CN102687598A - Flexible circuit board and manufacturing method thereof - Google Patents
Flexible circuit board and manufacturing method thereof Download PDFInfo
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- CN102687598A CN102687598A CN2010800588282A CN201080058828A CN102687598A CN 102687598 A CN102687598 A CN 102687598A CN 2010800588282 A CN2010800588282 A CN 2010800588282A CN 201080058828 A CN201080058828 A CN 201080058828A CN 102687598 A CN102687598 A CN 102687598A
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- flexible circuit
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
Abstract
In a flexible circuit board having a bending portion formed therein, there are provided a flexible circuit board and its method of manufacture in which the flexible circuit board is deformable in a flexible manner, and in which even if deformation of the board is repeated, or if there is heat dissipation from electronic parts, or if fine wiring is formed, exfoliation and breakage of a wiring layer will not occur, and connection reliability is high. In a flexible circuit board 1 which has an insulating film 2 made of liquid crystal polymer, a wiring layer 3 formed on the insulating film 2, and an insulating layer 4 formed on the wiring layer 3 and made of a liquid crystal polymer, it is characterized in that a bending portion 1A having a radius of curvature R (mm) is formed in at least one place of the board, and the board is constructed to be deformable in a state where the radius of curvature R (mm) of the bending portion 1A is maintained.
Description
Technical field
The present invention relates to flexible circuit board and manufacturing approach thereof that a kind of surface at dielectric film has directly or utilize the wiring layer of bonding agent formation.Specifically; Flexible circuit board involved in the present invention and manufacturing approach thereof; Be mainly used in the various e-machines of communication, projection machine etc.; Also can be used for the connection between the building block of automobile or aviation machine, robot etc., the wiring harness substrate of build-up member and a plurality of LED that are equipped with in the lighting device are installed, and (Light Emitting Diode: filament portion light-emitting diode), it can be processed into arbitrary shape.
Background technology
Existing circuit substrate, for example known have Japanese patent of invention to disclose disclosed holostrome IVH resin multi-layer circuit substrate in the 2003-008161 communique (patent documentation 1).Also known in addition the whole or crooked so-called flexible circuit board that uses of a part, in recent years, such flexible circuit board is used to the liquid crystal driver module of portable equipment etc.
Fig. 5 representes the schematic section of typical flexible circuit board.Shown in Fig. 5 (a), flexible circuit board 100 has, and is formed at the wiring layer 30 on the dielectric film 20 and is formed at the insulating barrier 40 (being commonly referred to cover layer (CL layer)) on the wiring layer 30.Shown in Fig. 5 (b), also known flexible circuit board with its multiple stratification.As shown in the figure, the flexible circuit board 100 of multiple stratification is provided with the through hole 50 that is used to be electrically connected each wiring layer 30, thus, and the connection of the complicacy each other that can realize connecting up.In addition, the flexible circuit board 100 shown in Fig. 5 (a), Fig. 5 (b) is on dielectric film 20, directly to form wiring layer 30, but as the also known flexible circuit board that between dielectric film and wiring layer, is provided with adhesive linkage of another kind of structure.In existing flexible base, board, dielectric film 20 uses polyimide film with insulating barrier 40, and wiring layer 30 uses rolled copper foil.
Flexible circuit board with structure like this is very thin, can free bend, and in the very little space between therefore can insertion parts.Therefore, because the more build-up member of configuration in can be between the parts very little space can improve the packing density in the space between parts.That is,, can improve the performance of device, realize miniaturization, so flexible circuit board will be applied in field more widely from now on owing to be under the state of bending, to use flexible circuit board.Correlation technique is disclosed in patent documentation 1 ~ patent documentation 3.
The prior art document
Patent documentation
Patent documentation 1: Japanese patent of invention discloses the 2003-008161 communique
Patent documentation 2: Japanese Utility Model discloses flat 5-76070 communique
Summary of the invention
But there is following problem in existing flexible circuit board.
Above-mentioned existing flexible circuit board is bending and stretching repeatedly, or when bending with deep camber, at the kink place; Cause that by bending stress wiring layer (that is Copper Foil) is from insulating properties material (that is dielectric film; Adhesive linkage with suitable setting) peel off, or the wiring layer fracture, the result causes bad connection.In addition, with the high-density installation electronic unit time, can cause bad connection because of the flexible circuit board heat release.That is, when the thermal discharge of electronic unit was big, the heat difference that flexible circuit board is accepted when stopping when electronic unit moves was big, and the result causes the temperature of flexible circuit board significantly to rise repeatedly and descend.Therefore, owing between the insulating properties material-wiring layer of flexible circuit board, existing thermal expansion difference to cause peeling off of wiring layer or rupturing.
To electronic equipment; Be accompanied by the more requirement of high-performance and miniaturization etc.; The wiring width of studying flexible circuit board is the technology of granular more, so that can be with high-density installation electronic unit more, but because wiring is tending towards granular; And more be easy to generate the problem of above-mentioned bad connection (that is, peeling off from the insulating properties material of wiring layer etc.).
In addition, for example, in Japanese Utility Model the structure that discloses the pliability circuit substrate that can under case of bending, use in the flat 5-76070 communique (patent documentation 2) is disclosed.Specifically, after pliability circuit substrate applying metal reinforcing plates, with the shape that the metal reinforcing plates bending machining becomes to stipulate, the pliability circuit substrate can be together crooked with metal reinforcing plates thus.On the other hand; Japan's patent of invention discloses flat 10-112571 communique (patent documentation 3) and discloses the PEN that spring rate is high and be used for circuit substrate; The rigid circuit material bending that thus, will have self shape retention is processed into the technology of institute's shaped.But,, thereby have the problem that lacks flexibility because the above-mentioned circuit substrate integral body that these have kink has rigidity.Therefore, the requirement that can not be installed on the movable part etc. of robot for example of these circuit substrates has the position of retractility.
