CN105636339A - Flexible printed circuit board and mobile terminal - Google Patents
Flexible printed circuit board and mobile terminal Download PDFInfo
- Publication number
- CN105636339A CN105636339A CN201511030112.2A CN201511030112A CN105636339A CN 105636339 A CN105636339 A CN 105636339A CN 201511030112 A CN201511030112 A CN 201511030112A CN 105636339 A CN105636339 A CN 105636339A
- Authority
- CN
- China
- Prior art keywords
- bending
- conductor wire
- copper foil
- foil layer
- flexible pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005452 bending Methods 0.000 claims abstract description 175
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 78
- 239000011889 copper foil Substances 0.000 claims abstract description 78
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000004020 conductor Substances 0.000 claims description 130
- 229920000297 Rayon Polymers 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 239000012528 membrane Substances 0.000 abstract 1
- 238000004804 winding Methods 0.000 abstract 1
- RKUAZJIXKHPFRK-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,4-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC=C1C1=C(Cl)C=C(Cl)C=C1Cl RKUAZJIXKHPFRK-UHFFFAOYSA-N 0.000 description 19
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000001680 brushing effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Conductors (AREA)
Abstract
The invention provides a flexible printed circuit board and a mobile terminal. The flexible printed circuit board comprises a substrate layer, a copper foil layer and a covering membrane. The copper foil layer is arranged on the substrate layer. The copper foil layer comprises two oppositely arranged non-bending parts and a strip-shaped bending part connected between the non-bending parts. Conductive wires are arranged on the non-bending parts. The bending part is of a winding structure. A bending conducive wire is arranged on the bending part and is bent along with the bending part. One end of the bending conductive wire is connected to the conductive wires. The covering layer is laminated on the copper foil layer, and covers the bending part and the non-bending parts. When the overall length of the flexible printed circuit board is not increased, bending flexibility is improved, stress of the bending part is also reduced and flexibility of the bending part of the flexible printed circuit board is improved.
Description
Technical field
The present invention relates to the communications field, particularly relate to a kind of flexible PCB and mobile terminal.
Background technology
The application of current flexible PCB is more and more extensive, thus the flexibility requirements of flexible PCB is more and more stricter, but current many flexible PCBs are for improving flexibility, the overall length increasing flexible PCB, the overall length increasing flexible PCB increases the use space of flexible PCB, increases production cost, and then affects the use of flexible PCB, both can save use space currently without one, the flexible PCB of flex capability can have been improved again.
Summary of the invention
Embodiment of the present invention technical problem to be solved is in that, it is provided that a kind of flexible PCB improving flexibility and mobile terminal.
The present invention provides a kind of flexible PCB, wherein, described flexible PCB includes substrate layer, copper foil layer and coverlay, described copper foil layer is located on described substrate layer, described copper foil layer includes two non-bending parts being oppositely arranged and the bar shaped bending part being connected between two described non-bending parts, described non-bending part is provided with conductor wire, described bending part is in meandering shape, described bending part is provided with bending conductor wire, the length direction of described bending conductor wire is paralleled with the length direction of described bending part, one end of described bending conductor wire is connected on described conductor wire, and adjacent described bending conductor wire completely cuts off mutually, the width of described bending conductor wire is less than the width of described conductor wire, described cover layer is laminated on described copper foil layer, cover described bending part and described non-bending part.
Wherein, described copper foil layer includes the first copper foil layer and the second copper foil layer that are laminated in described substrate layer both sides, described conductor wire is arranged on described first copper foil layer, the non-bending part of described second copper foil layer is provided with the electric-conductor electrically connecting described conductor wire, the number of described bending conductor wire is many, many described bending conductor wires are arranged side by side and are all connected to described conductor wire, multiple described bending conductor wires include being arranged at the first bending conductor wire of described first copper foil layer and being arranged at the second bending conductor wire of described second copper foil layer, one end of described first bending conductor wire is electrically connected to described conductor wire, one end of described second bending conductor wire is electrically connected to described electric-conductor.
Wherein, the number of described first bending conductor wire is many, and the number of described second bending conductor wire is many.
