CN108770184A - Flexible PCB, flexible circuit board manufacturing method and flexible display panels - Google Patents

Flexible PCB, flexible circuit board manufacturing method and flexible display panels Download PDF

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Publication number
CN108770184A
CN108770184A CN201810529331.2A CN201810529331A CN108770184A CN 108770184 A CN108770184 A CN 108770184A CN 201810529331 A CN201810529331 A CN 201810529331A CN 108770184 A CN108770184 A CN 108770184A
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China
Prior art keywords
layer
insulating protective
flexible
protective layer
flexible pcb
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Application number
CN201810529331.2A
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Chinese (zh)
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CN108770184B (en
Inventor
熊水浒
黄秀颀
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Guangzhou Guoxian Technology Co., Ltd
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Kunshan Guoxian Photoelectric Co Ltd
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Priority to CN201810529331.2A priority Critical patent/CN108770184B/en
Publication of CN108770184A publication Critical patent/CN108770184A/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09045Locally raised area or protrusion of insulating substrate

Abstract

This application involves a kind of flexible PCB, flexible circuit board manufacturing method and flexible display panels, which includes substrate layer, circuit turn-on layer and insulating protective layer;The circuit turn-on is laminated to fit with the substrate layer, and the circuit turn-on layer another side fits with the insulating protective layer;The substrate layer, circuit turn-on layer and insulating protective layer are the curve shape structure agreed with mutually.Since flexible PCB is curve shape structure, it can be easier to realize flexible bending, and crooked process radius can be reduced, and reduce the rebound stress of flexible PCB, so that flexible PCB has better bending performance, process can also reduce the paste performance requirement of glue in practical application, and then achieve the purpose that reduce cost.