That is, for the flexible circuit board that is formed with kink, also do not disclose in the prior art any relevant, can flexibly be out of shape; And at repeated deformation; Receive the electronic unit heat release, or form under the situation of fine pitch wirings, the flexible circuit board that wiring layer is peeled off, ruptured does not take place.The object of the present invention is to provide a kind of flexible circuit board and manufacturing approach thereof; The flexible circuit board that is formed with kink can flexibly be out of shape; And at repeated deformation, receive the electronic unit heat release, or form under the situation of fine pitch wirings; Wiring layer can not take place yet peel off, rupture, and connection reliability is high.
The technological means of dealing with problems
For achieving the above object, flexible circuit board of the present invention is characterized in that, has
The dielectric film of processing by thermoplastic resin;
Be formed at the wiring layer on the said dielectric film; With
Be formed at insulating barrier on the said wiring layer, that process by thermoplastic resin,
Said flexible circuit board is formed with the kink of radius of curvature R (mm) at least one place,
And can distortion under the state of the radius of curvature R (mm) that keeps said kink.
According to above structure, owing to form the kink with radius of curvature R (mm) at least one place of flexible circuit board, flexible base, board can dilatation, for example can the flexible circuit board under the bending state be inserted into the little space between parts.That is,, can realize the frivolous miniaturization of electronic equipment, reduce installing component effectively with the installing space of idle space as flexible circuit board through flexible circuit board being installed with the shape-consistent ground of electronic equipment.And, can form a plurality of kinks, for example, can flexible circuit board be formed snake abdomen shape.At this moment, flexible circuit board can dilatation, and the requirement that can be applied to the movable part etc. of above-mentioned robot has the position of retractility.Owing to can under the state of the radius of curvature R (mm) that keeps kink, be out of shape; Therefore can be bent and stretched repeatedly; Even or crooked with deep camber, can utilize also that substrate is whole to relax the stress that kink bore, can make kink keep certain radius of curvature R (mm).Likewise, even when making the flexible circuit board distortion because of the electronic unit heat release, also distortion under the state of the radius of curvature R (mm) that keeps kink of flexible circuit board.Thereby, because the wiring layer of kink along dielectric film, can keep shape, reduce the possibility of peeling off, rupturing of the wiring groove that kink takes place, keep good connection reliability.Because dielectric film and insulating barrier are to be formed by thermoplastic resin, the flexible circuit board of not wanting can return to the original form through heating once more, carries out the utilization again of resource.Here " being formed at the wiring layer on the dielectric film " is not only directly to form wiring layer at dielectric film, also comprises utilizing adhesive linkage that the situation of wiring layer on dielectric film is set.
Said radius of curvature R (mm) is preferably more than the 0.3mm.
According to this structure, further during the granular wiring width, can the degree of peeling off, rupturing of wiring layer not taken place in the Stress Control that wiring layer bore of kink.Therefore, can keep higher connection reliability.
The preferred liquid crystal polymer of said thermoplastic resin.
According to this structure, through using relative price lower, and the liquid crystal polymer of moulding easily, can control the manufacturing cost of flexible circuit board.
For achieving the above object, the present invention is correlated with
The manufacturing approach of above-mentioned flexible circuit board has following operation, comprising:
First operation: apply at two ends under the state of pulling force, utilize the crooked flexible circuit board of shaped device flexible circuit board, form radius of curvature R (mm) kink and
Second operation: under the state of the kink that has formed radius of curvature R (mm), at least
Heat said kink.
According to above-mentioned manufacturing approach, through easy manufacturing approach, flexible circuit board can form kink, can control the manufacturing cost of flexible circuit board.
Said first operation,
The said bend that makes the said shaped device with bend pushes said flexible circuit board alternately from the both sides of the thickness direction of said flexible circuit board, forms the kink that a plurality of radius of curvature are R (mm) thus.
According to above-mentioned manufacturing approach, for example serpentine-like configuration can more easily be made the flexible circuit board that forms a plurality of kinks.
The contact area of said first operation of use and said second operation and said flexible circuit board is provided with the said shaped device of rubber-like elasticity parts, and carries out said first operation and second operation.
According to above-mentioned manufacturing approach,, can impact as padded coaming through the rubber-like elasticity material, the friction aspect is protected flexible circuit board.That is, when diode was installed on flexible circuit board with LED, these installing components of the shaped device through above-mentioned manufacturing process need not worry and are damaged by pressure.Owing to utilize elastomeric elastomeric element, installing component contacts with shaped device, and heat is not directly passed to installing component during heating, can prevent because the breakage of the installing component that heat causes.
Said thermoplastic resin is a liquid crystal polymer,
In said second operation,
Heating-up temperature does, the surface temperature of said flexible circuit board is more than 150 ℃, and the thermal deformation that is lower than liquid crystal polymer begins the temperature of temperature,
Be in 1 hour heating time.
According to above-mentioned manufacturing approach, owing to the heating-up temperature heating fluid crystalline polymer that begins with the thermal deformation that does not reach liquid crystal polymer, liquid crystal polymer does not flow, and outward appearance, the performance of flexible circuit board are not damaged.Because the surface temperature of flexible circuit board reaches the heating-up temperature more than 150 ℃, can positively form kink to liquid crystal polymer, even, heat the shape (radius of curvature R (mm)) that also keeps not recovering original kink after accomplishing.If in 1 hour, can enhance productivity heating time, carry out long-time heating simultaneously, can avoid the variable color of liquid crystal polymer, the problem of thermal deformation and the damage of wiring layer.
The effect of invention
In sum, it is a kind of that the present invention can provide, for the flexible circuit board that forms kink, can soft be out of shape, even and if during repeated deformation, the flexible circuit board of peeling off, rupturing and the manufacturing approach thereof of wiring layer can not take place yet.
Description of drawings
Fig. 1 is the structure diagram of the flexible circuit board of this execution mode.
