CN112367762A

CN112367762A - Jointed board structure for improving high-multilayer PCB

Info

Publication number: CN112367762A
Application number: CN202011177527.3A
Authority: CN
Inventors: 范红
Original assignee: Aoshikang Technology Co Ltd
Current assignee: Aoshikang Technology Co Ltd
Priority date: 2020-10-28
Filing date: 2020-10-28
Publication date: 2021-02-12

Abstract

The invention relates to the technical field of PCB manufacturing, and discloses a jointed board structure for improving a high-multilayer PCB, which comprises a multilayer core board, wherein the core board comprises a plurality of small boards, a milling cutter belt is arranged between every two adjacent small boards, the milling cutter belt comprises a reserved area and a copper-paving area, the copper-paving area is arranged in the reserved area, and the copper-paving area is provided with a copper layer. Compared with the prior art, the milling cutter belt is paved with copper between the small plates, so that the uniformity of the PCB surface is improved, the collapse of the area where the milling cutter belt is positioned on the PCB surface is avoided, the occurrence of incomplete polishing or substrate leakage during board grinding is reduced, and the rejection of the substrate is reduced. The structure is simple in design, the appearance of the milling plate can be prevented from being influenced, and the proceeding of other procedures is not influenced.

Description

Jointed board structure for improving high-multilayer PCB

Technical Field

The invention relates to the technical field of PCB manufacturing, in particular to a jointed board structure for improving a high-multilayer PCB.

Background

With the high-speed development of 5G products, the PCB advances towards a high-density and high-integration direction, and particularly, the demand on the PCB with high layers, thin core boards, thin lines and high reliability is increased, and the demand on the core boards is increased due to the fact that the thickness of the high-density multilayer boards is controlled and arranged; when a high-rise board of a PCB is processed, in order to improve the utilization rate of the board and the processing convenience (the size is too small and exceeds the processing capacity of equipment too much), a plurality of modules (set) in the same unit or modules in different units are often spliced on the same large board (pnl), and then the board is cut and separated by a routing tool after the processing is finished. Influenced by the size of the milling cutter, the spacing between set and set is set to be 2-2.5 mm in the general setting in the industry, and the milling cutter is designed to be a copper-free area. The diameter of the gong knife is generally 0.8-10 mm.

When the number of the plate layers is more than 12, the thickness of the core plate is 0.05 mm-0.1mm, and after etching and pressing, the multi-layer core plates are overlapped and deformed on the copper-free jointed plate strips and insufficient in glue filling, so that the surface of the jointed plate is collapsed. Meanwhile, in order to improve the hole reliability and wiring density of the PCB, resin is often used for hole plugging and polishing. When the resin hole is filled and the plate is ground, the conditions of incomplete grinding and excessive grinding leakage of the base material caused by plate surface collapse are easy to occur.

Therefore, there is a need to provide a new and improved panel structure for high multi-layer PCB to solve the above-mentioned problems.

Disclosure of Invention

The invention aims to solve the technical problem of providing a jointed board structure for improving a high-multilayer PCB, which has a simple structure and can prevent the surface of the jointed board of the PCB from collapsing.

The technical scheme is that the jointed board structure for improving the high-multilayer PCB comprises a multilayer core board, wherein the core board comprises a plurality of small boards, a milling cutter belt is arranged between every two adjacent small boards, the milling cutter belt comprises a reserved area and a copper-paving area, the copper-paving area is arranged in the reserved area, and the copper-paving area is provided with a copper layer.

Preferably, the number of the copper layers is multiple, and the copper layers between two adjacent core plates are arranged in a staggered manner.

Preferably, the width of the milling cutter belt is a, and the range of the width of the milling cutter belt is 2 mm-4 mm.

Preferably, the width of the reserved area is c, wherein c is greater than or equal to 0.1 mm.

Preferably, the copper layers are arranged in a row, the length and the width of each copper layer are respectively a-2c, and the distance between every two adjacent copper layers is smaller than a-2 c.

Preferably, the copper layers are arranged in two rows, the distance between the two rows of the copper layers is b, the length and the width of the copper layers are respectively (a-2c-b)/2, the distance between two adjacent copper layers in each row of the copper layers is less than (a-2c-b)/2, and b is greater than or equal to 0.1 mm.

Preferably, the number of the core plates is greater than 12, that is, the number of the core plates is greater than 12.

Compared with the prior art, the milling cutter belt is paved with copper between the small plates, so that the uniformity of the PCB surface is improved, the collapse of the area where the milling cutter belt is positioned on the PCB surface is avoided, the occurrence of incomplete polishing or substrate leakage during board grinding is reduced, and the rejection of the substrate is reduced. The structure is simple in design, the appearance of the milling plate can be prevented from being influenced, and the proceeding of other procedures is not influenced.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a top view of a first embodiment of the present invention;

fig. 3 is a top view of a second embodiment of the present invention.