Description

Flexible PCB, flexible circuit board manufacturing method and flexible display panels
Technical field
This application involves technical field of display panel, more particularly to a kind of flexible PCB, flexible PCB making side Method and flexible display panels.
Background technology
Flexible PCB (FPC, Flexible Printed Circuit) is that one kind is with polyimides or polyester film Flexible printed circuit made of base material has the characteristics that Distribution density is high, light-weight, thickness is thin.Using flexible circuit When plate, exists and need to bend flexible PCB to adapt to the demand of application scenarios, be mostly to use plane in traditional technology The flexible PCB of shape is bent, and by using glue with the flexible PCB for reaching to bending paste and Fixed purpose.
However, since polyimides has certain buckle resistance, it is bent to planar flexible circuit board When, have the shortcomings that crooked process radius is larger, also, since the flexible PCB of bending has certain rebound stress, to pasting The paste performance of glue requires also relatively high.
Invention content
Based on this, it is necessary in view of the above technical problems, provide a kind of better flexible PCB of bending performance, flexible electrical Road board manufacturing method and flexible display panels.
A kind of flexible PCB, including:Substrate layer, circuit turn-on layer and insulating protective layer;
The circuit turn-on is laminated to fit with the substrate layer, and the circuit turn-on layer another side is protected with the insulation Sheath fits;
The substrate layer, circuit turn-on layer and insulating protective layer are the curve shape structure agreed with mutually.
The curve shape includes in one of the embodiments,:Sine wave curve, square-wave curve, sawtooth curve and Triangular wave curve.
The insulating protective layer offers fenestration in one of the embodiments,.
The insulating protective layer is provided with protection against oxidation structure, the protection against oxidation in one of the embodiments, Structure covers the fenestration.
The flexible PCB is doubling plate in one of the embodiments, and the circuit turn-on layer includes the first circuit Conductting layer and second circuit conductting layer, the insulating protective layer include the first insulating protective layer and the second insulating protective layer;
The base material it is laminated with first circuit turn-on is laminated fits, the first circuit turn-on layer another side It fits with the first insulating protective layer any surface;Laminated be affixed is connected with the second circuit in the substrate layer another side It closes, the second circuit conductting layer another side fits with the second insulating protective layer any surface.
A kind of flexible circuit board manufacturing method, including heat-press step and superposition step;
The heat-press step, including:The substrate layer, circuit turn-on layer and insulating protective layer of the flexible PCB are carried out Hot press operation is so that substrate layer, circuit turn-on layer and insulating protective layer after hot pressing are the curve shape structure agreed with mutually;
The superposition step, including:The substrate layer, circuit turn-on layer and insulating protective layer of the flexible PCB are carried out Superposition pressing is to obtain flexible PCB, and in the flexible PCB, the circuit turn-on is laminated to be affixed with the substrate layer It closes, the circuit turn-on layer another side fits with the insulating protective layer.
The execution sequence of the heat-press step and superposition step can be interchanged in one of the embodiments,.
In one of the embodiments, in the heat-press step, the temperature range of the hot press operation be 20 degrees Celsius extremely 400 degrees Celsius.
In one of the embodiments, in the heat-press step, substrate layer, the circuit to the flexible PCB is led Logical layer and insulating protective layer carry out hot press operation so that substrate layer, circuit turn-on layer and insulating protective layer after hot pressing are mutual The step of curve shape structure agreed with, including:
Integral heat pressure operation is carried out to the substrate layer, circuit turn-on layer and insulating protective layer, so that the base after hot pressing The curve shape structure that material layer entirety, circuit turn-on layer entirety and insulating protective layer generally agree with mutually;Or,
Local hot press operation is carried out to the substrate layer, circuit turn-on layer and insulating protective layer, so that the base after hot pressing Material layer part, circuit turn-on layer part and insulating protective layer are locally the curve shape structure agreed with mutually.
A kind of flexible display panels, including:
Flexible display substrates;
It is set to the flexible printed circuit board away from the display surface side of the flexible display substrates;
Chip on film for connecting the flexible display substrates and the flexible printed circuit board, the chip on film packet It includes above-mentioned flexible PCB and is set to the IC chip of the flexible circuit plate surface.
Above-mentioned flexible PCB, flexible circuit board manufacturing method and flexible display panels, the flexible PCB include base material Layer, circuit turn-on layer and insulating protective layer;The circuit turn-on is laminated to fit with the substrate layer, the circuit turn-on layer Another side fits with the insulating protective layer;The substrate layer, circuit turn-on layer and insulating protective layer are the song agreed with mutually Wire shaped structure.Since flexible PCB is curve shape structure, can be easier to realize flexible bending, and bending half can be reduced Diameter, and the rebound stress of flexible PCB is reduced, so that flexible PCB has better bending performance, practical application Middle process can also reduce the paste performance requirement of glue, and then achieve the purpose that reduce cost.