Fig. 2 is the sketch map of manufacturing approach of the flexible circuit board of this execution mode of expression.
Fig. 3 is the sketch map of manufacturing approach of the flexible circuit board of this execution mode of expression.
Fig. 4 is the sketch map of method of the flexible test of this execution mode of expression.
Fig. 5 is the schematic section of existing flexible circuit board.
Description of reference numerals
1. flexible circuit board
1A. kink
2. dielectric film
3. wiring layer
4. insulating barrier
5. adhesive linkage
Embodiment
Following with reference to accompanying drawing, in conjunction with example in detail execution mode of the present invention.But only if special explanation is arranged, otherwise scope of the present invention is not limited to size, material, shape, its configuration etc. relatively of the building block described in the following execution mode.
[execution mode]
(1: the brief configuration of flexible circuit board)
With reference to Fig. 1, the brief configuration of the flexible circuit board 1 of this execution mode is described.Fig. 1 (a) is the enlarged drawing that is formed at the kink 1A of flexible circuit board 1; Fig. 1 (b) is the structure diagram of flexible circuit board 1; Fig. 1 (c) is the schematic section of flexible circuit board 1, and Fig. 1 (d) is the sketch map of action of the kink 1A of the relevant flexible circuit board 1 of expression.
Shown in Fig. 1 (c), flexible circuit board 1 comprises dielectric film 2; Be formed at the wiring layer 3 on the dielectric film 2; Be formed at the insulating barrier 4 on the wiring layer 3.Wiring layer 3 is adhered on the dielectric film 2 through adhesive linkage 5, but also adhesive linkage 5 can be set.In addition, shown in Fig. 1 (b), at least one place has the kink 1A (be also referred to as three-dimensional formation portion, or bend) of radius of curvature R (mm) in the flexible circuit board 1.The flexible circuit board 1 that the explanation of this execution mode has the snake abdomen shape of a plurality of kink 1A, but the shape of flexible circuit board 1 is not limited to this, for example also can be the roughly U word shape that is provided with kink at a place.
Utilize adhesive linkage 5 that the known metal forming of rolled copper foil and electrolytic copper foil etc. is attached at dielectric film 2, and form wiring layer 3.Or, also can be on the surface of dielectric film 2 surface of the adhesive linkage 5 on the dielectric film 2 (or be formed at), metals such as utilization and copper or silver form wiring layer 3 through methods such as vapor deposition or sputters.The known thermoplastic resin or the cyanate of adhesive linkage 5 use polyimides etc. are that resin, polyphenylene oxide are that resin, phenolic aldehyde are known thermosetting resins such as resin, naphthalene resin, urea formaldehyde resin, amino resins, alkyd resins, silane resin, furane resins, unsaturated polyester resin, epoxy resin and polyurethane resin.Perhaps, also can be the inorganic filler of dispersed silicon dioxide in above-mentioned organic resin (silica) or aluminium oxide etc. and form adhesive linkage 5.
Dielectric film 2 and insulating barrier 4; Special recommendation requires to have stable on heating thermoplastic resin; Preferred liquid crystal polymer (for example; Trade name " Rodlan " (UNITIKA corporate system), " EPE " (Mitsubishi Chemical Ind's system), " bright dipping LCP " (bright dipping petrochemistry corporate system), " Econol " (sumitomo chemical company system), " XYDAR " (Japan petroleum chemical company system), " LCP " (eastern Cao's corporate system), " Vectra " (Hirst corporate system), " SRP " (ICI corporate system), " VECSTAR " (Kuraray corporate system), " BIAC " (Ri Bengeer corporate system), " ア ミ カ ス one パ one LCP " (sumitomo chemical company system); Polyamide (for example; Polyamide that obtains from the aromatic diamine of trimellitic anhydride and diphenyl methane two, diamino-phenyl ether, m-or p-phenylenediamine etc. etc.), thermoplasticity polyimides (for example, trade name " Aurum " (Mitsui Chemicals system)) etc.Be used for the thermoplastic resin of dielectric film 2 and insulating barrier 4, can use identical materials, also can select material different respectively for use.Below explanation is used for the situation of the liquid crystal polymer of dielectric film 2 and insulating barrier 4.
As stated, the flexible circuit board 1 of this execution mode forms the snake abdomen shape of the kink 1A with radius of curvature R (mm) in many places.Have under the situation of above-mentioned shape, flexible circuit board 1 can dilatation, and external force is done the time spent, and flexible circuit board 1 integral body is dilatation also, can prevent stress raisers thus.The architectural feature of the flexible circuit board 1 of this execution mode is following.That is, usually, when forming above-mentioned kink on the flexible circuit board, under the situation of power effect outside, the stress concentration of local is in kink, and the radius of curvature of kink changes, and wiring layer takes place peel off, rupture.But in this execution mode, making flexible circuit board 1 through the manufacturing approach of stating after utilizing can obtain, even also can keep the flexible circuit board 1 of the radius of curvature R (mm) of kink 1A under external force.Promptly; According to this execution mode shown in Fig. 1 (d); Even flexible circuit board 1 distortion (dotted portion among the figure), the radius of curvature R (mm) that yet can keep kink 1A does not exist in the danger of peeling off, rupturing that wiring takes place at kink 1A place for certain.
(2: the manufacturing approach of flexible circuit board)
With reference to Fig. 2, the manufacturing approach of the flexible circuit board 1 of this execution mode is described.
At first, shown in Fig. 2 (a), prepare metal pad pasting 11.Form adhesive linkage 5 through surface,, combine to make 3 layers of integrated metal pad pasting 11 that forms through hot pressing at the surperficial range upon range of metal forming 3A of adhesive linkage 5 at the dielectric film that forms by thermoplastic resin 2.The additive method that forms metal pad pasting 11 also can have been enumerated, and on metal forming, is coated with the varnish (varnish) as the presoma of dielectric film, and makes the dry method of this presoma; On dielectric film, pass through the method that vapor deposition or sputter or the like form metal level; And through the dielectric film that is coated with conductive paste being electroplated method that forms wiring layer etc.