Wherein, described coverlay includes fitting in the first coverlay of described first copper foil layer and fitting in the second coverlay of described second copper foil layer.
Wherein, described flexible PCB also includes flexible support plate, described flexible support plate is provided with two fixed parts being oppositely arranged, and two described non-bending parts are individually fixed in two described fixed parts, the Geometrical Bending axis place vertical described flexible support plate of plane of described bending part.
Wherein, described copper foil layer arranges slotted eye at described bending part, and the length direction of described slotted eye is paralleled with the length direction of described bending conductor wire, and described slotted eye is positioned at described bending conductor wire side.
Wherein, described coverlay is adhered on described copper foil layer by viscose glue.
Wherein, described conductor wire is Copper Foil.
Wherein, the width sum of many described bending conductor wires is equal to the width of described conductor wire.
The present invention also provides for a kind of mobile terminal, wherein, described mobile terminal includes apparatus body, is located at the mainboard within described apparatus body and flexible PCB described in above-mentioned any one, and described flexible PCB is located at inside described apparatus body, and electrically connects with described mainboard.
Flexible PCB provided by the invention by described bending part between two described non-bending parts in meandering shape, and bending conductor wire is set at described bending part, the one end utilizing described bending conductor wire is connected on described conductor wire, thus under not increasing flexible PCB entire length situation, the length making bending part increases, improve bending flexible, also reduce the stress of described bending part simultaneously so that the bending part flexibility of described flexible PCB improves.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of the flexible PCB that the embodiment of the present invention provides;
Fig. 2 is the top view of the flexible PCB of Fig. 1
Fig. 3 is another structural representation of the flexible PCB of Fig. 1.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments. Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.
Refer to Fig. 1, Fig. 2 and Fig. 3, the present invention provides a kind of mobile terminal of embodiment, including apparatus body (not indicating in figure), it is located at the mainboard (not indicating in figure) within described apparatus body and flexible PCB 100, described flexible PCB 100 is located at inside described apparatus body, and electrically connects with described mainboard.
Described mobile terminal can be the intelligent mobile terminals such as mobile phone, computer, flat board, handheld device or media player. In the present embodiment, illustrate for described mobile terminal for mobile phone.
Described flexible PCB 100 includes substrate layer 10, copper foil layer 20 and coverlay 30, described copper foil layer 20 is located on described substrate layer 10, described copper foil layer 20 includes two non-bending parts being oppositely arranged 21 and a bar shaped bending part 22 being connected between two described non-bending parts 21, and described copper foil layer 20 is provided with at least one conductor wire 23 at described non-bending part 21. In meandering shape, described bending part 22 is provided with the many bending conductor wires 24 being arranged side by side to described bending part 22. Many described bending conductor wires 24 are with the bending of described bending part 22, one end of many described bending conductor wires 24 is all connected on described conductor wire 23, and many described bending conductor wires 24 completely cut off mutually, 24 width of described bending conductor wire are less than the width of described conductor wire 23. Described coverlay 30 is laminated on described copper foil layer 20, covers described bending part 22 and described non-bending part 21.
By described bending part 22 between two described non-bendings 21 in meandering shape, and bending conductor wire 24 is set at described bending part 22, the one end utilizing described bending conductor wire 24 is connected on described conductor wire 23, thus under not increasing flexible PCB entire length situation, the length making bending part 22 increases, improve bending flexible, also reduce the stress of described bending part 22 simultaneously so that the bending part 22 of described flexible PCB 100 is flexible to be improved.
In present embodiment, described substrate layer 10 can adopt the material such as polyimides or the double; two stupid diformates (PolyethyleneterephthalatePET) of polyethylene, so that when on described substrate layer 10, described copper foil layer 20 is set, insulation environment can be provided, in order to the etching of described copper foil layer 20. Preferably, the thickness of described substrate layer 10 can be 20 ��m.
