CN101090604A

CN101090604A - Circuit board with honeycomb resin discharge channel

Info

Publication number: CN101090604A
Application number: CNA2006100918803A
Authority: CN
Inventors: 杨永松
Original assignee: HUATONG COMPUTER CO Ltd
Current assignee: HUATONG COMPUTER CO Ltd
Priority date: 2006-06-13
Filing date: 2006-06-13
Publication date: 2007-12-19

Abstract

This invention discloses a CB, the periphery of which is a honeycomb state array spread with multiple hexagonal false weld pads and a channel is formed between any two adjacent false weld pads forming a honeycomb resin discharge path to discharge air bubbles remained in interbeds and part of melt resin uniformly when the CB is hot-pressed with another upper layer CB.

Description

Circuit board with honeycomb resin discharge channel

Technical field

The present invention relates to a kind of printed circuit board (PCB), especially a kind of circuit board with honeycomb resin discharge channel relevant with the pressing manufacturing process of multilayer board.

Background technology

The pressing manufacturing process of multilayer circuit board influences the success or failure responsibility of follow-up quality, and can't heavy industry, the operation of most critical in the multi-layer sheet processing procedure of can saying so.This pressing manufacturing process mainly is to finish each inner plating (thin core) pressing all-in-one-piece multilayer circuit board that circuit pattern is made, and in the pressing process, the resin material of this inner plating pushes to four limits because of being subjected to hot pressing to be molten condition, via around here process with between complete layer then and the filling up of space.

In No. 508012 novel patent case announced in the tw Taiwan, disclosed a circuit board pressing overfall structure, it mainly is to be provided with gummosis mouth and overfall in circuit board edges of boards corner location, in order in circuit board pressing manufacture process, discharge the resin of a part of fusion and remain in the bubble of interlayer.

In Fig. 5, the periphery that shows a circuit board is formed with the pseudo-weld pad of a plurality of circles (Dummy Pads) 81, be formed with runner 82 between these circular pseudo-weld pads 81, in order to resin of in circuit board pressing manufacture process, discharging a part of fusion and the bubble that remains in interlayer.This structure can cause the too much resin that runs off, and causes medium thickness to cross the thin problems such as uniformity control is difficult for that reach.

In addition, the runner that respectively forms an about 100mil of width in the peripheral corner of a circuit board is also arranged.Though this structure can be avoided the too much resin that runs off, only use all pressing manufacture processes in large scale or special circuit board, for example HDI plate (high density interconnect) or RCC plate (Resin CoatedCopper foil), the bubble of interlayer can't successfully be discharged.At present, though the high-pressure pressing only can make bubble diminish, can not get rid of fully.

Summary of the invention

Main purpose of the present invention is to provide a kind of circuit board that cellular resin flow is engaged in this profession that has.Engage in this profession in the cellular resin flow of circuit board periphery by the position, can make circuit board under lower pressure, carry out hot pressing with layer circuit board on another, and in the pressing process, remain in the bubble of interlayer and the resin of a part of fusion, can engage in this profession via this cellular resin flow and evenly discharge.

Particularly, foregoing circuit plate of the present invention comprises that a dielectric layer and is formed at the line layer of the one side of this dielectric layer.This line layer has a circuit pattern district and an external zones around this circuit pattern district.It is a honeycomb array that this external zones has that a plurality of hexagonal pseudo-weld pads arrange, and has a channel between wherein any two adjacent pseudo-weld pads and gang up this cellular resin flow of formation each other and engage in this profession.

In the above-mentioned honeycomb resin discharge channel each all is tortuous to outer pathway, thereby long outflow path is provided.Moreover each pseudo-weld pad all is hexagonal, more can slow down the rate of outflow of molten resin than the pseudo-weld pad of circle of the prior art.The width of each channel all is identical again, makes molten resin evenly to discharge with stable flow velocity, by can accurate control flows output obtaining the medium thickness of being desired then.

Description of drawings

Fig. 1 shows a preferred embodiment of the present invention.

Fig. 2 is the part section amplification figure of this preferred embodiment.

Fig. 3 is the part plan enlarged drawing of this preferred embodiment.

