CN108770184B - Flexible circuit board, manufacturing method of flexible circuit board and flexible display panel - Google Patents
Flexible circuit board, manufacturing method of flexible circuit board and flexible display panel Download PDFInfo
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- CN108770184B CN108770184B CN201810529331.2A CN201810529331A CN108770184B CN 108770184 B CN108770184 B CN 108770184B CN 201810529331 A CN201810529331 A CN 201810529331A CN 108770184 B CN108770184 B CN 108770184B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The application relates to a flexible circuit board, a flexible circuit board manufacturing method and a flexible display panel, wherein the flexible circuit board comprises a substrate layer, a circuit conduction layer and an insulation protection layer; one side of the circuit conduction layer is attached to the base material layer, and the other side of the circuit conduction layer is attached to the insulating protection layer; the substrate layer, the circuit conduction layer and the insulating protection layer are of curve-shaped structures matched with each other. Because the flexible circuit board is the curve shape structure, can realize the flexibility more easily and buckle to can reduce the radius of buckling, and reduce flexible circuit board's rebound stress, thereby make flexible circuit board have better bending performance, the in-process also can reduce the adhesion performance requirement of pasting the glue among the practical application, and then reaches reduce cost's purpose.
Description
Technical Field
The present disclosure relates to the field of display panel technologies, and in particular, to a flexible printed circuit board, a method for manufacturing the flexible printed circuit board, and a flexible display panel.
Background
A Flexible Printed Circuit (FPC) is a Flexible Printed Circuit board made of a polyimide or polyester film as a base material, and has the characteristics of high wiring density, light weight, and thin thickness. When using flexible circuit board, the demand that the existence need buckle in order to adapt to the application scene to flexible circuit board, mostly buckle using planar shape's flexible circuit board among the traditional art to paste through using and glue and paste and fix the purpose in order to reach the flexible circuit board of buckling.
However, since polyimide has a certain bending resistance, there is a disadvantage that a bending radius is large when a flat flexible circuit board is bent, and since the bent flexible circuit board has a certain rebound stress, a requirement for a bonding performance of the adhesive is high.
Disclosure of Invention
Accordingly, it is desirable to provide a flexible circuit board with better bending performance, a method for manufacturing the flexible circuit board, and a flexible display panel.
A flexible circuit board comprising: the circuit comprises a substrate layer, a circuit conduction layer and an insulating protection layer;
one side of the circuit conduction layer is attached to the base material layer, and the other side of the circuit conduction layer is attached to the insulating protection layer;
the substrate layer, the circuit conduction layer and the insulating protection layer are of curve-shaped structures matched with each other.
In one embodiment, the curvilinear shape comprises: sine wave curve, square wave curve, sawtooth wave curve and triangular wave curve.
In one embodiment, the insulating protection layer is provided with a window structure.
In one embodiment, the insulating protection layer is provided with an anti-oxidation protection structure, and the anti-oxidation protection structure covers the window structure.
In one embodiment, the flexible circuit board is a double-layer board, the circuit conduction layers comprise a first circuit conduction layer and a second circuit conduction layer, and the insulating protection layer comprises a first insulating protection layer and a second insulating protection layer;
one surface of the substrate layer is attached to one surface of the first circuit conduction layer, and the other surface of the first circuit conduction layer is attached to any surface of the first insulation protection layer; the substrate layer another side with second circuit conducts the laminating of layer one side mutually, second circuit conducts the laminating of layer another side with any one side of second insulating protective layer is laminated mutually.
A flexible circuit board manufacturing method comprises a hot pressing step and a superposition step;
the hot pressing step comprises: carrying out hot pressing operation on the substrate layer, the circuit conduction layer and the insulating protection layer of the flexible circuit board so that the substrate layer, the circuit conduction layer and the insulating protection layer after hot pressing are of curve-shaped structures which are mutually matched;
the superimposing step includes: and superposing and laminating the substrate layer, the circuit conduction layer and the insulating protection layer of the flexible circuit board to obtain the flexible circuit board, wherein in the flexible circuit board, one surface of the circuit conduction layer is jointed with the substrate layer, and the other surface of the circuit conduction layer is jointed with the insulating protection layer.
