CN112974580B - Bent circuit board and processing equipment and method thereof - Google Patents
Bent circuit board and processing equipment and method thereof Download PDFInfo
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- CN112974580B CN112974580B CN202110508342.4A CN202110508342A CN112974580B CN 112974580 B CN112974580 B CN 112974580B CN 202110508342 A CN202110508342 A CN 202110508342A CN 112974580 B CN112974580 B CN 112974580B
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- circuit board
- female die
- top surface
- bent circuit
- bent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D5/00—Bending sheet metal along straight lines, e.g. to form simple curves
- B21D5/02—Bending sheet metal along straight lines, e.g. to form simple curves on press brakes without making use of clamping means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/16—Heating or cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D43/00—Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
- B21D43/003—Positioning devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D45/00—Ejecting or stripping-off devices arranged in machines or tools dealt with in this subclass
- B21D45/02—Ejecting devices
- B21D45/04—Ejecting devices interrelated with motion of tool
Abstract
The invention discloses a bent circuit board which comprises a metal base layer (1), a heat conduction insulating layer (2) and a conducting layer (3), wherein the heat conduction insulating layer (2) is compounded on the top surface of the metal base layer (1), the conducting layer (3) is compounded on the top surface of the heat conduction insulating layer (2), a plurality of concave parts (4) are arranged at the bottom of the bent circuit board, and horizontal parts (5) are arranged on the left side and the right side of the bent circuit board; the top surface of the bent circuit board is provided with a square groove (6) which sequentially penetrates through the conductive layer (3), the heat-conducting insulating layer (2) and the metal base layer (1). The invention has the beneficial effects that: compact structure, prevent that the conducting layer burns and decreases, improve the circuit board processingquality of buckling.
Description
Technical Field
The invention relates to the technical field of bent circuit board structures and processing thereof, in particular to a bent circuit board and processing equipment and a method thereof.
Background
At present, along with the development of science and technology, more and more wearing equipment gets into we are nearby, and traditional circuit board is harder, installs inside wearing equipment rather inconveniently, and traditional flexible circuit board then the cost is higher, and economic nature is relatively poor. Therefore, a bent circuit board appears in the market, the bent circuit board is a combination of a hard circuit board and a flexible circuit board, and the bent circuit board has the characteristics of high wiring density, light weight, thin thickness and good bending property, so that the bent circuit board is very suitable for being installed in wearable equipment.
The structure of the existing bending circuit board is shown in figures 1-2, the existing bending circuit board comprises a metal base layer 1, a heat conduction insulating layer 2 and a conducting layer 3, the heat conduction insulating layer 2 is pressed on the top surface of the metal base layer 1, the conducting layer 3 is pressed on the heat conduction insulating layer 2, a circuit layer and a solder resist are arranged on the conducting layer 3, a plurality of concave parts 4 are arranged at the bottom of the bending circuit board, and horizontal parts 5 are arranged on the left edge and the right edge of the bending circuit board. At present, the bending equipment for producing the bent circuit board comprises a male die and a female die, wherein the male die is arranged on a punch head of a punch press, when in work, a blank for producing the bent circuit board is firstly horizontally placed on the top surface of the female die, to realize the positioning of the blank (wherein, the structure of the blank is shown in figure 3, the blank comprises a metal base layer 1, a heat conducting insulating layer 2 and a conducting layer 3 which are compounded into a whole in sequence and are in a plate shape), then a punch of a punch press is operated to move downwards, after a convex mould insert on the convex mould is matched with a groove in the concave mould, the bending circuit board can be bent and formed, the ejector rod positioned in the concave die is lifted upwards, the ejector rod is pressed against the bottom surface of the concave part 4 of the bending circuit board, the bent circuit board is ejected out of the female die, workers can conveniently take away the bent circuit board, and a circuit layer is etched on the conducting layer 3 after the bent circuit board is taken away, so that the finished bent circuit board is finally processed.
