CN114286503B - Flexible circuit board, preparation method thereof and display module - Google Patents
Flexible circuit board, preparation method thereof and display module Download PDFInfo
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- CN114286503B CN114286503B CN202111627467.5A CN202111627467A CN114286503B CN 114286503 B CN114286503 B CN 114286503B CN 202111627467 A CN202111627467 A CN 202111627467A CN 114286503 B CN114286503 B CN 114286503B
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Abstract
The application provides a flexible circuit board, a preparation method thereof and a display module, and relates to the technical field of display. The flexible circuit board comprises a substrate layer and a metal layer; the flexible circuit board comprises a bending region, and at least the substrate layer and/or the metal layer positioned in the bending region is of a Gaussian waveform structure. By making the substrate layer and/or the metal layer of at least the bending region in the flexible circuit board into a non-planar structure, at least the bending region in the flexible circuit board can have better bending performance.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible circuit board, a preparation method thereof and a display module.
Background
The flexible printed circuit board (FPC, flexible Printed Circuit) is a flexible printed circuit board made of polyimide or polyester film as a base material, and has the characteristics of high wiring density, light weight, and thin thickness. When using flexible circuit board, there is the demand that need buckle in order to adapt to the application scene to flexible circuit board, and most use planar flexible circuit board to buckle in the conventional art to through using the paste glue in order to reach the flexible circuit board that buckles and paste and fix the purpose.
However, polyimide has a certain bending resistance, so that when a planar flexible circuit board is bent, the planar flexible circuit board has the defect of larger bending radius, and the requirement on the adhesive performance of the adhesive is higher because the bent flexible circuit board has a certain rebound stress.
Disclosure of Invention
In view of the above, the invention provides a flexible circuit board, a manufacturing method thereof and a display module, so that the flexible circuit board can have better bending performance.
In a first aspect, the present application provides a flexible circuit board, including a substrate layer, a metal layer;
the flexible circuit board comprises a bending region, and at least the substrate layer and/or the metal layer which are positioned in the bending region are of a Gaussian waveform structure.
In a second aspect, the present application provides a display module, including:
a display panel;
the flexible circuit board is electrically connected with the display panel and comprises a substrate layer and a metal layer;
the flexible circuit board comprises a bending region, and at least the substrate layer and/or the metal layer which are positioned in the bending region are of a Gaussian waveform structure;
the display panel comprises a binding area, one end of the flexible circuit board is electrically connected with the binding area, and the other end of the flexible circuit board is bent to one side, away from the light emitting surface, of the display panel through the bending area.
In a third aspect, the present application provides a method for preparing a flexible circuit board, for preparing the flexible circuit board described above;
at least the substrate layer and/or the metal layer positioned in the bending region is of a Gaussian waveform structure; or alternatively, the first and second heat exchangers may be,
at least the substrate layer and the metal layer which are positioned in the bending area are of double-helix overlapped Gaussian waveform structures;
the method comprises the following steps:
printing by using a continuous fiber reinforced composite material to obtain the substrate layer by adopting a 3D printing technology;
the 3D printing technology is adopted to print the powdery metal layer by layer to obtain the metal layer
In a fourth aspect, the present application provides a method of manufacturing a flexible circuit board,
the flexible circuit board comprises a bending region, and at least the substrate layer and/or the metal layer which are positioned in the bending region are of a Gaussian waveform structure;
the method comprises the following steps:
providing a Gaussian waveform mold;
manufacturing a substrate layer on the surface of the Gaussian waveform mold;
and manufacturing a metal layer on one side of the substrate layer far away from the Gaussian waveform mold.
Compared with the prior art, the flexible circuit board, the preparation method thereof and the display module provided by the invention have the advantages that at least the following beneficial effects are realized:
the application provides a flexible circuit board and preparation method thereof, display module assembly, flexible circuit board include substrate layer and metal level at least, including bending region in the flexible circuit board, set up substrate layer and/or the metal level in bending region in the flexible circuit board at least and make into gaussian wave structure, through making substrate layer and/or the metal level in bending region in the flexible circuit board as non-planar structure to at least bending region in the flexible circuit board can have better bending performance.
