CN113543493B - Preparation method of Z-direction interconnection printed circuit board - Google Patents
Preparation method of Z-direction interconnection printed circuit board Download PDFInfo
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- CN113543493B CN113543493B CN202110783651.2A CN202110783651A CN113543493B CN 113543493 B CN113543493 B CN 113543493B CN 202110783651 A CN202110783651 A CN 202110783651A CN 113543493 B CN113543493 B CN 113543493B
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- hole
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Abstract
The invention relates to a preparation method of a Z-direction interconnection printed circuit board, which comprises the following steps: laminating a protective film on the core plate or the laminated plate; a through hole is formed in the grouting position of the target Z-direction communication; injecting the conductive copper paste into the opened through hole, heating for pre-curing, and then leveling the protruding copper paste at the through hole; cleaning, removing the protective film, printing copper paste on the upper and lower surfaces of the through holes of the core board or the laminated board after grouting, and then performing vacuum lamination to form a horizontal copper conducting layer, so that the copper conducting layer is electrically connected with the Z-direction conducting structure; etching to obtain horizontal conductive pattern layers between layers, and realizing Z-direction interconnection between the multiple layers of printed circuit boards. Compared with the prior art, the invention ensures that the communication among all layers does not depend on the through holes, thereby increasing the flexibility of the design of the circuit board, changing a high-layer board with a complex structure into a low-layer board with a simple structure, and avoiding the limitation on the thickness-diameter ratio of the high-layer board.
Description
Technical Field
The invention relates to the field of integrated circuit design, in particular to a preparation method of a Z-direction interconnection printed circuit board.
Background
With the rapid development of electronic technology, electronic products tend to be multifunctional and miniaturized. This has led to the development of multilayer, integrated and high-density printed circuit boards as the basis for electronic component mounting.
For interlayer electric connection, the traditional PCB multilayer board must be subjected to interlayer drilling and electroplating, electric conduction is realized through hole or blind hole connection after electroplating, the effective area of the printed board is reduced by the through hole, the alignment precision is difficult to control in the process of layer-by-layer drilling and electroplating, and the manufacturing of the multi-level crossed blind buried hole printed board is more complex.
CN109661128A provides a method for preparing a multilayer PCB board and the multilayer PCB board, the method for preparing the multilayer PCB board includes cutting, first drilling, first copper deposition and plating, resin plugging, inner layer line coating, inner layer pattern, inner layer line inspection, first pattern electroplating, inner layer etching, lamination, second drilling, second copper deposition and plating, outer layer line coating, outer layer pattern, line alignment, outer layer pattern electroplating, outer layer etching, solder resist printing; the multi-layer PCB comprises a laminated board formed by laminating at least two layers of core boards and semi-cured boards at intervals, and inner layer circuit patterns are formed on the upper surface and the lower surface of each layer of core board; resin is filled in the through holes of the upper and lower outer core plates; depositing a copper layer in a plug-in hole drilled on the laminated plate; the upper and lower surfaces of the laminated plate are formed with outer layer circuit patterns. In the technical scheme, the through holes subjected to copper deposition and electroplating treatment also need to be subjected to resin hole plugging treatment, so that the effective area of the printed board is reduced.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a preparation method of a Z-direction interconnection printed circuit board.
For the traditional PCB enterprises, the application of the technology realizes higher-order cross interconnection of the printed boards without adding and replacing too much equipment, and reduces the manufacturing cost for the enterprises.