In present embodiment, conductor wire 23 on two described non-bending parts 21 realizes the conducting between two electronic elements, utilize multiple described bending conductor wire 24 to be connected between two described conductor wires 23 thus ensure that the electric conductivity of described flexible PCB 100, and improve the described flexible PCB 100 flexibility at described bending part 22 place. Described bending part 22 arranges multiple fold 22a, multiple described fold 22a to carry out arranging as shown in Figure 1 along two described non-bending part 21 relative directions, it is also possible to be carry out stacking as shown in Figure 2 along described copper foil layer 20 with described substrate layer 10 stacked direction. Concrete, described conductor wire 23 and described sub-conductor line 24 are Copper Foil, described conductor wire 23 and described bending conductor wire 24 form according to the etched technique of prescribed route structure, described conductor wire 23 can be linearly extend, can also be along curve extension, described bending conductor wire 24 is with the Geometrical Bending axis bending of described bending part 22, so that the width that described copper foil layer 20 is at described bending part 22 place is minimum as far as possible, thus reducing the described copper foil layer 20 stress at described bending part 21 place, so that the flexible raising of described flexible PCB 100. The number of described conductor wire 23 can be many side by side, can also be single, the width sum of multiple described bending conductor wires 24 is equal to the width of described conductor wire 23, thus the impedance of single described conductor wire 23 is identical with the impedance of many described bending conductor wires 24, thus ensure that the electric conductivity of described flexible PCB 100. In other embodiments, described non-bending part 21 can also is that one, and described bending part 22 arranges conductive interface away from the edge of described non-bending part 21, and many described bending conductor wires 24 are connected on described conductive interface.
In present embodiment, it is hot-forming that described coverlay 30 can adopt polyester material to carry out. Described coverlay 30 passes through paste adhesive on described copper foil layer 20; thus protecting described conductor wire 23 and described bending conductor wire to be not subjected to lose or damage; simultaneously; adopt the mode of paste adhesive; it is also possible that described coverlay 30 is tightr with the connection of described copper foil layer 20, it is prevented that described coverlay 30 shifts and cannot the conductor wire 23 or bending conductor wire 24 that expose described coverlay 30 be protected. In other embodiments, described coverlay 30 can also is that adopting spraying plated film mode to carve is plated on described copper foil layer 20.
Further, described copper foil layer 20 includes the first copper foil layer 20a and the second copper foil layer 20b that are laminated in described substrate layer 10 both sides, described conductor wire 23 is arranged on described first copper foil layer 20a, non-bending part 21 place of described second copper foil layer 20b is provided with the electric-conductor 25 electrically connecting described conductor wire 23, multiple described bending conductor wires 24 include the first bending conductor wire 241 being arranged at described first copper foil layer 20a and the second bending conductor wire 242 being arranged at described second copper foil layer 20b, one end of described first bending conductor wire 241 is electrically connected to described conductor wire 23, one end of described second bending conductor wire 242 is electrically connected to described electric-conductor 25.
In present embodiment, described substrate layer 10 includes the first side 11 and the second side 12 being oppositely arranged. Described first copper foil layer 20a fits on described first side 11, and described second copper foil layer 20b fits on described second side 12. Described conductor wire 23 is arranged at non-bending part 21 place of described first copper foil layer 20a. One end of described conductor wire 23 connects described electric-conductor 25, and the other end is in order to electrically connect electronic element. Described first bending conductor wire 241 and described conductor wire 23 are positioned at the same side of described substrate layer 10. Described first bending conductor wire 241 be electrically connected to both ends of the one end connecting described electric-conductor 25 in two described conductor wires 23. The two ends of described second bending conductor wire 242 are connected to two described electric-conductors 25 away from described conductor wire 23 one end. The described electric-conductor 25 described substrate layer 10 of traverse, namely described first copper foil layer 20a offers the via (sign) running through described substrate layer 10 and described second copper foil layer 20b, described electric-conductor 25 is arranged in described via, and namely described electric-conductor 25 sequentially passes through described first copper foil layer 20a, substrate layer 10 and described second copper foil layer 20b. Described second bending conductor wire is utilized to be arranged on described second copper foil layer 20b, such that it is able to reduce the described flexible PCB 100 width in described flex area 22 further, thus improving the flexibility of described flexible PCB 100 further. In other embodiments, the number of described substrate layer 10 can also is that multiple, and the both sides of each described substrate layer 10 are provided with described copper foil layer 20.