Description of the drawings
Fig. 1 is the structural schematic diagram of flexible PCB in one embodiment;
Fig. 2 is the structural schematic diagram of flexible PCB in another embodiment;
Fig. 3 is the exemplary plot of curve shape in one embodiment;
Fig. 4 is the structural schematic diagram of the doubling plate of square-wave curve shape and structure in one embodiment;
Fig. 5 is the structural schematic diagram of the lamina of sine wave curve shape and structure in one embodiment;
Fig. 6 is the structural schematic diagram of the lamina of sine wave curve shape and structure in another embodiment;
Fig. 7 is the flow diagram of flexible circuit board manufacturing method in one embodiment;
Fig. 8 is the flow diagram of flexible circuit board manufacturing method in another embodiment;
Fig. 9 is the flow diagram of flexible circuit board manufacturing method in another embodiment;
Figure 10 is the structural schematic diagram of flexible display panels in one embodiment.
Specific implementation mode
It is with reference to the accompanying drawings and embodiments, right in order to make the object, technical solution and advantage of the application be more clearly understood The application is further elaborated.It should be appreciated that specific embodiment described herein is only used to explain the application, not For limiting the application.
Each layer structure of flexible PCB is all flat shape structure in tiling in traditional technology, although each layer structure has Standby certain bending performance, but there is a problem of that bending is difficult and crooked process radius is larger, if desired reduce its bending by force Radius can may also damage flexible PCB.In addition, due to flat shape flexible PCB bending when there are one Fixed internal stress, therefore the paste performance for fixing the glue of deformation after it bends to maintenance also has higher requirement.
The application provides a kind of flexible PCB, which is the flexible PCB of curve shape structure, specifically Including substrate layer, circuit turn-on layer and insulating protective layer.Circuit turn-on is laminated to fit with substrate layer, and circuit turn-on layer is another Face fits with insulating protective layer;Substrate layer, circuit turn-on layer and insulating protective layer are the curve shape structure agreed with mutually.It is bent The flexible PCB of wire shaped has better bending performance compared to the flexible PCB of the flat shape in traditional technology, It can be easier to carry out it flexible bending operation, and its crooked process radius can be reduced to a certain extent.In addition, can also reduce The paste performance requirement of the glue of deformation after maintaining flexible PCB to fix bending.
Specifically, flexible PCB can be lamina or doubling plate.Lamina is general only in the base material of flexible PCB The one side of layer is equipped with circuit-line, and doubling plate is to be designed with circuit-line on the two sides of the substrate layer of flexible PCB.User The type that flexible PCB to be used can be needed according to actual conditions selection, due to the lamina and bilayer of curve shape structure Plate has better bending performance, so as to be easy to carry out flexible bending operation.
In one embodiment, flexible PCB is lamina.As shown in Figure 1, with the list of sine wave curve shape and structure For laminate, lamina includes substrate layer 110, circuit turn-on layer 120 and insulating protective layer 130,120 one side of circuit turn-on layer with 110 any surface of substrate layer fits, and 120 another side of circuit turn-on layer fits with 130 any surface of insulating protective layer.Substrate layer 110, circuit turn-on layer 120 and insulating protective layer 130 are the curve shape structure agreed with mutually.Curve shape in the present embodiment The lamina of structure for the lamina compared to the flat shape structure in traditional technology, has better bending performance, can To be easier to carry out it flexible bending operation, and its crooked process radius can be reduced to a certain extent.
In one embodiment, flexible PCB is doubling plate, and in doubling plate, circuit turn-on layer is led including the first circuit Logical layer and second circuit conductting layer, insulating protective layer include the first insulating protective layer and the second insulating protective layer.Base material is laminated With the first circuit turn-on is laminated fits, the first conductting layer another side fits with the first insulating protective layer any surface;Base material Layer another side be connected with second circuit it is laminated fit, second circuit conductting layer another side and the second insulating protective layer any surface It fits.In the present embodiment, not about the first, second name order of circuit turn-on layer in doubling plate and insulating protective layer Considered critical, the two can be interchanged.
As shown in Fig. 2, by taking the doubling plate of sine wave curve shape and structure as an example, doubling plate includes the 210, first electricity of substrate layer Road conductting layer 220, the first insulating protective layer 230, second circuit conductting layer 240 and the second insulating protective layer 250, substrate layer 210 It fits while with the first circuit turn-on layer 220,220 another side of the first conductting layer and the first insulating protective layer 230 are any Face fits.210 another side of substrate layer fits on one side with second circuit conductting layer 240,240 another side of second circuit conductting layer It fits with 250 any surface of the second insulating protective layer.The doubling plate of curve shape structure in the present embodiment, compared to traditional skill For the doubling plate of flat shape structure in art, have better bending performance, can be easier to carry out flexible bending to it Operation, and its crooked process radius can be reduced to a certain extent.