Fig. 4 shows the partly enlarged drawing of the pseudo-weld pad of hexagon.

Fig. 5 shows that a kind of periphery has the known circuits plate of the pseudo-weld pad of a plurality of circles.

1 dielectric layer, 100 circuit boards

2 line layers, 21 circuit pattern districts

210 finished product districts, 22 external zoness

23 gaps, 3 hexagonal pseudo-weld pads

31 passage D width

The L length of side 81 circular pseudo-weld pads

82 runners

Embodiment

See also a preferred embodiment of the present invention shown in Figure 1.For the purpose of simplified illustration, the circuit board 100 shown in the figure only comprises an interface layer 1 and a line layer 2.In this case, this circuit board 100 is the one deck in the multilayer board usually.

In Fig. 1, dielectric layer 1 contains the resin composition, and line layer 2 is the one sides that are formed at dielectric layer 1, and has a circuit pattern district 21 and an external zones 2 is centered around around this circuit pattern district 21.Wherein, circuit pattern district 21 has eight finished product districts 210, between each finished product district 210 and the external zones 22 across a gap 23.In addition, for a multilayer board, dielectric layer 1 normally is made of an adhesive film (prepreg) that contains the resin composition.Line layer 2 is normally formed by being attached to the lip-deep Copper Foil of adhesive film.In any case, of the present inventionly focus on having in the external zones 22 a plurality of hexagonal pseudo-weld pads (Dummy pads) 3 and arrange into a honeycomb array.

Point out more clearly in Fig. 2,3 that in external zones 22 any two 3 adjacent of pseudo-weld pads respectively have a passage 31 gangs up each other and form a cellular resin discharge channel and be covered with this external zones 22, and the periphery of communication gap 23 and this external zones 22.Thus, once on layer circuit board can under lower pressure, carry out hot pressing with circuit board 100, at this moment, the resin of interlayer can be heated and be melt into glue, and the molten resin of a part and the bubble that remains in interlayer are promptly on average discharged via the cellular resin discharge channel that above-mentioned a plurality of passages 31 are formed.

What be different from prior art is, the pseudo-weld pad 3 in the external zones 22 on the circuit board 100 all is hexagonal, and the compartment of terrain arranges into the honeycomb array, in order to form cellular resin discharge channel in external zones 22.The benefit of doing like this is that each bar in this cellular resin discharge channel all is tortuous to outer pathway, thereby long outflow path is provided.Moreover, because each pseudo-weld pad 3 all is hexagonal, therefore, the rate of outflow that more can slow down molten resin than the pseudo-weld pad 81 of circle of the prior art.Thus, this molten resin is unlikely runs off too much, and then avoid crossing the problem that the thin plate that causes is curved or plate sticks up because of the medium thickness between circuit board 100 and the last layer circuit board.

See also Fig. 4, point out that wherein the width D between each passage 31 all is identical, this means that molten resin can on average discharge with stable flow velocity, thus can accurate control flows output, obtain the medium thickness desired and good pressing plate quality then.Each pseudo-weld pad 3 equilateral hexagon preferably again, and its each length of side L is preferably between 0.05～0.2 inch.In addition, the width D of each passage 31 is then preferably between 0.01～0.05 inch.Under these conditions, can obtain quite practical result.

Above-mentioned embodiment is only in order to explanation the present invention, and non-limiting the present invention.

Claims

1, a kind of circuit board is characterized in that, comprising:

One dielectric layer contains the resin composition;

One line layer, it is the one side that is formed at dielectric layer, and having a circuit pattern district and around the external zones in this circuit pattern district, this external zones has a plurality of hexagonal pseudo-weld pads and arranges into a honeycomb array, and respectively has a passage between wantonly two adjacent pseudo-weld pads and gang up each other.

2, circuit board as claimed in claim 1 is characterized in that, described each width of channel is all identical.

3, circuit board as claimed in claim 2 is characterized in that, described each width of channel is between 0.01 to 0.05 inch.

As claim 1 or 3 described circuit boards, it is characterized in that 4, described each pseudo-weld pad is an equilateral hexagon.

5, circuit board as claimed in claim 4 is characterized in that, each length of side of described each pseudo-weld pad is between 0.05～0.2 inch.