For example, when installing the connection wiring, the connection wiring is temporarily connected to the first substrate by soldering (temporarily fixing) one end of the connection wiring to the first sub-brand in a short time. be able to. In this temporary connection state, for example, the other end of the connection wiring is moved to the second main land using a soldering iron, and the soldering operation can be performed as it is. The first sub-land is provided separately from the first main land, and it is possible to easily determine whether or not it is in the temporary connection state by looking at the connection destination of the connection wiring. Furthermore, even if it is sent to the next manufacturing process in a temporarily connected state, the first sub-brand is electrically separated from the first wiring pattern and can be detected by an energization inspection. For this reason, it becomes difficult to produce the lighting fixture of the said structure leaving it in the state only temporarily fixed in the case of an assembly. Therefore, the lighting fixture based on this invention is equipped with the structure which a connection failure does not produce easily.

  Preferably, the first main land and the first sub-land are provided closer to the second substrate than the first light emitting element in the first direction, and the second The main land is provided in a position closer to the first substrate than the second light emitting element in the first direction.

  Preferably, the first substrate includes a main surface on which the first main land and the first sub-land are provided, and the first light emitting element is disposed on the main surface.

  Preferably, the first sub-land is formed smaller than the first main land.

  Preferably, the first main land and the connection wiring are connected by solder.

  Preferably, the first substrate is provided in a position closer to the second substrate than the first light emitting element in the first direction, and is electrically connected to the first wiring pattern. The second main substrate is provided in a position closer to the first substrate than the second light emitting element in the first direction, and the second substrate is provided with the second main substrate. An additional second main land that is electrically connected to the wiring pattern, and further includes an additional connection wiring that connects the additional first main land and the additional second main land, The first subland is provided at a position closer to the first main land than the additional first main land.

  Preferably, the first substrate is provided in a position closer to the second substrate than the first light emitting element in the first direction, and is electrically separated from the first wiring pattern. The additional first sub-land is provided at a position closer to the additional first main land than the first main land.

  Preferably, the first substrate is located on the opposite side of the first main land in the first direction with the first light emitting element interposed therebetween, and the first wiring pattern A third main land that is electrically connected; and the second substrate is electrically separated from the second main wiring pattern and the fourth main land that is electrically connected to the second wiring pattern. And the fourth main land and the second subland are arranged in the first direction with respect to the second main land with the second light emitting element interposed therebetween. Located on the opposite side.

  Preferably, the first substrate is formed in a long rectangular shape extending in the first direction, and is provided on the first substrate, and a plurality of additional substrates arranged along the first direction. A first light emitting element is provided, and the plurality of additional first light emitting elements are electrically connected to the first wiring pattern.

Preferably, the second substrate is formed in a long rectangular shape extending in the first direction, and is provided on the second substrate, and a plurality of additional substrates arranged along the first direction. A second light emitting element is provided, and the plurality of additional second light emitting elements are electrically connected to the second wiring pattern.

  The manufacturing method of the lighting fixture provided by the second aspect of the present invention includes a first wiring pattern electrically connected to the first light emitting element, a first main land electrically connected to the first wiring pattern, and A first substrate having a first sub-land electrically separated from the first wiring pattern, a second wiring pattern conductively connected to a second light emitting element, and the second wiring A connection step of connecting a second substrate having a second main land that is electrically connected to the pattern via a connection wiring, the connection step comprising: connecting the first sub-land and the connection wiring; A temporary fixing step of connecting, a step of connecting the connection wiring and the second main land, and a main fixing step of connecting the connection wiring and the first main land. Features.

  A lighting fixture provided by the third aspect of the present invention includes a first light emitting element, a second light emitting element, a first light emitting element that supports the first light emitting element and is electrically connected to the first light emitting element. A first substrate having a second land, a second substrate having a second land that supports the second light emitting element and is electrically connected to the second light emitting element, the first land, and the second land. A connection wiring for electrically connecting to the second land, the connection wiring being soldered to the first land and the second land soldered to the first land. 2 is provided, and the direction in which the first joint extends is different from the direction in which the second joint extends.

  Preferably, the first substrate is formed in a long rectangular shape, and a direction in which the first joint extends extends as the distance from the first light emitting element in the longitudinal direction of the first substrate increases. The substrate is inclined with respect to the longitudinal direction of the first substrate so as to move away from the first light emitting element in the short direction of the substrate.

  Preferably, the second substrate is formed in a long rectangular shape, and a direction in which the second bonding portion extends is increased as the distance from the second light emitting element in the longitudinal direction of the second substrate increases. The substrate is inclined with respect to the longitudinal direction of the second substrate so as to move away from the second light emitting element in the short direction of the substrate.

  Preferably, the first land is formed in a long rectangular shape extending in a direction in which the first joint extends, and the second land is a long rectangle extending in a direction in which the second joint extends. It is formed into a shape.

  Preferably, the first substrate includes an additional first land that is located on the opposite side of the first land in the lateral direction of the first substrate and is electrically connected to the first light emitting element. The second substrate includes an additional second land that is located on the opposite side of the second land in the lateral direction of the second substrate and is electrically connected to the second light emitting element. And further comprising an additional connection wiring for electrically connecting the additional first land and the additional second land, wherein the additional connection wiring is soldered to the additional first land. And an additional second joint that is soldered to the additional second land, the direction in which the additional first joint extends extends in the first direction. As moving away from the first light emitting element in the longitudinal direction of one substrate The direction in which the additional second bonding portion extends is inclined with respect to the longitudinal direction of the first substrate so as to move away from the first light emitting element in the short direction of the first substrate. In the longitudinal direction of the second substrate, the distance from the second light emitting element in the short direction of the second substrate increases with distance from the second light emitting element in the longitudinal direction of the second substrate. It is inclined with respect to it.

  Preferably, the additional first land is formed in a long rectangular shape extending in a direction in which the additional first joint extends, and the additional second land is the additional second joint. It is formed in a long rectangular shape that extends long in the direction in which the portion extends.

  The lighting fixture provided by the 4th side surface of this invention is a wiring which has a light emitting element, the base material which supports the said light emitting element, the path | route part which conducts with the said light emitting element, and the connection part connected to the said path part. A pattern, an opening that exposes the connection portion, and a protective layer that covers the path portion; and a connection wiring connected to the connection portion; and the wiring pattern includes the base material A first layer provided on the first layer; and a second layer provided on the first layer and made of a material different from the first layer, and the path portion includes the first layer. And the connecting portion includes the first layer and the second layer.

  Preferably, the connection portion includes a strip-shaped portion connected to the path portion, and a wide portion connected to the strip-shaped portion and formed wider than the strip-shaped portion, and the strip-shaped portion is In the direction in which the connection wiring extends, the connection wiring extends away from the connection wiring, and the connection wiring is connected to the wide portion.

  Preferably, a notch is formed in the belt-like portion.

  Preferably, the first layer is made of copper, and the second layer is formed of solder.