The aim of the invention can be achieved by the following technical scheme:
the technical scheme aims to protect a preparation method of a Z-direction interconnection printed circuit board, which comprises the following steps:
s1: laminating a protective film on the core plate or the laminated plate;
s2: a through hole is formed in the grouting position of the target Z-direction communication;
s3: injecting the conductive copper paste into the through hole formed in the step S2, heating and pre-curing, and then leveling the protruding copper paste at the through hole to form a Z-type conductive structure;
s4: cleaning the through hole after grouting, removing the protective film, printing copper paste on the upper and lower surfaces of the through hole of the core board or the laminated board after grouting, and then performing vacuum lamination to form a horizontal copper conducting layer, so that the copper conducting layer is electrically connected with the Z-direction conducting structure;
s5: and (3) etching the horizontal copper conductive layer prepared in the step (S4) according to a preset interlayer conductive path to obtain an interlayer horizontal conductive pattern layer, and realizing Z-direction interconnection among the plurality of layers of printed circuit boards through matching of the horizontal conductive pattern layers on the upper and lower surfaces among the layers of the printed circuit boards and Z-direction conductive structures of the specific layers.
Further, in S2, a through hole is formed by mechanical drilling.
Further, in S3, a vacuum hole plugging machine is used to perform the injection of the conductive copper paste into the through holes opened in S2.
Further, the heating and pre-curing condition in the step S3 is that heating is carried out for 1-10 min at 50-70 ℃.
Further, the condition of heating and pre-curing in S3 is that heating is carried out for 10min at 70 ℃.
Further, in S3, a scraper is adopted to scrape the convex copper paste at the through hole in the vacuum box, so as to realize the leveling process.
Further, the S4 is cleaned by adopting a mixed solution of 3 to 5 percent of dilute sulfuric acid and 50 to 70g/L of sodium persulfate.
Further, the temperature of the vacuum lamination in S4 is 180 ℃.
Further, the conductive copper paste is a conductive paste composed of copper, silver, tin and epoxy resin.
Further, the conductive copper paste has a viscosity of 1500 (BH type/dpa.s) and a density of 5.1.+ -. 0.2 (g/cm) 3 ) The shaking factor was 4.0 (2 rpm/20 rpm), the thermal conductivity was 28 (W/mk), the melting point was 260℃and the average particle size was 1 to 25. Mu.m.
Compared with the prior art, the invention has the following technical advantages:
1) According to the Z-direction connection technology in the technical scheme, the electric performance of the printed board is realized by adding the conductive material in the insulating layer at a local position, so that the communication between the layers of the printed board is not dependent on through holes, the flexibility of the design of the circuit board is improved, the high-layer board with a complex structure is changed into the low-layer board with a simple structure, and the limitation on the thickness-diameter ratio of the high-layer board is not existed. For the traditional PCB enterprises, the application of the technology realizes higher-order cross interconnection of the printed boards without adding and replacing too much equipment, and reduces the manufacturing cost for the enterprises.
2) The technical scheme is not limited by the plate thickness aperture ratio, and the printed plate with higher plate thickness aperture ratio can be finished by adopting the most common equipment, so that the equipment cost is saved.
3) The alloy copper paste has stable electric conductivity at the low temperature lower than 160 ℃, and meanwhile, the melting point of the alloy layer exceeds 260 ℃, so that the alloy copper paste has good heat conductivity and good electric performance and heat dissipation performance.
4) The interlayer interconnection layer by layer alignment has no strict precision limitation, and common interlayer deviation can not cause poor electrical performance or poor insulation or even short circuit, so that the product qualification rate is improved.
Drawings
FIG. 1 is a schematic view of the positive effect of a copper paste plug hole in the present solution;
FIG. 2 is a schematic view showing the three-dimensional effect of a copper paste plug hole in the present solution;
FIG. 3 is an effect diagram of laser drilling;
FIG. 4 is an effect diagram of mechanical drilling;
FIG. 5 is a schematic illustration of a process of scraping copper paste protruding from a through hole in a vacuum box with a doctor blade;
FIG. 6 is a schematic diagram of a good hole plugging picture;
FIG. 7 is a graph of a sample of a prior art sliced sheet after the brown oxide treatment of the copper surface and lamination of printed copper paste;
FIG. 8 is a view of a sample of a slice after press-fit of a printed copper paste after chemical cleaning;
FIG. 9 is a temperature variation process of vacuum lamination to cure copper paste;
FIG. 10 is a schematic diagram of the overall flow in the present embodiment;
fig. 11 is a schematic cross-sectional view of the resulting laminated multilayer board.