In one embodiment, the order of execution of the hot pressing step and the stacking step may be interchanged.
In one embodiment, in the hot pressing step, the temperature of the hot pressing operation ranges from 20 degrees celsius to 400 degrees celsius.
In one embodiment, in the hot-pressing step, the step of performing hot-pressing operation on the substrate layer, the circuit conduction layer and the insulating protection layer of the flexible circuit board to make the substrate layer, the circuit conduction layer and the insulating protection layer after hot-pressing have curve-shaped structures matched with each other includes:
carrying out integral hot-pressing operation on the substrate layer, the circuit conduction layer and the insulating protection layer so as to enable the whole substrate layer, the whole circuit conduction layer and the whole insulating protection layer after hot pressing to be of curve-shaped structures which are mutually matched; or the like, or, alternatively,
and carrying out local hot pressing operation on the substrate layer, the circuit conduction layer and the insulating protection layer so as to enable the part of the substrate layer, the part of the circuit conduction layer and the part of the insulating protection layer after hot pressing to be of curve-shaped structures matched with each other.
A flexible display panel comprising:
a flexible display substrate;
the flexible printed circuit board is arranged on one side of the display surface which is far away from the flexible display substrate;
the chip on film is used for connecting the flexible display substrate and the flexible printed circuit board and comprises the flexible circuit board and an integrated circuit chip arranged on the surface of the flexible circuit board.
The flexible circuit board comprises a substrate layer, a circuit conduction layer and an insulation protection layer; one side of the circuit conduction layer is attached to the base material layer, and the other side of the circuit conduction layer is attached to the insulating protection layer; the substrate layer, the circuit conduction layer and the insulating protection layer are of curve-shaped structures matched with each other. Because the flexible circuit board is the curve shape structure, can realize the flexibility more easily and buckle to can reduce the radius of buckling, and reduce flexible circuit board's rebound stress, thereby make flexible circuit board have better bending performance, the in-process also can reduce the adhesion performance requirement of pasting the glue among the practical application, and then reaches reduce cost's purpose.
Drawings
FIG. 1 is a schematic diagram of a flexible circuit board according to one embodiment;
FIG. 2 is a schematic structural diagram of a flexible circuit board in another embodiment;
FIG. 3 is an exemplary graph of a curve shape in one embodiment;
FIG. 4 is a schematic structural view of a double-layer plate having a square wave curve shape structure according to an embodiment;
FIG. 5 is a schematic view of a single layer panel having a sinusoidal wave shape configuration in one embodiment;
FIG. 6 is a schematic view of a single-ply board having a sinusoidal wave curvilinear shape structure in another embodiment;
FIG. 7 is a schematic flow chart diagram illustrating a method for fabricating a flexible circuit board according to one embodiment;
FIG. 8 is a schematic flow chart illustrating a method for fabricating a flexible circuit board according to another embodiment;
FIG. 9 is a schematic flow chart illustrating a method for fabricating a flexible circuit board according to yet another embodiment;
fig. 10 is a schematic structural diagram of a flexible display panel in one embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
All be planar structure when tiling for flexible circuit board's each layer structure among the conventional art, though each layer structure possesses certain bending performance, nevertheless have the difficult and great problem of radius of buckling, if need reduce its radius of buckling by force, probably still can cause the damage to flexible circuit board. In addition, since the flat flexible circuit board has a certain internal stress when it is bent, it is highly required to maintain the adhesion performance of the adhesive which fixes the deformation of the flat flexible circuit board after bending.