In one embodiment, as shown in figure 3, the curve shape of substrate layer, circuit turn-on layer and insulating protective layer includes Sine wave curve, square-wave curve, triangular wave curve and sawtooth curve etc..Wherein, sine wave curve refers to being connected successively by multiple The curve that the segmental arc (S-shaped structure) connect is constituted is in wave shape;Square-wave curve refers to by multiple sequentially connected bow fonts The curve that structure is constituted;Triangular wave curve refers to the curve being made of multiple v-shaped structures alternate successively;Sawtooth curve refers to By the curve of multiple N shapes (positive N shapes or anti-N shapes) structure compositions alternate successively.Above-mentioned curve shape all includes alternate successively Wave crest and trough.
Specifically, as shown in figure 4, by taking the doubling plate of square-wave curve shape and structure as an example, which includes substrate layer 210, the first circuit turn-on layer 220, the first insulating protective layer 230, second circuit conductting layer 240 and the second insulating protective layer 250, Each layer structure is the square-wave curve shape and structure agreed with mutually.
It should be noted that being the purpose that each layer structure hot pressing is curve shape to improve the bending of each layer structure Can, therefore the curve shape in the present embodiment is not limited to provided in Fig. 3 four kinds of curve shapes, according to above-mentioned four kinds of curves The curve shape and other curve shapes that can improve bending performance that shape derives also belong to current embodiment require that protecting Within the scope of shield.
In addition it is also necessary to explanation, above-mentioned curve shape can be the sine wave curve, square-wave curve, sawtooth of standard Wave profile and triangular wave curve, that is, the position of each wave crest of each curve and trough is identical;Above-mentioned curved shape Shape can also be off-gauge sine wave curve, square-wave curve, sawtooth curve and triangular wave curve, that is, each curve The position of each wave crest and trough can also be different, can according in actual conditions to the position of wave crest and trough into Row adjustment, to achieve the purpose that be adjusted flexibly according to actual needs to flexible circuit board bending performance.
In the present embodiment, substrate layer, circuit turn-on layer and insulating protective layer in flexible PCB are to agree with mutually just String curve wire shaped or square-wave curve shape or the curve shapes such as sawtooth curve shape or triangular wave curve, to reach Improve the purpose of the bending performance of each layer structure.
In one embodiment, the insulating protective layer offers fenestration.In flexible PCB manufacture craft, base Material layer is usually using polyimides or PET (Polyethylene terephthalate, polyethylene terephthalate) Equal other materials do substrate, and for circuit turn-on layer usually using layers of copper or other metal material layers, insulating protective layer is usually used Polyimide covercoat.Polyimide material has the characteristics that high temperature resistant, low temperature resistant, corrosion resistant, however, since the material has Certain buckle resistance energy, to which certain influence can be generated to the bending performance of flexible PCB, therefore, in the present embodiment, By opening up fenestration in insulating protective layer, to remove the polyurethane material of insulating protective layer local surfaces, with further Improve the bending performance of flexible PCB.
It opens a window in the insulating protective layer to sine wave curve shape, sawtooth curve shape and triangular wave curve shape When processing operation, wave crest and/or the part polyimide of wave trough position can be chosen to remove;In the insulation to square-wave curve shape When protective layer carries out windowing processing operation, can be chosen to remove face where high level position with and/or low level position place The polyimide in face.The size of windowing can be selected according to actual conditions.Specifically, as shown in figure 5, with sine wave curve For the lamina of shape and structure, lamina includes substrate layer 110, circuit turn-on layer 120 and insulating protective layer 130, is being insulated The crest location of protective layer 130 offers fenestration 132.
The present embodiment can reduce the rebound stress of insulating protective layer by opening up fenestration in insulating protective layer, from And it can be more smoothed out flexible bending, and crooked process radius is reduced, further increase the bending performance of flexible PCB.
In one embodiment, the insulating protective layer is provided with protection against oxidation structure, the protection against oxidation structure Cover the fenestration.Specifically, as shown in fig. 6, by taking the lamina of sine wave curve shape and structure as an example, lamina includes Substrate layer 110, circuit turn-on layer 120 and insulating protective layer 130 offer windowing knot in the crest location of insulating protective layer 130 Structure 132.Insulating protective layer 130 is additionally provided with protection against oxidation structure 134, and protection against oxidation structure 134 covers fenestration 132。
It should be noted that in figure 6, the fenestration indicated by 132 labels is also provided with protection against oxidation structure , fenestration and protection against oxidation structure are embodied in order to enable the label in Fig. 6 to distinguish, therefore, indicated by 132 labels The protection against oxidation incomplete structure being arranged at fenestration is not drawn into.