Then, shown in Fig. 2 (b), metal level (metal forming 3A) is etched into desirable wiring pattern and forms wiring layer 3, obtain flexible circuit board 1.Then, shown in Fig. 2 (c),, form insulating barrier 4 through coated heat moldable resin on wiring layer 3.Perhaps, also can form insulating barrier 4 through the dielectric film that hot pressing combines to be formed by thermoplastic resin.More than, through operation shown in Fig. 2 (a) ~ Fig. 2 (c), obtain having the single-sided flexible circuit substrate 1 of insulating barrier 4.
The flexible circuit board 1 of this execution mode not only can adopt above-mentioned single-sided structure, also can adopt the sandwich construction shown in following.With reference to Fig. 3, the manufacturing approach of the multi-layer flexible circuit substrate with 3-tier architecture is described.
At first, shown in Fig. 3 (a), the metal pad pasting 11 shown in the set-up dirgram 2 (a), single-sided flexible circuit substrate 1 and metal forming 7 are prepared 2 then and are used for 3 bonding films 6 that sheet material is bonding.The thermoplastic resin of above-mentioned insulating barrier 4 usefulness is formed sheet be used for bonding film 6.As shown in the figure that they are range upon range of, through it being formed as one the sandwich heating and pressurizing.
Secondly, shown in Fig. 3 (b), form through hole 8 with drill bit and laser, form through hole coating 8a, make between the wiring layer 3 to be electrically connected in desirable position.Fig. 3 (b) expression makes the form of utilizing coating to connect between the wiring layer.Additive method can also be, through filling conductive paste in through hole 8, and makes the conductive paste sclerosis, and with being electrically connected between wiring layer.
Then, shown in Fig. 3 (c), utilize the method for etching etc., form wiring layer 3 with desirable wiring pattern with being arranged at each surperficial metal forming 3A, 7.Then, with said method (with reference to Fig. 2 (c)) likewise, form insulating barrier 4.Thus, can make multi-layer flexible circuit substrate with 3-tier architecture.Execution mode with 3-tier architecture has been described, but the structure of multi-layer flexible circuit substrate is not limited to 3-tier architecture here.
(3: the forming method of kink)
With reference to Fig. 2 (d), explain utilize above-mentioned manufacturing approach to make flexible circuit board 1 after, the flexible circuit board 1 of manufacturing is formed the forming method of kink 1A.
The manufacturing approach of the flexible circuit board 1 of this execution mode comprises, first operation wherein, applies at the two ends to flexible circuit board 1 under the state of pulling force, utilizes the crooked flexible circuit board 1 of shaped device, forms the kink 1A of radius of curvature R (mm); Second operation, wherein, the flexible circuit board 1 under the state that is in the kink 1A that forms radius of curvature R (mm) heats kink 1A at least.In this execution mode, as shaped device, it has and can move from two side direction flexible circuit boards 1 of the thickness direction of flexible circuit board 1, and front end has a plurality of moulds 9 (being also referred to as part mould) of bend.
In first operation; Utilize the two ends of the draw-off mechanism tractive flexible circuit board of not representing among the figure 1; Applying at the two ends to flexible circuit board 1 under the state of pulling force, move moulds 9, is both sides and flexible circuit board 1 pushing of the front end of mould 9 from the thickness direction of flexible circuit board 1.Because the front end at mould 9 is formed with bend, therefore, can form a plurality of kink 1A to flexible circuit board 1 through making mould 9 push flexible circuit board 1 alternately from both sides.Can change the radius of curvature R (mm) of the kink 1A in this execution mode through the front end shape that changes mould 9, same, quantity that can be through changing mould 9 aptly, at interval, and set quantity, the kink 1A interval each other of kink 1A arbitrarily.Also can make in the mould 9 of the thickness direction both sides that are in flexible circuit board 1, at least one direction flexible circuit board 1 moves.Plus-pressure during through 9 pairs of flexible circuit boards of mould 1 pressurization so long as the plus-pressure that can make flexible circuit board 1 positively form kink 1A at least get final product, can change according to the thickness of flexible circuit board 1, material etc. aptly.
In second operation, make flexible circuit board 1 be in that two ends are pulled and by mould 9 pushings, and forming under the state of a plurality of kink 1A, flexible circuit board 1 is heated its kink 1A at least.In this execution mode; For the flexible circuit board that is formed with kink 1A 1, through each mould 9 is dropped into heater, thus to flexible circuit board 1 heating; But also can be; At mould 9 set inside heater blocks, through the heat that mould 9 produces, to flexible circuit board 1 is that kink 1A heats at least.In this execution mode, heating-up temperature is to make the surface temperature of flexible circuit board 1 reach more than 150 ℃ and the thermal deformation of not enough liquid crystal polymer begins the temperature of temperature, is set at one hour heating time.In the surface temperature that makes flexible circuit board 1 is more than 150 ℃ and the thermal deformation of not enough liquid crystal polymer begins to heat under the temperature of temperature; Then liquid crystal polymer does not flow; Can not damage outward appearance, the performance of flexible circuit board 1, and, be the heating-up temperature more than 150 ℃ owing to make the surface temperature of flexible circuit board 1; Can positively form kink 1A for liquid crystal polymer; And then after heating finished, kink 1A can not recover original shape (keeping radius of curvature R (mm)).Through making heating time is in one hour, can enhance productivity, and can avoid liquid crystal polymer variable color, thermal deformation problem and wiring layer 3 damages because of long-time heating produces.At this; Explained and used liquid crystal polymer to make the situation of dielectric film 2, insulating barrier 4; But the material that is applicable to dielectric film 2, insulating barrier 4 as stated is not limited only to these, when selecting other materials, through the above-mentioned heating-up temperature of appropriate change, heating time; Can form kink 1A (thermal deformation that wherein, is limited to not enough selected material on the heating-up temperature begins the temperature of temperature).