Description of the embodiments
The invention will now be described in detail with reference to the drawings and specific examples.
The whole flow of the preparation of the technical scheme is shown in figure 10.
S1: the protection film is adhered on the core plate or the laminated plate, namely, the technical scheme can be applied to circuit connection of two sides of the core plate, and Z-direction communication among the multi-layer laminated plates can be realized.
The protective film plays a role in protecting the surface of the insulating material and increasing the height of the copper paste.
And selecting different types of protective films for different types of prepregs, performing a pre-pressing test on the protective films, and selecting optimal pre-pressing parameters.
When the technical scheme is applied to a scene of a multi-layer board, the protective film needs to be selected: the non-adhesive prepreg uses a protective film (25 um) containing glue; the slightly adhesive prepreg uses a protective film (25 um) without adhesive; the slightly-adhesive prepreg has the viscosity, and if the adhesive-containing protective film is used for lamination, the adhesive layer on the surface of the prepreg can be damaged in the film tearing process.
When the method is applied to the lamination process of prepregs, the prepregs are subjected to prepressing parameters as shown in the following table:
s2: through holes are formed in grouting positions of the target Z-direction communication, and the through holes are formed in a mechanical drilling mode in the embodiment. Fig. 3 is an effect diagram of laser drilling, and fig. 4 is an effect diagram of mechanical drilling.
In the technical scheme, PET material with a core plate of 25 mu m is selected, and the mechanical drilling effect of the PET material is obviously superior to that of laser drilling. In the drilling process, 0.25mm FR-4 optical plates are required to be added on and under the semi-cured plate, and the plates cannot be directly stacked to prevent the hole edge from being pulled.
S3: injecting the conductive copper paste into the through hole formed in the step S2, heating and pre-curing, and then leveling the protruding copper paste at the through hole to form the Z-type conductive structure. FIG. 1 is a schematic view of the positive effect of a copper paste plug hole in the present solution; fig. 2 is a schematic view of a three-dimensional effect of a copper paste plug hole in the present technical solution. The copper paste protrusion height was about 18 μm.
The conductive copper paste used in the implementation process is a conductive paste composed of copper, silver, tin and epoxy resin. The viscosity of the conductive copper paste was 1500 (BH type/dpa.s) and the density was 5.1.+ -. 0.2 (g/cm) 3 ) A shaking factor of 4.0 (2 rpm/20 rpm), a thermal conductivity of 28 (W/mk), a melting point of 260℃and an average particle size of 1 to 25. Mu.mm。
The special copper paste is a composition of silver, alloy copper, tin powder and epoxy resin, is pasty at normal temperature, has certain viscosity and fluidity, needs to be solidified at high temperature and high pressure, and has good bonding and conductive properties, and the characteristics are shown in the following table:
| viscosity (BH type/dpa.s) | 1500 |
| Density (g/cm) 3 ） | 5.1±0.2 |
| Coefficient of shaking (2/20 rpm) | 4.0 |
| |
180℃/60min |
| Volume impedance (Ω cm) | 0.0001 |
| Tg(℃)（DMA） | 147 |
| Elasticity (GPa) | 4.6 |
| Thermal conductivity (W/mk) | 28 |
| Melting point (. Degree. C.) | 260 |
In specific implementation, the conductive copper paste is injected into the through hole formed in S2 by using a vacuum hole plugging machine. The heating pre-curing condition is that heating is carried out for 1-10 min at 50-70 ℃. Most preferably, the conditions for heat pre-curing are at 70℃for 10min. In practice, the effect of curing parameters on resistance is shown in the following table.
The test was cured using the above 9 parameters, and no significant difference was found in the sections, with a resistance value of 70 degrees being optimal for 10 minutes.