In the figure:

1. the core board, 2, small board, 3, milling cutter belt, 31, reserved area, 32, copper laying area and 321 copper layer.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Example one

Referring to fig. 1-2, the present embodiment includes a multilayer core board 1, where the core board 1 includes a plurality of small boards 2, a milling cutter strip 3 is disposed between two adjacent small boards 2, the milling cutter strip 3 includes a reserved area 31 and a copper-spreading area 32, the copper-spreading area 32 is disposed in the reserved area 31, the copper-spreading area 32 is provided with a copper layer 321, and the reserved area 31 is an area between the copper layer 321 and the small board 2. The small plate 2 is a circuit board required by a customer, namely a delivery unit; the small plates 2 in the core plate 1 may be the same or different.

The copper layers 321 are multiple, and the area between two adjacent copper layers 321 does not need to be paved with copper, so that the arrangement is favorable for reducing the consumption of copper and the cost. Copper layer 321 dislocation set between two adjacent core boards 1, in upper and lower two-layer core board 1, the position that the copper layer 321 of lower floor core board 1 corresponds is the region of upper core board 1's no spreading copper, the position that the region between two copper layers 321 of lower floor core board 1 corresponds is the copper layer 321 of upper core board 1, this structure is when reducing the quantity of copper, and copper layer 321 in each core board 1 can play fine supporting effect, does benefit to and prevents that 3 regions in PCB board surface milling cutter area from taking place to collapse.

In this embodiment the distance a of the milling cutter strip 3 is 2.5 mm.

The width c of the reserved area 31 is 0.1mm, the reserved area 31 is an area between the copper layer 321 and the small plate 2, the precision tolerance of the shape of the milling cutter is 0.075mm-0.1mm, and the saw-shaped shape caused by the influence of the precision of the shape of the milling cutter can be avoided by the arrangement during milling.

The copper layers 321 are arranged in a row, the length and the width of each copper layer 321 are 2.3mm, and the distance between two adjacent copper layers 321 is less than or equal to 2.3 mm. In this structure, the number of copper layers 321 is small, but the length of the copper layers 321 is long.

The number of core boards 1 is greater than 12.

Example two

This embodiment is substantially the same as the first embodiment, except that:

referring to fig. 3, the copper layers 321 are arranged in two rows, the distance b between the two rows of copper layers is 0.1mm, the length and the width of each copper layer 321 are 1.1mm, and the distance between two adjacent copper layers 321 in each row of copper layers is less than or equal to 1.1 mm. In this structure, the number of copper layers 321 is large, but the length of the copper layer 321 is short.

According to the invention, by paving copper in the milling cutter belt 3 between the

small plates

2 and 2, the uniformity of the PCB surface is improved, and the collapse of the area where the milling cutter belt 3 is positioned on the PCB surface is avoided, so that the occurrence of incomplete polishing or substrate leakage during board grinding is reduced, and the rejection of the substrate is further reduced. The structure is simple in design, the appearance of the milling plate can be prevented from being influenced, and the proceeding of other procedures is not influenced.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims

1. The utility model provides an improve makeup structure of high multilayer PCB board which characterized in that, includes the multilayer core, the core includes a plurality of platelets, adjacent two be equipped with the milling cutter area between the platelet, the milling cutter area is including reservation zone and shop copper district, shop copper district locates in the reservation zone, shop copper district is equipped with the copper layer.

2. The improved jointed board structure of multi-layer PCB board as claimed in claim 1, wherein said copper layers are multiple, and the copper layers between two adjacent said core boards are arranged in a staggered manner.

3. The jointed board structure of an improved high multi-layer PCB board as claimed in claim 2, wherein the width of the milling cutter belt is a, and a ranges from 2mm to 4 mm.

4. An improved puzzle structure for higher multi-layer PCBs, as in claim 3, wherein said pre-cut area has a width of c, where c is greater than or equal to 0.1 mm.

5. The improved jigsaw structure of a multilayer PCB as claimed in claim 4, wherein the copper layers are arranged in a row, the length and width of each copper layer are a-2c, and the distance between two adjacent copper layers is less than a-2 c.

6. The improved jigsaw structure of a multilayer PCB as defined in claim 4, wherein the copper layers are two rows, the distance between two rows of the copper layers is b, the length and width of the copper layers are (a-2c-b)/2, respectively, and the distance between two adjacent copper layers in each row of the copper layers is less than (a-2c-b)/2, wherein b is greater than or equal to 0.1 mm.

7. A jigsaw structure of an improved high multi-layer PCB board as claimed in claim 5 or claim 6, wherein the number of layers is 12 or more.