In the present embodiment, after insulating protective layer opens up fenestration, the insulation protection layer material of the part is removed, from And make the circuit turn-on layer inside insulating protective layer exposed, and since circuit turn-on layer is mostly metal material, the layer material It is exposed metal material to be aoxidized, the performance of flexible PCB is had an impact.Therefore, insulating protective layer is provided with anti- Oxidation protection structure, protection against oxidation structure cover the fenestration, anti-oxidation to be played to exposed circuit turn-on layer Protective effect.Can be specifically to form the protection against oxidation structure using conventional printing ink.The present embodiment is by being arranged anti-oxidation guarantor Protection structure achievees the purpose that ensure flexible PCB performance to play the role of protection against oxidation to exposed circuit turn-on layer.
In one embodiment, as shown in fig. 7, providing a kind of flexible circuit board manufacturing method, this method includes hot pressing step Rapid S100 and superposition step S200.
Heat-press step S100 includes:Hot pressing is carried out to the substrate layer, circuit turn-on layer and insulating protective layer of flexible PCB It is the curve shape structure agreed with mutually to be operable so that the substrate layer after hot pressing, circuit turn-on layer and insulating protective layer.Curve Shape has better bending performance compared to flat shape, therefore each layer structure of curve shape is compared in traditional technology Each layer structure of flat shape can be easier to carry out it flexible bending operation, and it is curved to reduce its to a certain extent Diameter by half, also, the internal stress after each layer structure bending after bending also reduces.
Being superimposed step S200 includes:The substrate layer, circuit turn-on layer and insulating protective layer of flexible PCB are overlapped Pressing is to obtain flexible PCB.By to the substrate layer in the curve shape structure agreed with mutually, the circuit turn-on after hot pressing Layer and insulating protective layer are overlapped pressing so that circuit turn-on is laminated to fit with substrate layer, circuit turn-on layer another side It fits with insulating protective layer, to obtain the flexible PCB of curve shape structure.
In the present embodiment, by carrying out hot press operation to the layers of material for making flexible PCB, curve shape knot is obtained The layers of material of structure then obtains the flexible PCB of curve shape, curve shape after being overlapped pressing to layers of material Flexible PCB compared to the flexible PCB of the flat shape in traditional technology, have better bending performance, Ke Yigeng It is easy to carry out it flexible bending operation, and its crooked process radius can be reduced to a certain extent, also, each layer knot after bending Internal stress after structure bending also reduces, so as to reduce in practical application the paste performance requirement to glue, reduce at This.
In another embodiment, the heat-press step S100 of flexible circuit board manufacturing method and superposition step S200 are held Row sequence can be interchanged, that is, can also be to first carry out superposition step S200, then execute heat-press step S100.To the flexible electrical After substrate layer, circuit turn-on floor and the insulating protective layer of road plate is overlapped pressing to obtain flexible PCB, to obtaining The flexible PCB of flat shape structure carries out hot press operation, to obtain the flexible PCB of curve shape structure.
In the present embodiment, hot press operation is carried out by the flexible PCB of the flat shape structure to making, obtains song The flexible PCB of wire shaped structure, the flexible electrical of the flexible PCB of curve shape compared to the flat shape in traditional technology Road plate has better bending performance, can be easier to carry out it flexible bending operation, and can to a certain extent reduce Its crooked process radius, also, the internal stress after each layer structure bending after bending also reduces, so as to reduce in practical application Paste performance requirement to glue, reduces use cost.
In one embodiment, the substrate layer of flexible PCB, circuit turn-on layer and insulating protective layer are being carried out respectively When hot press operation, the temperature range of hot press operation is 20 degrees Celsius to 400 degrees Celsius.In the present embodiment, to prevent substrate layer, electricity Road conductting layer and insulation protection layer material the case where distortional stress discharges, each layer structural material is caused to flatten after hot-pressing, because Different temperature, pressures may be used in this in hot pressing, is controlled at 20 degrees Celsius specifically, hot press operation is temperature range To 400 degree Celsius ranges, pressure controls in the pressure limit that each layer structural material can be made to deform upon.The present embodiment By controlling the temperature and pressure of hot press operation, so that each layer structural material reaches permanent deformation, ensure flexible PCB The stability of curve shape structure.
In one embodiment, to the substrate layer of flexible PCB, circuit turn-on layer and insulating protective layer in step S100 When carrying out hot press operation, including step 110 or step 120.
Step 110, integral heat pressure operation is carried out to the substrate layer of flexible PCB, circuit turn-on layer and insulating protective layer. It is that hot press operation is integrally carried out to each layer structure of flexible PCB in this step, so that the substrate layer after hot pressing is whole, electricity Road conductting layer entirety and insulating protective layer generally curve shape structure, to improve the bending performance of flexible PCB entirety.