  The lighting fixture provided by the 5th side surface of this invention is a wiring which has a light emitting element, the base material which supports the said light emitting element, the path | route part which conducts with the said light emitting element, and the connection part connected to the said path part. A pattern, an opening that exposes the connection part, and a protective layer that covers the path part, and a connection wiring that is connected to the connection part, and covers the protection layer and includes the protection An additional protective layer made of a material different from that of the layer is provided, and the additional protective layer overlaps the path portion.

  Preferably, the protective layer is a solder resist, and the additional protective layer is made of a silicone resin.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

It is a figure which shows the lighting fixture based on 1st Embodiment of this invention. It is a top view which shows a part of lighting fixture shown in FIG. It is an enlarged plan view for demonstrating in detail the principal part of the lighting fixture shown in FIG. It is sectional drawing which follows the IV-IV line of FIG. It is sectional drawing which follows the VV line of FIG. It is a figure for demonstrating the manufacturing method of the lighting fixture shown in FIG. It is a figure which shows the state which temporarily fixed one end of the connection wiring. It is a figure which shows the state which fixed the other end of the connection wiring. It is a figure which shows the state which removed the temporary fix | stop of the end of connection wiring. It is a figure which shows the state which fixed one end of the connection wiring. It is a figure for demonstrating the lighting fixture based on 2nd Embodiment of this invention. It is an enlarged plan view for demonstrating in detail the principal part of the lighting fixture shown in FIG. It is a figure for demonstrating an example of the manufacturing method of the lighting fixture shown in FIG. It is a figure for demonstrating the process following the process shown in FIG. It is a figure for demonstrating the lighting fixture based on 3rd Embodiment of this invention. It is a principal part enlarged plan view of the lighting fixture shown in FIG. It is sectional drawing which follows the XVII-XVII line of FIG. It is a figure for demonstrating the lighting fixture based on 4th Embodiment of this invention. It is a figure for demonstrating the lighting fixture based on 5th Embodiment of this invention. It is a figure for demonstrating the lighting fixture based on 6th Embodiment of this invention. It is a figure for demonstrating the lighting fixture based on 7th Embodiment of this invention. It is a figure for demonstrating the lighting fixture based on 8th Embodiment of this invention. It is a figure for demonstrating the lighting fixture based on 9th Embodiment of this invention. It is a figure for demonstrating the lighting fixture based on 10th Embodiment of this invention. It is sectional drawing which follows the XXV-XXV line | wire of FIG.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1-5 has shown the lighting fixture based on 1st Embodiment of this invention. The lighting fixture 101 of this embodiment is fixed to the ceiling W1 and used to illuminate the room. Below, let the longitudinal direction of the lighting fixture 101 be an x direction, and let the direction orthogonal to this x direction be a y and z direction. The z direction coincides with the direction from the ceiling W1 toward the floor surface. In the example shown in FIG. 1, a power supply device P1 connected to a commercial power supply, a socket S1 connected to the power supply device P1, and a socket S2 spaced from the socket S1 in the x direction are provided on the ceiling W1. The lighting fixture 101 is fixed to the ceiling W1 by fitting the right end in FIG. 1 in the x direction into the socket S1 and the left end in FIG. 1 into the socket S2.

  As shown in FIG. 1, the luminaire 101 includes a diffusion cover 1 formed in a cylindrical shape extending in the x direction so as to have an appearance similar to a straight tube fluorescent lamp, and along the x direction. And a plurality of light emitting units 2 arranged. The diffusion cover 1 covers a plurality of light emitting units 2. Furthermore, the luminaire 101 includes a plurality of substrates 3, a heat dissipation member 4 in contact with these substrates 3, a plurality of connection wires 5, end caps 61 and 62, and caps 71 and 72. As shown in FIG. 1, the end cap 61 and the base 71 are located on the right side in the figure in the x direction, and the end cap 62 and the base 72 are located on the left side in the figure in the x direction.

  The diffusion cover 1 is made of, for example, a transparent polycarbonate resin to which a diffusion material such as mercury chloride is added. Such a diffusion cover 1 transmits the light from the light emitting unit 2 while diffusing it. 2 to 5, the diffusion cover 1 is omitted for simplification.

  As shown in FIG. 4, each light emitting unit 2 includes an LED chip 21 and a translucent resin 22 that covers the LED chip 21. In addition, the translucent resin 22 is abbreviate | omitted in FIGS. 1-3 for simplification. The translucent resin 22 is obtained by adding a fluorescent material to an epoxy resin, for example. This fluorescent material is excited by the light from the LED chip 21 and emits light. The color of the light emitted from the light emitting unit 2 is a combination of the light emitted from the LED chip 21 and the light emitted from the fluorescent material in the translucent resin 22. For example, when the LED chip 21 emits blue light and the fluorescent material receives blue light and emits yellow light, the color of the light emitted from the light emitting unit 2 is white light.

  The LED chip 21 is, for example, a two-wire type, and is connected to the substrate 3 via a wire (not shown). The translucent resin 22 is formed to protect the wire together with the LED chip 21. The LED chip 21 may be a one-wire type or a flip chip type. Moreover, you may mount what was modularized instead of the structure which installs the LED chip 21 in the board | substrate 3 directly.

  Each substrate 3 is formed in a long rectangular shape extending in the x direction. In other words, the longitudinal direction of each substrate 3 coincides with the x direction, and the short direction coincides with the y direction. As shown in FIG. 2, the plurality of substrates 3 are arranged in a line along the x direction. Adjacent substrates 3 are electrically connected by connection wiring 5. Each light emitting unit 2 is supported by one of a plurality of substrates 3. In this embodiment, each board | substrate 3 is formed so that it may have the same structure, and the number of the light emission parts 2 which each board | substrate 3 supports is constant. Each board 3 includes a pair of main lands 31 and 32 and a pair of sub-brands 33 and 34 for connecting to the right-side board 3 at the right end in FIG. 2 in the x direction. . Each substrate 3 includes a pair of main lands 35 and 36 for connection to the left adjacent substrate 3 at the left end in FIG. 2 in the x direction. Further, as shown in FIG. 4, each substrate 3 includes a ceramic base material 310, a metal wiring pattern 320 provided on the base material 310, and a protective layer 330 that protects the wiring pattern 320. Yes.

  In the present embodiment, the base material 310 is made of ceramic, but an epoxy resin may be used as the base material 310. The wiring pattern 320 is made of, for example, copper. The protective layer 330 is, for example, a solder resist made of a thermosetting epoxy resin. In the protective layer 330, an opening 340 for exposing the main lands 31, 32, 35, and 36 and an opening 350 for exposing the sub-brands 33 and 34 are formed (see FIG. 5).

  In order to give a more specific explanation, FIG. 3 shows an enlarged view of the vicinity of a connection portion between two adjacent substrates 3. Hereinafter, among the substrates 3 shown in FIG. 3, the one located on the left side in the drawing is referred to as a first substrate 3A, and the one located on the right side in the drawing is referred to as a second substrate 3B. Although all the substrates 3 of this embodiment have the same configuration, for convenience of explanation, each component of the first substrate 3A is denoted by reference symbol A, and each component of the second substrate 3B is denoted by reference symbol. B is used for distinction. In FIG. 3, the translucent resin 22 and the heat radiating member 4 of each light emitting unit 2 are omitted.