Of course, it is not necessary for any one product embodying the invention to achieve all of the technical effects described above at the same time.
Other features of the present invention and its advantages will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a top view of a flexible circuit board according to an embodiment of the present application;
FIG. 2 is a cross-sectional view of AA' of FIG. 1 provided in an embodiment of the present application;
FIG. 3 is another cross-sectional view of AA' of FIG. 1 provided in an embodiment of the present application;
FIG. 4 is another cross-sectional view of AA' of FIG. 1 provided in an embodiment of the present application;
FIG. 5 is another cross-sectional view of AA' of FIG. 1 provided in an embodiment of the present application;
FIG. 6 is another cross-sectional view of AA' of FIG. 1 provided in an embodiment of the present application;
FIG. 7 is a cross-sectional view of BB' of FIG. 1 provided in an embodiment of the present application;
FIG. 8 is another cross-sectional view of BB' of FIG. 1 provided in an embodiment of the present application;
fig. 9 is a top view of a display module according to an embodiment of the disclosure;
fig. 10 is a cross-sectional view of a display module according to an embodiment of the disclosure;
FIG. 11 is a cross-sectional view of a flexible circuit board according to an embodiment of the present application in a flattened state;
fig. 12 is a flowchart of a method for manufacturing a flexible circuit board according to an embodiment of the present application
Fig. 13 is another flowchart of a method for manufacturing a flexible circuit board according to an embodiment of the present application.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise.
The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
In the prior art, when using flexible circuit board, there is the demand that needs to buckle in order to adapt to the application scene to flexible circuit board, and most use planar flexible circuit board to buckle in the conventional art to through using the paste glue in order to reach the flexible circuit board that buckles and paste and fix the purpose. However, polyimide has a certain bending resistance, so that when a planar flexible circuit board is bent, the planar flexible circuit board has the defect of larger bending radius, and the requirement on the adhesive performance of the adhesive is higher because the bent flexible circuit board has a certain rebound stress.
In view of the above, the invention provides a flexible circuit board, a manufacturing method thereof and a display module, so that the flexible circuit board can have better bending performance.
Fig. 1 is a top view of a flexible circuit board according to an embodiment of the present application, fig. 2 is a cross-sectional view of AA ' in fig. 1 according to an embodiment of the present application, fig. 3 is another cross-sectional view of AA ' in fig. 1 according to an embodiment of the present application, fig. 4 is another cross-sectional view of AA ' in fig. 1 according to an embodiment of the present application, please refer to fig. 1-4, and a flexible circuit board 100 is provided according to the present application, including a substrate layer 11 and a metal layer 12;
the flexible circuit board 100 includes a bending region 10, and at least a substrate layer 11 and/or a metal layer 12 located in the bending region 10 has a gaussian waveform structure.
Specifically, the present application provides a flexible circuit board 100, where the flexible circuit board 100 includes at least a substrate layer 11 and a metal layer 12, and the flexible circuit board 100 includes a bending region 10, and the bending region 10 may be used to implement bending or bending of a flexible display panel, as shown in fig. 2 and fig. 3, by setting at least the substrate layer 11 located in the region of the bending region 10 to be of a gaussian waveform structure, or setting at least the substrate layer 11 located in the region of the bending region 10 to be of a wave structure, or setting at least the metal layer 12 to be of a wave structure, the substrate layer 11 or the metal layer 12 of the gaussian waveform structure (wave structure) may enable the bending region 10 to have better scalability, so that the substrate layer 11 or the metal layer 12 in the region may have better bending performance than when it is in a flat state.
On the basis of the above, as shown in fig. 4, the substrate layer 11 and the metal layer 12 in the bending region 10 of the flexible circuit board 100 are provided with gaussian wave structures (wave structures), and the waveforms of the substrate layer 11 and the metal layer 12 in the bending region 10 are identical, so that the thickness of the substrate layer 11 can be equal everywhere, and the thickness of the metal layer 12 everywhere is identical, and the surface of one side of the substrate layer 11, which is close to the metal layer 12, can be completely bonded with the surface of one side of the metal layer 12, which is close to the substrate layer 11, so as to improve the fixing effect of the substrate layer 11 and the metal layer 12, thereby being beneficial to improving the fixing effect of the metal layer 12 and the substrate layer 11 in the bending region 10 of the flexible circuit board 100, reducing or even eliminating the risk of mutual peeling between the metal layer 12 and the substrate layer 11 in the bending region 10, and improving the service life of the flexible circuit board 100.