However, although this kind of bending apparatus can process the bent circuit board, still has more defects, and specific defects are as follows: I. in the process of closing the female die and the male die, the horizontal parts 5 on two sides of the product are tilted upwards, the tilting direction is shown by a hollow arrow in figure 1, and the two horizontal parts 5 are technically required to be positioned on the same plane, so that the processing quality of the bent circuit board is reduced. II. When the ejector pin is in the depressed part 4 in-process of jack-up product, because the horizontal part 5 part of product still firm laminating on the top surface of die, the upper surface of product is fixed promptly, and the lower surface atress of product, the atress direction is as shown by solid arrow in fig. 1 to lead to the upward sunken polygon of depressed part 4, further reduction the processingquality of bending circuit board. III, in the die closing process of the female die and the male die, a large amount of heat is generated between the male die insert and the conducting layer 3, and the heat is accumulated on the conducting layer 3 to cause the surface of the conducting layer 3 to be burnt, so that the product percent of pass is reduced.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a bent circuit board, processing equipment and a method thereof, wherein the bent circuit board has a compact structure, prevents a conducting layer from being burnt, and improves the processing quality of the bent circuit board.
The purpose of the invention is realized by the following technical scheme: a bent circuit board comprises a metal base layer, a heat conduction insulating layer and a conducting layer, wherein the heat conduction insulating layer is compounded on the top surface of the metal base layer, the conducting layer is compounded on the top surface of the heat conduction insulating layer, a plurality of concave parts are arranged at the bottom of the bent circuit board, and horizontal parts are arranged on the left side and the right side of the bent circuit board; the top surface of the bent circuit board is provided with a square groove which penetrates through the conductive layer, the heat conduction insulating layer and the metal base layer in sequence.
The concave part is arranged longitudinally, and the bottom surface of the concave part is a plane.
The horizontal part is flush with the top surface of the bent circuit board.
The processing equipment for the bent circuit board comprises a male die and a female die, wherein a plurality of grooves matched with the concave parts are formed in the top surface of the female die, the grooves penetrate through the front end face and the rear end face of the female die, a plurality of square rods matched with the square grooves are fixedly arranged on the top surface of the female die and positioned in the middle of the top surface of the female die, lifting oil cylinders are fixedly arranged on the left end face and the right end face of the female die, limiting plates are fixedly arranged on the action ends of piston rods of the lifting oil cylinders, the limiting plates are arranged on the outer sides of the grooves and positioned above the female die, and guide plates are fixedly arranged on the top surfaces of the limiting plates; a product jacking mechanism is arranged between the two limiting plates; the jacking mechanism comprises an electromagnet, a lifting plate arranged below the female die, and guide holes which are formed in the bottom of the groove and penetrate through the bottom surface of the female die, ejector rods are slidably mounted in the guide holes, the bottom of each ejector rod is welded on the lifting plate, guide posts are fixedly arranged at the left end and the right end of the lifting plate, the top ends of the guide posts penetrate through the female die upwards and are welded on the limiting plate, the electromagnet is fixedly arranged in the limiting plate, the bottom surface of the electromagnet is flush with the bottom surface of the limiting plate, and the electromagnet is arranged outside the groove and between the two guide posts; the male die is arranged in an area defined by the two guide plates in a sliding mode, and a plurality of male die inserts matched with the grooves are fixedly arranged on the bottom surface of the male die.
The bottom of die sets firmly many supporting legs that support in subaerial.
The square bars are arranged in sequence from front to back.
The bottom surface of the limiting plate is provided with a step hole, the electromagnet is embedded into the large hole of the step hole, and a lead of the electromagnet upwards penetrates through the small hole of the step hole and is electrically connected with a power supply.
The through-hole of vertical setting is all seted up to the tip about the die, guide post slidable mounting is in the through-hole.
A plurality of conical grooves corresponding to the male die insert up and down are formed in the top surface of the male die; and the bottom surface of the male die is provided with a containing groove matched with the square rod.