  On the first substrate 3A, a plurality of LED chips 21A1 and LED chips 21A2 are arranged along the x direction. The LED chip 21A2 is installed at the right end of the first substrate 3A. The plurality of LED chips 21A1 are all installed on the left side in the drawing with respect to the LED chip 21A2. The LED chip 21A1 corresponds to the first light emitting element in the claims of the present invention.

  A plurality of LED chips 21B1 and LED chips 21B2 are arranged along the x direction on the second substrate 3B. The LED chip 21B2 is installed at the left end of the second substrate 3B. The plurality of LED chips 21B1 are all installed on the right side in the drawing with respect to the LED chip 21B2. The LED chip 21B1 corresponds to the second light emitting element in the claims of the present invention.

  As shown in FIG. 3, the plurality of LED chips 21A1, LED chip 21A2, the plurality of LED chips 21B1, and the LED chip 21B2 are arranged in a line along the x direction. Further, the plurality of LED chips 21A1, the LED chip 21A2, the plurality of LED chips 21B1, and the LED chip 21B2 are arranged at a constant pitch. In order to realize such an arrangement, the LED chip 21A2 is installed to the left of about half of the pitch from the right end of the first substrate 3A, and the LED chip 21B2 is about half of the pitch from the left end of the second substrate 3B. It is installed on the right side.

  The first substrate 3A includes a first wiring pattern 320A, a first main land 31A, an additional first main land 32A, a first sub-land 33A, and an additional first sub-land 34A. It has. Although omitted in FIG. 3, as shown in FIG. 5, a light emitting section 2A1 is provided on the first substrate 3A. The light emitting unit 2A1 includes an LED chip 21A1 and a translucent resin 22A1.

  The first wiring pattern 320A is electrically connected to the plurality of LED chips 21A1 and LED chip 21A2. The first main land 31A and the additional first main land 32A are electrically connected to the first wiring pattern 320A. On the other hand, the first sub-brand 33A and the additional first sub-brand 34A are electrically separated from the first wiring pattern 320A. Specifically, the first sub-land 33A and the additional first sub-land 34A are separated from the first wiring pattern 320A, the first main land 31A, and the additional first main land 32A by the protective layer 330. It has been.

  As shown in FIG. 3, the first main land 31A, the additional first main land 32A, the first sub-land 33A, and the additional first sub-land 34A are from the LED chip 21A1 in the x direction. Is also provided at a position close to the second substrate 3B. More specifically, the first main land 31A, the additional first main land 32A, the first sub-land 33A, and the additional first sub-land 34A are located on the left side of the LED chip 21A2 in the drawing. It is located in the right side in the figure rather than LED chip 21A1 located in rightmost. Note that such a positional relationship is merely an example, and the first main land 31A and the like may be positioned on the right side of the LED chip 21A2 in the drawing, and conversely, on the left side of a part of the LED chip 21A1. May be located.

  In the present embodiment, the first main land 31A is formed in a long rectangular shape extending long in the x direction. The first sub-land 33A is formed in a long rectangular shape smaller than the first main land 31A. Specifically, the first sub-land 33A has a smaller width in the y direction and a shorter length in the x direction than the first main land 31A.

  The additional first main land 32A is formed in a long rectangular shape similar to the first main land 31A. The additional first sub-brand 34A is formed in a long rectangular shape smaller than the additional first main land 32A. Specifically, the additional first sub-brand 34A is formed in a long rectangular shape similar to the first sub-brand 33A.

  The first main land 31A and the additional first main land 32A are disposed so as to be opposite to each other with the plurality of LED chips 21A1 interposed therebetween in the y direction. Specifically, the first main land 31A is provided at a position near the upper end in FIG. 3 in the y direction on the first substrate 3A, and the additional first main land 32A is near the lower end in FIG. In the position.

  As shown in FIG. 3, the first sub-land 33A is provided at a position closer to the first main land 31A than to the additional first main land 32A. Further, the additional first sub-brand 34A is provided at a position closer to the additional first main land 32A than to the first main land 31A. Specifically, the first sub-brand 33A is located above the plurality of LED chips 21A1 in the y direction in the y direction and below the first main land 31A in the figure. The additional first sub-brand 34A is located below the plurality of LED chips 21A1 in the y direction in the figure and is located above the additional first main land 32A in the figure. Further, the right end of the first sub-land 33A and the additional first sub-land 34A in the y direction in the figure is substantially the same as the right end of the first main land 31A and the additional first main land 32A in the y direction of the figure. In the same position.

  The second substrate 3B includes a second wiring pattern 320B, a second main land 35B, and an additional second main land 36B. Although the names are different for convenience, the second board 3B has the same configuration as the first board 3A, and the main lands 31 and 32 and the sub-brands 33 and 34 are arranged at the ends not shown in FIG. It has. Further, the first substrate 3A is also provided with main lands 35 and 36 at the end which is not shown in FIG.

  The second wiring pattern 320B is electrically connected to the plurality of LED chips 21B1 and LED chip 21B2. The second main land 35B and the additional second main land 36B are electrically connected to the second wiring pattern 320B.

  As shown in FIG. 3, the second main land 35B and the additional second main land 36B are provided at a position closer to the first substrate 3A than the LED chip 21B1 in the x direction. More specifically, the second main land 35B and the additional second main land 36B are located on the right side of the LED chip 21B2 in the drawing and in the drawing than the LED chip 21B1 located on the leftmost side. Located on the left. Note that such a positional relationship is merely an example, and the second main land 35B or the like may be located on the left side of the LED chip 21B2 in the drawing, and conversely, on the right side of a part of the LED chip 21B1. May be located.

  In the present embodiment, the second main land 35B is formed in a long rectangular shape extending long in the x direction. The additional second main land 36B is formed in a long rectangular shape similar to the second main land 35B. The second main land 35B and the additional second main land 36B are approximately the same size as the first main land 31A.

  The second main land 35B and the additional second main land 36B are disposed so as to be opposite to each other with the plurality of LED chips 21B1 interposed therebetween in the y direction. Specifically, the second main land 35B is arranged so as to be substantially the same position as the first main land 31A in the y direction, and the additional second main land 36B is the additional first main land 35B. Arranged to be substantially the same position as 32A.

  The first substrate 3 </ b> A and the second substrate 3 </ b> B are connected by two connection wires 5 of the plurality of connection wires 5. Each connection wiring 5 is formed by coating a core wire made of, for example, copper with vinyl chloride. At both ends of the connection wiring 5, the core wire is exposed from the vinyl chloride. Hereinafter, one of the two connection wirings 5 will be described as a connection wiring 51, and the other will be described as a connection wiring 52.