The substrate layer 11 and the metal layer 12 of the bending region 10 of the flexible circuit board 100 are provided with a wave-shaped structure, compared with the bending region 10 in a substantially flat (unbent) state, for example, when the bending region 10 is in a bending state, the wave-shaped amplitude is correspondingly reduced, and the wavelength is correspondingly increased; thereby avoiding the problem of overstressing the bending zone 10 during bending. In addition, the substrate layer 11 and the metal layer 12 are provided with wavy structures, and the substrate layer 11 and the metal layer 12 can be stretched or contracted to a certain extent to realize displacement of the two end side areas of the bending area 10 of the flexible circuit board 100, so that corresponding adjustment of specific positions of the two end side areas of the bending area 10 is realized to meet the requirements of the flexible circuit board 100 in different applications.
It should be noted that, the flexible circuit board 100 is not limited to include only the substrate layer 11 and the metal layer 12, and a user may set other film structures to be included in the flexible circuit board 100 according to actual requirements, so long as the substrate layer 11 and/or the metal layer 12 in the bending region 10 of the flexible circuit board 100 can be ensured to be in a gaussian waveform structure (wave structure) so as to ensure that the bending effect of the bending region 10 of the flexible circuit board 100 is good.
It should be further noted that the metal layer 12 in the flexible circuit board 100 may be made of copper metal, but the present application is not limited thereto, and the user may also select the rest of metal to make the metal layer 12 on the basis of ensuring the normal operation of the flexible circuit board 100, which is not particularly limited herein.
Fig. 5 is another cross-sectional view of AA' of fig. 1 provided in an embodiment of the present application, referring to fig. 1 and 5, optionally, the substrate layer 11 and the metal layer 12 in the bending region 10 have a double-spiral overlapping gaussian waveform structure.
Specifically, in addition to the above-mentioned arrangement of the substrate layer 11 and the metal layer 12 in the bending region 10 of the flexible circuit board 100 into a wave-shaped structure, the present application also provides an arrangement of the flexible circuit board 100, in which the substrate layer 11 and the metal layer 12 in the bending region 10 of the flexible circuit board 100 are arranged into a double-spiral overlapping gaussian wave-shaped structure, so that the substrate layer 11 and the metal layer 12 can be fixed in a twisting manner, thereby further improving the bending performance of the bending region 10 of the flexible circuit board 100.
It should be added that the base material layer 11 and the metal layer 12 of the double-spiral overlapped gaussian waveform structure comprise spiral nodes 13, and the double-spiral overlapped gaussian waveform structure can be fixed through connection between the spiral nodes 13.
Compared with the bending region 10 in a substantially flat (unbent) state, for example, when the bending region 10 is in a bent state, the distance between two adjacent spiral nodes 13 of the double-spiral overlapped gaussian waveform structure is correspondingly large; so that the problem of overstressing the bending zone 10 during bending can also be avoided.
In addition, the base material layer 11 and the metal layer 12 are set to be of a double-spiral overlapped gaussian waveform structure, and the base material layer 11 and the metal layer 12 can be stretched or contracted to a certain extent to realize displacement of the two end side areas of the bending area 10 of the flexible circuit board 100, so that corresponding adjustment of specific positions of the two end side areas of the bending area 10 is realized to meet the requirements of the flexible circuit board 100 in different applications.
Fig. 6 is a cross-sectional view of AA' of fig. 1 provided in an embodiment of the present application, referring to fig. 1 and 6, optionally, a double-spiral overlapping gaussian waveform structure includes a first spiral gaussian waveform member 111, a second spiral gaussian waveform member 121, and a first connecting member 14;
the base material layer 11 is a first spiral Gaussian waveform piece 111, and the metal layer 12 is a second spiral Gaussian waveform piece 121; the two ends of the first connecting piece 14 are respectively connected with the first spiral Gaussian waveform piece 111 and the second spiral Gaussian waveform piece 121;
the double-helix overlapped Gaussian waveform structure integrally presents a DNA double-helix structure.