The method for processing the bent circuit board by the processing equipment comprises the following steps:
s1, filling refrigerant into each conical groove; connecting the top of the male die to a punch head of a punch press;
s2, punching a plurality of square grooves matched with the square rods in the middle of the blank;
s3, positioning the blank: the square rods are sleeved with the square grooves on the blank correspondingly, the metal base layer of the blank is supported on the top surface of the female die, and the left end part and the right end part of the blank are respectively positioned under the two limiting plates and between the two guide columns, so that the quick positioning tool for the blank is realized;
s4, limiting the left end and the right end of the blank: controlling the two lifting oil cylinders to enable piston rods of the two lifting oil cylinders to synchronously retract downwards, driving the limiting plate to move downwards by the piston rods, immediately closing the lifting oil cylinders after the bottom surface of the limiting plate is contacted with the top surface of the conducting layer of the blank, and limiting the left end part and the right end part of the blank between the limiting plate and the female die at the moment;
s5, forming of the bent circuit board: the punch is operated to move downwards, the punch brings the male die to move downwards along the area formed by the two guide plates, the male die drives the male die insert to move downwards, and after the male die insert and the groove are closed, the bent circuit board can be formed;
s6, taking out the bent circuit board, wherein the specific operation steps are as follows: firstly, operating a punch press to enable the punch to move upwards, driving the punch to move upwards, switching on a power supply after the punch is separated from a bent circuit board, adsorbing a horizontal part of the bent circuit board after an electromagnet is electrified, then controlling a lifting oil cylinder to enable a piston rod of the lifting oil cylinder to move upwards, driving the piston rod to move upwards by a limiting plate, driving the electromagnet to move upwards by the limiting plate, lifting the horizontal part adsorbed on the electromagnet upwards by the electromagnet to lift the top surface of the bent circuit board, simultaneously driving a guide post to move upwards synchronously by the limiting plate, driving a lifting plate to move upwards by the guide post, driving a push rod to move upwards along a guide hole by the lifting plate, jacking the bottom surface of a concave part of the bent circuit board by the push rod to jack the bottom surface of the bent circuit board, and cutting off the power supply after the limiting plate is reset, so that the bent circuit board can be taken out from a female die;
and S7, etching a circuit layer on the conductive layer through an etching process, thereby finally producing the finished bent circuit board.
The invention has the following advantages: the invention has compact structure, prevents the conductive layer from burning loss and improves the processing quality of the bent circuit board.
Drawings
FIG. 1 is a schematic structural diagram of a conventional bending circuit board;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a schematic structural view of a blank;
FIG. 4 is a schematic structural diagram of a bending circuit board according to the present invention;
FIG. 5 is a top view of FIG. 4;
FIG. 6 is an enlarged partial view of portion I of FIG. 4;
FIG. 7 is a schematic structural view after a square groove is formed in a blank;
FIG. 8 is a top view of FIG. 7;
FIG. 9 is a schematic view of the structure of a processing apparatus according to the present invention;
FIG. 10 is an enlarged partial view of section II of FIG. 9;
FIG. 11 is a view taken along line A of FIG. 9;
FIG. 12 is a schematic view of a tooling blank;
FIG. 13 is a schematic view of the blank left and right end stops;
FIG. 14 is a schematic view of a formed and bent circuit board;
FIG. 15 is a schematic view of the folded circuit board taken out;
in the figure, 1-metal base layer, 2-heat conducting insulating layer, 3-conducting layer, 4-depressed part, 5-horizontal part, 6-square groove, 7-convex mould, 8-concave mould, 9-groove, 10-square rod, 11-lifting oil cylinder, 12-limiting plate, 13-guide plate, 14-electromagnet, 15-lifting plate, 16-guide hole, 17-ejector rod, 18-guide column, 19-convex mould insert, 20-supporting leg, 21-step hole, 22-through hole, 23-conical groove, 24-blank and 25-bending circuit board.
Detailed Description
The invention will be further described with reference to the accompanying drawings, without limiting the scope of the invention to the following:
as shown in fig. 4 to 6, a bent circuit board includes a metal base layer 1, a heat conducting insulating layer 2 and a conductive layer 3, wherein the heat conducting insulating layer 2 is compounded on the top surface of the metal base layer 1, the conductive layer 3 is compounded on the top surface of the heat conducting insulating layer 2, a plurality of concave portions 4 are arranged at the bottom of the bent circuit board, and horizontal portions 5 are arranged at both left and right sides of the bent circuit board; the concave part 4 is arranged longitudinally, and the bottom surface of the concave part 4 is a plane. The horizontal portion 5 is flush with the top surface of the bent circuit board. Set up the square groove 6 that runs through conducting layer 3, heat-conducting insulation layer 2 and metal-based layer 1 setting in order on the top surface of the circuit board of buckling, square groove 6 can play the effect of location in production, compares traditional circuit board of buckling moreover and still has radiating effect, and the circuit board of buckling is at the during operation, and the heat on the conducting layer 3 discharges to the external world through square groove 6.