The following table shows experimental parameters of reliability test, and the resistance change rate of copper paste after lead-free reflow soldering for different times is minimum when the copper paste is left to stand and is not solidified; the resistance value of the pre-curing parameter is minimum when the pre-curing parameter is 70 ℃ for 10 minutes, the resistance value of the cross product is 2.02 milliohms, and the resistance value of the copper plating interconnection is in the range of 1.9-2.1 milliohms in the conventional process; the resistance of the copper paste connection process can meet the production requirements of actual products.
The manual hole plugging easily causes that small bubbles generated in the copper paste cannot be discharged, so that hole plugging cavities are sunken, and the hole plugging defect rate is high, so that the vacuum hole plugging is better. After plugging, the pre-curing or standing treatment is directly carried out, the protruding copper paste is leveled after pre-curing, a scraper is adopted in a vacuum box to scrape the protruding copper paste at the through hole, the leveling process is realized, and referring to fig. 5, the following two advantages are realized when the surface copper paste is leveled before curing: 1. the copper paste does not sag 2 due to cure shrinkage the slight oxidation of the copper paste surface due to baking can be removed. A good picture of the plug hole is seen in fig. 6.
S4: cleaning the through hole after grouting, removing the protective film, printing copper paste on the upper and lower surfaces of the through hole of the core board or the laminated board after grouting, and then performing vacuum lamination to form a horizontal copper conducting layer, so that the copper conducting layer is electrically connected with the Z-direction conducting structure.
In the concrete implementation, the mixture of 3-5% dilute sulfuric acid and 50-70g/L sodium persulfate is adopted for cleaning. The temperature of the vacuum lamination was 180 ℃.
In practice, copper paste was printed on the brown oxide layer, and the analysis of the cut pieces after lamination was as shown in fig. 7. Copper paste was printed after chemical cleaning and the cut sheet analysis after lamination is shown in fig. 8. And comparing and analyzing the slices, wherein the printed copper paste slices after browning have a layer of cracks at the joint of the copper paste and the base copper, and the printed copper paste slices after chemical cleaning have no cracks at the joint of the copper paste and the base copper.
And further analyzing the influence of copper surface treatment before lamination on the resistance.
The analysis is carried out from the two aspects of slicing and resistance, and the effect of the mixed liquid system of 3% -5% of dilute sulfuric acid and 50-70g/L of sodium persulfate after chemical cleaning treatment of the copper surface is better than the effect after brown chemical treatment of the copper surface.
In practice, the vacuum lamination causes the temperature change of the copper paste curing conditions to be as shown in fig. 9.
S5: according to the preset interlayer conductive path, the horizontal copper conductive layer prepared in the step S4 is etched, the etching process can be realized by adopting the prior art, the interlayer horizontal conductive pattern layer is obtained, the Z-direction interconnection between the multilayer printed circuit boards is realized by matching the horizontal conductive pattern layers on the upper surface and the lower surface of each layer of the printed circuit boards with the Z-direction conductive structures of the specific layers, and finally the sample is shown in fig. 11.
The previous description of the embodiments is provided to facilitate a person of ordinary skill in the art in order to make and use the present invention. It will be apparent to those skilled in the art that various modifications can be readily made to these embodiments and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the above-described embodiments, and those skilled in the art, based on the present disclosure, should make improvements and modifications without departing from the scope of the present invention.