Through carrying out above-mentioned first operation and second operation, can be manufactured at least one place and have radius of curvature R (mm), and can be under the state that keeps radius of curvature R (mm) flexible circuit board 1 of dilatation.In addition, also can carry out first operation and second operation simultaneously.That is, adopt heating to be equivalent to the part of kink 1A, and utilize mould 9 to make the method for flexible circuit board 1 bending.For mould 9, can in first operation and second operation, to the zone that contacts elastomeric elastomeric material be set with flexible circuit board 1.According to above structure, utilize the rubber-like elasticity material as padded coaming, can protect that flexible circuit board 1 is not hit, friction etc.That is, when at the surface mount capacitor of flexible circuit board 1 or LED, in manufacturing process, there is not the problem of damaging above-mentioned installing component because of mould 9 by pressure.Because across the contact of rubber-like elasticity parts, so heat can directly not be passed to installing component, can prevent that installing component from damaging because of being heated between installing component and the mould 9.As elastomeric elastomeric material, so long as have abrasion performance, resistance to impact, resistance to bend(ing) etc., its material is not special to be limited, and for example, can use polyurethane, neoprene, NBR, fluorubber, silicon rubber, natural rubber etc.
(4: test effect)
For the flexible circuit board of checking this execution mode and the effect of manufacturing approach thereof, according to the check test that is described below, relatively present embodiment and comparative example.Its assay is described.
At first; In the comparative example 1 ~ 5, prepare S ' PERFLEX (エ ス パ one Off レ Star Network ス: trade name) (Sumitomo Metal Industries' mine system, polyimide film: Kapton-EN as single face copper-surfaced paper tinsel 2 strata acid imide films as the copper-surfaced film; Thickness: 50 μ m, the thickness of Copper Foil: 18 μ m).In comparative example 6 ~ 10, prepare single face copper-surfaced paper tinsel 3 strata acid imide films (polyimide film: Kapton-EN, thickness: 50 μ m, the thickness of rolled copper foil: 18 μ m, bonding agent: epoxy resin, the thickness of bonding agent: 10 μ m) as the copper-surfaced film.These samples are done etch processes, form wiring layer 3, obtain single-sided flexible circuit substrate 1 with wiring pattern shown in Fig. 4 (a).The width of circuit substrate, wiring width etc., as shown in the figure.At this used polyimide film: Kapton-EN has thermosetting, and at least in this, the circuit substrate of comparative example 1 ~ 10 is different with the flexible circuit board of this execution mode 1.
Secondly, in the condition of table 1 record (surface temperature of radius of curvature (mm), substrate (℃), molding time (h)) form the single-sided flexible circuit substrate down.At this, as shaped device, the mould 9 used with this execution mode is identical.
[table 1]
| Sample | Radius of curvature (mm) | Surface temperature (℃) | Molding time (h) |
| Comparative example 1 | 1.0 | 100 | 1 |
| Comparative example 2 | 1.0 | 150 | 1 |
| Comparative example 3 | 1.0 | 200 | 1 |
| Comparative example 4 | 1.0 | 250 | 1 |
| Comparative example 5 | 1.0 | 300 | 1 |
| Comparative example 6 | 1.0 | 100 | 1 |
| Comparative example 7 | 1.0 | 150 | 1 |
| Comparative example 8 | 1.0 | 200 | 1 |
| Comparative example 9 | 1.0 | 250 | 1 |
| Comparative example 10 | 1.0 | 300 | 1 |
For estimating the connection reliability of resulting each sample, carry out " flexible repeatedly test ".With reference to Fig. 4 (b), simple declaration test method.Fig. 4 (b) has schematically shown to implementing the device of " flexible repeatedly test ".At first, when implementing test, will be fixed in fixed head 16 and movable platen 18 up and down respectively at fixed part 17 places as the two ends of the flexible circuit board 1 of subjects.At this moment, set flexible circuit board 1 under compressive state fixed head 16 and up and down the distance between the movable platen 18 be the aggregate value of the radius of curvature R (mm) of flexible circuit board 1.Set under the extended state fixed head 16 and up and down the distance between the movable platen 18 be 5 times of aggregate value of the radius of curvature of flexible circuit board 1.Secondly, movable platen 18 is up and down moved back and forth up and down 100,000 times with the speed of 100mm/ second.Then, with the resistance value of the resistance value of wiring layer 3 wiring layer 3 before flexible rise 10% this be regarded as " bad ".Be made as 20 for each sampling test number (N).Its result of the test of table 2 expression." could keep shape " in the table 2, be used for estimating, and whether the shape after the test keeps the radius of curvature R (mm) of kink." could moulding " be after examination is taken out flexible circuit boards from mould 9, whether forms the kink of radius of curvature R (mm).
Benchmark that could moulding in the table 2, could keep the benchmark of shape to do,
Zero: radius of curvature be design load ± 10% in,
△: radius of curvature be design load ± more than 10% ± 20% in,
*: radius of curvature be design load ± more than 20%,
The benchmark of outward appearance does,
Zero: do not observe the outflow of dielectric film or insulating barrier,
*: observe the outflow of dielectric film or insulating barrier.
[table 2]
| Sample | Could moulding | Could keep shape | Outward appearance | Umber of defectives (N=20) |
| Comparative example 1 | × | - | - | - |
| Comparative example 2 | × | - | - | - |
| Comparative example 3 | × | - | - | - |
| Comparative example 4 | × | - | - | - |
| Comparative example 5 | × | - | - | - |
| Comparative example 6 | × | - | - | - |
| Comparative example 7 | × | - | - | - |
| Comparative example 8 | △ | × | ○ | 8 |
| Comparative example 9 | △ | × | ○ | 9 |
| Comparative example 10 | △ | × | ○ | 12 |
Can know according to table 2, in comparative example 1 ~ comparative example 7, even if heating can not form kink to flexible circuit board.Can know in addition in comparative example 8 ~ comparative example 10, form kink during heating, yet when carrying out above-mentioned flexible test, the radius of curvature R of kink (mm) changes a lot, and is difficult to maintenance radius of curvature R (mm).Thereby, implemented same test to following sample A ~ E.The condition of sample A ~ E is following.