As shown in fig. 9 to 11, the processing equipment for the bent circuit board comprises a male die 7 and a female die 8, a plurality of grooves 9 matched with the concave portions 4 are formed in the top surface of the female die 8, the grooves 9 penetrate through the front end face and the rear end face of the female die 8, a plurality of square rods 10 matched with the square grooves 6 are fixedly arranged on the top surface of the female die 8 and located in the middle of the top surface of the female die 8, the square rods 10 are sequentially arranged from front to back, lifting cylinders 11 are fixedly arranged on the left end face and the right end face of the female die 8, limiting plates 12 are fixedly arranged on the acting ends of piston rods of the lifting cylinders 11, the limiting plates 12 are arranged outside the grooves 9 and located above the female die 8, and guide plates 13 are fixedly arranged on the top surfaces of the limiting plates 12; a product jacking mechanism is arranged between the two limiting plates 12; the jacking mechanism comprises an electromagnet 14, a lifting plate 15 arranged below the female die 8 and a guide hole 16 which is arranged at the bottom of the groove 9 and penetrates through the bottom surface of the female die 8, a push rod 17 is slidably mounted in the guide hole 16, the bottom of the push rod 17 is welded on the lifting plate 15, guide posts 18 are fixedly arranged at the left end part and the right end part of the lifting plate 15, the top end parts of the guide posts 18 upwards penetrate through the female die 8 and are welded on the limiting plate 12, the electromagnet 14 is fixedly arranged in the limiting plate 12, the bottom surface of the electromagnet is flush with the bottom surface of the limiting plate 12, and the electromagnet 14 is arranged at the outer side of the groove 9 and is positioned between the two guide posts 18; the male die 7 is slidably mounted in an area surrounded by the two guide plates 13, and a plurality of male die inserts 19 respectively matched with the grooves 9 are fixedly arranged on the bottom surface of the male die 7.
And a plurality of supporting legs 20 supported on the ground are fixedly arranged at the bottom of the female die 8. The bottom surface of the limiting plate 12 is provided with a step hole 21, the electromagnet 14 is embedded into a large hole of the step hole 21, and a lead of the electromagnet 14 upwards penetrates through a small hole of the step hole 21 and is electrically connected with a power supply. The through-hole 22 of vertical setting is all seted up to the tip about the die 8, guide post 18 slidable mounting is in through-hole 22. The top surface of the male die 7 is provided with a plurality of conical grooves 23 which correspond to the male die insert 19 up and down, and the bottom surface of the male die 7 is provided with an accommodating groove which is matched with the square rod 10.
The method for processing the bent circuit board by the processing equipment comprises the following steps:
s1, filling the respective tapered grooves 23 with refrigerant; connecting the top of the male die 7 to a punch of a punch press;
s2, as shown in figures 7-8, punching a plurality of square grooves 6 matched with the square rods 10 in the middle of the blank;
s3, positioning the blank: the square grooves 6 on the blank 24 are correspondingly sleeved on the square rods 10, and the metal base layer 1 of the blank 24 is supported on the top surface of the female die 8, at this time, the left end and the right end of the blank 24 are respectively positioned under the two limit plates 12 and between the two guide posts 18, so that the quick positioning tool for the blank is realized, as shown in fig. 12;
s4, limiting the left end and the right end of the blank: controlling the two lifting cylinders 11 to enable the piston rods of the two lifting cylinders to synchronously retract downwards, driving the limiting plates 12 to move downwards by the piston rods, immediately closing the lifting cylinders 11 after the bottom surfaces of the limiting plates 12 are contacted with the top surfaces of the conducting layers 3 of the blanks 24, and limiting the left end parts and the right end parts of the blanks 24 between the limiting plates 12 and the female die 8 at the moment, as shown in fig. 13;
s5, forming of the bent circuit board: the punch is operated to move downwards, the punch brings the punch to the punch 7 to move downwards along the area formed by the two guide plates 13, the punch 7 drives the punch insert 19 to move downwards, and after the punch insert 19 and the groove 9 are closed, a bent circuit board can be formed, as shown in fig. 14, and meanwhile, the square rod 10 enters the accommodating groove;
s6, taking out the bent circuit board, wherein the specific operation steps are as follows: firstly operating the punch press to enable the punch press to move upwards, enabling the punch press to drive the punch press 7 to move upwards, switching on a power supply after the punch press is separated from the bent circuit board 25, enabling the electromagnet 14 to be electrified to adsorb the horizontal part 5 of the bent circuit board 25, then controlling the lifting oil cylinder 11 to enable the piston rod of the lifting oil cylinder to move upwards, enabling the piston rod to drive the limiting plate 12 to move upwards, enabling the limiting plate 12 to drive the electromagnet 14 to move upwards, enabling the electromagnet 14 to lift the horizontal part 5 adsorbed on the electromagnet 14 upwards to lift the top surface of the bent circuit board 25, enabling the limiting plate 12 to drive the guide post 18 to move upwards synchronously, enabling the guide post 18 to drive the lifting plate 15 to move upwards, enabling the lifting plate 15 to drive the ejector rod 17 to move upwards along the guide hole 16, enabling the ejector rod 17 to jack the bottom surface of the concave part 4 of the bent circuit board 25 to jack the bottom surface of the bent circuit board 25, as shown in figure 15, and after the limiting plate 12 is reset, the power supply is cut off, and the bent circuit board 25 can be taken out from the female die 8; because the upper and lower tip of the circuit board 25 of buckling is promoted simultaneously, compares climbing mechanism in the traditional die, has effectively avoided the shaping 4 upwards sunken edges of the depressed part of the circuit board 25 of buckling to very big improvement the processingquality of the circuit board of buckling.