Step 140, local hot press operation is carried out to the substrate layer of flexible PCB, circuit turn-on layer and insulating protective layer. It is that hot press operation is carried out to each layer structure partial of flexible PCB in this step, so that the substrate layer part after hot pressing, electricity Road conductting layer part and insulating protective layer are locally curve shape structure, to improve the bending performance of flexible PCB part, And it can guarantee the strength character of non-heated pressure section.
The present embodiment provides two kinds of hot press operation methods, i.e. integral heat pressure and local hot pressing, in practical applications, if needing Flexible PCB is integrally bent, then the method that integral heat pressure may be used;If only needing to flexible PCB part It is bent, then the method that local hot pressing may be used, and ensures the strength character for the part that other need not be bent.This For embodiment by providing integral heat pressure and local hot pressing two kinds of hot press operation methods, user can select heat according to actual conditions Splenium position, to achieve the purpose that flexibly to carry out hot press operation according to practical bending demand so that the product after hot pressing more meets Needs of production.
In one embodiment, as shown in figure 8, after step S200, which further includes step S300 carries out windowing processing operation, to obtain fenestration to insulating protective layer.The present embodiment is by carrying out insulating protective layer Open a window processing operation, can reduce the rebound stress of insulating protective layer, so as to more be smoothed out flexible bending, and reduce Crooked process radius further increases the bending performance of flexible PCB.
In one embodiment, as shown in figure 9, after step S300, which further includes step S400 carries out protection against oxidation operation, to obtain protection against oxidation structure to circuit turn-on layer exposed after windowing processing operation. The present embodiment ensures flexibility by carrying out protection against oxidation operation to circuit turn-on layer exposed after windowing processing operation to reach The purpose of circuit board performance.
In one embodiment, insulating protective layer can be that well in advance carries out hot pressing again, can also be to carry out hot pressing The making for carrying out insulating protective layer when operation again reaches so as to flexibly control the thickness of insulating protective layer according to actual needs To the purpose for the bending performance for flexibly controlling flexible PCB according to actual needs.
It should be understood that although each step in the flow chart of Fig. 7-9 is shown successively according to the instruction of arrow, These steps are not that the inevitable sequence indicated according to arrow executes successively.Unless expressly stating otherwise herein, these steps Execution there is no stringent sequences to limit, these steps can execute in other order.Moreover, at least one in Fig. 7-9 Part steps may include that either these sub-steps of multiple stages or stage are not necessarily in synchronization to multiple sub-steps Completion is executed, but can be executed at different times, the execution sequence in these sub-steps or stage is also not necessarily successively It carries out, but can either the sub-step of other steps or at least part in stage be in turn or alternately with other steps It executes.
In one embodiment, as shown in Figure 10, a kind of flexible display panels are provided, which is characterized in that the Flexible Displays Panel includes flexible display substrates 310, flexible printed circuit board 320 and chip on film 330 (not marked in figure).
Flexible display substrates 310 are the substrate with display surface.Flexible printed circuit board 320 is set to away from Flexible Displays The side of the display surface of substrate 310.Chip on film 330 is used to connect flexible display substrates 310 and flexible printed circuit board 320, Chip on film 330 includes flexible PCB 332 in any of the above-described embodiment and is set to the collection on 332 surface of flexible PCB At circuit chip 334, flexible PCB 332 is fixedly connected by pasting substance with flexible display substrates 310.Flexible electrical in figure Road plate 332 is the flexible PCB of sine wave curve shape and structure.
In the present embodiment, need to bend flexible PCB 332 and paste fixation, due to the use of be curve shape The flexible PCB of structure, therefore can be easier to carry out it flexible bending operation, and it can be reduced to a certain extent Crooked process radius, also, the internal stress of the flexible PCB after bending also reduces, so as to reduce in practical application to pasting The paste performance requirement of glue, reduces use cost.
Each technical characteristic of above example can be combined arbitrarily, to keep description succinct, not to above-described embodiment In each technical characteristic it is all possible combination be all described, as long as however, the combination of these technical characteristics be not present lance Shield is all considered to be the range of this specification record.
The several embodiments of the application above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art It says, under the premise of not departing from the application design, various modifications and improvements can be made, these belong to the protection of the application Range.Therefore, the protection domain of the application patent should be determined by the appended claims.