  The connection wiring 51 connects the first main land 31A and the second main land 35B. The left end of the connection wiring 51 in FIG. 3 is connected and fixed to the first main land 31A by a joining member 53 made of solder. As shown in FIG. 5, the connection wiring 51 is in direct contact with the first main land 31A, and the bonding member 53 covers a contact portion between the connection wiring 51 and the first main land 31A. The right end of the connection wiring 51 in FIG. 3 is fixed to the second main land 35 </ b> B by the bonding member 53. The configuration of the connection portion between the connection wiring 51 and the second main land 35B is the same as that of the connection portion between the connection wiring 51 and the first main land 31A.

  The connection wiring 52 connects the additional first main land 32A and the additional second main land 36B. The left end of the connection wiring 52 in FIG. 3 is connected and fixed to the additional first main land 32 </ b> A by the joining member 53. As shown in FIG. 5, the connection wiring 52 is in direct contact with the additional first main land 32A, and the joining member 53 covers a contact portion between the connection wiring 52 and the additional first main land 32A. . The right end of the connection wiring 52 in FIG. 3 is fixed to the additional second main land 36 </ b> B by the joining member 53. The configuration of the connection portion between the connection wiring 52 and the additional second main land 36B is the same as the connection portion between the connection wiring 52 and the additional first main land 32A.

  As shown in FIG. 2, the heat dissipation member 4 is formed so as to extend long in the x direction as a whole. As shown in FIG. 4, the heat dissipation member 4 includes a plate-like support portion 41, a side portion 42 that extends downward from the left end of the support portion 41 in the drawing, and a lower portion of the support portion 41 from the right end in the drawing. And a side portion 43 extending to the side. In the present embodiment, the boundary portion between the support portion 41 and the side portion 42 is gently bent. The boundary portion between the support portion 41 and the side portion 43 is also gently bent. A groove 411 is formed in the support portion 41, and each substrate 3 is fitted in the groove 411. The lower end in FIG. 4 of each substrate 3 is in contact with the bottom of the groove 411. Heat generated when the LED chip 21 is lit is quickly transmitted to the heat radiating member 4 through the substrate 3.

  In the present embodiment, the side portion 42 is provided with a convex portion 421 protruding leftward in FIG. 4 in the y direction, and the side portion 43 is provided with a convex portion 431 protruding rightward in FIG. 4 in the y direction. Yes. These convex portions 421 and 431 are provided at the same position in the z direction. These convex portions 421 and 431 can be used, for example, to hold the heat radiating member 4 at a desired position when conducting an electrical current inspection in the manufacturing process of the lighting fixture 101.

  Hereinafter, the manufacturing method of the lighting fixture 101 is demonstrated, referring FIGS.

  When manufacturing the lighting fixture 101, the connection process of connecting the first substrate 3A and the second substrate 3B is performed. The following will describe the connection process for connecting the first substrate 3A and the second substrate 3B, but the same process is performed when connecting the other substrates 3 to each other.

  FIG. 6 shows the first substrate 3A and the second substrate 3B before connection. The connection step between the first substrate 3A and the second substrate 3B includes a temporary fixing step of temporarily fixing one end of the connection wiring 51 to the first sub-brand 33A. FIG. 7 shows a state where the left end of the connection wiring 51 in the drawing is temporarily fixed to the first sub-brand 33A. The temporary fixing process is performed in a shorter working time than the soldering work performed in the subsequent processes. By the temporary fixing step, the temporary joining member 54 that connects the first sub-brand 33A and the left end of the connection wiring 51 in FIG. 7 is formed. By this step, the left end of the connection wiring 51 in FIG. 7 is fixed to the first substrate 3A, and even if an unintended force is applied, the connection wiring 51 can be prevented from moving greatly. For this reason, the right end in FIG. 7 of the connection wiring 51 can be smoothly moved to the position of the second main land 35B using, for example, a soldering iron.

  The connection step between the first substrate 3A and the second substrate 3B includes a step of connecting the second main land 35B and the connection wiring 51. This step is performed after the temporary fixing step. FIG. 8 shows a state in which the right end of the connection wiring 51 in the drawing is connected to the second main land 35B. As shown in FIG. 8, the right end of the connection wiring 51 in the drawing is electrically connected to the second main land 35 </ b> B by a bonding member 53 and is physically fixed. Specifically, the step of connecting the second main land 35B and the connection wiring 51 is performed by a soldering operation, and the joining member 53 is made of a solidified solder. In this soldering operation, a larger amount of solder is used than in the previous temporary fixing process. For this reason, the joining member 53 is formed larger than the temporary joining member 54.

  The connection step between the first substrate 3A and the second substrate 3B includes a step of releasing the temporary fixing. This step is performed after the step of connecting the second main land 35B and the connection wiring 51 is performed. FIG. 9 shows a state in which the temporary fixing is released and the left end of the connection wiring 51 is moved to a position overlapping the first main land 31A. In the step of releasing the temporary fixing, the temporary joining member 54 is removed, and the left end in FIG. 9 of the connection wiring 51 is pulled away from the first sub-brand 33A. The temporary joining member 54 can be removed by, for example, physically applying pressure or heating with a soldering iron. Since the temporary fixing process is performed using a small amount of solder in a short time, it is easy to remove the temporary bonding member 54.

  After releasing the temporary fixing, the operation of moving the left end in FIG. 9 of the connection wiring 51 to the position overlapping the first main land 31A is, for example, pulling the left end in FIG. 9 of the connection wiring 51 using a soldering iron. Can be done. Since the right end of the connection wiring 51 in FIG. 9 is fixed to the second main land 35B, this operation can be easily performed.

  The connection step between the first substrate 3A and the second substrate 3B includes a main fastening step for connecting the first main land 31A and the connection wiring 51. This final fixing step is performed after the step of releasing the temporary fixing and further moving the left end of the connection wiring 51 in FIG. 9 to the first main land 31A. FIG. 10 shows a state after performing the main stopping process. This final fastening step is performed by soldering the left end of the connection wiring 51 in FIG. 10 and the first main land 31A. The soldering operation in the final fastening step is performed in the same manner as the soldering operation in the step of connecting the second main land 35B and the connection wiring 51.

  Thereafter, one end of the connection wiring 52 (see FIG. 3) is temporarily fixed to the additional first sub-land 34A, and then the connection wiring 52 is connected to the additional second main land 36B and the additional first main land 32A. Solder. Since these operations can be performed by repeating the procedure described above, description thereof is omitted.

  Hereinafter, the effect | action of the manufacturing method of the lighting fixture 101 and the lighting fixture 101 is demonstrated.

  The luminaire 101 includes sub-lands 33 and 34 used in the manufacturing process in addition to the main lands 31, 32, 35 and 36 used for actual connection. In the manufacturing method described above, one end of the connection wiring 51 is temporarily fixed to the first sub-land 33A, so that the other end of the connection wiring 51 can be easily soldered to the second main land 35B. Not only the first sub-brand 33A but other sub-brands 33 and 34 are also used for temporary fixing. Since the lighting fixture 101 is provided with the sub-brands 33 and 34 for temporary fixing, it is possible to easily confirm whether or not the lighting fixture 101 is only temporarily fixed in the manufacturing process. That is, if one end of the connection wiring 5 is connected to the sub-brand 33 or the sub-brand 34, it can be easily determined that it is in a temporarily fixed state, and the temporarily fixed one is sent to the next step. Mistakes are less likely to occur.