Specifically, the present application also provides another structure in which the base material layer 11 and the metal layer 12 of the bending region 10 are a double-spiral overlapping gaussian waveform structure, and the double-spiral overlapping gaussian waveform structure includes a first spiral gaussian waveform member 111, a second spiral gaussian waveform member 121, and a first connecting member 14 fixedly connecting the first spiral gaussian waveform member 111 and the second spiral gaussian waveform member 121; the first spiral gaussian waveform 111 is a base material layer 11, the second spiral gaussian waveform 121 is a metal layer 12, and a plurality of first connecting pieces 14 are fixed between the base material layer 11 and the metal layer 12.
The substrate layer 11 and the metal layer 12 are spiral like a "twist" around a common axis in the right hand direction, and the substrate layer 11 and the metal layer 12 are parallel to each other and are opposite in direction when spiral so as to form a double-spiral configuration, and are connected by a plurality of first connecting pieces 14; that is, the structure formed by the base material layer 11, the metal layer 12 and the plurality of first connectors 14 is specifically represented as a DNA double helix structure.
The first connecting member 14 is optionally made of a flexible metal, on the basis that the structure formed by the base material layer 11, the metal layer 12 and the plurality of first connecting members 14 is in a DNA double helix structure. The first connecting piece 14 is made of flexible metal, so that when the bending area 10 of the flexible circuit board 100 is in a bending state, the distance between the substrate layer 11, the metal layer 12 and the common axis is reduced, and the first connecting piece 14 with flexibility can be correspondingly shortened or deformed, so that the risk of breakage of the substrate layer 11 and the metal layer 12 is avoided, and the bending performance of the bending area 10 of the flexible circuit board 100 is improved.
In addition, the substrate layer 11 and the metal layer 12 are provided with a DNA double helix structure, and the substrate layer 11 and the metal layer 12 can be stretched or contracted to a certain extent to realize displacement of the two end side areas of the bending area 10 of the flexible circuit board 100, so as to correspondingly adjust the specific positions of the two end side areas of the bending area 10, thereby meeting the requirements of the flexible circuit board 100 in different applications.
Fig. 7 is a cross-sectional view of BB' in fig. 1 provided in an embodiment of the present application, referring to fig. 1 and 7, optionally, the flexible circuit board 100 further includes a flat area 20, the flat area 20 includes a first sub-flat area 21 and a second sub-flat area 22, and the bending area 10 is located between the first sub-flat area 21 and the second sub-flat area 22;
the substrate layer 11 and/or the metal layer 12 in the flat region 20 has a gaussian waveform structure.
Specifically, the flexible circuit board 100 further includes a flat area 20 in addition to the bending area 10, where the flat area 20 may include a first sub-flat area 21 and a second sub-flat area 22, and the first sub-flat area 21 and the second sub-flat area 22 are respectively disposed on two sides of the bending area 10, and besides the above-mentioned arrangement that the substrate layer 11 and/or the metal layer 12 in the bending area 10 are in a gaussian waveform structure, the substrate layer 11 and/or the metal layer 12 in the first sub-flat area 21 and/or the second sub-flat area 22 may also be in a gaussian waveform structure, so that the bending performance of the whole flexible circuit board 100 can be improved.
It should be noted that, in the first sub-flat region 21 and the second sub-flat region 22 in the flexible circuit board 100 of the present application, besides the substrate layer 11 and the metal layer 12, the remaining film layer structures on the side of the substrate layer 11 far from the metal layer 12 and the remaining film layer structures on the side of the metal layer 12 far from the substrate layer 11 may be included, so all the substrate layers 11 and the metal layers 12 in the flexible circuit board 100 may be provided with gaussian wave structures, and the surfaces on the side of the remaining film layer structures on the side of the first sub-flat region 21 and the second sub-flat region 22 far from the substrate layer 11/the metal layer 12 are flat surfaces; when the flexible circuit board 100 is attached to and fixed to the display panel, the flattened surface is favorable for facilitating attaching operation, and ensuring close attachment between the flexible circuit board 100 and the display panel everywhere.