The application provides a flexible circuit board, this flexible circuit board is the flexible circuit board of curve shape structure, specifically includes substrate layer, circuit conduction layer and insulating protective layer. One side of the circuit conduction layer is attached to the base material layer, and the other side of the circuit conduction layer is attached to the insulating protection layer; the substrate layer, the circuit conduction layer and the insulating protection layer are of curve-shaped structures matched with each other. The flexible circuit board of curve shape compares in the flexible circuit board of the planar shape among the conventional art, possesses better bending performance, can carry out flexible bending operation to it more easily, and can reduce its radius of buckling to a certain extent. In addition, the requirement of the pasting performance of the pasting glue for maintaining the deformation of the flexible circuit board after being fixed and bent can be reduced.
In particular, the flexible circuit board may be a single-layer board or a double-layer board. The single-layer board is generally provided with circuit lines only on one side of the substrate layer of the flexible circuit board, and the double-layer board is provided with circuit lines on both sides of the substrate layer of the flexible circuit board. The user can select the kind of flexible circuit board that needs to use according to actual conditions, because the single-deck board and the double-deck board of curve shape structure have better bending performance to can carry out flexible bending operation easily.
In one embodiment, the flexible circuit board is a single layer board. As shown in fig. 1, the single-layer board having a sinusoidal curve structure is exemplified, and the single-layer board includes a base material layer 110, a circuit conduction layer 120, and an insulating protective layer 130, wherein one surface of the circuit conduction layer 120 is bonded to any one surface of the base material layer 110, and the other surface of the circuit conduction layer 120 is bonded to any one surface of the insulating protective layer 130. The base layer 110, the conductive layer 120 and the insulating protection layer 130 are curved structures that are fitted to each other. The single-layer plate with the curved-shape structure in the embodiment has better bending performance compared with a single-layer plate with a planar-shape structure in the traditional technology, can be bent flexibly and more easily, and can reduce the bending radius to a certain extent.
In one embodiment, the flexible circuit board is a double-layer board in which the circuit-conduction layers include a first circuit-conduction layer and a second circuit-conduction layer, and the insulating protective layer includes a first insulating protective layer and a second insulating protective layer. One surface of the substrate layer is attached to one surface of the first circuit conduction layer, and the other surface of the first conduction layer is attached to any surface of the first insulation protection layer; the other side of the substrate layer is attached to one side of the second circuit conduction layer, and the other side of the second circuit conduction layer is attached to any side of the second insulation protection layer. In this embodiment, the first and second names of the conductive layer and the insulating protective layer in the double-layer board are not strictly limited, and they can be interchanged.
As shown in fig. 2, taking a double-layer board with a sine-wave curve structure as an example, the double-layer board includes a base material layer 210, a first circuit conduction layer 220, a first insulating protection layer 230, a second circuit conduction layer 240, and a second insulating protection layer 250, one surface of the base material layer 210 is bonded to one surface of the first circuit conduction layer 220, and the other surface of the first conduction layer 220 is bonded to any one surface of the first insulating protection layer 230. The other surface of the substrate layer 210 is attached to one surface of the second circuit conducting layer 240, and the other surface of the second circuit conducting layer 240 is attached to any surface of the second insulating protective layer 250. The double-layer plate with the curve-shaped structure in the embodiment has better bending performance compared with a double-layer plate with a plane-shaped structure in the traditional technology, can be bent flexibly and more easily, and can reduce the bending radius of the double-layer plate to a certain extent.
In one embodiment, as shown in fig. 3, the shapes of the substrate layer, the circuit conducting layer and the insulating protection layer include sine wave curve, square wave curve, triangular wave curve, sawtooth wave curve, etc. The sine wave curve is a curve formed by a plurality of arc-shaped sections (S-shaped structures) which are connected in sequence and is in a wave line shape; the square wave curve is a curve formed by a plurality of sequentially connected bow-shaped structures; the triangular wave curve is a curve formed by a plurality of sequentially alternating V-shaped structures; a sawtooth curve is a curve composed of a plurality of sequentially alternating N-shaped (positive N-shaped or negative N-shaped) structures. The curved shapes all include alternating peaks and valleys in sequence.