Among sample A ~ E, with this execution mode likewise, dielectric film 2 uses liquid crystal polymers with insulating barrier 4.That is,, prepare ESPANEX (エ ス パ ネ Star Network ス) L (trade name) (Nippon Steel's chemistry system, thickness: 50 μ m, the thickness of rolled copper foil: 18 μ m, thermal deformation begins temperature: 290 ℃) as single face copper-surfaced paper tinsel liquid crystalline polymer film at first as the copper-surfaced film.These samples are done etch processes, form wiring layer 3, obtain single-sided flexible circuit substrate 1 with wiring pattern shown in Fig. 4 (a).The width of circuit substrate, wiring width etc., as shown in the figure.Under condition shown in the table 3, form kink 1A,, carry out above-mentioned flexible test the flexible circuit board 1 that is formed with kink 1A.Show result of the test in the table 4.
[table 3]
| Sample | Radius of curvature (mm) | Surface temperature (℃) | Molding time (h) |
| A | 1.0 | 100 | 1 |
| B | 1.0 | 150 | 1 |
| C | 1.0 | 200 | 1 |
| D | 1.0 | 250 | 1 |
| E | 1.0 | 300 | 1 |
[table 4]
| Sample | Could moulding | Could keep shape | Outward appearance | Umber of defectives (N=20) |
| A | × | - | - | - |
| B | ○ | △ | ○ | 0 |
| C | ○ | ○ | ○ | 0 |
| D | ○ | ○ | ○ | 0 |
| E | △ | × | × | 15 |
According to the experimental result shown in the table 4, shown in sample A, can know that in the surface temperature that makes flexible circuit board 1 be 100 ℃ when heating, be difficult to form kink 1A.On the other hand, shown in sample E, can know that in the surface temperature that makes flexible circuit board 1 be 300 ℃ when heating, begin temperature owing to surpassed the thermal deformation of liquid crystal polymer, liquid crystal polymer begins thermal deformation, the polymerizable mesogenic flow.That is, form kink 1A, the very difficult radius of curvature R (mm) that keeps kink 1A in heating back even can know.Because flowing of liquid crystal polymer confirmed that outward appearance does not reach degree of admission yet.Shown in sample B ~ D; The surface temperature that can know flexible circuit board 1 is more than 150 ℃ and the thermal deformation of not enough liquid crystal polymer when beginning temperature, can form kink 1A, and; Carry out also keeping after the above-mentioned test radius of curvature R (mm) of kink 1A, outward appearance also is a degree of admission.That is, can claim that " 150 ℃ " are to form kink 1A; And implementing flexible test also can keep the lower limit heating-up temperature of the radius of curvature R (mm) of this kink 1A (in this execution mode, to use liquid crystal polymer; Certainly, when using other materials, this temperature possibly change).Be set at 1 hour in this heating time, but the inventor is through conscientiously learning after the research, even be in 1 hour heating time, " could moulding ", " could keep shape ", " outward appearance " also can fully reach the permission degree.
In sum, can draw to draw a conclusion.
When using thermosetting resin, can not form kink, maybe can not keep the curvature R (mm) of kink.
When using thermoplastic resin (during liquid crystal polymer); Making heating-up temperature be that to make the surface temperature of flexible circuit board be more than 150 ℃ and the thermal deformation of not enough liquid crystal polymer begins the temperature of temperature; Molding time is in 1 hour the time; Can form kink 1A, and carry out also can keeping after the above-mentioned flexible test radius of curvature R (mm) of kink 1A.Outward appearance also reaches the permission degree.
Below, research radius of curvature R (mm).At this; To the flexible circuit board 1 identical with sample A ~ sample E structure, the surface temperature in when heating is 200 ℃, and molding time is under 1 hour the condition; Form radius of curvature R (mm)=0.1mm (sample F), 0.3mm (sample G) respectively, and carry out above-mentioned flexible test.Condition of molding is as shown in table 5, and result of the test is as shown in table 6.
[table 5]
| Sample | Radius of curvature (mm) | Surface temperature (℃) | Molding time (h) |
| F | 0.1 | 200 | 1 |
| G | 0.3 | 200 | 1 |
[table 6]
| Sample | Could moulding | Could keep shape | Outward appearance | Bad generation number (N=20) |
| F | ○ | ○ | ○ | 10 |
| G | ○ | ○ | ○ | 0 |
According to this result, when radius of curvature was R (mm)=0.1mm, " could moulding ", " could keep shape ", " outward appearance " be all in the permission degree, but the ratio of about half takes place by " bad ".Consider that its reason is, owing to keep the radius of curvature R (mm) of kink 1A, radius of curvature R (mm) little (=curvature is big), therefore in kink 1A, wiring layer 3 is under pressure, and peels off, ruptures easily.Consider that the quantity that " bad " takes place increases because of the further granular that connects up.On the other hand, during radius of curvature R (mm)=0.3mm, " could moulding ", " could keep shape ", " outward appearance " be the permission degree, and " bad " do not take place.That is, for the peeling off, rupture of the wiring that positively prevented kink 1A, further improved connection reliability, preferred curvature radius R (mm) is more than the 0.3mm.
In sum, according to this execution mode a kind of flexible circuit board and manufacturing approach thereof are provided, it is for the flexible circuit board that is formed with kink; It can flexibly be out of shape; Even and, receive heat release from electronic unit at repeated deformation, perhaps form under the situation of trickle wiring; Peeling off, rupturing of wiring layer can not taken place yet, and connection reliability is high.