Claims (10)

1. a kind of flexible PCB, which is characterized in that including:Substrate layer, circuit turn-on layer and insulating protective layer;
The circuit turn-on is laminated to fit with the substrate layer, the circuit turn-on layer another side and the insulating protective layer It fits;
The substrate layer, circuit turn-on layer and insulating protective layer are the curve shape structure agreed with mutually.
2. flexible PCB according to claim 1, which is characterized in that the curve shape includes:Sine wave curve, side Wave profile, sawtooth curve and triangular wave curve.
3. flexible PCB according to claim 1, which is characterized in that the insulating protective layer offers fenestration.
4. flexible PCB according to claim 3, which is characterized in that the insulating protective layer is provided with protection against oxidation Structure, the protection against oxidation structure cover the fenestration.
5. flexible PCB according to claim 1, which is characterized in that the flexible PCB is doubling plate, the electricity Road conductting layer include the first circuit turn-on floor and second circuit conductting layer, the insulating protective layer include the first insulating protective layer and Second insulating protective layer;
The base material it is laminated with first circuit turn-on is laminated fits, the first circuit turn-on layer another side and institute The first insulating protective layer any surface is stated to fit;The substrate layer another side be connected with the second circuit it is laminated fit, The second circuit conductting layer another side fits with the second insulating protective layer any surface.
6. a kind of flexible circuit board manufacturing method, which is characterized in that including heat-press step and superposition step;
The heat-press step, including:Hot pressing is carried out to the substrate layer, circuit turn-on layer and insulating protective layer of the flexible PCB It is the curve shape structure agreed with mutually to be operable so that the substrate layer after hot pressing, circuit turn-on layer and insulating protective layer;
The superposition step, including:The substrate layer, circuit turn-on layer and insulating protective layer of the flexible PCB are overlapped Pressing is to obtain flexible PCB, and in the flexible PCB, the circuit turn-on is laminated to fit with the substrate layer, institute Circuit turn-on layer another side is stated to fit with the insulating protective layer.
7. flexible circuit board manufacturing method according to claim 6, which is characterized in that the heat-press step and superposition step Rapid execution sequence can be interchanged.
8. flexible circuit board manufacturing method according to claim 6, which is characterized in that in the heat-press step, the heat The temperature range of press operation is 20 degrees Celsius to 400 degrees Celsius.
9. flexible circuit board manufacturing method according to claim 6, which is characterized in that described right in the heat-press step The substrate layer of the flexible PCB, circuit turn-on layer and insulating protective layer carry out hot press operation so that base material after hot pressing The step of layer, circuit turn-on layer and insulating protective layer are the curve shape structure agreed with mutually, including:
Integral heat pressure operation is carried out to the substrate layer, circuit turn-on layer and insulating protective layer, so that the substrate layer after hot pressing The curve shape structure that whole, circuit turn-on layer entirety and insulating protective layer generally agree with mutually;Or,
Local hot press operation is carried out to the substrate layer, circuit turn-on layer and insulating protective layer, so that the substrate layer after hot pressing Part, circuit turn-on layer part and insulating protective layer are locally the curve shape structure agreed with mutually.
10. a kind of flexible display panels, which is characterized in that including:
Flexible display substrates;
It is set to the flexible printed circuit board away from the display surface side of the flexible display substrates;
Chip on film for connecting the flexible display substrates and the flexible printed circuit board, the chip on film include such as Flexible PCB described in any one of claim 1 to 5 and the IC chip for being set to the flexible circuit plate surface.
CN201810529331.2A 2018-05-29 2018-05-29 Flexible circuit board, manufacturing method of flexible circuit board and flexible display panel Active CN108770184B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109638209A (en) * 2018-12-17 2019-04-16 安捷利电子科技(苏州)有限公司 A kind of battery signal acquisition harness and its bending technique with bending structure
CN109686759A (en) * 2018-12-05 2019-04-26 武汉华星光电半导体显示技术有限公司 Display screen component
US10923542B2 (en) 2018-12-05 2021-02-16 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display screen assembly having a flexible circuit board with curved portions