Specifically, as shown in fig. 4, the double-layer board with a square-wave curve-shaped structure is taken as an example, and the double-layer board includes a substrate layer 210, a first circuit-conducting layer 220, a first insulating protection layer 230, a second circuit-conducting layer 240, and a second insulating protection layer 250, and each layer structure is a square-wave curve-shaped structure matched with each other.
It should be noted that the purpose of hot-pressing the layer structures into curved shapes is to improve the bending performance of the layer structures, so the curved shapes in this embodiment are not limited to the four curved shapes provided in fig. 3, and curved shapes derived from the four curved shapes and other curved shapes capable of improving the bending performance also fall within the protection scope of this embodiment.
In addition, the curve shape may be a standard sine wave curve, a square wave curve, a sawtooth wave curve, or a triangular wave curve, that is, the positions of the peaks and the troughs of the curves are the same; the curve shape can also be a nonstandard sine wave curve, a square wave curve, a sawtooth wave curve and a triangular wave curve, namely the positions of each wave crest and each wave trough of each curve can also be different, and the positions of the wave crests and the wave troughs can be adjusted according to actual conditions, so that the purpose of flexibly adjusting the bending performance of the flexible circuit board according to actual requirements is achieved.
In this embodiment, the substrate layer, the circuit conducting layer and the insulating protective layer in the flexible circuit board are in a shape of a sine wave curve, a square wave curve, a sawtooth wave curve, a triangular wave curve or other curves that are mutually matched, so as to achieve the purpose of improving the bending performance of each layer structure.
In one embodiment, the insulating protection layer is provided with a window structure. In the manufacturing process of the flexible printed circuit board, the substrate layer is usually made of other materials such as polyimide or PET (Polyethylene terephthalate), the circuit conducting layer is usually made of a copper layer or other metal material layers, and the insulating protective layer is usually made of a polyimide protective layer. The polyimide material has the characteristics of high temperature resistance, low temperature resistance and corrosion resistance, however, the material has certain bending resistance, so that the bending resistance of the flexible circuit board can be influenced to a certain extent, and therefore, in the embodiment, the polyimide material on the local surface of the insulating protective layer is removed by arranging the windowing structure on the insulating protective layer, so that the bending resistance of the flexible circuit board is further improved.
When the insulating protective layer with the sine wave curve shape, the sawtooth wave curve shape and the triangular wave curve shape is subjected to windowing treatment operation, partial polyimide at the positions of wave crests and/or wave troughs can be selectively removed; when the insulating protective layer in the shape of a square wave is subjected to windowing treatment, the polyimide on the surface of the high level position and/or the polyimide on the surface of the low level position can be selectively removed. The size of the windowing can be selected according to actual conditions. Specifically, as shown in fig. 5, taking a single-layer board with a sine wave curve structure as an example, the single-layer board includes a base material layer 110, a circuit conduction layer 120, and an insulating protection layer 130, and a window structure 132 is opened at a peak position of the insulating protection layer 130.
This embodiment is through seting up the structure of windowing at insulating protective layer, can reduce insulating protective layer's rebound stress to can carry out the flexibility more smoothly and buckle, and reduce the radius of buckling, further improve flexible circuit board's the performance of buckling.
In one embodiment, the insulating protection layer is provided with an oxidation prevention protection structure, and the oxidation prevention protection structure covers the window structure. Specifically, as shown in fig. 6, taking a single-layer board with a sine wave curve structure as an example, the single-layer board includes a base material layer 110, a circuit conduction layer 120, and an insulating protection layer 130, and a window structure 132 is opened at a peak position of the insulating protection layer 130. The insulating protection layer 130 is further provided with an anti-oxidation protection structure 134, and the anti-oxidation protection structure 134 covers the window structure 132.