Further, the number of described first bending conductor wire 241 is multiple, and the number of described second bending conductor wire 242 is multiple. Multiple described first bending conductor wires 241 are arranged on described first copper foil layer 20a, and the length direction of described first bending conductor wire 241 is paralleled with the Geometrical Bending axis of described bending part 22. Multiple described second bending conductor wires 242 are arranged on described second copper foil layer 20b, parallel with the Geometrical Bending axis of described bending part 22. So that the width of described second bending conductor wire 242 reduces further, thus improve the flexibility of described flexible PCB 100 further.
Further, described coverlay 30 includes fitting in the first coverlay 30a of described first copper foil layer 20a and fitting in the second coverlay 30b of described second copper foil layer 20b. Described first coverlay 30a covers described non-bending part 21 and described bending part 22; described second coverlay 30b correspondence covers described bending part 21; thus described conductor wire 23 and described first bending conductor wire 241 are protected by described first coverlay 30a; described second bending conductor wire 242 is protected by described second coverlay 30b; thus reducing the consumption of described coverlay 30, thus reducing the production cost of described flexible PCB 100.
Further, described flexible PCB 100 also includes flexible support plate 40. Described flexible support plate 40 is provided with two fixed parts being oppositely arranged 41, and two described non-bending parts 21 are individually fixed in two described fixed parts 41, the vertical described flexible support plate 40 of Geometrical Bending axis place plane of described bending part 22.
In present embodiment, the hardness of described flexible support plate 40 is more than the hardness of described bending part 22, described flexible support plate 40 is provided with the circuit electrically connecting described conductor wire 23, and this circuit can arrange electronic component so that described flexible PCB 100 can meet Rigid Flex demand. Concrete, described fixed part 41 can arrange the first terminal (sign) of electrical connection circuit, described non-bending part 21 can arrange the second terminal being welded in described the first terminal, so that described conductor wire 23 and described bending conductor wire 24 transmit the signal of telecommunication. Described non-bending part 21 is utilized to be fixed on described fixed part 21, and utilize the vertical described flexible support plate 40 of Geometrical Bending axis place plane of described bending part 22, so that the entire length of described flexible PCB 100 can remain unchanged, and improve bending flexibility. In other embodiments, described flexible support plate 40 can also be without arranging circuit, and the flexibility of described flexible support plate 40 is less than the hardness of described bending part 22.
Further, described copper foil layer 20 arranges slotted eye 26 at described bending part 22 place, and the length direction of described slotted eye 26 is paralleled with the length direction of described bending conductor wire 24, and described slotted eye 26 is positioned at described bending conductor wire 24 side. The number of described slotted eye 26 can be multiple, and multiple described slotted eyes 26 are arranged at intervals between multiple described bending conductor wire 24. Described slotted eye 26 runs through described first copper foil layer 20a, substrate layer 10 and described second copper foil layer 20b. By arranging multiple described slotted eye 26 at the bending part 22 of described flexible PCB 100, so that described flexible PCB 100 reduces at the stress of bending part, thus the bending improving described flexible PCB 100 is flexible. In other embodiment, described slotted eye 26 can also is that circular port, and multiple described slotted eyes 26 are at described bending part 22 place array.
Further, described coverlay 30 passes through paste adhesive on described copper foil layer 20. Concrete, described first coverlay 30a is pasted on described first copper foil layer 20a, and described second coverlay 30b is pasted on described second copper foil layer 20b. Adopt aforesaid way so that described coverlay 30 is more easy when being attached at described copper foil layer 20, instead of that brushing that existing employing brushing silver slurry layer on described copper foil layer 20 likely occurs is uneven and that the cause discontinuous problem of signal lead. Simultaneously as adopt in the method for paste so that processing staff is to add man-hour more easy, and operation is also more simple, it is simple to processing staff operates. Additionally, due to coverlay 30 is without noiseproof feature, thus the one layer of screened film (sign) that can also be sticked again on described coverlay 30, thus improving the interference free performance of described flexible PCB 100.