Fig. 8 is another cross-sectional view of BB' in fig. 1 provided in an embodiment of the present application, referring to fig. 1 and 8, optionally further including an insulating protection layer 15, where the insulating protection layer 15 includes a first insulating protection layer 151 and a second insulating protection layer 152, and the metal layer 12 includes a first metal layer 122 and a second metal layer 123;
along the direction perpendicular to the plane of the flexible circuit board 100, the first metal layer 122 and the first insulating protection layer 151 are sequentially disposed on the first side of the substrate layer 11, and the second metal layer 123 and the second insulating protection layer 152 are sequentially disposed on the second side of the substrate layer 11;
the first side and the second side are opposite sides in a direction perpendicular to the plane in which the substrate layer 11 lies.
Specifically, the flexible circuit board 100 further includes an insulating protection layer 15, the insulating protection layer 15 may include a first insulating protection layer 151 and a second insulating protection layer 152, the flexible circuit board 100 still includes the substrate layer 11 described above, the metal layer 12 may include a first metal layer 122 and a second metal layer 123, and at this time, the specific film layer structure of the flexible circuit board 100 is that, along the direction perpendicular to the plane where the flexible circuit board 100 is located, the first metal layer 122 and the first insulating protection layer 151 are sequentially disposed on a first side of the substrate layer 11, and the second metal layer 123 and the second insulating protection layer 152 are sequentially disposed on a second side of the substrate layer 11, that is, the first metal layer 122 and the second metal layer 123 are at least partially disposed symmetrically with respect to the substrate layer 11, and the first insulating protection layer 151 and the second insulating protection layer 152 are symmetrically disposed with respect to the three film layer structures of the first metal layer 122, the substrate layer 11 and the second metal layer 123.
At this time, at least one of three film structures including the first metal layer 122, the base material layer 11 and the second metal layer 123 may be selected to have a gaussian wave structure (wave structure); optionally, as shown in fig. 8, when the three film layers of the first metal layer 122, the substrate layer 11 and the second metal layer 123 are all in a gaussian wave structure (wave structure), the waveforms of the substrate layer 11, the first metal layer 122 and the second metal layer 123 may be all identical, so that the surface of the substrate layer 11 near the first metal layer 122 may be completely attached to the surface of the substrate layer 11 near the first metal layer 122, the surface of the substrate layer 11 near the second metal layer 123 may be completely attached to the surface of the substrate layer 123 near the substrate layer 11, so as to improve the fixing effect of the substrate layer 11 and the first metal layer 122, the second metal layer 123, respectively, on the basis of improving the bending performance of the flexible circuit board 100, and further facilitate improving the fixing effect of the first metal layer 122 and the substrate layer 11, the second metal layer 123 and the substrate layer 11, and reducing or even eliminating the risk of mutual stripping between the first metal layer 122 and the substrate layer 11, the second metal layer 123 and the substrate layer 11, and the service life of the flexible circuit board 100.
When the substrate layer 11, the first metal layer 122 and the second metal layer 123 of the flexible circuit board 100 are all in a wave-shaped structure, compared with the state that the substrate layer is flat (not bent), when the substrate layer is in a bending state, the wave-shaped amplitude can be correspondingly reduced, and the wavelength can be correspondingly increased, so that the problem of overlarge stress during bending is avoided, and the bending effect of the flexible circuit board 100 is improved.
As shown in fig. 1 and 8, the present application provides an alternative embodiment, and optionally, the flexible circuit board 100 further includes a flat area 20, and the insulating protection layer 15 is only located in the flat area 20. That is, when the flexible circuit board 100 includes the inflection region 10 and the flat region 20, the first insulating protection layer 151 and the second insulating protection layer 152 may be disposed only in the flat region 20, and the substrate layer 11, the first metal layer 122 and the second metal layer 123 may be disposed only in the inflection region 10, or the substrate layer 11, the first metal layer 122 and the second metal layer 123 may be disposed further in the flat region 20; the application is not particularly limited, and the user can correspondingly adjust the device according to actual use requirements.