In fig. 6, the window structure indicated by 132 is also provided with an anti-oxidation protection structure, and in order to make the window structure and the anti-oxidation protection structure be distinguished from each other by the reference numerals in fig. 6, the anti-oxidation protection structure provided at the window structure indicated by 132 is omitted and not shown.
In this embodiment, after the structure of windowing was seted up at insulating protective layer, the insulating protective layer material of this part was got rid of to make the circuit conduction layer that is located insulating protective layer inside expose, because circuit conduction layer is mostly metallic material, this layer of material exposes and can make metallic material take place the oxidation, produces the influence to flexible circuit board's performance. Therefore, the insulating protection layer is provided with an anti-oxidation protection structure, and the anti-oxidation protection structure covers the windowing structure, so that the anti-oxidation protection effect is achieved on the exposed circuit conducting layer. Specifically, the oxidation prevention structure may be formed using a conventional ink. This embodiment is through setting up anti-oxidation protection architecture to play anti-oxidation guard action to exposed circuit conducting layer, reach the purpose of guaranteeing the flexible circuit board performance.
In one embodiment, as shown in fig. 7, a method for manufacturing a flexible circuit board is provided, which includes a hot pressing step S100 and a stacking step S200.
The hot pressing step S100 includes: and carrying out hot pressing operation on the substrate layer, the circuit conduction layer and the insulating protection layer of the flexible circuit board so that the substrate layer, the circuit conduction layer and the insulating protection layer after hot pressing are of curve-shaped structures which are mutually matched. The curve shape possesses better bending performance than the plane shape, therefore each layer structure of curve shape compares in the plane shape among the conventional art each layer structure, can carry out flexible bending operation to it more easily, and can reduce its radius of buckling to a certain extent to, and the internal stress after each layer structure of buckling after buckling also reduces.
The superimposing step S200 includes: and superposing and laminating the substrate layer, the circuit conducting layer and the insulating protective layer of the flexible circuit board to obtain the flexible circuit board. Through the substrate layer, the circuit conduction layer and the insulating protective layer that are the curve shape structure that agree with each other to being behind the hot pressing superpose the pressfitting for circuit conduction layer one side is laminated with the substrate layer mutually, and circuit conduction layer another side is laminated with insulating protective layer mutually, thereby obtains the flexible circuit board of curve shape structure.
In this embodiment, each layer material through to preparation flexible circuit board carries out hot pressing operation, each layer material that obtains curve shape structure, then obtain curve shape's flexible circuit board after carrying out the stack pressfitting to each layer material, curve shape's flexible circuit board compares in the flexible circuit board of the planar shape in the conventional art, possess better bending performance, can carry out the flexible operation of buckling to it more easily, and can reduce its radius of buckling to a certain extent, and, the internal stress after buckling of each layer structure after buckling also reduces, thereby can reduce the performance requirement of pasting gluey among the practical application, reduce the cost.
In another embodiment, the execution sequence of the hot pressing step S100 and the stacking step S200 of the flexible circuit board manufacturing method may be interchanged, that is, the stacking step S200 may be executed first, and then the hot pressing step S100 is executed. And after the substrate layer, the circuit conduction layer and the insulating protection layer of the flexible circuit board are superposed and pressed to obtain the flexible circuit board, carrying out hot pressing operation on the flexible circuit board with the obtained planar structure, thereby obtaining the flexible circuit board with the curved structure.
In this embodiment, carry out hot pressing operation through the flexible circuit board to the planar structure who makes, obtain the flexible circuit board of curve shape structure, the flexible circuit board of curve shape compares in the planar flexible circuit board in traditional technology, possess better bending performance, can carry out the flexible operation of buckling to it more easily, and can reduce its radius of buckling to a certain extent, and, the internal stress after each layer structure of buckling after buckling also reduces, thereby can reduce the performance requirement of pasting to gluing among the practical application, reduce use cost.