Flexible PCB provided by the invention by arranging multiple bending conductor wire side by side in described non-flex area, the one end utilizing multiple described bending conductor wire is connected on described conductor wire, and be isolated each other, and the width of described bending conductor wire is set less than described conductor wire width, thus reducing the described flexible PCB stress in flex area so that the flex area flexibility of described flexible PCB improves.
Embodiments described above, is not intended that the restriction to this technical scheme protection domain. The amendment made within any spirit at above-mentioned embodiment and principle, equivalent replacement and improvement etc., should be included within the protection domain of this technical scheme.
Claims (10)
1. a flexible PCB, it is characterized in that: described flexible PCB includes substrate layer, copper foil layer and coverlay, described copper foil layer is located on described substrate layer, described copper foil layer includes two non-bending parts being oppositely arranged and the bar shaped bending part being connected between two described non-bending parts, described non-bending part is provided with conductor wire, described bending part is in meandering shape, described bending part is provided with the bending conductor wire connecting described conductor wire, described bending conductor wire is with described bending part bending, described cover layer is laminated on described copper foil layer, cover described bending part and described non-bending part.
2. flexible PCB as claimed in claim 1, it is characterized in that: described copper foil layer includes being laminated in the first copper foil layer and second copper foil layer of described substrate layer both sides, described conductor wire is arranged on described first copper foil layer, the non-bending part of described second copper foil layer is provided with the electric-conductor electrically connecting described conductor wire, the number of described bending conductor wire is many, many described bending conductor wires are arranged side by side and are all connected to described conductor wire, described bending conductor wire includes being arranged at the first bending conductor wire of described first copper foil layer and being arranged at the second bending conductor wire of described second copper foil layer, one end of described first bending conductor wire is electrically connected to described conductor wire, one end of described second bending conductor wire is electrically connected to described electric-conductor.
3. flexible PCB as claimed in claim 2, it is characterised in that: the number of described first bending conductor wire is many, and the number of described second bending conductor wire is many.
4. flexible PCB as claimed in claim 2, it is characterised in that: described coverlay includes fitting in the first coverlay of described first copper foil layer and fitting in the second coverlay of described second copper foil layer.
5. flexible PCB as claimed in claim 1, it is characterized in that, described flexible PCB also includes flexible support plate, described flexible support plate is provided with two fixed parts being oppositely arranged, two described non-bending parts are individually fixed in two described fixed parts, the Geometrical Bending axis place vertical described flexible support plate of plane of described bending part.
6. flexible PCB as claimed in claim 1, it is characterised in that: described copper foil layer arranges slotted eye at described bending part, and the length direction of described slotted eye is paralleled with the length direction of described bending conductor wire, and described slotted eye is positioned at described bending conductor wire side.
7. flexible PCB as claimed in claim 1, it is characterised in that: described coverlay is adhered on described copper foil layer by viscose glue.
8. flexible PCB as claimed in claim 1, it is characterised in that: described conductor wire is Copper Foil.
9. flexible PCB as claimed in claim 1, it is characterised in that: the width sum of many described bending conductor wires is equal to the width of described conductor wire.