Claims (7)
1. a flexible circuit board is characterized in that having
The dielectric film of processing by thermoplastic resin;
Be formed at the wiring layer on the said dielectric film; With
Be formed at insulating barrier on the said wiring layer, that process by thermoplastic resin,
Said flexible circuit board is formed with the kink of radius of curvature R (mm) at least one place,
And can distortion under the state of the radius of curvature R (mm) that keeps said kink.
2. a flexible circuit board is characterized in that,
Said radius of curvature R (mm) is more than the 0.3mm.
3. flexible circuit board according to claim 1 and 2 is characterized in that,
Said thermoplastic resin is a liquid crystal polymer.
4. the manufacturing approach like each said flexible circuit board in the claim 1 ~ 3 is characterized in that, comprising:
First operation: apply at two ends under the state of pulling force, utilize the crooked flexible circuit board of shaped device flexible circuit board, form radius of curvature R (mm) kink and
Second operation: under the state of the kink that has formed radius of curvature R (mm), heat said kink at least.
5. according to the manufacturing approach of the said flexible circuit board of claim 4, it is characterized in that,
In said first operation,
The said bend that makes the said shaped device with bend pushes said flexible circuit board alternately from the both sides of the thickness direction of said flexible circuit board, forms the kink that a plurality of radius of curvature are R (mm) thus.
6. according to the manufacturing approach of claim 4 or 5 said flexible circuit boards, it is characterized in that,
The contact area of said first operation of use and said second operation and said flexible circuit board is provided with the said shaped device of rubber-like elasticity parts, and carries out said first operation and second operation.
7. according to the manufacturing approach of any one described flexible circuit board in the claim 4 ~ 6, it is characterized in that,
Said thermoplastic resin is a liquid crystal polymer,
In said second operation,
Heating-up temperature does, the surface temperature of said flexible circuit board is more than 150 ℃, and the thermal deformation that is lower than liquid crystal polymer begins the temperature of temperature,
Be in 1 hour heating time.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009292801A JP5717961B2 (en) | 2009-12-24 | 2009-12-24 | Method for manufacturing flexible circuit board |
| JP2009-292801 | 2009-12-24 | ||
| PCT/JP2010/062057 WO2011077777A1 (en) | 2009-12-24 | 2010-07-16 | Flexible circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102687598A true CN102687598A (en) | 2012-09-19 |
| CN102687598B CN102687598B (en) | 2016-01-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080058828.2A Active CN102687598B (en) | 2009-12-24 | 2010-07-16 | Flexible circuit board and manufacture method thereof |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9024198B2 (en) |
| EP (1) | EP2519083A4 (en) |
| JP (1) | JP5717961B2 (en) |
| CN (1) | CN102687598B (en) |
| HK (1) | HK1169777A1 (en) |
| TW (1) | TWI508634B (en) |
| WO (1) | WO2011077777A1 (en) |
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| CN107148808A (en) * | 2014-08-29 | 2017-09-08 | 诺基亚技术有限公司 | Device and associated method for deformable electronic device |
| CN108012406A (en) * | 2017-12-06 | 2018-05-08 | 广州兴森快捷电路科技有限公司 | Stretchable FPC plates and preparation method thereof |
| CN108235567A (en) * | 2016-12-22 | 2018-06-29 | 东洋铝株式会社 | Circuit board |
| CN108495488A (en) * | 2018-05-23 | 2018-09-04 | 华普通用技术研究（广州）有限公司 | A kind of production method of multilayer printed circuit board |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3300572A (en) * | 1963-12-18 | 1967-01-24 | Sanders Associates Inc | Extensible and retractable flexible circuit cable |
| US5747743A (en) * | 1994-02-04 | 1998-05-05 | Nippondenso Co., Ltd. | Coil-shaped flexible printed circuit board |
| CN1829412A (en) * | 2005-02-17 | 2006-09-06 | 新日铁化学株式会社 | Double-side flexible circuit substrate capable of repeatedly bending |
| JP2007134473A (en) * | 2005-11-10 | 2007-05-31 | Matsushita Electric Ind Co Ltd | Flexible wiring board and its manufacturing method |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03220787A (en) * | 1990-01-26 | 1991-09-27 | Yazaki Corp | Flexible circuit body and manufacture thereof |
| US5341806A (en) | 1991-04-18 | 1994-08-30 | Physio-Control Corporation | Multiple electrode strip |
| US5316693A (en) * | 1991-04-18 | 1994-05-31 | Idemitsu Kosan Co., Ltd. | Liquid crystal composition and information display apparatus using the liquid crystal composition |
| JPH0576070A (en) | 1991-09-17 | 1993-03-26 | Nec Corp | Remote control transmitter |
| JP2537639Y2 (en) | 1992-03-21 | 1997-06-04 | 日本メクトロン株式会社 | Bending structure of flexible circuit board |
| JP3203883B2 (en) | 1993-06-10 | 2001-08-27 | 横河電機株式会社 | Print coil type transformer |
| JPH08274417A (en) | 1995-03-31 | 1996-10-18 | Matsushita Electric Ind Co Ltd | Flexible wiring board and its manufacture |