In one embodiment, when the substrate layer, the circuit conducting layer and the insulating protective layer of the flexible circuit board are respectively subjected to the hot pressing operation, the temperature range of the hot pressing operation is 20 to 400 degrees celsius. In this embodiment, for preventing substrate layer, circuit conduction layer and insulating protection layer material deformation stress release after the hot pressing, lead to the condition that each layer structural material becomes level and smooth, consequently can adopt different temperature and pressure in hot pressing process, and is concrete, and hot pressing operation is that temperature range control is in 20 degrees centigrade to 400 degrees centigrade within range, and pressure control can in the pressure range that enables each layer structural material to take place deformation. The temperature and the pressure of hot pressing operation are controlled, so that each layer of structural material can be permanently deformed, and the stability of the curve-shaped structure of the flexible circuit board is guaranteed.
In one embodiment, the step S100 of performing a hot-pressing operation on the substrate layer, the circuit conducting layer and the insulating protective layer of the flexible circuit board includes the step 110 or the step 120.
And step 110, carrying out integral hot pressing operation on the substrate layer, the circuit conduction layer and the insulating protection layer of the flexible circuit board. The whole hot pressing operation is carried out on each layer structure of the flexible circuit board in the step, so that the whole base material layer, the whole circuit conduction layer and the whole insulating protection layer after hot pressing are of curve-shaped structures, and the whole bending performance of the flexible circuit board is improved.
And 140, carrying out local hot pressing operation on the substrate layer, the circuit conduction layer and the insulating protection layer of the flexible circuit board. In the step, hot pressing operation is performed on the local part of each layer structure of the flexible circuit board, so that the local part of the base material layer, the local part of the circuit conduction layer and the local part of the insulating protection layer after hot pressing are of curve-shaped structures, the local bending performance of the flexible circuit board is improved, and the strength performance of the part which is not hot pressed can be ensured.
In practical application, if the flexible circuit board needs to be bent integrally, an integral hot-pressing method can be adopted; if the flexible circuit board is only required to be locally bent, a local hot pressing method can be adopted, and the strength performance of other parts which do not need to be bent is ensured. This embodiment is through providing two kinds of hot pressing operation methods of whole hot pressing and local hot pressing, and the user can select the hot pressing position according to actual conditions to reach the purpose of bending the nimble hot pressing operation that carries out of demand according to the reality, make the product after the hot pressing more accord with actual production needs.
In one embodiment, as shown in fig. 8, after step S200, the method for manufacturing a flexible circuit board further includes step S300 of performing a windowing operation on the insulating protection layer to obtain a windowing structure. This embodiment can reduce insulating protective layer's rebound stress through carrying out windowing to insulating protective layer to can carry out the flexibility more smoothly and buckle, and reduce the radius of buckling, further improve flexible circuit board's the performance of buckling.
In an embodiment, as shown in fig. 9, after step S300, the method for manufacturing a flexible circuit board further includes step S400 of performing an anti-oxidation protection operation on the exposed circuit conducting layer after the windowing operation to obtain an anti-oxidation protection structure. In the embodiment, the exposed circuit conduction layer after the windowing treatment operation is subjected to anti-oxidation protection operation, so that the purpose of ensuring the performance of the flexible circuit board is achieved.
In one embodiment, the insulating protective layer can be prepared in advance and then hot-pressed, or the insulating protective layer can be prepared when hot-pressing operation is performed, so that the thickness of the insulating protective layer can be flexibly controlled according to actual needs, and the purpose of flexibly controlling the bending performance of the flexible circuit board according to actual needs is achieved.
It should be understood that although the various steps in the flowcharts of fig. 7-9 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least some of the steps in fig. 7-9 may include multiple sub-steps or multiple stages that are not necessarily performed at the same time, but may be performed at different times, and the order of performance of the sub-steps or stages is not necessarily sequential, but may be performed in turn or alternating with other steps or at least some of the sub-steps or stages of other steps.