  In the present embodiment, the first sub-land 33A and the additional first sub-land 34A are formed smaller than the first main land 31A and the additional first main land 32A. This is also true for other sub-brands 33 and 34. Since the sub-land 33, 34 is formed smaller than the main lands 31, 32, it is easy to distinguish the sub-land 33, 34 from the main lands 31, 32. This is advantageous when it is quickly determined visually whether or not the temporarily fixed state.

  Further, since the sub-brands 33 and 34 are not electrically connected to the wiring pattern 320, the electrical connection between the substrates 3 is not completed only by temporarily fixing. For this reason, even if it is overlooked that it is in the temporarily fixed state, it is possible to detect that it is left in the temporarily fixed state when conducting the energization inspection.

  As mentioned above, according to the structure of the lighting fixture 101, possibility that temporary fixing will be left in a manufacturing process can be made small. This leads to a reduction in the possibility of poor connection in the shipped lighting fixtures 101.

  11 to 25 show another embodiment of the present invention. In these drawings, the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.

  11 and 12 show a luminaire according to a second embodiment of the present invention. The basic configuration of the lighting fixture 102 shown in FIGS. 11 and 12 is the same as that of the lighting fixture 101, but the method of connecting adjacent substrates 3 is different from that of the lighting fixture 101. Hereinafter, a method for connecting adjacent substrates 3 of the lighting fixture 102 will be described.

  In the lighting fixture 101, the sub-brands 33 and 34 used for temporary fixing are provided on the substrate 3, but the sub-brands 33 and 34 are not provided on the substrate 3 of the present embodiment. Further, the substrate 3 of this embodiment includes lands 37a, 37b, 38a, and 38b instead of the main lands 31, 32, 35, and 36 in the substrate 3 of the lighting fixture 101. As shown in FIG. 11, the land 37 a and the land 37 b are located near the right end of each substrate 3 in the drawing, and the land 38 a and the land 38 b are located near the left end of each substrate 3 in the drawing. The land 37a and the land 37b are located on the opposite sides of the LED chip 21 in the y direction. The land 38a and the land 38b are located on opposite sides of the LED chip 21 in the y direction. In FIG. 11, the land 37 a and the land 38 a are located above each LED chip 21, and the land 37 b and the land 38 b are located below each LED chip 21.

  As shown in FIG. 11, the connection wiring 5 of this embodiment differs in the shape of planar view from the case of the lighting fixture 101. FIG. Although the connection wiring 5 in the lighting fixture 101 is formed in a straight line shape along the x direction, the connection wiring 5 of the present embodiment is bent in the middle.

  FIG. 12 shows the first substrate 3A and the second substrate 3B adjacent to each other. As in the case of the lighting fixture 101, a plurality of LED chips 21A1 and LED chips 21A2 are arranged along the x direction on the first substrate 3A. A plurality of LED chips 21B1 and LED chips 21B2 are arranged along the x direction on the second substrate 3B. As in the case of the lighting fixture 101, the first substrate 3A has a wiring pattern that is electrically connected to the plurality of LED chips 21A1 and the LED chips 21A2. This wiring pattern is electrically connected to the lands 37a, 37b, 38a, 38b of the first substrate 3A. The second substrate 3B has a wiring pattern that is electrically connected to the plurality of LED chips 21B1 and LED chip 21B2, and this wiring pattern is electrically connected to the lands 37a, 37b, 38a, and 38b of the second substrate 3B. ing. Although distinguished for convenience, the first substrate 3A and the second substrate 3B have the same configuration.

  In FIG. 12, lands 37a and lands 37b of the first substrate 3A appear, and lands 38a and lands 38b of the second substrate 3B appear. In the present embodiment, the land 37a and the land 37b are located on the left side in FIG. 12 with respect to the LED chip 21A2 in the x direction, and on the right side in FIG. 12 with respect to the LED chip 21A1 located on the rightmost side. . Note that such a positional relationship is merely an example, and the land 37a and the land 37b may be located on the right side of the LED chip 21A2 in the drawing, and conversely, located on the left side of a part of the LED chip 21A1. May be.

  The land 38a and the land 38b are located on the right side in FIG. 12 with respect to the LED chip 21B2 in the x direction and on the left side in FIG. 12 with respect to the leftmost LED chip 21B1. Such a positional relationship is merely an example, and the land 38a and the land 38b may be located on the left side of the LED chip 21B2 in the drawing, and conversely, located on the right side of a part of the LED chip 21B1. May be.

  As shown in FIG. 12, the land 37 a and the land 38 a are connected by a connection wiring 51 that is one of the plurality of connection wirings 5. The land 37 b and the land 38 b are connected by a connection wiring 52 that is one of the plurality of connection wirings 5.

  As shown in FIG. 12, the connection wiring 51 is joined to the land 37a of the first substrate 3A via the joining member 53, and to the land 38a of the second substrate 3B. 2nd junction part 512 joined via 53 is comprised. Specifically, the first joint portion 511 is soldered to the land 37a, and the second joint portion 512 is soldered to the land 38a.

  The first joint portion 511 extends along the first extending direction X1 shown in FIG. 12, and the second joint portion 512 extends along the second extending direction X2 shown in FIG. The first extending direction X1 and the second extending direction X2 are different from each other, and both are inclined with respect to the x direction. The first extending direction X1 is inclined with respect to the x direction so as to move away from the LED chip 21A1 in the y direction as it moves away from the LED chip 21A1 in the x direction. The second extending direction X2 is inclined with respect to the x direction so as to move away from the LED chip 21B1 in the y direction as it moves away from the LED chip 21B1 in the x direction.

  The land 37a is formed in a long rectangular shape that extends long in the first extending direction X1, and the land 38a is formed in a long rectangular shape that extends long in the second extending direction X2.

  As shown in FIG. 12, the connection wiring 52 is joined to the land 37b of the first substrate 3A via the joining member 53, and to the land 38b of the second substrate 3B. A second joint portion 522 is provided to be joined via 53. Specifically, the first joint portion 521 is soldered to the land 37b, and the second joint portion 522 is soldered to the land 38b.

  The first joint portion 521 extends along the third extending direction X3 shown in FIG. 12, and the second joint portion 522 extends along the fourth extending direction X4 shown in FIG. The third extending direction X3 and the fourth extending direction X4 are different from each other, and both are inclined with respect to the x direction. The third extending direction X3 is inclined with respect to the x direction so as to move away from the LED chip 21A1 in the y direction as it moves away from the LED chip 21A1 in the x direction. In the present embodiment, the third extending direction X3 is different from the first extending direction X1. The fourth extending direction X4 is inclined with respect to the x direction so as to move away from the LED chip 21B1 in the y direction as it moves away from the LED chip 21B1 in the x direction. In the present embodiment, the fourth stretching direction X4 is different from the second stretching direction X2.