Fig. 9 is a top view of a display module provided in an embodiment of the present application, fig. 10 is a cross-sectional view of the display module provided in an embodiment of the present application, please refer to fig. 9 and 10 in conjunction with fig. 1-8, and based on the same inventive concept, the present application further provides a display module 300, which includes:
a display panel 200;
a flexible circuit board 100 electrically connected to the display panel 200, the flexible circuit board 100 including a base material layer 11, a metal layer 12;
the flexible circuit board 100 includes a bending region 10, and at least a substrate layer 11 and/or a metal layer 12 located in the bending region 10 has a gaussian waveform structure;
the display panel 200 includes a binding area 201, one end of the flexible circuit board 100 is electrically connected with the binding area 201, and the other end is bent to a side of the display panel 200 facing away from the light emitting surface through the bending area 10.
Specifically, the application further provides a display module 300, the display module 300 includes a display panel 200 and a flexible circuit board 100 electrically connected to the display panel 200, the flexible circuit board 100 includes at least a substrate layer 11 and a metal layer 12, and the flexible circuit board 100 includes a bending region 10, the bending region 10 can be used to implement bending or bending of the flexible display panel 200, the substrate layer 11 at least located in the region of the bending region 10 is of a gaussian waveform structure, or the metal layer 12 is of a gaussian waveform structure, or the substrate layer 11 at the region of the bending region 10 is of a wave structure, or the metal layer 12 is of a wave structure, and the substrate layer 11 or the metal layer 12 of the gaussian waveform structure (wave structure) can enable the bending region 10 to have better scalability, so that the substrate layer 11 or the metal layer 12 in the region can have better bending performance compared with the substrate layer 11 or the metal layer 12 in the region in a flat state.
The display panel 200 includes a binding area 201, and when the flexible circuit board 100 is electrically connected to and attached to the display panel 200, specifically, one end of the flexible circuit board 100 is electrically connected to the binding area 201 on the front side of the display panel 200, and the other end is bent/curved to the back side of the display panel 200 through the bending area 10, and can be further fixed to the back side of the display panel 200 in a bonding manner or the like, so that the electrical connection and fixing effects of the flexible circuit board 100 and the display panel 200 are better, the stability of the whole display module 300 is improved, and the service life of the display module 300 is ensured.
According to the method, the substrate layer 11 and/or the metal layer 12 at least located in the bending area 10 are/is arranged to be of a Gaussian waveform structure, so that when the flexible circuit board 100 and the display panel 200 are electrically connected in alignment, movement of the display panel 200 can be avoided, accurate alignment of the binding area 201 of the flexible circuit board 100 and the display panel 200 can be achieved through stretching/shrinking of the flexible circuit board 100, after the flexible circuit board 100 and the display panel 200 are bound, the other end of the flexible circuit board 100, far away from the display panel 200, can be bent to the back of the display panel 200 through bending/bending, and the problem that stress caused by bending of the flexible circuit board 100 is overlarge and breakage is avoided.
It should be added that the display module 300 including the flexible circuit board 100 provided in the present application may be used for: the display device is used in any product and component with display functions such as mobile phones, tablet computers, televisions, displays, notebook computers, navigator and the like.
Fig. 11 is a cross-sectional view of a flexible circuit board in a flat state according to an embodiment of the present application, referring to fig. 11 in conjunction with fig. 1-10, and optionally further including an adhesive layer 16;
in the bending zone 10, an adhesive layer 16 is applied to at least a portion of the side of the metal layer 12 remote from the substrate layer 11.
Specifically, the display module 300 may further include an adhesive layer 16 in addition to the substrate layer 11 and the metal layer 12, and after the substrate layer 11 and the metal layer 12 with the gaussian waveform structure are bent to the back of the display panel 200 and fixed, the substrate layer 11 and the metal layer 12 in the bending region 10 are fixed by coating the adhesive layer 16 on the surface of one side of at least part of the metal layer 12 away from the substrate layer 11, so that the substrate layer 11 and the metal layer 12 in the bending region 10 are in a stable state, thereby improving the stability of the whole display module 300; at the same time, the adhesive layer 16 is coated on the surface of the metal layer 12, which is beneficial to preventing the risk of corrosion of the metal layer 12 caused by invasion of substances such as water vapor; further guaranteeing the service life of the display module 300.