In one embodiment, as shown in fig. 10, a flexible display panel is provided, wherein the flexible display panel includes a flexible display substrate 310, a flexible printed circuit board 320 and a flip-chip film 330 (not shown).
The flexible display substrate 310 is a substrate having a display surface. The flexible printed circuit board 320 is disposed on a side facing away from the display surface of the flexible display substrate 310. The flip-chip 330 is used to connect the flexible display substrate 310 and the flexible printed circuit board 320, the flip-chip 330 includes the flexible circuit board 332 in any of the embodiments and the integrated circuit chip 334 disposed on the surface of the flexible circuit board 332, and the flexible circuit board 332 is fixedly connected to the flexible display substrate 310 by a bonding material. The flexible circuit board 332 in the figure is a flexible circuit board having a sine wave curve shape structure.
In this embodiment, it is fixed to need buckle and paste flexible circuit board 332, because the flexible circuit board of curve shape structure that uses, consequently can carry out the flexible operation of buckling to it more easily, and can reduce its radius of buckling to a certain extent, and the internal stress of the flexible circuit board after buckling also reduces, thereby can reduce the performance requirement of pasting to gluing in the practical application, reduce use cost.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. A flexible circuit board, comprising: the circuit comprises a substrate layer, a circuit conduction layer and an insulating protection layer;
one side of the circuit conduction layer is attached to the base material layer, and the other side of the circuit conduction layer is attached to the insulating protection layer;
the substrate layer, the circuit conduction layer and the insulating protection layer are of curve-shaped structures which are mutually matched;
the insulating protective layer is provided with a windowing structure, and when the curve shape comprises a wave crest shape and a wave trough shape, the windowing structure is positioned at the wave crest position and/or the wave trough position of the insulating protective layer; when the curve shape comprises a high level shape and a low level shape, the windowing structure is positioned on the high level surface and/or the low level surface of the insulating protection layer.
2. The flexible circuit board of claim 1, wherein the curvilinear shape comprises: sine wave curve, square wave curve, sawtooth wave curve and triangular wave curve.
3. The flexible circuit board according to claim 1, wherein the insulating protective layer is provided with an oxidation prevention protective structure that covers the window structure.
4. The flexible circuit board according to claim 1, wherein the flexible circuit board is a double-layer board, the circuit-conduction layers include a first circuit-conduction layer and a second circuit-conduction layer, and the insulating protective layer includes a first insulating protective layer and a second insulating protective layer;
one surface of the substrate layer is attached to one surface of the first circuit conduction layer, and the other surface of the first circuit conduction layer is attached to any surface of the first insulation protection layer; the substrate layer another side with second circuit conducts the laminating of layer one side mutually, second circuit conducts the laminating of layer another side with any one side of second insulating protective layer is laminated mutually.
5. A flexible circuit board manufacturing method is characterized by comprising a hot pressing step, a superposition step and a windowing step;
the hot pressing step comprises: carrying out hot pressing operation on the substrate layer, the circuit conduction layer and the insulating protection layer of the flexible circuit board so that the substrate layer, the circuit conduction layer and the insulating protection layer after hot pressing are of curve-shaped structures which are mutually matched;
the superimposing step includes: superposing and laminating a substrate layer, a circuit conduction layer and an insulating protection layer of the flexible circuit board to obtain the flexible circuit board, wherein in the flexible circuit board, one surface of the circuit conduction layer is jointed with the substrate layer, and the other surface of the circuit conduction layer is jointed with the insulating protection layer;
the windowing step comprises: the insulating protective layer is provided with a windowing structure, and when the curve shape comprises a wave crest shape and a wave trough shape, the windowing structure is positioned at the wave crest position and/or the wave trough position of the insulating protective layer; when the curve shape comprises a high level shape and a low level shape, the windowing structure is positioned on the high level surface and/or the low level surface of the insulating protection layer.