  The land 37b is formed in a long rectangular shape extending in the third extending direction X3, and the land 38b is formed in a long rectangular shape extending in the fourth extending direction X4.

  FIG. 13 and FIG. 14 are diagrams for explaining a method of installing the connection wiring 51.

  When installing the connection wiring 51, first, the first end portion 511a of the connection wiring 51 is soldered to the land 37a. FIG. 13 shows a state where the first end portion 511a of the connection wiring 51 is soldered to the land 37a. Since the lands 37a are formed along the first extending direction X1, as shown in FIG. 13, the connection wiring 51 is installed along the first extending direction X1.

  Next, the connection wiring 51 is bent so that the second end portion 512a of the connection wiring 51 not connected to the land 37a extends along the land 38a. At this time, the vinyl chloride covering the core wire of the connection wiring 51 repels the bending force, but the end of the connection wiring 51 is soldered to the land 38a while suppressing the repulsion. Through such a process, the first end portion 511a becomes the first joint portion 511 along the first extending direction X1, and the second end portion 512a becomes the second connecting portion along the second extending direction X2. It becomes the joint portion 512.

  Note that the connection wiring 52 can be installed in the same manner as the connection wiring 51. In addition, when the other connection wiring 5 is installed, a process of bending the connection wiring 5 is performed in the same manner.

  The connection wiring 5 of this embodiment has undergone a bending process during soldering. For this reason, the vinyl chloride covering the core wire of the connection wiring 51 continues to apply a force to the core wire to return to the original shape. This force is applied to the connection portion between the connection wiring 5 and the lands 37a, 37b, 38a, 38b. That is, according to the configuration of the present embodiment, force is continuously applied to the bonding member 53 from the connection wiring 5. If the connection between the second joint portion 512 and the land 38a is not correctly performed and the connection is released even with a small amount of force, the connection wiring 51 has a linear shape as shown in FIG. Attempting to return, the second joint 512 moves away from the land 38a.

  This is effective in preventing the second joint portion 512 and the land 38a from being maintained in an unstable connection state. For example, when the second joint portion 512 and the land 38a are not sufficiently soldered and a minute gap is generated between the core wire of the connection wiring 51 and the land 38a, a discharge is generated between the core wire and the land 38a. It can happen. In order to prevent such a problem, the structure of the lighting fixture 102 is effective.

  In this embodiment, the restoring force of vinyl chloride that covers the core wire of the connection wiring 5 is used, but tension may be applied to the connection wiring 5 more positively. For example, the vinyl chloride coating may be thickened or the core wire may be coated with a more rigid material. Alternatively, an elastic member may be attached to the connection wiring 5.

  FIGS. 15-17 has shown the lighting fixture based on 3rd Embodiment of this invention. The basic configuration of the lighting fixture 103 shown in FIGS. 15 to 17 is the same as that of the lighting fixture 101, but the method of connecting adjacent substrates 3 is different from that of the lighting fixture 101. Hereinafter, a method of connecting adjacent substrates 3 of the lighting fixture 103 will be described.

  The substrate 3 in this embodiment includes a base material 310 that supports the plurality of LED chips 21, a wiring pattern 320, and a protective layer 330. The wiring pattern 320 includes a pair of path portions 360 that are electrically connected to the plurality of LED chips 21, and two pairs of connection portions 370 that are connected to the path portions 360. The pair of path portions 360 are provided on both sides of the plurality of LED chips 21 in the y direction. Each connection portion 370 is connected to one of both ends of the pair of path portions 360 in the x direction. For example, FIG. 15 shows a pair of connecting portions 370 located at the right end of the left substrate 3 in the figure, and shows a pair of connecting portions 370 located at the left end of the right substrate 3 in the figure. ing. The upper connection portion 370 of the left substrate 3 in FIG. 15 is connected to the upper connection portion 370 of the right substrate 3 in FIG. Further, the lower connection portion 370 of the left substrate 3 in FIG. 15 is connected to the lower connection portion 370 of the right substrate 3 in FIG. Connected. The two connection wirings 5 of this embodiment are both formed so as to extend along the x direction. FIG. 16 is an enlarged view of the connection portion 370 located on the lower side of the substrate 3 on the left side in FIG.

  In the present embodiment, the path portion 360 is covered with the protective layer 330. An opening 340 is formed in the protective layer 330. The connection part 370 is located in the opening part 340 and is exposed from the protective layer 330.

  As shown in FIG. 17, the wiring pattern 320 of the present embodiment has a first layer 321 provided on the substrate 310 and a second layer 322 provided on the first layer 321. The second layer 322 is made of a material different from that of the first layer 321. Specifically, the first layer 321 is made of copper, and the second layer 322 is made of solder. The second layer 322 is formed, for example, by printing cream solder on a portion exposed to the outside of the protective layer 330 from the opening 340 of the first layer 321.

  The second layer 322 is provided in a range exposed from the opening 340 in the first layer 321, and the second layer 322 is not provided in the path portion 360 covered with the protective layer 330. That is, the path portion 360 is composed of the first layer 321, and the connection portion 370 is composed of the first layer 321 and the second layer 322.

  As illustrated in FIG. 16, the connection portion 370 includes a strip-shaped portion 371 that is connected to the path portion 360 and a wide portion 372 that is connected to the strip-shaped portion 371. The wide portion 372 is formed in a long rectangular shape that extends long in the x direction. The wide portion 372 is formed to have a size that allows the joining member 53 to fit inside with a margin. The width in the y direction of the wide portion 372 is formed to be larger than the width in the y direction of the band-shaped portion 371. The belt-like portion 371 extends from the left end in FIG. 16 in the x direction of the wide portion 372 to the left in FIG. 16 so as to be away from the connection wiring 5. The width in the y direction of the band-shaped portion 371 is the same as that of the path portion 360.

  The opening 340 of the present embodiment is formed in accordance with the shape of the connection portion 370. That is, the opening 340 has a band-shaped opening 341 that exposes the band-shaped part 371 and a wide-opening part 342 that exposes the wide-width part 372. Note that the shape of the opening 340 can be adjusted as appropriate, and may be formed in, for example, a rectangular shape in plan view extending long in the x direction.

  As shown in FIG. 17, the connection wiring 5 of this embodiment is connected to the wide portion 372 by a joining member 53 made of solder. In addition, although it has shown distinguishing in FIG. 17, since both the joining member 53 and the 2nd layer 322 are solder, it may become a mixed structure.

  Connection between the connection wiring 5 and the connection portion 370 may be performed by manual soldering, and it is difficult to eliminate the possibility of connection failure due to manual operation. For example, it is possible that the portion of the connection wiring 5 covered with vinyl chloride rides on the connection portion 370 and is fixed in a state where the core wire of the connection wiring 5 floats from the connection portion 370. In this case, discharge may occur between the core wire of the connection wiring 5 and the connection portion 370, and the connection portion 370 may become high temperature. Furthermore, the protective layer 330 may be damaged by this heat, and the path portion 360 may be exposed. The path portion 360 is made of copper, and there is a problem that an oxidation reaction is likely to occur at a high temperature.