It should be added that the adhesive layer 16 may be selected from UV (ultraviolet light curing) adhesive or silicone, which is not limited in this application, and the materials used for the adhesive layer 16 may be selected according to actual requirements.
Fig. 12 is a flowchart of a method for manufacturing a flexible circuit board according to an embodiment of the present application, please refer to fig. 12 in combination with fig. 1-11, and further provides a method for manufacturing a flexible circuit board 100 based on the same inventive concept, for manufacturing the aforementioned flexible circuit board 100;
at least the substrate layer 11 and/or the metal layer 12 at the bending region 10 has a gaussian waveform structure; or alternatively, the first and second heat exchangers may be,
at least the base material layer 11 and the metal layer 12 which are positioned in the bending region 10 are of double-spiral overlapped Gaussian waveform structures;
the method comprises the following steps:
step 41, printing by using a 3D printing technology and using a continuous fiber reinforced composite material to obtain a substrate layer 11;
step 42, using 3D printing technology, the powdered metal is printed layer by layer to obtain the metal layer 12.
Specifically, the present disclosure discloses a method for manufacturing a flexible circuit board 100, where the flexible circuit board 100 includes at least a substrate layer 11 and/or a metal layer 12 that are embodied in a wave structure, or where the flexible circuit board 100 includes at least a substrate layer 11 and a metal layer 12 that are embodied in a double-spiral overlapping gaussian wave structure, the substrate layer 11 and the metal layer 12 may be manufactured by using a 3D printing technology.
The substrate layer 11 may be printed out using a continuous fiber reinforced composite material, in particular by using a 3D printing technique, and the metal layer 12 may be obtained by further printing powdered metal layer by using a 3D printing technique.
It should be noted that the substrate layer 11 and the metal layer 12 may be made of a graphene-like high-order material instead.
Specifically, a laser sintering process (SLS) may be selected to manufacture the metal layer 12, and a powdered metal material is used, and the metal powder is scanned and irradiated by a laser to realize sintering and bonding of the material, so that the metal material is stacked layer by layer to realize forming. A layer of metal material is firstly paved on the upper surface of a formed spiral workpiece by adopting a compression roller, scanning irradiation is carried out on the metal powder layer according to the section outline of the layer by using a numerical control laser beam, so that the temperature of the metal powder is raised to a melting point, thereby sintering is carried out, and bonding is realized on the node part (the first connecting piece 14) formed below.
Fig. 13 is another flowchart of a method for manufacturing a flexible circuit board according to an embodiment of the present application, please refer to fig. 13 in combination with fig. 1-11, and based on the same inventive concept, the present application further provides a method for manufacturing a flexible circuit board 100, where the flexible circuit board 100 includes a substrate layer 11 and a metal layer 12;
the flexible circuit board 100 comprises a bending region 10, and at least a substrate layer 11 and a metal layer 12 positioned in the bending region 10 are of a Gaussian waveform structure;
the method comprises the following steps:
step 51, providing a Gaussian waveform mold;
step 52, manufacturing a substrate layer 11 on the surface of the Gaussian waveform mold;
step 53, manufacturing a metal layer 12 on one side of the substrate layer 11 far away from the Gaussian waveform mold;
and step 54, stripping the Gaussian waveform mold.
Specifically, when at least part of the substrate layer 11 and the metal layer 12 are in a wave-shaped structure, the substrate layer 11 and the metal layer 12 with the wave-shaped structure can be manufactured by providing a mold with the wave-shaped structure, forming the substrate layer 11 on the surface of the mold, further manufacturing the metal layer 12 on the surface of the substrate layer 11 away from the mold, and then stripping the wave-shaped mold from the surface of the substrate layer 11 away from the metal layer 12. The method has simple process and low cost, is beneficial to reducing the manufacturing cost of the flexible circuit board 100 and improving the manufacturing efficiency of the flexible display panel 200.