| US6027958A (en) * | 1996-07-11 | 2000-02-22 | Kopin Corporation | Transferred flexible integrated circuit |
| JP3592464B2 (en) | 1996-10-05 | 2004-11-24 | 日東電工株式会社 | Rigid circuit members |
| US6274225B1 (en) | 1996-10-05 | 2001-08-14 | Nitto Denko Corporation | Circuit member and circuit board |
| CN1115082C (en) | 1996-10-05 | 2003-07-16 | 日东电工株式会社 | Circuit member and circuit board |
| JPH1154873A (en) | 1997-07-31 | 1999-02-26 | Canon Inc | Flexible printed circuit board |
| US5906507A (en) * | 1997-08-07 | 1999-05-25 | Howard; James R. | Foldable electrical cord |
| JP4190049B2 (en) * | 1998-04-07 | 2008-12-03 | 株式会社神戸製鋼所 | Tensile bending method for profiles |
| JP2000042638A (en) * | 1998-07-28 | 2000-02-15 | Toyota Motor Corp | Tension-bending device |
| JP2002094191A (en) | 2000-09-18 | 2002-03-29 | Matsushita Electric Ind Co Ltd | Flexible board and device using the same |
| GB2401492B (en) * | 2000-10-13 | 2005-03-30 | Nokia Corp | Apparatus for routing a flexible circuit |
| JP2003008161A (en) | 2001-06-26 | 2003-01-10 | Matsushita Electric Ind Co Ltd | Conductor and circuit board |
| JP3828412B2 (en) * | 2001-12-03 | 2006-10-04 | 本田技研工業株式会社 | Forming method of panel member with closed section and molding apparatus for panel member with closed section |
| JP3989820B2 (en) | 2002-11-18 | 2007-10-10 | 山一電機株式会社 | Multilayer wiring board and manufacturing method thereof |
| CN101437456A (en) * | 2006-01-26 | 2009-05-20 | 康奈尔研究基金会股份有限公司 | Microfabricated tools for manipulation of small samples |
| JP2007305704A (en) * | 2006-05-10 | 2007-11-22 | Kaneka Corp | Flexible circuit substrate with enhanced flexibility |
| JP4907328B2 (en) * | 2006-12-15 | 2012-03-28 | 日東電工株式会社 | Printed wiring board, manufacturing method thereof, and electronic device |
| JP2008159908A (en) * | 2006-12-25 | 2008-07-10 | Teikoku Tsushin Kogyo Co Ltd | Bending structure of flexible circuit board |
| JP4830881B2 (en) * | 2007-02-05 | 2011-12-07 | 住友金属鉱山株式会社 | Circuit board for molding and three-dimensional circuit board obtained by molding the same |
| JP2008210891A (en) * | 2007-02-23 | 2008-09-11 | Fujikura Ltd | Flexible printed circuit board |
| WO2010058476A1 (en) * | 2008-11-21 | 2010-05-27 | 日立化成工業株式会社 | Photoelectric hybrid board and electronic apparatus |
| CN102237628A (en) * | 2010-05-06 | 2011-11-09 | 鸿富锦精密工业（深圳）有限公司 | Connecting piece and electronic device with connecting piece |
-
2009
- 2009-12-24 JP JP2009292801A patent/JP5717961B2/en active Active
-
2010
- 2010-07-16 US US13/518,470 patent/US9024198B2/en active Active
- 2010-07-16 WO PCT/JP2010/062057 patent/WO2011077777A1/en active Application Filing
- 2010-07-16 EP EP10839014.7A patent/EP2519083A4/en not_active Ceased
- 2010-07-16 CN CN201080058828.2A patent/CN102687598B/en active Active
- 2010-12-20 TW TW099144732A patent/TWI508634B/en active
-
2012
- 2012-10-22 HK HK12110516.0A patent/HK1169777A1/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3300572A (en) * | 1963-12-18 | 1967-01-24 | Sanders Associates Inc | Extensible and retractable flexible circuit cable |
| US5747743A (en) * | 1994-02-04 | 1998-05-05 | Nippondenso Co., Ltd. | Coil-shaped flexible printed circuit board |
| CN1829412A (en) * | 2005-02-17 | 2006-09-06 | 新日铁化学株式会社 | Double-side flexible circuit substrate capable of repeatedly bending |
| JP2007134473A (en) * | 2005-11-10 | 2007-05-31 | Matsushita Electric Ind Co Ltd | Flexible wiring board and its manufacturing method |
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| CN104952741B (en) * | 2014-03-27 | 2018-07-17 | 英特尔公司 | Electric circuit on flexible base board |
| CN104952741A (en) * | 2014-03-27 | 2015-09-30 | 英特尔公司 | Electric circuit on flexible substrate |
| CN107148808B (en) * | 2014-08-29 | 2019-07-09 | 诺基亚技术有限公司 | Device and associated method for deformable electronic device |
| CN107148808A (en) * | 2014-08-29 | 2017-09-08 | 诺基亚技术有限公司 | Device and associated method for deformable electronic device |
| US10321563B2 (en) | 2014-08-29 | 2019-06-11 | Nokia Technologies Oy | Apparatus and associated methods for deformable electronics |
| CN108235567A (en) * | 2016-12-22 | 2018-06-29 | 东洋铝株式会社 | Circuit board |
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| CN108495488A (en) * | 2018-05-23 | 2018-09-04 | 华普通用技术研究（广州）有限公司 | A kind of production method of multilayer printed circuit board |
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| CN113646664B (en) * | 2019-03-29 | 2024-03-15 | 富士胶片株式会社 | Radiographic imaging apparatus |
| CN114174062A (en) * | 2019-08-06 | 2022-03-11 | 株式会社村田制作所 | Resin sheet and resin multilayer substrate |
| CN113689978A (en) * | 2021-08-12 | 2021-11-23 | 武汉华星光电半导体显示技术有限公司 | Flexible circuit board and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2519083A1 (en) | 2012-10-31 |
| WO2011077777A1 (en) | 2011-06-30 |
| HK1169777A1 (en) | 2013-02-01 |
| CN102687598B (en) | 2016-01-20 |
| US20140102771A1 (en) | 2014-04-17 |
| JP2011134884A (en) | 2011-07-07 |
| EP2519083A4 (en) | 2013-09-11 |
| JP5717961B2 (en) | 2015-05-13 |
| US9024198B2 (en) | 2015-05-05 |
| TWI508634B (en) | 2015-11-11 |
| TW201141323A (en) | 2011-11-16 |
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