  In order to solve the above-described problem, it is effective to separate the protective layer 330 from the portion that is likely to generate heat, that is, the contact portion between the connection wiring 5 and the connection portion 370. However, if such a configuration is attempted, the opening 340 of the protective layer 330 becomes large, and the area of the first layer 321 exposed from the opening 340 may become too large. For this reason, in this embodiment, it is set as the structure which covers the part exposed from the opening part 340 of the 1st layer 321 with the 2nd layer 322 made from solder. Since the copper first layer 321 is covered with the solder second layer 322, the first layer 321 is less likely to cause an oxidation reaction.

  In the present embodiment, the connection portion 370 includes a long rectangular wide portion 372 extending long in the x direction, and a strip-like portion 371 extending from the end of the wide portion 372 so as to be away from the connection wiring 5. The path part 360 is connected to the end of the band-like part 371. For example, the path portion 360 is located farther from the connection wiring 5 than in the case where it is directly connected to the wide portion 372 without providing the belt-like portion 371. Since it is the periphery of the connection wiring 5 that is likely to generate heat, a configuration in which the path portion 360 is away from the connection wiring 5 is desirable in order to prevent damage to the portion of the protective layer 330 that covers the path portion 360. .

  If the connection wiring 5 and the path portion 360 are simply moved away from each other, the belt-like portion 371 and the wide portion 372 may be configured to have the same width, that is, the connection portion 370 may be configured to have a long rectangular shape with a constant width. However, when the connection portion 370 has such a shape, when a person performing a soldering operation solders the connection wiring 5 to the connection portion 370, the connection wiring 5 is soldered to a position close to the path portion 360. There is a possibility that. As in the present embodiment, by forming the band-shaped part 371 with a width narrower than that of the wide part 372, it can be expected that the band-shaped part 371 is avoided and soldered to the wide part 372.

  In the above embodiment, there may be a problem that heat is transmitted to the portion of the protective layer 330 that overlaps the path portion 360 through the belt-shaped portion 371. In order to prevent heat from being transmitted through the band-shaped part 371, it is conceivable that a part of the band-shaped part 371 is narrowed so that heat is not easily transmitted to the end of the band-shaped part 371. Hereinafter, what changed the shape of the strip | belt-shaped part 371 is demonstrated, referring FIGS. 18-23 as 4th-9th embodiment.

  In the lighting fixture 104 shown in FIG. 18, a round notch 373 is formed in the belt-like portion 371. The notch 373 is formed in the vicinity of the left end in FIG. 18 in the x direction of the strip 371 so as to be recessed downward in FIG. 18 in the y direction. In the example illustrated in FIG. 18, the protective layer 330 that overlaps the path portion 360 exists on the left side in the x direction of the band-shaped portion 371. For this reason, by providing a notch 373 in the middle of the belt-shaped portion 371 and preventing heat from being transmitted in the x direction through the belt-shaped portion 371, a portion overlapping the path portion 360 of the protective layer 330 is prevented from being heated. Can do.

  In the lighting fixture 105 shown in FIG. 19, a pair of rounded notches 373 and 374 are formed in the belt-like portion 371. The notches 373 and 374 are formed in the vicinity of the left end in FIG. The notch 373 is formed to be recessed downward in FIG. 19 in the y direction, and the notch 374 is formed to be recessed upward in FIG. 19 in the y direction. The portion sandwiched between the cutouts 373 and 374 of the belt-like portion 371 is very narrow, and heat is more difficult to pass through this portion.

  In the lighting device 106 shown in FIG. 20, a wedge-shaped notch 375 is formed in the band-shaped portion 371. The notch 375 has the same effect as the notch 373 in the lighting fixture 104 only in the shape.

  In the lighting fixture 107 shown in FIG. 21, a pair of wedge-shaped notches 375 and 376 are formed in the belt-like portion 371. The notch 376 is provided on the side opposite to the notch 375 in the y direction. In the present embodiment, the notch 375 and the notch 376 are provided at different positions in the x direction. According to such a configuration, a plurality of portions that are difficult for heat to pass through can be prepared.

  In the lighting fixture 108 shown in FIG. 22, a rectangular notch 377 is formed in the belt-like portion 371. This notch 377 has the same effect as the notch 373 in the luminaire 104 only in the shape.

  In the lighting fixture 109 shown in FIG. 23, a pair of rectangular cutouts 377 and 378 are formed in the belt-like portion 371. These notches 377 and 378 have the same effects as the pair of notches 373 and 374 in the lighting fixture 105 only in the shape. Note that the positions of the notches 377 and 378 in the x direction may be shifted like the notches 375 and 376 in the lighting fixture 107.

  Another method for preventing damage to the protective layer 330 will be described as a tenth embodiment with reference to FIGS. 24 and 25. FIG.

  The lighting fixture 110 shown in FIGS. 24 and 25 is different from the lighting fixture 103 in that an additional protective layer 380 that overlaps the wiring pattern 320 is provided. Further, in the lighting fixture 110, a rectangular opening 340 is formed in the protective layer 330, and the rectangular connecting portion 370 is exposed to the outside of the protective layer 330 from the opening 340. The other structure of the lighting fixture 110 is the same as that of the lighting fixture 103.

  The additional protective layer 380 is made of a material different from that of the protective layer 330, and is provided on the protective layer 330 so as to overlap the path portion 360, as shown in FIGS. The protective layer 330 of this embodiment is a solder resist like the protective layer 330 of the lighting fixture 101. The additional protective layer 380 is made of, for example, a silicone resin.

  The additional protective layer 380 serves to prevent a portion of the protective layer 330 overlapping the wiring pattern 320 from being exposed to oxygen. Even if heated, the protective layer 330 can be prevented from being burned by preventing contact with oxygen.

  In the present embodiment, the opening 340 and the connecting portion 370 are rectangular, but a band-shaped opening 341 and a band-shaped portion 371 may be provided as in the case of the lighting fixture 103. Furthermore, you may form a notch in the strip | belt-shaped part 371 like the lighting fixtures 104-109.

  The lighting fixture and the manufacturing method of a lighting fixture based on this invention are not limited to embodiment mentioned above. The specific configuration of the lighting fixture and the specific steps of the manufacturing method of the lighting fixture according to the present invention can be varied in design in various ways.

  For example, in the lighting fixture 101 described above, sub-brands 33 and 34 used for temporary fixing are provided. The lighting fixtures 102 to 110 may be provided with a sub-brand for temporary fixing.