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CN102687598A (en) * 2009-12-24 2012-09-19 日本梅克特隆株式会社 Flexible circuit board and manufacturing method thereof
CN105636339A (en) * 2015-12-29 2016-06-01 广东欧珀移动通信有限公司 Flexible printed circuit board and mobile terminal

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JP2001339125A (en) * 2000-05-30 2001-12-07 Fujikura Ltd Flexible printed board
CN102687598A (en) * 2009-12-24 2012-09-19 日本梅克特隆株式会社 Flexible circuit board and manufacturing method thereof
CN202121866U (en) * 2011-06-17 2012-01-18 湖北友邦电子材料有限公司 Copper foil substrate of flexible circuit board
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109686759A (en) * 2018-12-05 2019-04-26 武汉华星光电半导体显示技术有限公司 Display screen component
CN109686759B (en) * 2018-12-05 2020-11-06 武汉华星光电半导体显示技术有限公司 Display screen assembly
US10923542B2 (en) 2018-12-05 2021-02-16 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display screen assembly having a flexible circuit board with curved portions
CN109638209A (en) * 2018-12-17 2019-04-16 安捷利电子科技(苏州)有限公司 A kind of battery signal acquisition harness and its bending technique with bending structure

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Application publication date: 20181106

Assignee: Yungu (Gu'an) Technology Co., Ltd.|Bazhou Yungu Electronic Technology Co., Ltd.|Kunshan Institute of technology new flat panel display technology center Co., Ltd

Assignor: Kunshan Guo Xian Photoelectric Co., Ltd.

Contract record no.: X2019990000156

Denomination of invention: Flexible circuit board, flexible circuit board manufacturing method, and flexible display panel

License type: Common License

Record date: 20191030

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Effective date of registration: 20191206

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Address before: 215300, No. 1, Longteng Road, Kunshan Development Zone, Jiangsu, Suzhou, 4

Applicant before: Kunshan Guo Xian Photoelectric Co., Ltd.