6. The method of claim 5, wherein the sequence of the hot pressing step and the stacking step is interchangeable.
7. The method for manufacturing a flexible circuit board according to claim 5, wherein in the hot-pressing step, the temperature range of the hot-pressing operation is 20 to 400 ℃.
8. The method of manufacturing a flexible circuit board according to claim 5, wherein in the hot-pressing step, the step of hot-pressing the substrate layer, the circuit conduction layer, and the insulating protective layer of the flexible circuit board so that the substrate layer, the circuit conduction layer, and the insulating protective layer after the hot-pressing are in curved structures fitted to each other includes:
carrying out integral hot-pressing operation on the substrate layer, the circuit conduction layer and the insulating protection layer so as to enable the whole substrate layer, the whole circuit conduction layer and the whole insulating protection layer after hot pressing to be of curve-shaped structures which are mutually matched; or the like, or, alternatively,
and carrying out local hot pressing operation on the substrate layer, the circuit conduction layer and the insulating protection layer so as to enable the part of the substrate layer, the part of the circuit conduction layer and the part of the insulating protection layer after hot pressing to be of curve-shaped structures matched with each other.
9. A flexible display panel, comprising:
a flexible display substrate;
the flexible printed circuit board is arranged on one side of the display surface which is far away from the flexible display substrate;
a chip on film for connecting the flexible display substrate and the flexible printed circuit board, the chip on film comprising the flexible circuit board according to any one of claims 1 to 4 and an integrated circuit chip disposed on the surface of the flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109686759B (en) * | 2018-12-05 | 2020-11-06 | 武汉华星光电半导体显示技术有限公司 | Display screen assembly |
| US10923542B2 (en) | 2018-12-05 | 2021-02-16 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display screen assembly having a flexible circuit board with curved portions |
| CN109638209A (en) * | 2018-12-17 | 2019-04-16 | 安捷利电子科技（苏州）有限公司 | A kind of battery signal acquisition harness and its bending technique with bending structure |
| CN111613132A (en) * | 2019-02-26 | 2020-09-01 | 昆山工研院新型平板显示技术中心有限公司 | Stretchable display screen and display device |
| CN111867234B (en) * | 2020-08-10 | 2024-02-09 | 深圳市特深电气有限公司 | Flexible circuit board and magnetic resonance surface coil |
| CN112974580B (en) * | 2021-05-11 | 2021-07-30 | 四川英创力电子科技股份有限公司 | Bent circuit board and processing equipment and method thereof |
| CN113689978A (en) * | 2021-08-12 | 2021-11-23 | 武汉华星光电半导体显示技术有限公司 | Flexible circuit board and electronic equipment |
| CN114155790B (en) * | 2021-11-30 | 2023-07-21 | 联想(北京)有限公司 | Connecting piece and assembly |
| CN114286503B (en) * | 2021-12-28 | 2024-02-09 | 武汉天马微电子有限公司 | Flexible circuit board, preparation method thereof and display module |
| CN114628062B (en) * | 2022-03-28 | 2023-06-02 | Tcl华星光电技术有限公司 | Conductive film and display panel |
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| CN102687598A (en) * | 2009-12-24 | 2012-09-19 | 日本梅克特隆株式会社 | Flexible circuit board and manufacturing method thereof |
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Application publication date: 20181106 Assignee: Yungu (Gu'an) Technology Co., Ltd.|Bazhou Yungu Electronic Technology Co., Ltd.|Kunshan Institute of technology new flat panel display technology center Co., Ltd Assignor: Kunshan Guo Xian Photoelectric Co., Ltd. Contract record no.: X2019990000156 Denomination of invention: Flexible circuit board, flexible circuit board manufacturing method, and flexible display panel License type: Common License Record date: 20191030 |
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