And S7, etching a circuit layer on the conductive layer 3 through an etching process, thereby finally producing the finished bent circuit board.
In the forming process of step S5, since the left and right ends of the blank 24 are always limited between the limiting plate 12 and the die 8, the horizontal portion 5 of the formed bent circuit board 25 is prevented from being tilted upward, and the processing quality of the bent circuit board is improved. In addition, because the refrigerant is stored in the convex die 7, in the forming process, the heat generated on the conducting layer 3 is transferred to the convex die insert 19, the convex die insert 19 transfers the heat to the convex die 7, and the convex die 7 transfers the heat to the refrigerant, so that the conducting layer 3 is cooled, the conducting layer 3 is effectively prevented from being burnt due to overhigh surface temperature, and the conducting layer 3 is well protected.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The processing equipment of the bent circuit board comprises a metal base layer (1), a heat conduction insulating layer (2) and a conducting layer (3), wherein the heat conduction insulating layer (2) is compounded on the top surface of the metal base layer (1), the conducting layer (3) is compounded on the top surface of the heat conduction insulating layer (2), a plurality of concave parts (4) are arranged at the bottom of the bent circuit board, and horizontal parts (5) are arranged on the left side and the right side of the bent circuit board; set up square groove (6) that run through conducting layer (3), heat conduction insulating layer (2) and metal-based layer (1) setting in order on the top surface of the circuit board of buckling, depressed part (4) vertically sets up, and the basal surface of depressed part (4) is the plane, horizontal part (5) and the top surface parallel and level of the circuit board of buckling, its characterized in that: the processing equipment comprises a male die (7) and a female die (8), a plurality of grooves (9) matched with the concave part (4) are formed in the top surface of the female die (8), the grooves (9) penetrate through the front end face and the rear end face of the female die (8), a plurality of square rods (10) matched with the square grooves (6) are fixedly arranged on the top surface of the female die (8) and positioned in the middle of the top surface of the female die, lifting oil cylinders (11) are fixedly arranged on the left end face and the right end face of the female die (8), limiting plates (12) are fixedly arranged on the action ends of piston rods of the lifting oil cylinders (11), the limiting plates (12) are arranged on the outer sides of the grooves (9) and positioned above the female die (8), and guide plates (13) are fixedly arranged on the top surfaces of the limiting plates (12); a product jacking mechanism is arranged between the two limiting plates (12); the jacking mechanism comprises an electromagnet (14), a lifting plate (15) arranged below the female die (8), and guide holes (16) which are formed in the bottom of the groove (9) and penetrate through the bottom surface of the female die (8), ejector rods (17) are slidably mounted in the guide holes (16), the bottoms of the ejector rods (17) are welded on the lifting plate (15), guide posts (18) are fixedly arranged at the left end part and the right end part of the lifting plate (15), the top ends of the guide posts (18) penetrate through the female die (8) upwards and are welded on the limiting plate (12), the electromagnet (14) is fixedly arranged in the limiting plate (12), the bottom surface of the electromagnet is flush with the bottom surface of the limiting plate (12), and the electromagnet (14) is arranged outside the groove (9) and is positioned between the two guide posts (18); the male die (7) is slidably mounted in an area surrounded by the two guide plates (13), and a plurality of male die inserts (19) which are respectively matched with the grooves (9) are fixedly arranged on the bottom surface of the male die (7).
2. The apparatus for bending a circuit board according to claim 1, wherein: and a plurality of supporting legs (20) supported on the ground are fixedly arranged at the bottom of the female die (8).