101-110 Lighting fixture 1 Diffusion cover 2 Light emitting part 21 LED chip 21A1 LED chip (first light emitting element)
21A2 LED chip 21B1 LED chip (second light emitting element)
21B2 LED chip 22 Translucent resin 3 Substrate 3A First substrate 3B Second substrate 31, 32, 35, 36 Main land 33, 34 Subland 31A First main land 32A Additional first main land 33A First Sub-land 34A Additional first sub-land 35B Second main land 36B Additional second main land 310 Substrate 320 Wiring pattern 320A First wiring pattern 320B Second wiring pattern 321 First layer 322 Second Layer 330 Protective layer 340 Opening 341 Strip opening 342 Wide opening 350 Opening 360 Path portion 370 Connection portion 371 Strip 372 Wide portion 373 to 378 Notch 380 Additional protective layer 4 Heat radiation member 41 Support portion 411 Groove 42, 43 Side parts 421, 431 Convex part 5 Connection wiring 51 Connection wiring 511 First joint 51 Second joint 52 Connection wiring 521 First joint 522 Second joint 53 Joint member 54 Temporary joint members 61 and 62 End caps 71 and 72 Base S1, S2 Socket P1 Power supply device W1 Ceiling X1 First extension Direction X2 second stretching direction X3 third stretching direction X4 fourth stretching direction

Claims (17)

A first light emitting element;
A second light emitting element aligned with the first light emitting element along a first direction;
A first wiring pattern electrically connected to the first light emitting element, a first main land electrically connected to the first wiring pattern, and a first sub-land electrically separated from the first wiring pattern. A first substrate comprising:
A second substrate comprising a second wiring pattern electrically connected to the second light emitting element, and a second main land electrically connected to the second wiring pattern;
A connection wiring connecting the first main land and the second main land;
A luminaire characterized by comprising: The first main land and the first sub-land are provided in a position closer to the second substrate than the first light emitting element in the first direction,
The lighting apparatus according to claim 1, wherein the second main land is provided at a position closer to the first substrate than the second light emitting element in the first direction. The first substrate includes a main surface on which the first main land and the first sub-land are provided,
The lighting apparatus according to claim 2, wherein the first light emitting element is installed on the main surface.   The lighting apparatus according to claim 3, wherein the first sub-land is formed smaller than the first main land.   The lighting fixture according to claim 2, wherein the first main land and the connection wiring are connected by solder. The first substrate is provided in a position closer to the second substrate than the first light emitting element in the first direction, and the first substrate is electrically connected to the first wiring pattern. It has a main land,
The second substrate is provided in a position closer to the first substrate than the second light emitting element in the first direction, and is electrically connected to the second wiring pattern. It has a main land,
An additional connection wiring for connecting the additional first main land and the additional second main land;
The lighting fixture according to claim 5, wherein the first sub-brand is provided at a position closer to the first main land than the additional first main land. The first substrate is provided at a position closer to the second substrate than the first light emitting element in the first direction, and is electrically separated from the first wiring pattern. It has the first sub-brand,
The lighting apparatus according to claim 6, wherein the additional first sub-brand is provided at a position closer to the additional first main land than the first main land. The first substrate is located on the opposite side of the first main land in the first direction with the first light emitting element interposed therebetween, and is electrically connected to the first wiring pattern. 3 main lands,
The second substrate includes a fourth main land that is electrically connected to the second wiring pattern, and a second sub-land that is electrically separated from the second wiring pattern,
The fourth main land and the second sub-land are located on the opposite side of the second main land in the first direction with the second light emitting element interposed therebetween. The lighting fixture according to any one of claims 2 to 7. The first substrate is formed in a long rectangular shape extending in the first direction,
A plurality of additional first light-emitting elements provided on the first substrate and arranged along the first direction;
The lighting fixture according to claim 8, wherein the plurality of additional first light emitting elements are electrically connected to the first wiring pattern. The second substrate is formed in a long rectangular shape extending in the first direction,
A plurality of additional second light emitting elements provided on the second substrate and arranged along the first direction;
The lighting fixture according to claim 9, wherein the plurality of additional second light emitting elements are electrically connected to the second wiring pattern. A first wiring pattern electrically connected to the first light emitting element; a first main land electrically connected to the first wiring pattern; and a first sub-land electrically separated from the first wiring pattern. A first substrate comprising:
A second wiring pattern electrically connected to the second light emitting element, and a second substrate comprising a second main land electrically connected to the second wiring pattern,
It has a connection process to connect via connection wiring,
The connecting step includes a temporary fixing step of connecting the first sub-brand and the connection wiring, a step of connecting the connection wiring and the second main land, the connection wiring and the first main A method for manufacturing a lighting fixture, comprising: a final fastening step for connecting the land. A first light emitting element;
A second light emitting element;
A first substrate comprising a first land that supports the first light emitting element and is electrically connected to the first light emitting element;
A second substrate comprising a second land that supports the second light emitting element and is electrically connected to the second light emitting element;
A connection wiring for conductively connecting the first land and the second land;
With
The connection wiring includes a first joint portion soldered to the first land and a second joint portion soldered to the second land,
The lighting fixture, wherein a direction in which the first joint extends is different from a direction in which the second joint extends. The first substrate is formed in a long rectangular shape,
The direction in which the first joint extends extends away from the first light emitting element in the lateral direction of the first substrate as it moves away from the first light emitting element in the longitudinal direction of the first substrate. The lighting fixture according to claim 12, wherein the lighting fixture is inclined with respect to a longitudinal direction of the first substrate. The second substrate is formed in a long rectangular shape,
The direction in which the second joint extends extends away from the second light emitting element in the lateral direction of the second substrate as it moves away from the second light emitting element in the longitudinal direction of the second substrate. The lighting fixture according to claim 13, wherein the lighting fixture is inclined with respect to a longitudinal direction of the second substrate. The first land is formed in a long rectangular shape extending long in a direction in which the first joint extends.
The lighting device according to claim 14, wherein the second land is formed in a long rectangular shape extending in a direction in which the second joint portion extends. The first substrate includes an additional first land located on the opposite side of the first land in the lateral direction of the first substrate and electrically connected to the first light emitting element,
The second substrate includes an additional second land that is located on the opposite side of the second land in the lateral direction of the second substrate and is electrically connected to the second light emitting element. ,
An additional connection wiring for electrically connecting the additional first land and the additional second land;
The additional connection wiring includes an additional first joint soldered to the additional first land and an additional second joint soldered to the additional second land. And
The direction in which the additional first joint extends extends away from the first light emitting element in the short direction of the first substrate as it moves away from the first light emitting element in the longitudinal direction of the first substrate. Is inclined with respect to the longitudinal direction of the first substrate,
The direction in which the additional second joint extends extends away from the second light emitting element in the short direction of the second substrate as it moves away from the second light emitting element in the longitudinal direction of the second substrate. The lighting fixture according to claim 15, wherein the lighting fixture is inclined with respect to the longitudinal direction of the second substrate. The additional first land is formed in a long rectangular shape extending long in a direction in which the additional first joint extends.
The lighting device according to claim 16, wherein the additional second land is formed in a long rectangular shape extending in a direction in which the additional second joint extends .

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