10. a mobile terminal, it is characterized in that: described mobile terminal includes apparatus body, is located at the mainboard within described apparatus body and flexible PCB as described in claim 1��9 any one, described flexible PCB is located at inside described apparatus body, and electrically connects with described mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511030112.2A CN105636339B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511030112.2A CN105636339B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105636339A true CN105636339A (en) | 2016-06-01 |
| CN105636339B CN105636339B (en) | 2018-12-11 |
Family
ID=56050666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511030112.2A Expired - Fee Related CN105636339B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105636339B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108770184A (en) * | 2018-05-29 | 2018-11-06 | 昆山国显光电有限公司 | Flexible PCB, flexible circuit board manufacturing method and flexible display panels |
| WO2020258295A1 (en) * | 2019-06-28 | 2020-12-30 | 京东方科技集团股份有限公司 | Flexible circuit board, flexible device, and display apparatus |
| CN112974580A (en) * | 2021-05-11 | 2021-06-18 | 四川英创力电子科技股份有限公司 | Bent circuit board and processing equipment and method thereof |
| WO2021127845A1 (en) * | 2019-12-23 | 2021-07-01 | 瑞声声学科技(深圳)有限公司 | Flexible printed circuit board |
| EP3806591A4 (en) * | 2018-07-17 | 2021-07-07 | Huawei Technologies Co., Ltd. | Mobile terminal |
| CN114188387A (en) * | 2021-12-09 | 2022-03-15 | 深圳市华星光电半导体显示技术有限公司 | Flexible display panel |
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| CN2805301Y (en) * | 2005-03-22 | 2006-08-09 | 比亚迪股份有限公司 | Wiring structure of pliancy and flexibility printed circuit board |
| JP2012230954A (en) * | 2011-04-25 | 2012-11-22 | Sumitomo Electric Printed Circuit Inc | Printed wiring board and printed wiring board manufacturing method |
| CN203399399U (en) * | 2013-08-09 | 2014-01-15 | 阿尓派株式会社 | Flexible circuit board and electronic device provided with the flexible circuit board |
| CN204887687U (en) * | 2015-09-10 | 2015-12-16 | 上海卓易科技股份有限公司 | Flexible circuit board and electronic product |
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2015
- 2015-12-29 CN CN201511030112.2A patent/CN105636339B/en not_active Expired - Fee Related
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| CN2805301Y (en) * | 2005-03-22 | 2006-08-09 | 比亚迪股份有限公司 | Wiring structure of pliancy and flexibility printed circuit board |
| JP2012230954A (en) * | 2011-04-25 | 2012-11-22 | Sumitomo Electric Printed Circuit Inc | Printed wiring board and printed wiring board manufacturing method |
| CN203399399U (en) * | 2013-08-09 | 2014-01-15 | 阿尓派株式会社 | Flexible circuit board and electronic device provided with the flexible circuit board |
| CN204887687U (en) * | 2015-09-10 | 2015-12-16 | 上海卓易科技股份有限公司 | Flexible circuit board and electronic product |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108770184A (en) * | 2018-05-29 | 2018-11-06 | 昆山国显光电有限公司 | Flexible PCB, flexible circuit board manufacturing method and flexible display panels |
| CN108770184B (en) * | 2018-05-29 | 2019-12-27 | 广州国显科技有限公司 | Flexible circuit board, manufacturing method of flexible circuit board and flexible display panel |
| EP3806591A4 (en) * | 2018-07-17 | 2021-07-07 | Huawei Technologies Co., Ltd. | Mobile terminal |
| US11886240B2 (en) | 2018-07-17 | 2024-01-30 | Huawei Technologies Co., Ltd. | Mobile terminal with a bendable structure |
| WO2020258295A1 (en) * | 2019-06-28 | 2020-12-30 | 京东方科技集团股份有限公司 | Flexible circuit board, flexible device, and display apparatus |
| CN112534969A (en) * | 2019-06-28 | 2021-03-19 | 京东方科技集团股份有限公司 | Flexible circuit board, flexible device and display device |
| US11647580B2 (en) | 2019-06-28 | 2023-05-09 | Boe Technology Group Co., Ltd. | Flexible printed circuit, flexible apparatus and display device |
| CN112534969B (en) * | 2019-06-28 | 2024-10-11 | 京东方科技集团股份有限公司 | Flexible circuit board, flexible device and display equipment |
| WO2021127845A1 (en) * | 2019-12-23 | 2021-07-01 | 瑞声声学科技(深圳)有限公司 | Flexible printed circuit board |
| CN112974580A (en) * | 2021-05-11 | 2021-06-18 | 四川英创力电子科技股份有限公司 | Bent circuit board and processing equipment and method thereof |
| CN114188387A (en) * | 2021-12-09 | 2022-03-15 | 深圳市华星光电半导体显示技术有限公司 | Flexible display panel |
| CN114188387B (en) * | 2021-12-09 | 2023-08-22 | 深圳市华星光电半导体显示技术有限公司 | Flexible display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105636339B (en) | 2018-12-11 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20181211 |