3. The apparatus for bending a circuit board according to claim 1, wherein: the square bars (10) are sequentially arranged from front to back.
4. The apparatus for bending a circuit board according to claim 1, wherein: the bottom surface of the limiting plate (12) is provided with a step hole (21), the electromagnet (14) is embedded into a large hole of the step hole (21), and a lead of the electromagnet (14) upwards penetrates through a small hole of the step hole (21) and is electrically connected with a power supply.
5. The apparatus for bending a circuit board according to claim 1, wherein: the through-hole (22) of vertical setting are all seted up to the tip about die (8), guide post (18) slidable mounting is in through-hole (22).
6. The apparatus for bending a circuit board according to claim 1, wherein: a plurality of conical grooves (23) which vertically correspond to the male die inserts (19) are formed in the top surface of the male die (7); the bottom surface of the male die (7) is provided with an accommodating groove matched with the square rod (10).
7. The method for processing the bent circuit board by the processing equipment according to any one of claims 1 to 6, wherein the method comprises the following steps: the method comprises the following steps:
s1, filling refrigerant into each conical groove (23); connecting the top of the male die (7) to a punch head of a punch press;
s2, punching a plurality of square grooves (6) matched with the square rods (10) in the middle of the blank;
s3, positioning the blank: the square rods (10) are correspondingly sleeved with the square grooves (6) on the blank (24), the metal base layer (1) of the blank (24) is supported on the top surface of the female die (8), and the left end part and the right end part of the blank (24) are respectively positioned under the two limiting plates (12) and between the two guide columns (18), so that the quick positioning tool for the blank is realized;
s4, limiting the left end and the right end of the blank: controlling the two lifting oil cylinders (11) to enable piston rods of the two lifting oil cylinders to synchronously retract downwards, driving the limiting plate (12) to move downwards by the piston rods, immediately closing the lifting oil cylinders (11) after the bottom surfaces of the limiting plate (12) are contacted with the top surface of the conducting layer (3) of the blank (24), and limiting the left end part and the right end part of the blank (24) between the limiting plate (12) and the female die (8);
s5, forming of the bent circuit board: the punch is operated to move downwards, the punch is brought to the male die (7) to move downwards along the area formed by the two guide plates (13), the male die (7) drives the male die insert (19) to move downwards, and after the male die insert (19) and the groove (9) are closed, the bent circuit board can be formed;
s6, taking out the bent circuit board, wherein the specific operation steps are as follows: firstly operating the punch press to enable the punch press to move upwards, driving the punch press (7) to move upwards, switching on a power supply after the punch press is separated from the bent circuit board (25), enabling an electromagnet (14) to be electrified to adsorb a horizontal part (5) of the bent circuit board (25), then controlling a lifting oil cylinder (11) to enable a piston rod of the lifting oil cylinder to move upwards, driving the piston rod to move upwards by a limiting plate (12), driving the electromagnet (14) to move upwards by the limiting plate (12), lifting the horizontal part (5) adsorbed on the electromagnet (14) upwards to lift the top surface of the bent circuit board (25), simultaneously driving a guide post (18) to synchronously move upwards by the limiting plate (12), driving a lifting plate (15) to move upwards by the guide post (18), driving a push rod (17) to move upwards along a guide hole (16), and pushing the bottom surface of a concave part (4) of the bent circuit board (25) by the push rod (17), the bottom surface of the bent circuit board (25) is jacked up, and after the limiting plate (12) is reset, the power supply is cut off, so that the bent circuit board (25) can be taken out of the female die (8);
and S7, etching a circuit layer on the conductive layer (3) through an etching process, thereby finally producing the finished bent circuit board.
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| CN202110508342.4A CN112974580B (en) | 2021-05-11 | 2021-05-11 | Bent circuit board and processing equipment and method thereof |
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| CN202110508342.4A CN112974580B (en) | 2021-05-11 | 2021-05-11 | Bent circuit board and processing equipment and method thereof |
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| CN113543532A (en) * | 2021-07-27 | 2021-10-22 | 四川深北电路科技有限公司 | Integrated circuit board pressing device and method |
| CN114071887B (en) * | 2022-01-11 | 2022-03-25 | 四川英创力电子科技股份有限公司 | Edge covering device and method for double-sided circuit board adhesive tape |
| CN114346006B (en) * | 2022-01-21 | 2023-05-02 | 四川华体照明科技股份有限公司 | Panel bending device and lamp post forming method |
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