According to the embodiment, the flexible circuit board, the preparation method thereof and the display module provided by the invention have the following beneficial effects:
the application provides a flexible circuit board and preparation method thereof, display module assembly, flexible circuit board include substrate layer and metal level at least, including bending region in the flexible circuit board, set up substrate layer and/or the metal level in bending region in the flexible circuit board at least and make into gaussian wave structure, through making substrate layer and/or the metal level in bending region in the flexible circuit board as non-planar structure to at least bending region in the flexible circuit board can have better bending performance.
While certain specific embodiments of the invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (8)
1. A flexible circuit board is characterized by comprising a substrate layer and a metal layer;
the flexible circuit board comprises a bending region, and at least the substrate layer and the metal layer which are positioned in the bending region are of double-helix overlapped Gaussian waveform structures;
the double-spiral overlapped Gaussian waveform structure comprises a first spiral Gaussian waveform piece, a second spiral Gaussian waveform piece and a first connecting piece;
the substrate layer is the first spiral Gaussian waveform piece, and the metal layer is the second spiral Gaussian waveform piece; the two ends of the first connecting piece are respectively connected with the first spiral Gaussian waveform piece and the second spiral Gaussian waveform piece;
the whole double-helix overlapped Gaussian waveform structure presents a DNA double-helix structure.
2. The flexible circuit board of claim 1, wherein the first connector is made of a flexible metal.
3. The flexible circuit board of claim 1, further comprising a flat region comprising a first sub-flat region and a second sub-flat region, the inflection region being located between the first sub-flat region and the second sub-flat region;
the substrate layer and/or the metal layer in the flat region has a Gaussian waveform structure.
4. The flexible circuit board of claim 1, further comprising an insulating protective layer comprising a first insulating protective layer and a second insulating protective layer, the metal layer comprising a first metal layer and a second metal layer;
the first metal layer and the first insulating protection layer are sequentially arranged on the first side of the substrate layer along the direction perpendicular to the plane where the flexible circuit board is located, and the second metal layer and the second insulating protection layer are sequentially arranged on the second side of the substrate layer;
the first side and the second side are opposite sides along a direction perpendicular to a plane in which the substrate layer is located.
5. The flexible circuit board of claim 4, further comprising a flat region, wherein the insulating protective layer is located only in the flat region.
6. A display module, comprising:
a display panel;
the flexible circuit board is electrically connected with the display panel and comprises a substrate layer and a metal layer;
the flexible circuit board comprises a bending region, and at least the substrate layer and the metal layer which are positioned in the bending region are of double-helix overlapped Gaussian waveform structures;
the double-spiral overlapped Gaussian waveform structure comprises a first spiral Gaussian waveform piece, a second spiral Gaussian waveform piece and a first connecting piece;
the substrate layer is the first spiral Gaussian waveform piece, and the metal layer is the second spiral Gaussian waveform piece; the two ends of the first connecting piece are respectively connected with the first spiral Gaussian waveform piece and the second spiral Gaussian waveform piece;
the whole double-helix overlapped Gaussian waveform structure presents a DNA double-helix structure;
the display panel comprises a binding area, one end of the flexible circuit board is electrically connected with the binding area, and the other end of the flexible circuit board is bent to one side, away from the light emitting surface, of the display panel through the bending area.
7. The display module assembly of claim 6, further comprising an adhesive layer;
in the bending area, the adhesive layer is coated on one side of at least part of the metal layer far away from the substrate layer.
8. A method of manufacturing a flexible circuit board, characterized by being used for manufacturing the flexible circuit board according to any one of claims 1 to 5;
at least the substrate layer and the metal layer which are positioned in the bending area are of double-helix overlapped Gaussian waveform structures;
the method comprises the following steps:
printing by using a continuous fiber reinforced composite material to obtain the substrate layer by adopting a 3D printing technology; and (3) adopting a 3D printing technology, and printing the powdery metal layer by layer to obtain the metal layer.
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| CN114980492A (en) * | 2022-06-28 | 2022-08-30 | 昆山国显光电有限公司 | Circuit board assembly, display screen and electronic equipment |
| CN117135808A (en) * | 2023-04-21 | 2023-11-28 | 荣耀终端有限公司 | Flexible circuit board, watchband and wearable equipment |
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