Claims (1)
1. The preparation method of the Z-direction interconnection printed circuit board is characterized by comprising the following steps of:
s1: laminating a protective film on the core plate or the laminated plate;
s2: a through hole is formed in the grouting position of the target Z-direction communication;
s3: injecting conductive copper paste into the through hole formed in the S2, heating and pre-curing, and leveling the protruding copper paste at the through hole to form a Z-direction conductive structure, wherein the conductive copper paste is injected into the through hole formed in the S2 by using a vacuum hole plugging machine, the viscosity of the conductive copper paste is 1500 BH type/dpa.s, and the density is 5.1+/-0.2 g/cm 3 The shaking coefficient is 4.0.2 rpm/20rpm, the thermal conductivity is 28W/mk, and the melting point is 260 ℃;
s4: cleaning the through hole after grouting, removing the protective film, printing copper paste on the upper and lower surfaces of the through hole of the core board or the laminated board after grouting, and then performing vacuum lamination to form a horizontal copper conducting layer, so that the copper conducting layer is electrically connected with the Z-direction conducting structure;
s5: etching the horizontal copper conductive layer prepared in the step S4 according to a preset interlayer conductive path to obtain an interlayer horizontal conductive pattern layer, and realizing Z-direction interconnection among the multilayer printed circuit boards through matching of the horizontal conductive pattern layers on the upper and lower surfaces among the layers of the printed circuit boards and Z-direction conductive structures of the specific layers;
s2, a through hole is formed in a mechanical drilling mode;
s3, heating and pre-curing at 70 ℃ for 10min;
s3, scraping the convex copper paste at the through hole by using a scraper in the vacuum box to realize a leveling process;
s4, cleaning by adopting mixed solution of 3% -5% of dilute sulfuric acid and 50-70g/L of sodium persulfate;
the temperature of vacuum lamination in the step S4 is 180 ℃;
the conductive copper paste is formed by copper, silver, tin and epoxy resin.
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| CN114401584A (en) * | 2021-11-01 | 2022-04-26 | 安捷利美维电子(厦门)有限责任公司 | High-density interconnected circuit board interlayer interconnection structure and processing technology |
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|---|---|---|---|---|
| JPH03112606A (en) * | 1989-09-26 | 1991-05-14 | Kyocera Corp | Manufacture of ceramic multilayer interconnection board |
| JP2004153084A (en) * | 2002-10-31 | 2004-05-27 | Denso Corp | Multilayer circuit board and manufacture thereof |
| CN112601377A (en) * | 2020-11-30 | 2021-04-02 | 景旺电子科技(珠海)有限公司 | Manufacturing method of copper paste hole plugging printed board and manufacturing method of FPC board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3952004B2 (en) * | 1995-02-08 | 2007-08-01 | 日立化成工業株式会社 | Conductive paste |
| JP4436946B2 (en) * | 1999-06-25 | 2010-03-24 | イビデン株式会社 | Method for manufacturing single-sided circuit board and method for manufacturing multilayer printed wiring board |
| JP2009049136A (en) * | 2007-08-17 | 2009-03-05 | Fujitsu Ltd | Wiring board, wiring pattern forming method, and manufacturing method of wiring board |
| JP5287570B2 (en) * | 2009-07-21 | 2013-09-11 | ソニー株式会社 | Method for manufacturing printed wiring board |
| CN204361126U (en) * | 2014-12-31 | 2015-05-27 | 共青城超群科技股份有限公司 | A kind of SMD LED package substrate |
| US10349520B2 (en) * | 2017-06-28 | 2019-07-09 | Catlam, Llc | Multi-layer circuit board using interposer layer and conductive paste |
| CN110366329A (en) * | 2018-04-10 | 2019-10-22 | 电连技术股份有限公司 | A kind of manufacturing method and multilager base plate of multilager base plate |
| CN110621118B (en) * | 2019-09-12 | 2022-09-16 | 深圳市华升鑫电路有限公司 | Circuit board hole plugging method and circuit board |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03112606A (en) * | 1989-09-26 | 1991-05-14 | Kyocera Corp | Manufacture of ceramic multilayer interconnection board |
| JP2004153084A (en) * | 2002-10-31 | 2004-05-27 | Denso Corp | Multilayer circuit board and manufacture thereof |
| CN112601377A (en) * | 2020-11-30 | 2021-04-02 | 景旺电子科技(珠海)有限公司 | Manufacturing method of copper paste hole plugging printed board and manufacturing method of FPC board |
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